CN105537703A - Laminated fitting preparing method for three-dimensional microelectrode - Google Patents
Laminated fitting preparing method for three-dimensional microelectrode Download PDFInfo
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- CN105537703A CN105537703A CN201610037155.1A CN201610037155A CN105537703A CN 105537703 A CN105537703 A CN 105537703A CN 201610037155 A CN201610037155 A CN 201610037155A CN 105537703 A CN105537703 A CN 105537703A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H1/00—Electrical discharge machining, i.e. removing metal with a series of rapidly recurring electrical discharges between an electrode and a workpiece in the presence of a fluid dielectric
- B23H1/04—Electrodes specially adapted therefor or their manufacture
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H3/00—Electrochemical machining, i.e. removing metal by passing current between an electrode and a workpiece in the presence of an electrolyte
- B23H3/04—Electrodes specially adapted therefor or their manufacture
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
Abstract
The invention provides a laminated fitting preparing method for a three-dimensional microelectrode. The outline of the three-dimensional laminated microelectrode is formed by manufacturing a part model, establishing a three-dimensional microelectrode model, establishing a thin slice electrode data model, setting three-dimensional microelectrode parameters, machining the three-dimensional microelectrode and conducting thermal diffusion welding on the three-dimensional microelectrode. In addition, the machining precision can be improved through the further grinding step. According to the laminated fitting preparing method for the three-dimensional microelectrode, the technical problem that three-dimensional microelectrodes are hard to manufacture is solved, a three-dimensional microstructure can be obtained through simple vertical reciprocating type machining, the machining process is simple, and efficiency is high; and meanwhile, a step of the three-dimensional laminated microelectrode is effectively removed through electric spark forming grinding, and the surface quality of the machined part is improved.
Description
Technical field
What the present invention relates to is the processing method of three-dimensional micro-electrode for micro EDM or electrochemical micromachining.
Background technology
Usually, micro-structural is defined as: at least on bidimensional yardstick, and the product with submillimeter or micron order micro-feature structure is called micro-(structure) part.
The main flow manufacturing process preparing three-dimensional microstructures by the micro EDM of micro-electrode or electrochemical micromachining.This technical process is specially:
Make the tiny two-dimentional semi-cylindrical microelectrode of diameter by various processing method, then obtain three-dimensional microstructures by the electric discharge of the scanning layer by layer processing of microelectrode or Electrolyzed Processing.But, because cylindrical microelectrode diameter dimension is very fine relative to scan area, make working (machining) efficiency very low.And in the process of the electric discharge of the scanning layer by layer processing of microelectrode, microelectrode loss is very serious, is difficult to long-time normal work.
Summary of the invention
Technical problem to be solved by this invention makes up the defect that above-mentioned prior art exists, and provides a kind of manufacturing process of the three-dimensional micro-electrode for micro EDM or electrochemical micromachining.
Technical problem of the present invention is solved by the following technical programs:
A kind of three-dimensional micro-electrode lamination matching preparation method, it comprises the following steps:
Step one: make part model; Draw the three-dimensional microstructures geometrical model of part to be prepared;
Step 2: set up three-dimensional micro-electrode model; According to described three-dimensional microstructures geometrical model, set up the three-dimensional micro-electrode geometrical model of this model of spark machined, and described three-dimensional micro-electrode geometrical model is carried out discrete slices, obtain discrete slices geometrical model;
Step 3: set up thin electrode data model; Described discrete slices geometrical model is converted into one group of thin electrode data model be parallel to each other; Thin electrode quantity in described thin electrode data model is equal with the number of sections N in described discrete slices geometrical model, and the thickness of described thin electrode is equal with the thickness H of described section;
Step 4: three-dimensional micro-electrode parameter is set; Track data according to described number of sections N, thickness H, thin electrode arranges the number of plies of three-dimensional micro-electrode, thickness and outline data;
Step 5: machining 3 D microelectrode; One group of metal forming be fixedly clamped, the thickness of described metal forming is identical with the thickness H in described step 4; Maintained static by ground floor unitary piece of metal paper tinsel, all the other each layers metal forming to be processed is bent upwards under external force, and blocks fixing with the first block; The microelectrode profile of corresponding ground floor is processed as by Linear cut or laser cutting operation; After described ground floor microelectrode contour machining completes, by External Force Acting, make it be bent downwardly, and block with the second block;
Step 6: machining 3 D microelectrode; Maintained static by second layer unitary piece of metal paper tinsel, all the other each layers metal forming to be processed is bent upwards under external force, and blocks fixing with the first block; The microelectrode profile of the corresponding second layer is processed as by Linear cut or laser cutting operation; After described second layer microelectrode contour machining completes, by External Force Acting, make it be bent downwardly, and block with the second block; Repeat this step successively, until each layer metal forming to be processed as each layer two-dimensional slice microelectrode profile;
Step 7: thermodiffusion welding three-dimensional micro-electrode; Putting into vacuum drying oven by machining multilayer two-dimension thin slice microelectrode that is rear, that be still in clamp position, carrying out vacuum pressure thermodiffusion welding, each layer two-dimensional slice microelectrode is connected completely, forming three-dimensional micro-electrode; Pressure P≤the 10Pa of described vacuum drying oven, welding temperature T are 0.5 ~ 0.8 times of three-diemsnional electrode material melting point, temperature retention time t >=1 hour, with stove cooling after completing, form 3-D stacks microelectrode profile.
In order to improve machining accuracy further, preferably, the present invention comprises the grinding step of 3-D stacks microelectrode profile further:
Step 8: according to the three-dimensional micro-electrode geometrical model designed in step 2, and the gap between the actual 3-D stacks microelectrode profile prepared, design grinding curve; 3-D stacks microelectrode containing step is carried out Electro Spark Discharge Grinding, is level and smooth curve by described step grinding.
Preferably, described metal forming is Copper Foil or nickel foil or molybdenum foil.
The thickness of described section can be also can be uneven uniformly, specifically can determine according to the fitting precision of laminate electrode.Preferably, the thickness of described section is even, and thickness H≤500 μm of described section; Preferably, the thickness h≤1.0mm of described two-dimensional slice microelectrode.
The beneficial effect that the present invention is compared with the prior art is:
1) the present invention proposes by multilayer two-dimension thin slice microelectrode lamination matching shaping three-dimensional micro-electrode first, efficiently solves the technical barrier that three-dimensional micro-electrode is difficult to prepare.
2) three-dimensional micro-electrode is used for micro EDM or electrochemical micromachining can prepare three-dimensional microstructures.Scanning layer by layer to discharge with the micro-electrode with simple cross sectional shape processes or scans layer by layer compared with Electrolyzed Processing three-dimensional microstructures, three-dimensional micro-electrode only needs the processing carrying out simple upper and lower reciprocation type just can obtain three-dimensional microstructures, and process is simple and working (machining) efficiency is high.
3) the 3-D stacks microelectrode with step is directly used in micro EDM or electrochemical micromachining, step can be copied on processing result, thus has influence on form accuracy and the surface quality of processing result.Through spark-erosion sinking grinding, the step of 3-D stacks microelectrode is effectively canceled.3-D stacks microelectrode through spark-erosion sinking grinding is used for micro EDM or electrochemical micromachining, effectively can improves the form accuracy of processing result and improve the surface quality of processing result.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings;
Fig. 1 is the geometrical model schematic diagram of required three-dimensional microstructures;
Fig. 2 is the geometrical model schematic diagram of the three-dimensional micro-electrode designed by Fig. 1;
Fig. 3 is the discrete slices geometrical model schematic diagram of three-dimensional micro-electrode;
Fig. 4 is the schematic diagram that the lamination matching of three-diemsnional electrode is shaped;
Fig. 5 is the spark-erosion sinking Principle of Grinding and Cutting of 3-D stacks microelectrode;
Fig. 6 is the process of electric spark grinding abatement step effect;
Label declaration: block 1, the Copper Foil 2 processed, Copper Foil 3 to be processed, pinching end 4, has completed the Copper Foil 5 of processing, cutting tool 6, two-dimensional slice microelectrode 7, step 8, grinding tool 9, milled portion 10, non-milled portion 11,3-D stacks electrode 12, grinding direction A; Electrode design model silhouette 13, lamination microelectrode roughing TP 14, plunge grinding direction B.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
The three-dimensional micro-electrode lamination matching preparation method that the present invention proposes, it comprises the following steps:
Step one: make part model; Draw the three-dimensional microstructures geometrical model of part to be prepared; This step is generally completed by three-dimensional computer software;
Step 2: set up three-dimensional micro-electrode model; According to described three-dimensional microstructures geometrical model, set up the three-dimensional micro-electrode geometrical model of this model of spark machined, and described three-dimensional micro-electrode geometrical model is carried out discrete slices, obtain discrete slices geometrical model;
Step 3: set up thin electrode data model; Described discrete slices geometrical model is converted into one group of thin electrode data model be parallel to each other; Thin electrode quantity in described thin electrode data model is equal with the number of sections N in described discrete slices geometrical model, and the thickness of described thin electrode is equal with the thickness H of described section;
Step 4: three-dimensional micro-electrode parameter is set; Track data according to described number of sections N, thickness H, thin electrode arranges the number of plies of three-dimensional micro-electrode, thickness and outline data;
The thickness of three-dimensional microstructures geometrical model is obtained number of sections N (i.e. the number of plies) divided by the thickness of microelectrode by computer, thus obtains the number of plies, the thickness of two-dimensional slice microelectrode.Because two-dimensional slice microelectrode is by carrying out discrete slices acquisition to three-dimensional micro-electrode geometrical model, therefore containing the outline data of two-dimensional slice microelectrode in its section, is the foundation of processing two-dimensional slice electrode.
Step 5: machining 3 D microelectrode; One group of metal forming be fixedly clamped, the thickness of described metal forming is identical with the thickness H in described step 4; Maintained static by ground floor unitary piece of metal paper tinsel, all the other each layers metal forming to be processed is bent upwards under external force, and blocks fixing with the first block; The microelectrode profile of corresponding ground floor is processed as by Linear cut or laser cutting operation; After described ground floor microelectrode contour machining completes, by External Force Acting, make it be bent downwardly, and block with the second block;
Step 6: machining 3 D microelectrode; Maintained static by second layer unitary piece of metal paper tinsel, all the other each layers metal forming to be processed is bent upwards under external force, and blocks fixing with the first block; The microelectrode profile of the corresponding second layer is processed as by Linear cut or laser cutting operation; After described second layer microelectrode contour machining completes, by External Force Acting, make it be bent downwardly, and block with the second block; Repeat this step successively, until each layer metal forming to be processed as each layer two-dimensional slice microelectrode profile;
Through the three-dimensional micro-electrode of the preliminary lamination that step 6 obtains, inreal connection between its each layer two-dimensional slice microelectrode, therefore need to carry out vacuum pressure thermodiffusion welding in a vacuum furnace, thus complete the connection completely of each layer two-dimensional slice microelectrode, concrete steps are as follows:
Step 7: thermodiffusion welding three-dimensional micro-electrode; Putting into vacuum drying oven by machining multilayer two-dimension thin slice microelectrode that is rear, that be still in clamp position, carrying out vacuum pressure thermodiffusion welding, each layer two-dimensional slice microelectrode is connected completely, forming three-dimensional micro-electrode; Pressure P≤the 10Pa of described vacuum drying oven, welding temperature T are 0.5 ~ 0.8 times of three-diemsnional electrode material melting point, temperature retention time t >=1 hour, with stove cooling after completing, form 3-D stacks microelectrode profile.
According to the 3-D stacks microelectrode that above-mentioned steps processing obtains, its initial profile is made up of with vertical line segment (step that these line segments also constitute 3-D stacks microelectrode) trickle horizontal line section, and the superposition of these steps fits to the initial design profile of 3-D stacks microelectrode.The step of 3-D stacks microelectrode can have an impact to the form accuracy of laminate electrode, is eliminated by plunge grinding.Therefore the present invention can comprise grinding step further:
Step 8: according to the three-dimensional micro-electrode geometrical model designed in step 2, and the gap between the actual 3-D stacks microelectrode profile prepared, design grinding curve; 3-D stacks microelectrode containing step is carried out Electro Spark Discharge Grinding, is level and smooth curve by described step grinding; Its detailed process is as follows:
1), when starting plunge grinding, the step of 3-D stacks microelectrode is broken line, and step comprises concave point and salient point.Carry out Electro Spark Discharge Grinding to the 3-D stacks microelectrode containing step, under the impact of electrode kelvin effect, salient point loss is the fastest, and towards on the direction of two ends concave point, loss is then slack-off gradually, and the loss of concave point place is minimum; 2) carrying out gradually along with spark-erosion sinking grinding, step is level and smooth curve by grinding gradually, and now the salient point of 3-D stacks microelectrode becomes comparatively level and smooth gradually by the wedge angle of 90 °.Profile due to step gradually becomes more level and smooth curve, and therefore the grinding loss rate of step is slack-off gradually, and now the loss rate difference of salient point top and other position reduces gradually; 3) proceeding along with plunge grinding, the step of three-dimensional micro-electrode continues to be ground, and finally makes 3-D stacks microelectrode profile approach electrode design model silhouette as much as possible.
The thickness of described section can be also can be uneven uniformly, and specifically will determine with the fitting precision of laminate electrode, the thickness of section should be less than or equal to 500 μm.Preferably, the thickness h≤1.0mm of described two-dimensional slice microelectrode.
Embodiment 1: the electrode sheet material that the present embodiment adopts is the Copper Foil that 0.1mm is thick.
Concrete manufacture craft comprises the following steps:
Set up geometrical model one, to the three-dimensional microstructures of needs preparation, as shown in Figure 1.
Two, set up the geometrical model of three-dimensional fine electric spark electrode according to the geometrical model of three-dimensional microstructures, as shown in Figure 2, and this three-dimensional micro-electrode is carried out discrete slices, obtain discrete slices geometrical model, as shown in Figure 3.
Three, according to above-mentioned data, the lamination matching forming process of three-dimensional micro-electrode is as follows: one end of one group of Copper Foil is fixedly clamped by (1), is pinching end 4.Copper Foil divides the Copper Foil 5 machined, the Copper Foil 2 processed and Copper Foil to be processed 3, as shown in Figure 4; (2) other end of Copper Foil 3 to be processed needs upwards elastic bending and blocks with the first block 1, the other end of the Copper Foil 2 processed is fixed by fixture, and by the two-dimensional slice microelectrode 7 of this layer of line 6 cutting processing, the Copper Foil 5 machined needs downward elastic bending and blocks with the second block 1; (3) said process is repeated, until complete the processing of each layer two-dimensional slice microelectrode 7.These two-dimensional slice microelectrodes 7 pass through superposition matching thus obtain the three-dimensional micro-electrode of preliminary lamination; (4) its each layer two-dimensional slice microelectrode of three-dimensional micro-electrode of preliminary lamination is inreal connects, therefore need still to be kept one end clamped condition, the tentatively three-dimensional micro-electrode of lamination to put into vacuum drying oven, vacuum pressure thermodiffusion welding is carried out to it, thus completes the connection completely of each layer two-dimensional slice microelectrode.The atmospheric pressure of vacuum drying oven is 0.1Pa, and welding temperature is 850 DEG C, and temperature retention time is 10h, cools with stove.
Four, 3-D stacks electrode prepared by above-mentioned technique is formed grinding, as shown in Figure 5 and Figure 6, wherein 9 is grinding tool, 10 is milled portion, and 11 is non-milled portion, and 12 is 3-D stacks electrode, arrow A is grinding direction, and plunge grinding direction is arrow B.The target of electric spark grinding is the step 8 eliminated as far as possible in electrode design model beyond double dot dash line, and makes prepared lamination microelectrode profile (the lamination microelectrode roughing TP 14 namely representated by single-point setting-out part) namely approach electrode design model silhouette a as much as possible
es
eb
e(i.e. electrode design model silhouette 13 representated by double dot dash line part).The detailed process of step grinding is described below: when (1) starts plunge grinding, the step a of 3-D stacks microelectrode
0s
0b
0for broken line, wherein a
0and b
0for the concave point of step, s
0for the salient point of step.Under the impact of electrode kelvin effect, salient point s
0place's loss is the fastest, and towards two ends concave point a
0, b
0direction on, loss is then slack-off gradually, concave point a
0, b
0place's loss is minimum; (2) carrying out gradually along with plunge grinding, step a
0s
0b
0be level and smooth curve asb, now s by grinding gradually
0more level and smooth salient point s is gradually become by the wedge angles of 90 °.Due to step a
0s
0b
0profile gradually become more level and smooth curve asb, therefore the grinding loss rate of step is slack-off gradually, and now the loss rate difference of salient point s place and other position of camber line asb reduces gradually; (3) proceeding along with plunge grinding, the step of three-dimensional micro-electrode continues to be ground, and finally makes 3-D stacks microelectrode profile approach electrode design model silhouette a as much as possible
es
eb
e.
Five, three-dimensional micro-electrode prepared by above-mentioned technique is applied to micro EDM, just can obtain three-dimensional microstructures by the processing of three-dimensional micro-electrode formula up and down, working (machining) efficiency is high and export license is little.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. a three-dimensional micro-electrode lamination matching preparation method, is characterized in that: it comprises the following steps:
Step one: make part model; Draw the three-dimensional microstructures geometrical model of part to be prepared;
Step 2: set up three-dimensional micro-electrode model; According to described three-dimensional microstructures geometrical model, set up the three-dimensional micro-electrode geometrical model of this model of spark machined, and described three-dimensional micro-electrode geometrical model is carried out discrete slices, obtain discrete slices geometrical model;
Step 3: set up thin electrode data model; Described discrete slices geometrical model is converted into one group of thin electrode data model be parallel to each other; Thin electrode quantity in described thin electrode data model is equal with the number of sections N in described discrete slices geometrical model, and the thickness of described thin electrode is equal with the thickness H of described section;
Step 4: three-dimensional micro-electrode parameter is set; Track data according to described number of sections N, thickness H, thin electrode arranges the number of plies of three-dimensional micro-electrode, thickness and outline data;
Step 5: machining 3 D microelectrode; One group of metal forming be fixedly clamped, the thickness of described metal forming is identical with the thickness H in described step 4; Maintained static by ground floor unitary piece of metal paper tinsel, all the other each layers metal forming to be processed is bent upwards under external force, and blocks fixing with the first block; The microelectrode profile of corresponding ground floor is processed as by Linear cut or laser cutting operation; After described ground floor microelectrode contour machining completes, by External Force Acting, make it be bent downwardly, and block with the second block;
Step 6: machining 3 D microelectrode; Maintained static by second layer unitary piece of metal paper tinsel, all the other each layers metal forming to be processed is bent upwards under external force, and blocks fixing with the first block; The microelectrode profile of the corresponding second layer is processed as by Linear cut or laser cutting operation; After described second layer microelectrode contour machining completes, by External Force Acting, make it be bent downwardly, and block with the second block; Repeat this step successively, until each layer metal forming to be processed as each layer two-dimensional slice microelectrode profile;
Step 7: thermodiffusion welding three-dimensional micro-electrode; Putting into vacuum drying oven by machining multilayer two-dimension thin slice microelectrode that is rear, that be still in clamp position, carrying out vacuum pressure thermodiffusion welding, each layer two-dimensional slice microelectrode is connected completely, forming three-dimensional micro-electrode; Pressure P≤the 10Pa of described vacuum drying oven, welding temperature T are 0.5 ~ 0.8 times of three-diemsnional electrode material melting point, temperature retention time t >=1 hour, with stove cooling after completing, form 3-D stacks microelectrode profile.
2. three-dimensional micro-electrode lamination matching preparation method as claimed in claim 1, is characterized in that: it comprises the grinding step of 3-D stacks microelectrode profile further:
Step 8: according to the three-dimensional micro-electrode geometrical model designed in step 2, and the gap between the actual 3-D stacks microelectrode profile prepared, design grinding curve; 3-D stacks microelectrode containing step is carried out Electro Spark Discharge Grinding, is level and smooth curve by described step grinding.
3. three-dimensional micro-electrode lamination matching preparation method as claimed in claim 1, is characterized in that: thickness H≤500 μm of described section.
4. three-dimensional micro-electrode lamination matching preparation method as claimed in claim 1, is characterized in that: described metal forming is Copper Foil or nickel foil or molybdenum foil.
5. three-dimensional micro-electrode lamination matching preparation method as claimed in claim 1, is characterized in that: the thickness h≤1.0mm of described two-dimensional slice microelectrode.
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| CN107243679A (en) * | 2017-05-16 | 2017-10-13 | 深圳大学 | New thin slice queue microelectrode micro EDM method and device |
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| CN113319385A (en) * | 2021-05-31 | 2021-08-31 | 深圳市银宝山新科技股份有限公司 | Three-dimensional microelectrode processing method and three-dimensional microelectrode |
| CN114101821A (en) * | 2021-11-04 | 2022-03-01 | 深圳大学 | Electrode and preparation method thereof, helical gear forming die and helical gear |
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| CN107243679A (en) * | 2017-05-16 | 2017-10-13 | 深圳大学 | New thin slice queue microelectrode micro EDM method and device |
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| CN107931753A (en) * | 2017-11-14 | 2018-04-20 | 深圳大学 | The method for processing micro- rotary structure |
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| CN107931753B (en) * | 2017-11-14 | 2019-03-08 | 深圳大学 | The method for processing micro- rotary structure |
| CN110722230A (en) * | 2019-10-29 | 2020-01-24 | 深圳大学 | Part machining method based on electric spark machining |
| CN113319385A (en) * | 2021-05-31 | 2021-08-31 | 深圳市银宝山新科技股份有限公司 | Three-dimensional microelectrode processing method and three-dimensional microelectrode |
| CN113319385B (en) * | 2021-05-31 | 2022-01-18 | 深圳市银宝山新科技股份有限公司 | Three-dimensional microelectrode processing method and three-dimensional microelectrode |
| CN114101821A (en) * | 2021-11-04 | 2022-03-01 | 深圳大学 | Electrode and preparation method thereof, helical gear forming die and helical gear |
| CN114101821B (en) * | 2021-11-04 | 2022-09-30 | 深圳大学 | Electrode and preparation method thereof, helical gear forming die and helical gear |
| CN114985852A (en) * | 2022-06-30 | 2022-09-02 | 贵州安吉华元科技发展有限公司 | Machining method for special-shaped air film hole of aircraft engine blade |
| CN117182215A (en) * | 2023-11-07 | 2023-12-08 | 成都宝利根创科电子有限公司 | Electrode assembly and processing method and using method thereof |
| CN117182215B (en) * | 2023-11-07 | 2024-01-23 | 成都宝利根创科电子有限公司 | Electrode assembly and processing method and using method thereof |
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