CN105493279A - 用于将器件附接到柔性衬底的*** - Google Patents

用于将器件附接到柔性衬底的*** Download PDF

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Publication number
CN105493279A
CN105493279A CN201480048572.5A CN201480048572A CN105493279A CN 105493279 A CN105493279 A CN 105493279A CN 201480048572 A CN201480048572 A CN 201480048572A CN 105493279 A CN105493279 A CN 105493279A
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China
Prior art keywords
flexible substrate
conductive
conductive ink
epoxy resin
circuit
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CN201480048572.5A
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CN105493279B (zh
Inventor
R.S.斯皮尔
D.汉比
A.M.斯科奇
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Osram GmbH
Optoelectronics Co Ltd
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Osram Sylvania Inc
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    • H05K1/00—Printed circuits
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    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T156/1056—Perforating lamina
    • Y10T156/1057—Subsequent to assembly of laminae

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本公开针对用于将器件附接到柔性衬底的***。器件可以以在粘接剂有害的同时防止粘接剂接触导电墨水的方式被耦合到柔性衬底。如果导电环氧树脂被用于将器件中的导电焊盘锚定到柔性衬底，则可以超越其上可以应用导电墨水的器件的边沿来应用导电环氧树脂以作成电连接。小孔也可以被形成在柔性衬底中，允许导电环氧树脂暴露在与器件位置相对的柔性衬底的表面上，所述导电墨水连接是在所述相对的表面上作成的。导电墨水也可以在延伸超过器件的边沿时被直接应用到导电焊盘。柔性衬底可以预先印刷有电路路径，导电墨水将器件耦合到电路路径。

Description

用于将器件附接到柔性衬底的***
相关申请的交叉引用
本申请是要求题为“SYSTEMFORATTACHINGDEVICESTOFLEXIBLESUBSTRATES”的于2013年9月4日提交的美国专利申请No.14/017,439的权益的国际申请，其完整内容被通过引用合并到此。
技术领域
本发明涉及电子组装，并且更具体地，涉及以避免现有组装问题的方式将器件放置到柔性衬底上。
背景技术
在典型的电子制造处理中，包括但不限制于印刷电路板、柔性衬底、封装（诸如多芯片模块（MCM））等的线路可以使用拾放操作而填装有电子器件。例如，可以通过装配有用于标识线路中的器件放置位置的视觉***以及被配置为从供给位置（例如导轨、卷轴等）拾取器件并且将器件放置到先前所标识的器件位置中的操控器的机器对线路进行选路（route）。至少从以实质上快于手动器件***的速度利用各种器件精确地填装线路的观点来看，拾放制造已经是有效的。
自动化焊接***通常遵从拾放操作，其中，被填装的电路板可以通过焊料池或回流炉而被选路以持久地将组件贴附到板。这些处理牵涉对于典型的电路板材料（诸如聚四氟乙烯（Teflon?）、FR-4、FR-1、CEM-1或CEM-3）而言可以是可容忍的高温。然而，使用例如聚对苯二甲酸乙二醇酯（PET）的柔性衬底可能易遭受高热量的损坏，并且因此，要求替换的制造处理。诸如导电环氧树脂（例如包括银的环氧树脂）的材料可以用于在（例如足以加热以固化环氧树脂的）更低得多的温度将组件器件贴附到柔性衬底。然而，导电环氧树脂可能还是有问题的。新兴的柔性衬底技术要求在器件被放置在柔性衬底上之前柔性衬底初始地被印刷（例如丝网印）有基于导电墨水的电路迹线。可能在用于将所放置的器件锚定到柔性衬底的导电环氧树脂中出现的溶剂和其它化学品可能引起预先印刷的基于导电墨水的的电路迹线失去它们对柔性衬底的粘接（例如，剥离），将电路组装呈现为不可使用的。
附图说明
应当参照应当结合下面的各图阅读的下面的详细描述，其中，相同的标号表示相同的部分：
图1图解与本公开一致的用于将器件附接到柔性衬底的示例***；
图2图解与本公开一致的示例的基于粘接剂到导电墨水的连接；
图3图解与本公开一致的替换的示例的基于粘接剂到导电墨水的连接；
图4是与本公开一致的与本公开一致的示例的基于器件到导电墨水的连接；
图5是与本公开一致的用于器件桥接的电路路径的示例；以及
图6图解与本公开一致的针对用于将器件附接到柔性衬底的***的示例操作。
虽然将参照说明性实施例进行以下的具体描述，但很多替换、修改及其变化对于本领域技术人员来说将是明显的。
具体实施方式
本公开针对用于将器件附接到柔性衬底的***。一般而言，当粘接剂处于可能对导电墨水有害的状态下时，器件可以以防止粘接剂接触导电墨水的方式而被耦合到柔性衬底。与本公开一致的实施例可以取决于器件如何耦合到柔性衬底而变化。例如，如果导电环氧树脂被用于将器件中的至少一个导电焊盘耦合到柔性衬底，则可以延伸超越器件的边沿而应用附加的环氧树脂，额外的环氧树脂提供其上可以稍后应用导电墨水以进行电连接的地方。对于小孔而言还可以可能的是形成在衬底中，小孔允许导电环氧树脂暴露在与耦合器件的地方相对的柔性衬底的表面上，导电墨水连接在相对侧上进行。当导电墨水可以被直接应用到延伸超越器件的至少一个导电焊盘时，在实例中也可以采用非导电环氧树脂。在一个实施例中，柔性衬底可以进一步预先印刷有电路路径，导电墨水被应用到柔性衬底，以将器件与电路路径电气地耦合。
在一个实施例中，示例线路可以包括柔性衬底、至少一个器件、粘接剂和导电墨水。粘接剂可以被应用到柔性衬底，以将至少一个器件耦合到柔性衬底。导电墨水可以然后被应用到柔性衬底，以形成电耦合到至少一个器件的导体，导电墨水是在粘接剂之后应用的。
粘接剂可以在导电墨水被应用到柔性衬底之前被固化。在一个示例实现中，至少一个器件可以包括至少一个导电焊盘，并且粘接剂可以是通过将至少一个导电焊盘粘接到柔性衬底来将所述至少一个器件锚定到柔性衬底的导电环氧树脂。导电环氧树脂可以被应用到柔性衬底，从而当被耦合到柔性衬底时，导电环氧树脂的至少一部分可以被暴露成超越所述至少一个器件的边沿。导电墨水可以被应用在导电环氧树脂的所暴露的部分的至少一部分上，以形成电耦合到至少一个器件的导体。
在另一示例实现中，柔性衬底可以包括开孔，开孔在至少一个器件被耦合到柔性衬底时被形成在与至少一个导电焊盘对应的柔性衬底的表面上的位置中，开孔从柔性衬底的表面穿过到相对的表面，导电环氧树脂被应用到柔性衬底，以填充开孔，从而当至少一个器件被耦合到柔性衬底时，导电环氧树脂被暴露在柔性衬底的相对侧上。导电墨水可以然后被应用到柔性衬底的相对侧并且在所暴露的导电环氧树脂上，以形成电耦合到至少一个器件的导体。
在另一示例实现中，至少一个器件可以包括至少一个导电焊盘，其包括延伸超越所述至少一个器件的边沿的部分，并且粘接剂是非导电环氧树脂，以将器件粘接到柔性衬底。导电墨水可以然后被应用在延伸超越至少一个器件的边沿的至少一个导电焊盘的部分的至少一部分上，以形成电耦合到所述至少一个器件的导体。
示例线路可以进一步包括至少一个电路路径，印刷在柔性衬底上，导体将所述至少一个印刷电路路径耦合到至少一个器件。与本公开的各个实施例一致的方法可以包括例如：将粘接剂应用到柔性衬底；使用粘接剂将包括至少一个导电焊盘的至少一个器件耦合到衬底；并且将导电墨水应用到柔性衬底，以形成电耦合到至少一个器件的导体。
图1图解与本公开一致的用于将器件附接到柔性衬底的示例***。***100可以包括例如衬底102，在其上可以附接至少一个器件104。衬底102可以是基于PET、纸张或提供其上可以安装器件的非导电表面的任何其它柔性材料的柔性衬底。器件104可以包括任何类型的电组件。与本公开各个实施例一致的电组件的一个示例可以是表面安装封装中的发光二极管（LED）。多个表面安装LED可以被自动地放置在衬底102上，以例如形成用于在照明灯具（例如灯泡、荧光管更换、灯、手电筒等）中使用的光源阵列。器件104可以包括至少一个导电焊盘106。导电焊盘106可以将器件104电耦合到包括例如导体、电路路径等的衬底102的表面。在表面安装LED的实例中，器件104可以包括至少两个导电焊盘106。
***100公开示例实现，其中，使用导电粘接剂108通过导电焊盘106将器件104附接到衬底102。例如，导电粘接剂108可以是导电环氧树脂（例如包括用于导电的银的两部分环氧树脂）。导电粘接剂108允许器件104在不需要（例如如焊接附接所要求的）高温的情况下持久地贴附到衬底102。如PET和纸张的材料不能承受焊接温度，并且不受高热量影响的现有材料（例如聚亚酰胺衬底）对制造添加实质成本，这对于在柔性衬底上制造各类型的线路而言通常是不可行的。如图2中将更详细地公开的那样，导电粘接剂108可以延伸超越器件104的边沿，创建其上可以应用导电墨水110的接触。导电墨水110可以被应用到衬底102，以形成电耦合到器件104的导体。例如，在***100中，可以通过导电墨水110串联耦合多个器件104。
图2图解与本公开一致的示例的基于粘接剂到导电墨水的连接。示出如图1所公开的***100的侧视图，其中，关于器件104'提供附加的细节。器件104'可以包括通过布线或迹线202耦合到导电焊盘106的集成电路（IC）200（例如实际的IC管芯）。导电焊盘106可以通过导电粘接剂108锚定到衬底102。导电墨水110可以然后被应用在导电粘接剂108的部分之上。结果，导电粘接剂108可以将导电焊盘106电耦合到导电墨水110，允许器件104'被电耦合到衬底102上的其它器件104'和/或线路。
图2中在204至206处示出用于***100的示例组装阶段。初始地，导电粘接剂108可以被应用到衬底102，如在204处图解那样，其上应用导电粘接剂108的区域当被附接时超越器件104'的预期区域。当器件104'被附接到衬底102时，在206处该操作被看得更清楚。重要的是，注意，在与本公开一致的至少一个实施例中，衬底102可以经受处理以固化导电粘接剂108。固化导电粘接剂108可以移除可能对于导电墨水110是腐蚀性的导电粘接剂108中的一些溶剂和/或其它化学物。如在208处图解那样，导电墨水110可以然后被应用在超过器件104'的边界的导电粘接剂108的部分的至少一部分上，以形成电耦合到器件104'的导体。
图3图解与本公开一致的替换的示例的基于粘接剂到导电墨水的连接。***100'可以包括形成在衬底102'中的至少一个开孔300。例如，开孔300的位置可以与器件104'中的导电焊盘106对应。可以然后以允许导电粘接剂108'既填充开孔300又将器件104'锚定到衬底102'的方式，将导电粘接剂108'应用到衬底102'。给定器件104'附接到其的衬底102'的表面是衬底102'的“正面”并且与该正面相对的衬底102'的表面是衬底102'的“背面”，导电墨水110'可以被应用在暴露在衬底102'的背面上的导电粘接剂108'之上，以形成电耦合到器件104'的导体。***100'所示的实现在如下的情况下可以是有益的：其中例如，用于在衬底102'的正面上附接器件104'的可用表面区域十分有限，其中衬底102'的正面可能被暴露于可能对于导电墨水110'有害的条件等。
图3中在302至306处示出用于***100'的示例组装阶段。初始地，至少一个开孔300可以被形成在衬底102'中，如在302处图解那样。例如，开孔（例如小孔）可以被冲钻、激光切割、刻蚀等而穿透衬底102'。导电粘接剂108'可以然后被应用在小孔300之上，并且器件104'可以使用导电粘接剂108'而被附接到衬底102'，如在304处所示那样。导电粘接剂108'可以既将器件104'锚定到衬底102'并且又将开孔300填充到至少一些导电粘接剂108'暴露在衬底108'的背面上的程度。在一个实施例中，可以固化导电粘接剂（例如导电环氧树脂）。在306处，导电墨水110'可以被应用到衬底102'的背面，导电墨水110'被应用在通过开孔300所暴露的导电粘接剂108'之上，以形成电耦合到器件104'的导体。
图4示出与本公开一致的示例的基于器件到导电墨水的连接。在***100''中，器件104''可以包括延伸超越器件104''的边沿的至少一个导电焊盘106'。可以利用非导电粘接剂400（例如非导电环氧树脂）以将器件104'的外壳锚定到衬底102。导电墨水110''可以然后被应用在延伸超越器件104''的边沿的导电焊盘106'的部分的至少一部分上，形成可以经由衬底102上的线路将器件104''电耦合到其它器件的导体。***100''的至少一个优点是排除了导电粘接剂。避免使用导电粘接剂可以减少组装的总体成本，并且可以消除在应用导电墨水110''之前进行固化的需要。然而，成本节省可以取决于导电粘接剂对于具有所修改的焊盘的器件104''的成本。
图4中在402至404处示出用于***100''的示例组装阶段。初始地，非导电粘接剂400可以被应用到衬底102，如在402处图解那样。非导电粘接剂400可以被应用在与器件104''的外壳当被附接到衬底102时将被定位的位置对应的区域中。在404处公开器件104''对衬底102的附接，导电焊盘106'延伸超越器件104''的边沿。导电墨水110''可以然后被应用在延伸超越器件104''的边沿的导电焊盘106'的部分的至少一部分之上。在***100''中，由于导电墨水110''可以不成为与非导电粘接剂400接触，因此非导电粘接剂400何时固化（如果必要的话）可以独立于导电墨水110''的应用。
图5是与本公开一致的用于器件桥接的电路路径的示例。在至少一个实施例中，电路路径（例如用于耦合被附接到衬底102的器件104的导电迹线）可以在器件104被附接之前被至少部分地应用到衬底102。在502至508处示出示例组装阶段。例如，在502处，电路路径500被示出为被预先印刷在衬底102上。可以使用自动化处理（诸如例如丝网印、印刷、绘制等）在导电墨水中预先印刷出电路路径500。使用如图1图解的***100作为示例，在504处，导电粘接剂108可以然后被应用到衬底102。可以以不成为与电路路径500接触的方式应用导电粘接剂。如在506处所示那样，器件104可以然后被应用到衬底102，采用导电粘接剂108以将器件104中的至少一个导电焊盘106锚定到衬底102。在一个实施例中，导电粘接剂108可以然后在应用导电墨水110之前被固化。如在508处所示那样，导电墨水110可以被应用于导电粘接剂108和电路路径500的至少一部分之上，以创建将器件104耦合到电路路径500的导体。重要的是，注意，虽然在串联耦合器件104的配置中示出电路路径500，但这种示例配置仅仅是为了解释。与本公开一致的实施例可以包括基于例如线路意图针对的应用而配置的实质上更复杂的电路路径500。此外，可以利用图2-图4中所公开的任何***来实现图5所示的示例。
图6图解与本公开一致的针对用于将器件附接到柔性衬底的***的示例操作。在操作600中，电路路径可以被应用到衬底（例如，可以在导电墨水中被预先印刷在衬底上）。操作600可以是可选的，因为可以稍后（例如在操作608中）简单地通过应用导电墨水来创建所有所要求的电路路径。在操作602中，粘接剂（例如环氧树脂）可以被应用到衬底。粘接剂是导电的还是非导电的取决于（例如诸如图2-图4中先前所公开的）所利用的***的类型。在操作604中，器件可以被附接到衬底。例如，可以使衬底贯穿于自动化拾放处理中，通过自动化拾放处理表面安装器件被应用到衬底。在可选操作606中，固化可以发生，以设置在操作602中应用的粘接剂。当例如利用基于导电环氧树脂的***时，可能要求固化，并且导电环氧树脂的固化对于消除可能对于导电墨水有害的导电环氧树脂中的溶剂和/或其它化学物可能是必要的。在操作608中，导电墨水可以被应用到衬底。例如，导电墨水可以被印刷、绘制、喷涂（等等）到衬底上，以形成电耦合到器件的导体。
虽然图6图解根据实施例的各个操作，但要理解的是，并非图6中所描绘的所有操作对于其它实施例而言是必要的。实际上，在此完全预期的是，在本公开的其它实施例中，图6中所描绘的操作和/或在此所描述的其它操作可以以任何附图中未具体示出的方式来组合，而仍与本公开完全一致。因此，针对一个附图中未明确示出的特征和/或操作的权利要求被认为处于本公开的范围和内容内。
如本申请以及权利要求中所使用的那样，由术语?“和/或?”结合的项的列表可以意味着所列出的项的任何组合。例如，短语?“A、B和/或C?”可以意味着A；B；C；A和B；A和C；B和C；或A、B和C。如本申请以及权利要求中所使用的那样，由术语?“……中的至少一个?”结合的项的列表可以意味着所列出的术语的任何组合。例如，短语?“A、B或C中的至少一个?”可以意味着A；B；C；A和B；A和C；B和C；或A、B和C。
如在此所使用的术语?“电耦合?”和?“电气地耦合?”等提及任何连接、耦合或链接等，通过这样的任何连接、耦合或链接等，由一个***元件承载的电信号和/或功率被给予到?“所耦合的?”元件。这样的“电耦合的?”器件或信号和器件并不一定被直接彼此连接，并且可以通过可以操控或修改这样的信号的中间组件或器件而被分离开。同样地，关于机械的或物理的连接或耦合而在此所使用的术语?“被连接的?”或?“被耦合的?”是相对的术语，并且不要求直接的物理连接。
因此，本公开针对用于将器件附接到柔性衬底的***。器件可以以在粘接剂有害的同时防止粘接剂接触导电墨水的方式来被耦合到柔性衬底。如果导电环氧树脂被用于将器件中的导电焊盘锚定到柔性衬底，则可以超越其上可以应用导电墨水的器件的边沿来应用导电环氧树脂以进行电连接。小孔也可以被形成在柔性衬底中，允许导电环氧树脂暴露在与器件位置相对的柔性衬底的表面上，导电墨水连接是在相对的表面上作出的。导电墨水也可以在被延伸超过器件的边沿时直接应用到导电焊盘。柔性衬底可以被预先印刷有电路路径，导电墨水将器件与电路路径连接。
根据一个方面，提供了一种线路。所述线路可以包括：柔性衬底；至少一个器件，耦合到所述柔性衬底；粘接剂，应用到所述柔性衬底，以将所述至少一个器件耦合到所述柔性衬底；以及导电墨水，应用到所述柔性衬底，以形成电耦合到所述至少一个器件的导体，所述导电墨水在所述粘接剂之后被应用。
根据另一方面，提供了一种方法。所述方法可以包括：将粘接剂应用到柔性衬底；使用所述粘接剂将包括至少一个导电焊盘的至少一个器件耦合到所述衬底；以及将导电墨水应用到所述柔性衬底，以形成电耦合到所述至少一个器件的导体。
虽然已经在此描述了发明的原理，但本领域技术人员要理解的是，该描述仅是通过示例的方式作出的并且不作为对于发明的范围的限制。除了在此所示出并且描述的示例性实施例之外，在本发明的范围内预期有其它实施例。本领域技术人员进行的修改和替代被看作在本发明的范围内，本发明的范围除了由随后的权利要求限制以外不受限制。

Claims (14)

1.一种线路，包括：
柔性衬底；
至少一个器件，耦合到所述柔性衬底；
粘接剂，被应用到所述柔性衬底，以将所述至少一个器件耦合到所述柔性衬底；以及
导电墨水，被应用到所述柔性衬底，以形成电耦合到所述至少一个器件的导体，所述导电墨水是在所述粘接剂之后被应用的。
2.如权利要求1所述的线路，其中，在所述导电墨水被应用到所述柔性衬底之前，固化所述粘接剂。
3.如权利要求1所述的线路，其中，所述至少一个器件包括至少一个导电焊盘，并且所述粘接剂是通过将所述至少一个导电焊盘粘接到所述柔性衬底来将所述至少一个器件锚定到所述柔性衬底的导电环氧树脂。
4.如权利要求3所述的线路，其中，所述导电环氧树脂被应用到所述柔性衬底，从而所述导电环氧树脂的至少一部分当被耦合到所述柔性衬底时被暴露成超越所述至少一个器件的边沿，并且其中，所述导电墨水被应用在所述导电环氧树脂的被暴露的部分的至少一部分上，以形成电耦合到所述至少一个器件的导体。
5.如权利要求3所述的线路，其中，所述柔性衬底包括开孔，所述开孔在所述至少一个器件被耦合到所述柔性衬底时被形成在与所述至少一个导电焊盘对应的柔性衬底的表面上的位置中，所述开孔从所述柔性衬底的表面穿过到相对的表面，所述导电环氧树脂被应用到所述柔性衬底以填充所述开孔，从而当所述至少一个器件被耦合到所述柔性衬底时，所述导电环氧树脂被暴露在所述柔性衬底的所述相对的表面上，并且其中，所述导电墨水被应用到所述柔性衬底的所述相对的表面并且在所暴露的导电环氧树脂上，以形成电耦合到所述至少一个器件的导体。
6.如权利要求1所述的线路，其中，所述至少一个器件包括至少一个导电焊盘，所述至少一个导电焊盘包括超越所述至少一个器件的边沿延伸的部分，并且所述粘接剂是非导电环氧树脂。
7.如权利要求6所述的线路，其中，所述导电墨水被应用在延伸超越所述至少一个器件的边沿的所述至少一个导电焊盘的部分的至少一部分上，以形成电耦合到所述至少一个器件的导体。
8.如权利要求1所述的线路，进一步包括至少一个电路路径，所述至少一个电路路径被印刷在所述柔性衬底上，所述导体将所述至少一个印刷电路路径耦合到所述至少一个器件。
9.一种方法，包括：
将粘接剂应用到柔性衬底；
使用所述粘接剂将包括至少一个导电焊盘的至少一个器件耦合到所述衬底；以及
将导电墨水应用到所述柔性衬底，以形成电耦合到所述至少一个器件的导体。
10.如权利要求9所述的方法，进一步包括：
在将所述导电墨水应用到所述柔性衬底之前，固化所述粘接剂。
11.如权利要求9所述的方法，其中：
所述粘接剂是导电环氧树脂；以及
将导电墨水应用到所述柔性衬底包括：将导电墨水应用到超越所述至少一个器件的边沿而暴露的所述导电环氧树脂的部分的至少一部分上，以形成电耦合到所述至少一个器件的导体。
12.如权利要求9所述的方法，其中：
所述粘接剂是非导电环氧树脂；以及
将导电墨水应用到所述柔性衬底包括：将导电墨水应用到超越所述至少一个器件的边沿而暴露的所述至少一个导电焊盘的部分的至少一部分上，以形成电耦合到所述至少一个器件的导体。
13.如权利要求9所述的方法，进一步包括：
当所述至少一个器件被耦合到所述柔性衬底时，在与所述至少一个导电焊盘对应的所述柔性衬底的表面上的位置中形成开孔，所述开孔从所述柔性衬底的所述表面穿过到相对的表面；
将导电环氧树脂应用到所述柔性衬底，以填充所述开孔，从而当所述至少一个器件被耦合到所述柔性衬底时，所述导电环氧树脂被暴露在所述柔性衬底的所述相对的表面上；以及
将导电墨水应用到所述柔性衬底的所述相对的表面并且在所暴露的导电环氧树脂上，以形成电耦合到所述至少一个器件的导体。
14.如权利要求9所述的方法，进一步包括：
在所述柔性衬底上印刷至少一个电路路径，所述导体将所述至少一个印刷电路路径耦合到所述至少一个器件。
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