CN105466100A - Heat exchanging device and semiconductor cooling refrigerator comprising same - Google Patents
Heat exchanging device and semiconductor cooling refrigerator comprising same Download PDFInfo
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- CN105466100A CN105466100A CN201510997071.8A CN201510997071A CN105466100A CN 105466100 A CN105466100 A CN 105466100A CN 201510997071 A CN201510997071 A CN 201510997071A CN 105466100 A CN105466100 A CN 105466100A
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- heat exchanging
- fins set
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
- F25D17/062—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation in household refrigerators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/09—Improving heat transfers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/12—Sound
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The invention relates to a heat exchanging device and a semiconductor cooling refrigerator comprising the same. Specifically, the heat exchanging device comprises two heat exchanging parts and an air feeding device. The two heat exchanging parts are symmetrically arranged relative to a geometrical plane, and each heat exchanging part is provided with two fin sets; each fin set is provided with a plurality of parallel fins which are arranged at intervals; the two fin sets are arranged in a spaced mode in the length direction or the width direction of the fins. The air feeding device is arranged between the two heat exchanging parts and arranged to suck airflow from one sides of the two heat exchanging parts and blow the airflow to the four fin sets so as to make the airflow enter a space between every two adjacent fins in each fin set. Besides, the invention further provides the semiconductor cooling refrigerator comprising the heat exchanging device. According to the heat exchanging device, due to the fact that the air feeding device is arranged in the center of the four fin sets, the airflow can be blown and fed to the four fin sets at the same time, and the thickness of the heat exchanging device can be reduced. The heat exchanging device is especially suitable for heat radiation of the semiconductor cooling refrigerator.
Description
Technical field
The present invention relates to refrigerating equipment, particularly relate to a kind of heat-exchanger rig and there is the semiconductor freezer of this heat-exchanger rig.
Background technology
Semiconductor freezer, is also referred to as thermoelectric refrigerator.It utilizes semiconductor chilling plate to realize refrigeration by heat pipe heat radiation and conduction technique and automatic pressure-transforming Variable flow control technology, without the need to refrigeration working medium and mechanical moving element, solves the application problem of traditional mechanical refrigerator such as medium pollution and mechanical oscillation.But, the cold junction of semiconductor chilling plate is while refrigeration, a large amount of heats can be produced in its hot junction, for ensureing that semiconductor chilling plate reliably carries out work constantly, need to dispel the heat to hot junction in time, but the scheme of by arranging blower fan fin being carried out to forced convertion heat radiation in prior art, is generally used for the hot-side heat dissipation of semiconductor chilling plate, to improve heat exchange efficiency, but the volume of radiating fin own is larger; In addition, axial flow blower is set in the side of radiating fin group, with to the gap blow flow between every two adjacent fins, or sucks air-flow from the gap between every two adjacent fins.The volume ratio of this heat exchanger is comparatively large, needs the problems such as installing space is large, is not suitable for installing in less space.In addition, hot-side heat dissipation normally reaches the object of heat radiation by the rotating speed and power increasing blower fan, radiating efficiency is poor and the large energy consumption of noise is high.
Summary of the invention
One object of the present invention is intended at least one defect overcoming existing heat-exchanger rig, provides a kind of heat-exchanger rig of novel structure, and it has less thickness, is specially adapted to the heat radiation of semiconductor freezer.
A further object of first aspect present invention to improve the heat exchange efficiency of heat-exchanger rig.
As far as possible another further object of first aspect present invention to reduce the noise of heat-exchanger rig.
An object of second aspect present invention to provide a kind of semiconductor freezer with above-mentioned heat-exchanger rig.
According to an aspect of the present invention, the invention provides a kind of heat-exchanger rig for semiconductor freezer.This heat-exchanger rig comprises:
Two heat exchanging part, described two heat exchanging part are arranged symmetrically with about a geometrical plane, and each described heat exchanging part has two fins set, each described fins set has the fin that multiple parallel interval is arranged, and described two fins set are arranged along the length direction of described fin or width interval; With
Air-supply arrangement, is arranged between two described heat exchanging part, is configured to suck air-flow from the side of described two heat exchanging part, and air-flow is blowed to four described fins set, to enter in each described fins set between every two adjacent fins to make air-flow.
Alternatively, described air-supply arrangement comprises:
Ducting assembly, is limited with central housing cavity in it, and is communicated with four supply air ducts in the gap in described central housing cavity and four described fins set between every two adjacent fins respectively; With
Centrifugal wind wheel, is installed in described central housing cavity, is configured to suck air-flow from its axial direction, and air-flow is flowed out from its radial direction, is split into four tunnels, to blow respectively to four described fins set by four described supply air ducts.
Alternatively, described heat-exchanger rig also comprises:
Two heat-transfer devices, each described heat-transfer device is symmetrical about described geometrical plane, and
The middle part of each described heat-transfer device is configured to absorb heat or cold from thermal source or low-temperature receiver;
A fins set of a described heat exchanging part and a fins set of heat exchanging part described in another are arranged at the two ends of a described heat-transfer device;
Another fins set of a described heat exchanging part and another fins set of heat exchanging part described in another are arranged at the two ends of heat-transfer device described in another.
Alternatively, each described heat-transfer device comprises:
Heat-conducting substrate, has and described thermal source or the hot linked heat-transfer surface of low-temperature receiver; With
Many heat carriers, length direction along described fin is spaced, heat carrier described in every root comprise the middle part heat carrier section that is fixed on described heat-conducting substrate and be positioned at heat carrier section both sides, described middle part, perpendicular to the straight heat carrier section in two ends of described geometrical plane, two end straight heat carrier sections of heat carrier described in every root extend respectively through the poling hole of each fin be mounted thereon.
Alternatively, the middle part heat carrier section of heat carrier described in every root comprises: the straight heat carrier section in middle part, and two connection heat carrier sections that the two ends of straight heat carrier section extend to both sides from described middle part respectively; And
In each described heat-transfer device, the straight heat carrier section in multiple described middle part is in same plane, the straight heat carrier section in multiple described end is in same plane, and the distance between every two adjacent middle part straight heat carrier sections is less than the distance between every two adjacent straight heat carrier sections in end, the distance between described middle part straight heat carrier section and described heat-transfer surface is less than the distance between described end straight heat carrier section and described heat-transfer surface.
Alternatively, heat carrier described in every root is heat pipe.
Alternatively, the width of each described fin is 1/7 to 3/7 of its length.
According to a second aspect of the invention, the invention provides a kind of semiconductor freezer, the heat-insulation layer comprising inner bag, semiconductor chilling plate and be arranged on rear side of described inner bag, especially, also comprise:
Back cover, the rear surface of itself and described heat-insulation layer is limited with installing space, and it offers air inlet, and is positioned at four air outlets of described air inlet periphery; With
Any one heat-exchanger rig above-mentioned, two heat exchanging part and air-supply arrangement are all installed in described installing space; And
Two fins set of each described heat exchanging part and the hot junction of described semiconductor chilling plate thermally coupled directly or indirectly;
Described air-supply arrangement is configured to impel air-flow to enter in described air-supply arrangement from described air inlet, flows to four described fins set afterwards, to carry out heat exchange with the fin of each described fins set, after flow out described installing space from four described air outlets.
Alternatively, described four air outlets are arranged to two row along the width of described inner bag;
A described heat exchanging part is arranged between two described air outlets in row, and heat exchanging part described in another is arranged between two described air outlets in another row.
Alternatively, described semiconductor chilling plate is two, and vertically interval is arranged; And
Each heat-transfer device of described heat-exchanger rig contacts against with the hot junction of a described semiconductor chilling plate respectively, is passed to two described heat exchanging part so that the hot junction of each described semiconductor chilling plate is produced heat.
Heat-exchanger rig of the present invention and semiconductor freezer, because air-supply arrangement is arranged at the central authorities of four fins set, not only simultaneously to four fins set blow flow, and can reduces the thickness of heat-exchanger rig, be specially adapted to the heat radiation of semiconductor freezer.In addition, there are two heat exchanging part and each heat exchanging part has the area of dissipation that two fins set also can improve heat-exchanger rig, improve radiating efficiency.Adopt an air-supply arrangement to make air-flow flow through from four fins set simultaneously, air-supply arrangement utilization rate can be improved, and the noise of heat-exchanger rig can be reduced.
According to hereafter by reference to the accompanying drawings to the detailed description of the specific embodiment of the invention, those skilled in the art will understand above-mentioned and other objects, advantage and feature of the present invention more.
Accompanying drawing explanation
Hereinafter describe specific embodiments more of the present invention with reference to the accompanying drawings by way of example, and not by way of limitation in detail.Reference numeral identical in accompanying drawing denotes same or similar parts or part.It should be appreciated by those skilled in the art that these accompanying drawings may not be drawn in proportion.In accompanying drawing:
Fig. 1 is the schematic elevational view of heat-exchanger rig according to an embodiment of the invention;
Fig. 2 is the schematic side elevation of heat-exchanger rig according to an embodiment of the invention;
Fig. 3 is the schematic side elevation of semiconductor freezer according to an embodiment of the invention;
Fig. 4 is the schematic rear view of semiconductor freezer according to an embodiment of the invention.
Detailed description of the invention
Fig. 1 and Fig. 2 is schematic elevational view and the side view of heat-exchanger rig 600 according to an embodiment of the invention respectively.As depicted in figs. 1 and 2, embodiments provide a kind of heat-exchanger rig 600 for semiconductor freezer, it can comprise two heat exchanging part and air-supply arrangement 620.Two heat exchanging part can be respectively the first heat exchanging part 610 and the second heat exchanging part 610', and are arranged symmetrically with about a geometrical plane.Each heat exchanging part has two fins set 611, and each fins set 611 has the fin that multiple parallel interval is arranged, and in each heat exchanging part, two fins set 611 are arranged along the length direction of fin or width interval.Air-supply arrangement 620 can be arranged between two heat exchanging part, specifically can in the central position of four fins set 611.This air-supply arrangement 620 can be configured to suck air-flow from the side of two heat exchanging part, and air-flow is blowed to four fins set, enters in each fins set between every two adjacent fins, to take away the cold/heat on fin to make air-flow.Preferably, the width of each fin is 1/7 to 3/7 of its length.When the inner bag rear wall of the fin in each fins set 611 perpendicular to refrigerator, two fins set 611 of each heat exchanging part are preferably arranged along the length direction interval of fin.When the fin in each fins set 611 is parallel to the inner bag rear wall of refrigerator, two fins set 611 of each heat exchanging part can be arranged along the length direction of fin or width interval, arrange like this, all can reduce the thickness of heat-exchanger rig.
In some embodiments of the invention, air-supply arrangement 620 can comprise ducting assembly 621 and centrifugal wind wheel 622.Be limited with central housing cavity in ducting assembly 621, and be communicated with four supply air ducts in the gap in central housing cavity and four fins set between every two adjacent fins respectively.Each supply air duct can extend from central housing cavity to a fins set flaring.Centrifugal wind wheel 622 can be installed in central housing cavity, is configured to suck air-flow from its axial direction, and air-flow is flowed out from its radial direction, is split into four tunnels, to blow respectively to four fins set by four supply air ducts.
In some embodiments of this embodiment, heat-exchanger rig 600 also comprises two heat-transfer devices 630, each heat-transfer device 630 is symmetrical about above-mentioned geometrical plane, and the middle part of each heat-transfer device 630 is configured to absorb heat or cold from thermal source or low-temperature receiver, can absorb heat or cold to make this heat-exchanger rig 600 from two thermals source simultaneously.A fins set of a heat exchanging part and a fins set of another heat exchanging part are arranged at the two ends of a heat-transfer device; Another fins set of a heat exchanging part and another fins set of another heat exchanging part are arranged at the two ends of another heat-transfer device.That is, a fins set 611 of the first heat exchanging part 610 and a fins set 611 of the second heat exchanging part 610' are arranged at the two ends of a heat-transfer device 630; Another fins set 611 of first heat exchanging part 610 and another fins set 611 of the second heat exchanging part 610' are arranged at the two ends of another heat-transfer device 630, the heat of a corresponding thermal source or low-temperature receiver or cold can be passed to a fins set 611 of the first heat exchanging part 610 and a fins set 611 of the second heat exchanging part 610' to make each heat-exchanger rig 600.
Particularly, each heat-transfer device 630 comprises heat-conducting substrate 631 and Duo Gen heat carrier 632.Heat-conducting substrate 631 has and thermal source or the hot linked heat-transfer surface of low-temperature receiver.Many heat carriers 632 can be spaced along the length direction of fin.And every root heat carrier 632 can be heat pipe, comprise the middle part heat carrier section that is fixed on heat-conducting substrate 631 and be positioned at heat carrier section both sides, middle part, perpendicular to the straight heat carrier section in two ends of geometrical plane.The middle part heat carrier section of every root heat carrier 632 comprises: the straight heat carrier section in middle part, and two connection heat carrier sections that the two ends of straight heat carrier section extend to both sides from middle part respectively.Two end straight heat carrier sections of every root heat carrier 632 extend respectively through the poling hole of each fin be mounted thereon.
Preferably, in each heat-transfer device 630, the straight heat carrier section in multiple middle part is in same plane, the straight heat carrier section in multiple end is in same plane, and the distance between every two adjacent middle part straight heat carrier sections is less than the distance between every two adjacent straight heat carrier sections in end, the distance between multiple middle part straight heat carrier section and heat-transfer surface is less than the distance between the straight heat carrier section in multiple end and heat-transfer surface.Such setting, can make heat-exchanger rig 600 have special structure, is convenient to heat-exchanger rig 600 to be installed on semiconductor freezer.
The straight heat carrier section in middle part is fixedly connected with mode and can is with heat-conducting substrate 631: heat-conducting substrate 631 only has a base plate, and it is opposing offers multiple holding tank in heat-transfer surface side; The straight heat carrier section in middle part of many heat carriers 632 is by the embedding holding tank that presses, and this mode connects reliably, thermal resistivity is low.The straight heat carrier section in middle part is fixedly connected with mode and also can is with heat-conducting substrate 631: heat-conducting substrate 631 can have base plate and cover plate, and the opposing of base plate offers multiple holding tank in heat-transfer surface side; The straight heat carrier section in middle part of many heat carriers 632 is by the embedding holding tank that presses; It is opposing in heat-transfer surface side that cover plate is installed on heat-conducting substrate 631, straight for the middle part of many heat carriers 632 heat carrier section to be folded in therebetween with base plate.
In some substituting embodiments, each heat-transfer device 630 can be the heat-conducting plate of strip, and the middle part of one side is heat-transfer surface.Four fins set 611 are arranged at the two ends of two heat-conducting plates respectively, and the fin of each fins set 611 extends from the another side of heat-conducting plate.Heat-conducting plate can be plate-type heat-pipe.In other substituting embodiments, two fins set 611 of the first heat exchanging part 610 can be installed on a heat-transfer device 630, and two fins set 611 of the second heat exchanging part 610' can be installed on another heat-transfer device 630.Particularly, each heat-transfer device 630 can comprise heat-conducting substrate 631 and many single u-shaped heat-conductive thermo tube.The middle part of each U-shaped heat-conductive thermo tube is thermally coupled with the hot junction of semiconductor chilling plate by heat-conducting substrate 631.The two ends of each U-shaped heat-conductive thermo tube are provided with a fins set 611.
Further, the embodiment of the present invention additionally provides a kind of semiconductor freezer using above-mentioned heat-exchanger rig 600, Fig. 3 and Fig. 4 is schematic side elevation and the rearview of semiconductor freezer according to an embodiment of the invention respectively.As shown in Figure 3 to Figure 4, the semiconductor freezer of the present embodiment can comprise semiconductor module 100, inner bag 200, shell, chamber door 300 and heat-insulation layer 400.Storage space is limited with in inner bag 200.Generally there are two kinds of structures in the shell of semiconductor freezer, a kind of be pin-connected panel, be namely assembled into a complete casing by top cover, left side plate, back cover 510, lower shoe etc.Another kind is monoblock type, by top cover and left side plate on request rolling become one to fall " U " font, be called U shell, then be welded into casing with back cover 510, lower shoe point.The semiconductor freezer of the embodiment of the present invention preferably uses monoblock type shell, and namely shell includes U shell and back cover 510.Back cover 510 can be limited with installing space with the rear surface of the heat-insulation layer 400 be positioned on rear side of inner bag 200, and back cover 510 offers air inlet, and is positioned at four air outlets of air inlet periphery.
In this embodiment, the semiconductor module 100 of semiconductor freezer can comprise semiconductor chilling plate, cold junction heat-exchanger rig and hot junction heat-exchanger rig.Heat-insulation layer 400 on rear side of the rear wall of inner bag 200 and inner bag 200 offers installing hole.Cold junction heat-exchanger rig can comprise cool guiding block, cold scattering substrate, the multiple cold scattering fins be formed on cold scattering substrate, and for the cold scattering fan of forced convertion cold scattering.Cool guiding block and semiconductor chilling plate are installed in installing hole, and the cold end surface thermo-contact of the rear surface of cool guiding block and semiconductor chilling plate.
Hot junction heat-exchanger rig can be the heat-exchanger rig 600 in above-mentioned any embodiment, and two heat exchanging part and air-supply arrangement 620 are all installed in installing space.Two fins set 611 of each heat exchanging part are thermally coupled directly or indirectly with the hot junction of semiconductor chilling plate.Air-supply arrangement 620 can be configured to impel air-flow to enter in air-supply arrangement 620 from air inlet, flows to four fins set 611 afterwards, to carry out heat exchange with the fin of each fins set, after flow out installing spaces from four air outlets.
Particularly, the air inlet of air-supply arrangement aligns in the longitudinal direction with the air inlet on back cover, and namely the air inlet of air-supply arrangement is right against the air inlet on back cover.Four air outlets are arranged to two row along the width of inner bag.A heat exchanging part is arranged between two air outlets in row, and another heat exchanging part is arranged between two air outlets in another row.
In this embodiment, semiconductor module 100 can be two, then semiconductor chilling plate can be two, and vertically interval is arranged, to improve refrigerating efficiency.Heat-exchanger rig 600 also can comprise two heat-transfer devices 630.The heat-transfer surface of the heat-conducting substrate 631 of each heat-transfer device 630 and the hot junction of a semiconductor chilling plate contact against, the heat of each semiconductor chilling plate to be passed to the first heat exchanging part 610 and the second heat exchanging part 610'.
So far, those skilled in the art will recognize that, although multiple exemplary embodiment of the present invention is illustrate and described herein detailed, but, without departing from the spirit and scope of the present invention, still can directly determine or derive other modification many or amendment of meeting the principle of the invention according to content disclosed by the invention.Therefore, scope of the present invention should be understood and regard as and cover all these other modification or amendments.
Claims (10)
1., for a heat-exchanger rig for semiconductor freezer, it is characterized in that comprising:
Two heat exchanging part, described two heat exchanging part are arranged symmetrically with about a geometrical plane, and each described heat exchanging part has two fins set, each described fins set has the fin that multiple parallel interval is arranged, and described two fins set are arranged along the length direction of described fin or width interval; With
Air-supply arrangement, is arranged between two described heat exchanging part, is configured to suck air-flow from the side of described two heat exchanging part, and air-flow is blowed to four described fins set, to enter in each described fins set between every two adjacent fins to make air-flow.
2. heat-exchanger rig according to claim 1, is characterized in that, described air-supply arrangement comprises:
Ducting assembly, is limited with central housing cavity in it, and is communicated with four supply air ducts in the gap in described central housing cavity and four described fins set between every two adjacent fins respectively; With
Centrifugal wind wheel, is installed in described central housing cavity, is configured to suck air-flow from its axial direction, and air-flow is flowed out from its radial direction, is split into four tunnels, to blow respectively to four described fins set by four described supply air ducts.
3. heat-exchanger rig according to claim 1, is characterized in that, also comprises:
Two heat-transfer devices, each described heat-transfer device is symmetrical about described geometrical plane, and
The middle part of each described heat-transfer device is configured to absorb heat or cold from thermal source or low-temperature receiver;
A fins set of a described heat exchanging part and a fins set of heat exchanging part described in another are arranged at the two ends of a described heat-transfer device;
Another fins set of a described heat exchanging part and another fins set of heat exchanging part described in another are arranged at the two ends of heat-transfer device described in another.
4. heat-exchanger rig according to claim 3, is characterized in that, each described heat-transfer device comprises:
Heat-conducting substrate, has and described thermal source or the hot linked heat-transfer surface of low-temperature receiver; With
Many heat carriers, length direction along described fin is spaced, heat carrier described in every root comprise the middle part heat carrier section that is fixed on described heat-conducting substrate and be positioned at heat carrier section both sides, described middle part, perpendicular to the straight heat carrier section in two ends of described geometrical plane, two end straight heat carrier sections of heat carrier described in every root extend respectively through the poling hole of each fin be mounted thereon.
5. heat-exchanger rig according to claim 4, is characterized in that,
The middle part heat carrier section of heat carrier described in every root comprises: the straight heat carrier section in middle part, and two connection heat carrier sections that the two ends of straight heat carrier section extend to both sides from described middle part respectively; And
In each described heat-transfer device, the straight heat carrier section in multiple described middle part is in same plane, the straight heat carrier section in multiple described end is in same plane, and the distance between every two adjacent middle part straight heat carrier sections is less than the distance between every two adjacent straight heat carrier sections in end, the distance between described middle part straight heat carrier section and described heat-transfer surface is less than the distance between described end straight heat carrier section and described heat-transfer surface.
6. heat-exchanger rig according to claim 4, is characterized in that,
Heat carrier described in every root is heat pipe.
7. heat-exchanger rig according to claim 1, is characterized in that,
The width of each described fin is 1/7 to 3/7 of its length.
8. a semiconductor freezer, the heat-insulation layer comprising inner bag, semiconductor chilling plate and be arranged on rear side of described inner bag, is characterized in that, also comprises:
Back cover, the rear surface of itself and described heat-insulation layer is limited with installing space, and it offers air inlet, and is positioned at four air outlets of described air inlet periphery; With
Heat-exchanger rig according to any one of claim 1 to 7, two heat exchanging part and air-supply arrangement are all installed in described installing space; And
Two fins set of each described heat exchanging part and the hot junction of described semiconductor chilling plate thermally coupled directly or indirectly;
Described air-supply arrangement is configured to impel air-flow to enter in described air-supply arrangement from described air inlet, flows to four described fins set afterwards, to carry out heat exchange with the fin of each described fins set, after flow out described installing space from four described air outlets.
9. semiconductor freezer according to claim 8, is characterized in that,
Described four air outlets are arranged to two row along the width of described inner bag;
A described heat exchanging part is arranged between two described air outlets in row, and heat exchanging part described in another is arranged between two described air outlets in another row.
10. semiconductor freezer according to claim 8, is characterized in that,
Described semiconductor chilling plate is two, and vertically interval is arranged; And
Each heat-transfer device of described heat-exchanger rig contacts against with the hot junction of a described semiconductor chilling plate respectively, is passed to two described heat exchanging part so that the hot junction of each described semiconductor chilling plate is produced heat.
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| CN201510997071.8A CN105466100B (en) | 2015-12-24 | 2015-12-24 | Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510997071.8A CN105466100B (en) | 2015-12-24 | 2015-12-24 | Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig |
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| CN105466100A true CN105466100A (en) | 2016-04-06 |
| CN105466100B CN105466100B (en) | 2018-10-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111043792A (en) * | 2019-12-31 | 2020-04-21 | 杭州非同工业设计有限公司 | Semiconductor refrigerating device |
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| CN104329848A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator |
| CN104197612A (en) * | 2014-09-03 | 2014-12-10 | 四川航天***工程研究所 | High-efficiency cooling assembly of semiconductor refrigerator |
| CN204612555U (en) * | 2015-04-30 | 2015-09-02 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
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| CN111043792A (en) * | 2019-12-31 | 2020-04-21 | 杭州非同工业设计有限公司 | Semiconductor refrigerating device |
| CN111043792B (en) * | 2019-12-31 | 2024-02-09 | 杭州非同工业设计有限公司 | Semiconductor refrigerating device |
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