CN205537253U - Heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator - Google Patents
Heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator Download PDFInfo
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- CN205537253U CN205537253U CN201521103575.2U CN201521103575U CN205537253U CN 205537253 U CN205537253 U CN 205537253U CN 201521103575 U CN201521103575 U CN 201521103575U CN 205537253 U CN205537253 U CN 205537253U
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Abstract
The utility model relates to a heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator. Particularly, the utility model provides a heat transfer device, it includes first heat transfer portion, first heat transfer portion has: two fin groups, every fin group have the fin that a plurality of parallel intervals set up, and just two fins are organized and are set up along the length direction interval of fin, and the fan, set up in between two fins groups, configure into and impel air current clearance between per two adjacent fins from the fin group to flow in the clearance between per two adjacent fins in to another fin group. Furthermore, the utility model also provides a semiconductor refrigeration refrigerator that has this heat transfer device. The utility model discloses a because the fan sets up in between two fins groups, and lie in the one end outside department of every fin among the heat transfer device, can reduce heat transfer device's thickness, the heat dissipation of specially adapted semiconductor refrigeration refrigerator.
Description
Technical field
This utility model relates to refrigerating equipment, particularly relates to a kind of heat-exchanger rig and has this heat exchange dress
The semiconductor freezer put.
Background technology
Semiconductor freezer, also referred to as thermoelectric refrigerator.It utilizes semiconductor chilling plate to pass through heat pipe heat radiation
And conduction technique and automatic pressure-transforming Variable flow control technology realize refrigeration, it is not necessary to refrigeration working medium and mechanical movement portion
Part, solves the application problem of the traditional mechanical refrigerator such as medium pollution and mechanical vibration.But, partly lead
The cold end of body cooling piece, while refrigeration, can produce substantial amounts of heat, for ensureing quasiconductor system in its hot junction
Cold is reliably continued for work, needs to dispel the heat hot junction in time, but for half in prior art
The hot-side heat dissipation of conductor cooling piece generally uses and fin is carried out forced convertion heat radiation by arranging blower fan
Scheme, to improve heat exchange efficiency, but the volume of radiating fin own is bigger；It addition, in radiating fin group
Side arranges axial flow blower, with the gap blow flow between the fin adjacent to each two, or from each two
Gap suction airflow between adjacent fin.The volume ratio of this heat exchanger is relatively big, needs installing space
The problem such as big, is not suitable for installing in less space.Additionally, hot-side heat dissipation is typically by increasing blower fan
Rotating speed and power reach the purpose of heat radiation, radiating efficiency difference and the big energy consumption of noise are high.
Utility model content
A purpose of the present utility model is intended to overcome at least one defect of existing heat-exchanger rig, it is provided that one
Planting the heat-exchanger rig of novel structure, it has less thickness, is particularly well-suited to dissipating of semiconductor freezer
Heat.
One of this utility model first aspect further objective is that the noise as far as possible reducing heat-exchanger rig.
One purpose of this utility model second aspect is to provide for a kind of having partly leading of above-mentioned heat-exchanger rig
System cold refrigerator.
According to an aspect of the present utility model, this utility model provides a kind of for semiconductor freezer
Heat-exchanger rig.This heat-exchanger rig includes that the first heat exchanging part, described first heat exchanging part have:
Two fins set, each described fins set has the fin that multiple parallel interval is arranged, and said two
Fins set is spaced setting along the length direction of described fin；With
Blower fan, is arranged between two described fins set, is configured to promote air-flow from a described fins set
Gap between each two adjacent fins in fins set another described between each two adjacent fins gap flowing.
Alternatively, described blower fan is axial flow blower, and its rotation axis extends along the length direction of described fin.
Alternatively, described first heat exchanging part also includes two ducting assemblies, is arranged at the both sides of described blower fan,
And each described ducting assembly limits gas channel, to connect the adjacent wing of each two in a described fins set
Gap between sheet and described blower fan.
Alternatively, described heat-exchanger rig also includes the second heat exchanging part, with described first heat exchanging part about a geometry
Plane symmetry is arranged.
Alternatively, described heat-exchanger rig also includes:
Two heat-transfer devices, each described heat-transfer device is symmetrical about described geometrical plane, and
The middle part of each described heat-transfer device is configured to absorb heat or cold from thermal source or low-temperature receiver；
One fins set of described first heat exchanging part and a fins set of described second heat exchanging part are arranged at one
The two ends of individual described heat-transfer device；
Another fins set of described first heat exchanging part and another fins set of described second heat exchanging part are arranged at separately
The two ends of heat-transfer device described in.
Alternatively, each described heat-transfer device includes:
Heat-conducting substrate, has heat-transfer surface hot linked with described thermal source or low-temperature receiver；With
Many heat carriers, the length direction along described fin is spaced, and every described heat carrier includes fixing
In described heat-conducting substrate middle part heat carrier section and be positioned at heat carrier section both sides, described middle part, be perpendicular to described
Two end straight heat carrier sections of geometrical plane, two end straight heat carrier sections of every described heat carrier are respectively
Extend through the poling hole of each fin being mounted thereon.
Alternatively, the middle part heat carrier section of every described heat carrier includes: middle part straight heat carrier section, Yi Jifen
Two the connection heat carrier sections not extended to both sides from the two ends of described middle part straight heat carrier section；And
In each described heat-transfer device, multiple described middle parts straight heat carrier section is in same plane, multiple
Described end straight heat carrier section is in same plane, and between the adjacent middle part straight heat carrier section of each two
Distance between the end straight heat carrier section that distance is adjacent less than each two, described middle part straight heat carrier section and institute
State the distance between heat-transfer surface less than the distance between described end straight heat carrier section and described heat-transfer surface.
Alternatively, the width of each described fin is the 1/7 to 3/7 of its length；
The width of each described fins set is the 1/3 to 2/3 of the length of each described fin.
According to second aspect of the present utility model, this utility model provides a kind of semiconductor freezer, bag
Include inner bag, semiconductor chilling plate and be arranged at the heat-insulation layer on rear side of described inner bag, especially, also including:
Back cover, it defines installing space with the rear surface of described heat-insulation layer, and offers the first air intake on it
Mouth and the first air outlet；With
Any of the above-described kind of heat-exchanger rig, two fins set of its first heat exchanging part and blower fan are mounted on described peace
Dress space in and be between described first air inlet and described first air outlet；And
Two fins set of described first heat exchanging part are with the hot junction of described semiconductor chilling plate directly or indirectly
Thermally coupled；
The blower fan of described first heat exchanging part is configured to promote air-flow to enter described installation from described first air inlet
Space, flows out described installation sky via after two fins set of described first heat exchanging part from described first air outlet
Between.
Alternatively, described first air outlet is arranged at the top of described first air inlet；
It is further opened with the second air inlet on described back cover and is in the second air-out above described second air inlet
Mouthful；And
Two fins set of the second heat exchanging part of described heat-exchanger rig and blower fan are mounted on described installing space
In and be between described second air inlet and described second air outlet；And
Two fins set of described second heat exchanging part are with the hot junction of described semiconductor chilling plate directly or indirectly
Thermally coupled；
The blower fan of described second heat exchanging part is configured to promote air-flow to enter described installation from described second air inlet
Space, flows out described installation sky via after two fins set of described second heat exchanging part from described second air outlet
Between.
Heat-exchanger rig of the present utility model and semiconductor freezer because blower fan be arranged at two fins set it
Between, and it is positioned at the outside, one end of each fin, it is possible to decrease and the thickness of heat-exchanger rig, it is particularly well-suited to partly lead
The heat radiation of system cold refrigerator.Additionally, there are two heat exchanging part and each heat exchanging part has two fins set and also may be used
Improve the area of dissipation of heat-exchanger rig.Use a blower fan to make air-flow flow through from two fins set simultaneously, can
Improve blower fan utilization rate, and the noise of heat-exchanger rig can be reduced.
According to below in conjunction with the accompanying drawing detailed description to this utility model specific embodiment, those skilled in the art
Will become more apparent from of the present utility model above-mentioned and other purposes, advantage and feature.
Accompanying drawing explanation
Describe in detail more of the present utility model the most by way of example, and not by way of limitation
Specific embodiment.Reference identical in accompanying drawing denotes same or similar parts or part.This area
It is to be understood by the skilled artisans that what these accompanying drawings were not necessarily drawn to scale.In accompanying drawing:
Fig. 1 is the schematic elevational view of the heat-exchanger rig according to one embodiment of this utility model；
Fig. 2 is the schematic side elevation of the heat-exchanger rig according to one embodiment of this utility model；
Fig. 3 is the schematic side elevation of the semiconductor freezer according to one embodiment of this utility model；
Fig. 4 is the schematic rear view of the semiconductor freezer according to one embodiment of this utility model.
Detailed description of the invention
Fig. 1 and Fig. 2 is the schematic main of the heat-exchanger rig 600 according to one embodiment of this utility model respectively
View and side view.As depicted in figs. 1 and 2, this utility model embodiment provides a kind of for quasiconductor
The heat-exchanger rig 600 of refrigerator, it can include the first heat exchanging part 610.First heat exchanging part 610 can have
Two fins set 611 and blower fan 612.Each fins set 611 has the fin that multiple parallel interval is arranged,
And with cold end/hot junction thermally coupled directly or indirectly of the semiconductor chilling plate in semiconductor freezer, and two
Individual fins set 611 can be spaced along the length direction of fin and arrange.Blower fan 612 may be disposed at two fins set 611
Between, it is configured to promote air-flow gap from a fins set 611 between each two adjacent fins to another wing
In sheet group 611, flow, to take away the cold/heat on fin in the gap between each two adjacent fins.Blower fan
612 are arranged between two fins set 611, and are positioned at the outside, one end of each fin, it is possible to decrease heat exchange
The thickness of device 600, is particularly well-suited to the heat radiation of semiconductor freezer.Preferably, blower fan 612 is axle
Flow fan, its rotation axis extends along the length direction of fin.The width of each fin is the 1/7 of its length
To 3/7.The width of each fins set 611 is the 1/3 to 2/3 of the length of each fin.
In some further embodiments of the present utility model, the first heat exchanging part 610 may also include two wind
Road assembly 613, is arranged at the both sides of blower fan 612, and each ducting assembly 613 limits gas channel,
Gap between each two adjacent fins and blower fan 612 in each gas channel one fins set 611 of connection.Tool
Body ground, the gap between each two adjacent fins and blower fan 612 in gas channel one fins set 611 of connection
Air inlet.Each two phase in the air outlet of another gas channel connection blower fan 612 and another fins set 611
Gap between adjacent fin.
Each ducting assembly 613 can include two side plates.Each side plate is from a corresponding fins set 611
One end of outside fin is extended, with one-body molded with this fin；Or, each side plate is also securable to one
One end of the outermost fin of corresponding fins set 611.Further, after available semiconductor freezer
Shell 510 grade and two side plates limit gas channel jointly；Each ducting assembly 613 also can farther include
Base plate and cover plate, to surround gas channel.
In embodiments more of the present utility model, as depicted in figs. 1 and 2, heat-exchanger rig 600 also can wrap
Include the second heat exchanging part 610'.Second heat exchanging part 610' also can have two fins set 611, blower fan 612 and two
Individual ducting assembly 613, and be arranged symmetrically with about a geometrical plane with the first heat exchanging part 610, to carry further
High heat exchange efficiency.
In some embodiments of this embodiment, heat-exchanger rig 600 also includes two heat-transfer devices 630,
Each heat-transfer device 630 is symmetrical about above-mentioned geometrical plane, and the middle part of each heat-transfer device 630 is configured to
Heat or cold is absorbed from thermal source or low-temperature receiver.One fins set 611 of the first heat exchanging part 610 and the second heat exchange
One fins set 611 of portion 610' is arranged at the two ends of a heat-transfer device 630；First heat exchanging part 610
Another fins set 611 of another fins set 611 and the second heat exchanging part 610' is arranged at another heat-transfer device 630
Two ends.It is to say, this heat-exchanger rig 600 simultaneously can absorb heats or cold from two thermals source, and often
One corresponding thermal source or the heat of low-temperature receiver or cold can be transferred to the first heat exchanging part 610 by individual heat-exchanger rig 600
A fins set 611 and a fins set 611 of the second heat exchanging part 610'.
Specifically, each heat-transfer device 630 includes heat-conducting substrate 631 and Duo Gen heat carrier 632.Heat conduction base
Plate 631 has heat-transfer surface hot linked with thermal source or low-temperature receiver.Many heat carriers 632 can be along the length side of fin
To being spaced.And, every heat carrier 632 can be heat pipe, including being fixed in heat-conducting substrate 631
Portion's heat carrier section and two that be positioned at heat carrier section both sides, middle part, to be perpendicular to geometrical plane straight heat carriers in end
Section.The middle part heat carrier section of every heat carrier 632 includes: middle part straight heat carrier section, and respectively from middle part
Two connection heat carrier sections that the two ends of straight heat carrier section extend to both sides.Two ends of every heat carrier 632
Portion's straight heat carrier section extends respectively through the poling hole of each fin being mounted thereon.
Preferably, in each heat-transfer device 630, multiple middle parts straight heat carrier section is in same plane,
Multiple ends straight heat carrier section is in same plane, and between the adjacent middle part straight heat carrier section of each two
Distance between the end straight heat carrier section that distance is adjacent less than each two, multiple middle parts straight heat carrier Duan Yuhuan
Distance between hot side is less than the distance between multiple ends straight heat carrier section and heat-transfer surface.So arrange, can make to change
Thermal 600 has special structure, it is simple to heat-exchanger rig 600 is installed on semiconductor freezer.
The straight heat carrier section in middle part is fixed connected mode with heat-conducting substrate 631 and can is: heat-conducting substrate 631 only has
Having a base plate, it is opposing offers multiple holding tank in heat-transfer surface side；The middle part of many heat carriers 632
Straight heat carrier section is by the embedding holding tank that presses, and this mode connects reliably, thermal resistivity is low.The straight heat conduction in middle part
Body section and heat-conducting substrate 631 fix connected mode: heat-conducting substrate 631 can have base plate and cover plate,
The opposing of base plate offers multiple holding tank in heat-transfer surface side；The straight heat carrier in middle part of many heat carriers 632
Section is by the embedding holding tank that presses；It is opposing in heat-transfer surface side that cover plate is installed on heat-conducting substrate 631, with the end
The middle part straight heat carrier section of many heat carriers 632 is folded in therebetween by plate.
In some alternative embodiments, each heat-transfer device 630 can be the heat-conducting plate of strip, one
The middle part of side is heat-transfer surface.Four fins set 611 are respectively arranged at the two ends of two heat-conducting plates, each wing
The fin of sheet group 611 extends from the another side of heat-conducting plate.Heat-conducting plate can be plate-type heat-pipe.At other
In alternative embodiment, two fins set 611 of the first heat exchanging part 610 are mountable to a heat-transfer device
On 630, two fins set 611 of the second heat exchanging part 610' are mountable on another heat-transfer device 630.Tool
Body ground, each heat-transfer device 630 can include heat-conducting substrate 631 and many single u-shaped heat-conductive thermo tube.Each U
The middle part of type heat-conductive thermo tube can be by the hot junction thermally coupled of heat-conducting substrate 631 with semiconductor chilling plate.Each U
The two ends of type heat-conductive thermo tube are provided with a fins set 611.
Further, this utility model embodiment additionally provides and a kind of uses partly leading of above-mentioned heat-exchanger rig 600
System cold refrigerator, Fig. 3 and Fig. 4 is the semiconductor freezer according to one embodiment of this utility model respectively
Schematic side elevation and rearview.As shown in Figure 3 to Figure 4, the semiconductor freezer of the present embodiment can
Including semiconductor module 100, inner bag 200, shell, chamber door 300 and heat-insulation layer 400.In inner bag 200
Define storage space.The shell of semiconductor freezer generally there are two kinds of structures, one be pin-connected panel,
I.e. it is assembled into a complete casing by top cover, left side plate, back cover 510, lower shoe etc..Another kind is
Monoblock type, will become an inverted " u " font by top cover with left side plate rolling on request, referred to as U shell, then with
Back cover 510, lower shoe point is welded into casing.The semiconductor freezer of this utility model embodiment is preferably used
Monoblock type shell, i.e. shell include U shell and back cover 510.Back cover 510 can be positioned on rear side of inner bag 200
The rear surface of heat-insulation layer 400 define and on installing space, and back cover 510, offer the first air inlet and
One air outlet.
In this embodiment, the semiconductor module 100 of semiconductor freezer can include semiconductor chilling plate,
Cold end heat-exchanger rig and hot junction heat-exchanger rig.Heat-insulation layer 400 on rear side of the rear wall of inner bag 200 and inner bag 200
On offer installing hole.Cold end heat-exchanger rig can include cool guiding block, cold scattering substrate, be formed on cold scattering substrate
Multiple cold scattering fins, and for the cold scattering fan of forced convertion cold scattering.Cool guiding block and semiconductor chilling plate
It is installed in installing hole, and the rear surface of cool guiding block thermally contacts with the cold end surface of semiconductor chilling plate.
Hot junction heat-exchanger rig can be the heat-exchanger rig 600 in any of the above-described embodiment, its first heat exchanging part 610
Two fins set 611 and blower fan 612 be mounted in installing space and be in the first air inlet and first going out
Between air port.And, two fins set 611 of the first heat exchanging part 610 are straight with the hot junction of semiconductor chilling plate
Connect or thermally coupled indirectly.The blower fan 612 of the first heat exchanging part 610 is configured to promote air-flow from the first air inlet
Enter installing space, flow out peace via after two fins set 611 of the first heat exchanging part 610 from the first air outlet
Dress space.
In order to improve heat exchange efficiency, heat-exchanger rig 600 farther includes the second heat exchanging part 610'.First air-out
Mouth is arranged at the top of the first air inlet；It is further opened with the second air inlet on back cover 510 and is in the second air intake
The second air outlet above Kou.First air inlet and the second air inlet at sustained height, the first air outlet
It is at sustained height with the second air outlet.Two fins set of the second heat exchanging part 610' of heat-exchanger rig 600
611 and blower fan 612 be mounted in installing space and be between the second air inlet and the second air outlet.And
And, two fins set 611 of the second heat exchanging part 610' and the direct or indirect underground heat in hot junction of semiconductor chilling plate
Connect；The blower fan 612 of the second heat exchanging part 610' is configured to promote air-flow to enter installing space from the second air inlet,
Installing space is flowed out from the second air outlet via after two fins set 611 of the second heat exchanging part 610'.
In this embodiment, semiconductor module 100 can be two, is vertically spaced setting, to improve
Refrigerating efficiency.Heat-exchanger rig 600 may also include two heat-transfer devices 630.Leading of each heat-transfer device 630
The hot junction of the heat-transfer surface of hot substrate 631 and a semiconductor chilling plate contacts against, with by each quasiconductor system
The heat of cold is transferred to the first heat exchanging part 610 and the second heat exchanging part 610'.
So far, although those skilled in the art will appreciate that the most detailed to illustrate and describe this practicality new
Multiple exemplary embodiments of type, but, in the case of without departing from this utility model spirit and scope, still
Can directly determine according to this utility model disclosure or derive the many meeting this utility model principle
Other variations or modifications.Therefore, scope of the present utility model is it is understood that and regard as covering all these
Other variations or modifications.
Claims (10)
1. the heat-exchanger rig for semiconductor freezer, it is characterised in that include the first heat exchanging part, institute
State the first heat exchanging part to have:
Two fins set, each described fins set has the fin that multiple parallel interval is arranged, and said two
Fins set is spaced setting along the length direction of described fin；With
Blower fan, is arranged between two described fins set, is configured to promote air-flow from a described fins set
Gap between each two adjacent fins in fins set another described between each two adjacent fins gap flowing.
Heat-exchanger rig the most according to claim 1, it is characterised in that
Described blower fan is axial flow blower, and its rotation axis extends along the length direction of described fin.
Heat-exchanger rig the most according to claim 1, it is characterised in that described first heat exchanging part also includes:
Two ducting assemblies, are arranged at the both sides of described blower fan, and each described ducting assembly limits air-flow
Passage, to connect in a described fins set gap between each two adjacent fins and described blower fan.
Heat-exchanger rig the most according to claim 1, it is characterised in that also include:
Second heat exchanging part, is arranged symmetrically with about a geometrical plane with described first heat exchanging part.
Heat-exchanger rig the most according to claim 4, it is characterised in that also include:
Two heat-transfer devices, each described heat-transfer device is symmetrical about described geometrical plane, and
The middle part of each described heat-transfer device is configured to absorb heat or cold from thermal source or low-temperature receiver；
One fins set of described first heat exchanging part and a fins set of described second heat exchanging part are arranged at one
The two ends of individual described heat-transfer device；
Another fins set of described first heat exchanging part and another fins set of described second heat exchanging part are arranged at separately
The two ends of heat-transfer device described in.
Heat-exchanger rig the most according to claim 5, it is characterised in that each described heat-transfer device includes:
Heat-conducting substrate, has heat-transfer surface hot linked with described thermal source or low-temperature receiver；With
Many heat carriers, the length direction along described fin is spaced, and every described heat carrier includes fixing
In described heat-conducting substrate middle part heat carrier section and be positioned at heat carrier section both sides, described middle part, be perpendicular to described
Two end straight heat carrier sections of geometrical plane, two end straight heat carrier sections of every described heat carrier are respectively
Extend through the poling hole of each fin being mounted thereon.
Heat-exchanger rig the most according to claim 6, it is characterised in that
The middle part heat carrier section of every described heat carrier includes: middle part straight heat carrier section, and respectively from described
Two connection heat carrier sections that the two ends of the straight heat carrier section in middle part extend to both sides；And
In each described heat-transfer device, multiple described middle parts straight heat carrier section is in same plane, multiple
Described end straight heat carrier section is in same plane, and between the adjacent middle part straight heat carrier section of each two
Distance between the end straight heat carrier section that distance is adjacent less than each two, described middle part straight heat carrier section and institute
State the distance between heat-transfer surface less than the distance between described end straight heat carrier section and described heat-transfer surface.
Heat-exchanger rig the most according to claim 1, it is characterised in that
The width of each described fin is the 1/7 to 3/7 of its length；
The width of each described fins set is the 1/3 to 2/3 of the length of each described fin.
9. a semiconductor freezer, including inner bag, semiconductor chilling plate be arranged on rear side of described inner bag
Heat-insulation layer, it is characterised in that also include:
Back cover, it defines installing space with the rear surface of described heat-insulation layer, and offers the first air intake on it
Mouth and the first air outlet；With
Heat-exchanger rig according to any one of claim 1 to 8, two fins of its first heat exchanging part
Organize in being mounted on described installing space with blower fan and be in described first air inlet and described first air outlet
Between；And
Two fins set of described first heat exchanging part are with the hot junction of described semiconductor chilling plate directly or indirectly
Thermally coupled；
The blower fan of described first heat exchanging part is configured to promote air-flow to enter described installation from described first air inlet
Space, flows out described installation sky via after two fins set of described first heat exchanging part from described first air outlet
Between.
Semiconductor freezer the most according to claim 9, it is characterised in that
Described first air outlet is arranged at the top of described first air inlet；
It is further opened with the second air inlet on described back cover and is in the second air-out above described second air inlet
Mouthful；And
Two fins set of the second heat exchanging part of described heat-exchanger rig and blower fan are mounted on described installing space
In and be between described second air inlet and described second air outlet；And
Two fins set of described second heat exchanging part are with the hot junction of described semiconductor chilling plate directly or indirectly
Thermally coupled；
The blower fan of described second heat exchanging part is configured to promote air-flow to enter described installation from described second air inlet
Space, flows out described installation sky via after two fins set of described second heat exchanging part from described second air outlet
Between.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521103575.2U CN205537253U (en) | 2015-12-24 | 2015-12-24 | Heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521103575.2U CN205537253U (en) | 2015-12-24 | 2015-12-24 | Heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205537253U true CN205537253U (en) | 2016-08-31 |
Family
ID=56762904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521103575.2U Active CN205537253U (en) | 2015-12-24 | 2015-12-24 | Heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator |
Country Status (1)
| Country | Link |
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| CN (1) | CN205537253U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105485969A (en) * | 2015-12-24 | 2016-04-13 | 青岛海尔电冰箱有限公司 | Heat exchange device and semiconductor refrigeration refrigerator with same |
-
2015
- 2015-12-24 CN CN201521103575.2U patent/CN205537253U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105485969A (en) * | 2015-12-24 | 2016-04-13 | 青岛海尔电冰箱有限公司 | Heat exchange device and semiconductor refrigeration refrigerator with same |
| CN105485969B (en) * | 2015-12-24 | 2018-10-12 | 青岛海尔电冰箱有限公司 | Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig |
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