CN104329848A - Semiconductor refrigeration refrigerator - Google Patents
Semiconductor refrigeration refrigerator Download PDFInfo
- Publication number
- CN104329848A CN104329848A CN201410123662.8A CN201410123662A CN104329848A CN 104329848 A CN104329848 A CN 104329848A CN 201410123662 A CN201410123662 A CN 201410123662A CN 104329848 A CN104329848 A CN 104329848A
- Authority
- CN
- China
- Prior art keywords
- semiconductor
- recess
- cover board
- heat
- duct cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 98
- 238000005057 refrigeration Methods 0.000 title abstract description 13
- 238000001816 cooling Methods 0.000 claims abstract description 46
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 62
- 238000010276 construction Methods 0.000 claims description 19
- 230000008030 elimination Effects 0.000 claims description 11
- 238000003379 elimination reaction Methods 0.000 claims description 11
- 230000005855 radiation Effects 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 238000007664 blowing Methods 0.000 claims description 3
- 238000009826 distribution Methods 0.000 claims description 3
- 230000014759 maintenance of location Effects 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 2
- 230000004087 circulation Effects 0.000 abstract description 4
- 230000005494 condensation Effects 0.000 description 11
- 238000009833 condensation Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000007323 disproportionation reaction Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000010358 mechanical oscillation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/003—General constructional features for cooling refrigerating machinery
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention provides a semiconductor refrigeration refrigerator. The semiconductor refrigeration refrigerator comprises a liner, a wind way cover plate and a semiconductor refrigeration device, wherein a storage cabinet is limited in the liner; a mounting opening is formed in the middle of the back wall of the liner; the wind way cover plate is arranged at the inner side of the back wall of the liner; a wind way is formed between the wind way cover plate and the back wall of the liner; a wind return port is formed in the wind way cover plate opposite to the mounting opening; wind outlets are respectively formed in the upper part and the lower part of the wind way cover plate; one part of the semiconductor refrigeration device penetrates through the mounting opening to extend into the wind way; and a cooling fan arranged on the semiconductor refrigeration device is arranged behind the wind return port for sucking an airflow in the storage cabinet into the wind way. The wind way is formed between the wind way cover plate and the back wall of the liner of the semiconductor refrigeration refrigerator, and upper and lower two air circulations are formed in the storage cabinet by using the cooling fan, so that the internal temperature of the storage cabinet is balanced, and the heat exchange efficiency is high.
Description
Technical field
The present invention relates to refrigeration plant, particularly relate to a kind of semiconductor freezer.
Background technology
Semiconductor freezer, is also referred to as thermoelectric refrigerator.It utilizes semiconductor chilling plate to realize refrigeration by the double-deck heat pipe heat radiation of highly effective ring and conduction technique and automatic pressure-transforming Variable flow control technology, without the need to refrigeration working medium and mechanical moving element, solve the application problem of traditional mechanical refrigerator such as medium pollution and mechanical oscillation.
But, semiconductor freezer needs effectively by indoor between the temperature conduction of semiconductor chilling plate cold junction to refrigerator storing, prior art generally adopts fin as low-temperature receiver, fin is by directly contacting with semiconductor chilling plate cold junction, and and between storing room carry out heat exchange, the heat conduction heat exchange efficiency of this refrigeration structure is low, be unfavorable for the performance of semiconductor optimum performance, and radiating fin volume is larger, take refrigerator space, and the temperature distributing disproportionation of chamber interior is even between storing, temperature near fin is low, comparatively distant positions temperature is high for distance fin, affect the normal use of semiconductor freezer.
Summary of the invention
An object of the present invention is to provide that a kind of heat exchange efficiency is high, freeze uniform semiconductor freezer.
The present invention's further object be to make semiconductor freezer take up room little, produce and assembly technology simple.
Another further object of the present invention be to solve semiconductor freezer inner bag inwall on the problem of condensation.
Especially, the invention provides a kind of semiconductor freezer.This semiconductor freezer comprises: inner bag, is limited with room between storing in it, is provided with construction opening in the middle part of the rear wall of inner bag; Air duct cover board, inside the rear wall being arranged on inner bag, and and be formed with air channel between the rear wall of inner bag, the correspondence position of air duct cover board and construction opening offers return air inlet, and the upper and lower of air duct cover board is respectively arranged with air outlet; Semiconductor cooling device, one partially passes through construction opening, is inserted in air channel, semiconductor cooling device with cold scattering blower fan, be arranged at the rear of return air inlet, with by room between storing air-flow suck air channel.
Alternatively, the rear wall of inner bag comprises: recess, is arranged at rear wall central authorities; Water guide structure part, is adjacent to below recess; Periphery, is looped around recess and water guide structure portion and is in same perpendicular; Recess is recessed backward relative to the perpendicular residing for periphery, and construction opening is arranged at the middle part of recess; Air duct cover board is covered on recess and water guide structure part, to form air channel with recess.
Alternatively, the width of recess and length are greater than water guide structure part respectively, and recess is the turning sphering joint face tilted at the side surface that its both lateral sides is connected with periphery; Water guide structure part comprises: dash boss, to be adjacent to below recess, relative to the recessed surfaces outwardly convex of recess but still the perpendicular rear be in residing for periphery; At least one vertical guiding gutter, the end face from dash boss, the protrusion surface relative to dash boss extend backward recessedly straight down; Be in the V-type water leg below guiding gutter and the delivery port being in V-type water leg minimum point place, V-type water leg is arranged to the water from V-type water leg and/or guiding gutter is guided to delivery port, to be discharged to outside inner bag.
Alternatively, the upper end face that recess is connected with periphery is the scalariform face of being with knuckle, scalariform face comprises: parallel surface, and parallel surface is connected with periphery, and parallel surface is parallel with the recessed surfaces of recess and between the surface and recessed surfaces of periphery; And inclined plane, inclined plane tilts to be connected with recessed surfaces; And knuckle, knuckle is to projecting inward and be greater than 90 degree.
Alternatively, parallel surface is provided with the upper fixing hole installing air duct cover board; Dash boss is provided with the lower fixed hole installing air duct cover board, the below of the dash boss of lower fixed hole between two guiding gutters, and the perpendicular of lower fixed hole is between dash surface and the bottom land plane of guiding gutter; The draw-in groove being provided with the air duct cover board for engaging semiconductor freezer of longitudinal separation on side surface.
Alternatively, the corresponding position of the opening of air duct cover board and rear wall is provided with and cold scattering blower fan shape adapts and towards the projection of chamber interior between storing, to form the space holding cold scattering blower fan; Return air inlet is multiple, is distributed in protruding surface.
Alternatively, return air inlet is along protruding center radial distribution, and wherein each return air inlet is hard iron circle, and its extended line forms the concentric circles that multi-turn is the center of circle with the center of projection.
Alternatively, semiconductor cooling device comprises: semiconductor chilling plate, is arranged at the outside of the rear wall of inner bag, and its cold junction is as the low-temperature receiver of semiconductor freezer; Cold scattering fin assembly, it comprises: conduction cooling plate, is arranged at opposing in the side of air duct cover board, thermally coupled with the cold junction of semiconductor chilling plate; Many cold scattering heat pipes, every root cold scattering heat pipe extend to relative second section parallel with conduction cooling plate from the hot linked first section forward fold of itself and conduction cooling plate; Cold scattering fin, is arranged on the second section of many cold scattering heat pipes, and it opposingly contacts in the side of air duct cover board in conduction cooling plate; Cold scattering fin is installed to be and stretches in air channel through construction opening.
Alternatively, cold scattering fin has draw-in groove with hook formation relative to the side of air duct cover board; The both sides of cold scattering blower fan are provided with anchorage bar, and anchorage bar is installed in draw-in groove, to be fixed on cold scattering fin by cold scattering blower fan, with the air-flow will sucked in room between storing, after blowing to cold scattering fin, are discharged along air channel through cold scattering fin by air outlet.
Alternatively, semiconductor freezer also comprises: heat insulation layer, is arranged between conduction cooling plate and semiconductor chilling plate; Cold transfer block, embeds heat insulation layer inner; Conduction cooling plate is opposing thermally coupled by the cold junction of cold transfer block and semiconductor chilling plate in the side of air duct cover board.
Alternatively, semiconductor freezer also comprises: also comprise: heat elimination assembly, thermally coupled with the hot junction of semiconductor chilling plate, and for hot-side heat dissipation, heat elimination assembly comprises: heat-conducting plate, and itself and hot junction are thermally coupled; Many heat radiation heat pipes, the bottom of every root heat radiation heat pipe and heat-conducting plate contact heat-exchanging; Radiating fin, is arranged at many heat radiation heat pipe tops; And cooling fan, be fixed on radiating fin by retention mechanism opposing in the side of air duct cover board, for generation of radiating airflow.
Semiconductor freezer of the present invention has taken into full account the refrigerating capacity of semiconductor cooling device and the profile feature of refrigerating efficiency and semiconductor cooling device, by arranging air duct cover board and inner container of icebox rear wall forms air channel, utilize cold scattering blower fan in air channel, produce room between storing to enter, through after carrying out heat exchange after refrigerating plant, room between storing is returned to respectively from upper and lower, upper and lower two air circulation of indoor formation between storing, make chamber interior temperature equalization between storing, heat exchange efficiency is high.
Further, the rear wall of inner container of icebox has recess, as the space forming air channel, takies space, room between storing little.
Again further, the present invention, by arranging corresponding air duct cover board fixed structure on rear wall, covering refrigerating plant and the water guide structure part of condensation, avoiding it directly to contact with refrigerator inside by installing air duct cover board, prevent the foreign material of refrigerator inside to adhere to, ensure that drainage effect.
According to hereafter by reference to the accompanying drawings to the detailed description of the specific embodiment of the invention, those skilled in the art will understand above-mentioned and other objects, advantage and feature of the present invention more.
Accompanying drawing explanation
Hereinafter describe specific embodiments more of the present invention with reference to the accompanying drawings by way of example, and not by way of limitation in detail.Reference numeral identical in accompanying drawing denotes same or similar parts or part.It should be appreciated by those skilled in the art that these accompanying drawings may not be drawn in proportion.In accompanying drawing:
Fig. 1 is the front schematic view of semiconductor freezer according to an embodiment of the invention;
Fig. 2 is the schematic cross sectional views intercepted along the cutting line E-E in Fig. 1;
Fig. 3 is the rear wall perspective schematic view of the inner bag according to semiconductor freezer in one embodiment of the invention;
Fig. 4 is the schematic cross sectional views intercepted along the cutting line A-A in Fig. 3;
Fig. 5 is the schematic cross sectional views intercepted along the cutting line B-B in Fig. 3;
Fig. 6 is that partial enlarged drawing is analysed and observe in the scalariform face of recess and periphery junction in Fig. 4;
Fig. 7 be in Fig. 4 water guide structure part analyse and observe enlarged diagram;
Fig. 8 is the exploded perspective view of semiconductor freezer according to an embodiment of the invention;
Fig. 9 is the cold scattering fin assembly exploded perspective view of semiconductor freezer according to an embodiment of the invention; And
Figure 10 is the heat elimination assembly exploded perspective view of semiconductor freezer according to an embodiment of the invention.
Detailed description of the invention
Fig. 1 is the front schematic view of semiconductor freezer according to an embodiment of the invention, Fig. 2 is the schematic cross sectional views intercepted along the cutting line E-E in Fig. 1, as shown in the figure, this semiconductor freezer can comprise in general manner: inner bag 100, air duct cover board 300, semiconductor cooling device 400, cold scattering blower fan 410, wherein, inner bag 100 is limited with room between storing in it, is provided with construction opening in the middle part of the rear wall of inner bag 100; Air duct cover board 300 is arranged on inside the rear wall of inner bag 100, and and be formed with air channel 500 between the rear wall of inner bag 100, air duct cover board 300 offers return air inlet 310 with the correspondence position of construction opening, and the upper and lower of air duct cover board 300 is respectively arranged with air outlet 320; The part of semiconductor cooling device 400, through construction opening, is inserted in air channel 500, semiconductor cooling device 400 with cold scattering blower fan 410, be arranged at the rear of return air inlet 420, so that the air-flow in room between storing is sucked air channel 500.Wherein, forward and backward, upper and lower position relation in the present embodiment can be for the normal condition of refrigerator, are the direction near refrigerator open wherein, are the direction near refrigerator back afterwards.
Semiconductor cooling device 400 is using semiconductor chilling plate as low-temperature receiver, and semiconductor chilling plate cold junction temperature to be delivered between storing in room, forced convertion is carried out owing to taking cold scattering blower fan 410, effectively improve heat exchange efficiency, the air-flow that the blower fan 410 of cold scattering simultaneously produces is guided by air channel 500, between storing, chamber interior forms multiple circulation, can the temperature of indoor each position between balanced storing effectively, improves the refrigeration of refrigerator.
In order to the space making air channel 500 not take room between storing, the semiconductor freezer of the present embodiment have employed unique inner-tube structure, both saves space, and solves the problem that condensed water gathers.
Fig. 3 is the rear wall perspective schematic view of the inner bag according to semiconductor freezer in one embodiment of the invention.Wherein, the rear wall 100 of inner bag is divided into be in rear wall central authorities recess 200, be adjacent to the water guide structure part 240 below recess and be looped around around recess 200 and water guide structure part 240 and the periphery 250 be in same perpendicular.Wherein recess 200 is recessed backward relative to the perpendicular residing for periphery 250, has the construction opening 202 for installing semiconductor cooling device in recess 200.The refrigerating plant of semiconductor freezer is arranged on construction opening 202 place of recess 200, therefore needs recess 200 to have corresponding installing space.Because condensation appears at around refrigerating plant, finally flow to below, so water guide structure part 240 to be arranged on the below of construction opening 202, so that the convergence of ponding and water conservancy diversion.Water guide structure part 240 comprises: be adjacent to the dash boss 241 below recess, and as shown in Figure 2, dash boss 241 is relative to the recessed surfaces outwardly convex of recess 200 but still the perpendicular rear be in residing for periphery 250.Namely dash boss 241 needs the ponding to recess 200 flows down to have barrier effect, and therefore its relative recess 200 is outwardly, but the height protruded can not exceed the vertical plane of periphery 250.For the ease of dredging the ponding at dash boss 241 place, dash boss 241 arranges at least one guiding gutter 210 vertically arranged, the end face of guiding gutter 210 from dash boss 241, the protrusion surface relative to dash boss 241 extend backward recessedly straight down.What guiding gutter 210 was vertical passes dash boss 241, so that guided by the ponding of recess 200 and pass dash boss 241.As long as the position of guiding gutter 210 on dash boss 241 is suitable for guiding the position of ponding all can.Inner bag is discharged for convenience of ponding, V-type water leg 230 and the delivery port 220 being in V-type water leg 230 minimum point place are set below guiding gutter 210, V-type water leg 230 is arranged to the ponding from V-type water leg self and/or guiding gutter to be guided to delivery port 220, thus is discharged to outside inner bag.
The semiconductor cooling device 400 of the semiconductor freezer that the application relates to is arranged on the rear wall outer surface of inner bag 100, a part for semiconductor cooling device 400 extend in air channel 500 through the construction opening 202 on recess 200, when semiconductor freezer normally works, semiconductor cooling device 400 stretches into the part in air channel 500 because temperature can produce condensation lower than surrounding environment, condensation finally can flow to water guide structure part 240 along recess 200, dash boss 241 pairs of water of water guide structure part 240 stop, water is made to be convenient to by guiding gutter 210 water conservancy diversion at the dash boss place delivery port 220 to below, and the water that water guide structure part 240 flows down by V-type water leg 230 is all pooled to delivery port 220 place, and discharge inner bag by delivery port 220.
The width of recess 200 and length can all be greater than water guide structure part 240.Such structure had both been beneficial to recess 200 and had installed associated refrigeration device, was beneficial to again water guide structure part 240 and converged ponding.
Fig. 4 is the schematic cross sectional views intercepted along the cutting line A-A in Fig. 3; Fig. 5 is the schematic cross sectional views intercepted along the cutting line B-B in Fig. 3.Can find out in figure that the bottom surface 201 that recess 200 is connected with water guide structure part 240 is the inclined plane tilting to connect.Bottom surface 201 is specifically connected to the back edge of the end face of dash boss 241, and structure can not affect the dash effect of dash boss end face in this wise.
In an embodiment of the application, its upper end open of guiding gutter 210 be positioned on dash boss 241 is connected with the bottom of bottom surface 201, and the bottom of the bottom land plane of guiding gutter 210 and bottom surface 201 is positioned on same perpendicular.Namely dash boss 241 is vertically divided into left and right two parts by guiding gutter 210, and the ponding flowed down to make recess 200 is converging and is being directed in the guiding gutter 210 of water guide structure part 240 after bottom surface 201.The bottom land plane of guiding gutter 210 and the bottom of bottom surface 201 are positioned at the flowing that same perpendicular is then conducive to ponding.
In a further embodiment of the application, guiding gutter 210 is provided with two, and two guiding gutters 210 are symmetrical arranged about the center upright axis of symmetry of dash boss 241.The more convenient water conservancy diversion ponding of such structure
Further, due to recess 200 surface, the left and right sides on condensation or the dirty impact of condensation little, therefore the left and right sides surface 203 of recess 200 is turning sphering joint face, and it tilts to be connected with periphery 250 by the mode that angle of inclination is less.Its angle of inclination of vertical plane of the relative recess 200 of side surface 203 is less than the angle of inclination of bottom incline.In addition, because ponding can block by V-type water leg 230, therefore water guide structure part 240 is directly connect according to the structure of V-type water leg outer side edges with the connection of periphery 250.
Fig. 6 is that partial enlarged drawing is analysed and observe in the scalariform face of recess and periphery junction in Fig. 4, Fig. 7 be in Fig. 4 water guide structure part analyse and observe enlarged diagram, there is shown: the upper topside 260 of recess 200 adopts ladder-shaper structure to be connected with periphery 250, ladder-shaper structure comprises parallel surface 261, inclined plane 262 and connects the knuckle 263 of parallel surface 261 and inclined plane 262, three forms a scalariform face, and knuckle 263 is inner and be greater than 90 degree towards inner bag.Namely the upper topside 260 of recess 200 is with periphery 250 by being connected with the limit of knuckle 263, forms stairstepping between excessive.Wherein going up the folding face that end face 260 is connected with periphery 250 is parallel surface 261, and parallel surface 261 is parallel with the recessed surfaces of recess 260 and between the surface and recessed surfaces of periphery 250.Inclined plane 262 tilts to be connected with recessed surfaces.Upper end face adopts ladder-shaper structure that the condensation at inner bag top both can have been facilitated to flow into recess 200 along periphery 250, and parallel surface 261 can also be made as the mounting points supporting air duct cover board 300.And the dual-side that scalariform face 260 and periphery 250 and recess 200 connect adopts the arc-shaped side with interior radian (its radian direction is contrary with the direction of knuckle) to be connected respectively, to ensure that condensation can flow into recess 200 smoothly, ponding is avoided to drip.
In an embodiment of the application, rear wall 100 is provided with upper fixing hole 243 and the lower fixed hole 242 of fixing air duct cover board 300, wherein go up fixing hole 243 to be arranged on the parallel surface 261 of end face 260, and lower fixed hole 242 is arranged on the below of dash boss 241 between two guiding gutters 210.The position of lower fixed hole 242 is arranged on below dash boss 241, the performance of dash boss 241 dash can be utilized to enter lower fixed hole 242 to prevent the ponding on top.Therefore, the perpendicular of lower fixed hole 242 is between the perpendicular and the bottom land plane of guiding gutter of dash boss 241.Namely observe in the mode that inwall 100 is parallel to the ground, the setting position height of lower fixed hole 242 will lower than the height of dash boss 241 and higher than the bottom land level of guiding gutter.After air duct cover board 300 is fixing, part, cold scattering blower fan 410 and water guide structure part 240 that recess 200, semiconductor cooling device 400 stretch in air channel 500 can be closed, with by refrigerating part and between condensation part and storing room separate, avoid condensation part adheres foreign material.
The position of cold scattering blower fan 410 is corresponding with the position of return air inlet 310 on air duct cover board 300.Under a kind of preferred embodiment, the corresponding position of the opening of air duct cover board 300 and rear wall is provided with and cold scattering blower fan 410 shape adapts and towards the projection of chamber interior between storing, to form the space holding cold scattering blower fan 410; Return air inlet 310 is multiple, is distributed in protruding surface.Such as, when the profile of cold scattering blower fan 410 is circular, air duct cover board 300 is formed with circular protrusions indoor towards between storing, and protruding height and the thickness of cold scattering blower fan 410 are to adaptation.
For ensureing that cold scattering blower fan 410 can effectively from indoor suction air between storing, return air inlet 310 is set to multiple, under a kind of embodiment, multiple return air inlet 310 is along the center radial distribution of projection, wherein each return air inlet 310 is hard iron circle, and its extended line forms the concentric circles that multi-turn is the center of circle with the center of projection.
Accordingly, multiple air outlets 320 that the upper and lower of air duct cover board 300 is arranged respectively, also can be that hard iron is circular, arrange parallel to each other.
In an embodiment of the application, for improving the fixed effect of air duct cover board 300 further, the draw-in groove 204 be provided with for engaging air duct cover board 300 of horizontal interval on the side surface 203 of recess 200.Draw-in groove 204 is for the fixture block of correspondence engaging air duct cover board 300 dual-side, when mounted, first the fixture block of air duct cover board both sides is engaged with the draw-in groove 204 of guide face both sides, and then by upper fixing hole 243 and lower fixed hole 242, air duct cover board 300 is fixed in recess 200 and water guide structure part 240.
Enter delivery port 220 for convenience of ponding, in the present embodiment, around delivery port 220, cheat 244 with delivery port 220 for convergent point arranges indent arc.V-type water leg 230 is cheated the bottom of 244 as arc and is tilted to delivery port 220, its angle tilted is with the vertical line of water guide structure part 240 to delivery port 220 for reference, and V-type water leg outer side edges is greater than 10 degree to the angle of water outlet and vertical line and is less than 40 degree.Namely the ponding that water guide structure part flows down blocks by V-type water leg 230 and dykes and dams of higher than delivery port 220 opening up as, makes it flow in delivery port 220.V-type water leg 230 entirety tilts to delivery port 220, while playing dash effect, also has the effect of retaining.When observing for standard with the vertical line on ground with water guide structure part 240, V-type water leg 230 tilts to vertical line, and V-type water leg 230 is cheated the bottom side of 244 as arc and cheated by half arcs that arc hole 244 is constrained to centered by delivery port 220 simultaneously.Now, the base of delivery port 220 contacts with V-type water leg 230 or overlaps, to ensure the smooth inflow of ponding.
The body structure of refrigerator generally yet comprises: shell, chamber door and heat insulation layer.Generally there are two kinds of structures in outcase of refrigerator, a kind of be pin-connected panel, be namely assembled into a complete casing by top cover, left side plate, postnotum, lower shoe etc.Another kind is monoblock type, by top cover and left side plate on request rolling become one to fall " U " font, be called U shell, be that postnotum, lower shoe point is welded into casing.The semiconductor freezer of the embodiment of the present invention preferably uses monoblock type shell, and namely shell includes U shell and back, and wherein U shell is arranged at the sidewall of inner bag 100 and the outside of roof, and the back of shell and the rear wall of inner bag are limited with installing space.
Fig. 8 is the exploded perspective view of semiconductor freezer according to an embodiment of the invention, in the installing space limited with shell back 620 outside the rear wall that semiconductor cooling device 400 is arranged in inner bag 100.
Semiconductor cooling device 400 comprises: semiconductor chilling plate 430, cold scattering fin assembly 420, heat elimination assembly 430, wherein semiconductor chilling plate 430, be arranged at the outside of the rear wall of inner bag 100, its cold junction is as the low-temperature receiver of semiconductor freezer.A part for cold scattering fin assembly 420 stretches in air channel by construction opening, with the conduction of room between storing cold junction temperature.
Fig. 9 is cold scattering fin assembly 420 exploded perspective view of semiconductor freezer according to an embodiment of the invention, cold scattering fin assembly 420 comprises: conduction cooling plate 421, many cold scattering heat pipes 422, cold scattering fins 423, wherein conduction cooling plate 421, be arranged at opposing in the side of air duct cover board 300, thermally coupled with the cold junction of semiconductor chilling plate 430; Every root cold scattering heat pipe 422 extends to relative second section parallel with conduction cooling plate 421 from the hot linked first section forward fold of itself and conduction cooling plate 421; Cold scattering fin 423 is arranged on the second section of many cold scattering heat pipes 422, and it opposingly contacts in the side of air duct cover board 300 in conduction cooling plate 421; Cold scattering fin 423 is installed to be and stretches in air channel through construction opening.
First section of every root cold scattering heat pipe 422 is directly welded in the side of conduction cooling plate 421 relative to cold scattering fin 423, or the first section directly embeds conduction cooling plate 421 inside.Every root cold scattering heat pipe 422 forms similar " U " type, and its first section has bend to be connected with the second section.
During the semiconductor freezer work of the present embodiment, cold scattering blower fan 410 enters from return air inlet 310 in generation air channel 500 in, through the gap of cold scattering fin 423 after abundant heat exchange, entered the air-flow of room between described storing by air outlet 320.
Cold scattering blower fan 410 can be fixedly installed on the inner bag of refrigerator, also can be fixed on cold scattering fin 423, and in a kind of embodiment, cold scattering fin 423 has the draw-in groove with hook formation relative to the side of air duct cover board 300; The both sides of cold scattering blower fan 410 are provided with anchorage bar, anchorage bar is installed in draw-in groove, so that cold scattering blower fan 410 is fixed on cold scattering fin 423, with the air-flow will sucked in room between storing, after blowing to cold scattering fin 423, heat exchange is carried out in gap through cold scattering fin 423, and is discharged along air channel 500 by air outlet 320.
Between the rear wall of semiconductor chilling plate 430 and inner bag 100, can certain distance be preferably set, to ensure that the heat in the hot junction when power failure or operation troubles can not conduct to inner bag 100, in this case, semiconductor freezer also comprises: heat insulation layer 610 and cold transfer block (being positioned at heat insulation layer inside cannot illustrate), wherein, heat insulation layer 610 is arranged between conduction cooling plate 421 and semiconductor chilling plate 430; It is inner that cold transfer block embeds heat insulation layer 610; Conduction cooling plate 421 is opposing thermally coupled by the cold junction of cold transfer block and semiconductor chilling plate 430 in the side of air duct cover board 300.
For solving the heat dissipation problem in semiconductor chilling plate hot junction, the semiconductor freezer of the present embodiment can also be provided with: the hot junction of heat elimination assembly and semiconductor chilling plate 430 is thermally coupled, is distributed to surrounding environment for the heat produced in hot junction.
Figure 10 is the heat elimination assembly exploded perspective view of semiconductor freezer according to an embodiment of the invention, this heat elimination assembly 440 comprises: heat-conducting plate 441, many heat radiations heat pipe 442, radiating fin 443, cooling fans 444, and wherein heat-conducting plate 441 is thermally coupled with hot junction; The bottom of every root heat radiation heat pipe 442 and heat-conducting plate 441 contact heat-exchanging, radiating fin 443, be arranged at the top of many heat radiation heat pipes 442; It is opposing in the side of air duct cover board that cooling fan 444 is fixed on radiating fin by retention mechanism, to carry out forced convertion heat radiation to the heat reaching radiating fin 443 from heat radiation heat pipe 442.For ensureing to adopt heat-conducting silicone grease (graphite or other media) to contact between each attaching parts of heat transfer efficiency.This heat elimination assembly is conducted heat by heat pipe fin structure, carries out forced convertion by fan, and radiating effect is fast, and structure is simple, easy to maintenance, concise production process.
Heat elimination assembly can also select other structures in addition, such as, use refrigerant line laminating and outcase of refrigerator, by outcase of refrigerator natural heat dissipation etc.
The air channel structure of the embodiment of the present invention can upper and lower two air circulation of indoor formation between storing effectively, makes chamber interior temperature equalization between storing, and heat exchange efficiency is high, it is little to take up room.
So far, those skilled in the art will recognize that, although multiple exemplary embodiment of the present invention is illustrate and described herein detailed, but, without departing from the spirit and scope of the present invention, still can directly determine or derive other modification many or amendment of meeting the principle of the invention according to content disclosed by the invention.Therefore, scope of the present invention should be understood and regard as and cover all these other modification or amendments.
Claims (11)
1. a semiconductor freezer, comprising:
Inner bag, is limited with room between storing in it, be provided with construction opening in the middle part of the rear wall of described inner bag;
Air duct cover board, inside the rear wall being arranged on inner bag, and and be formed with air channel between the rear wall of described inner bag, the correspondence position of described air duct cover board and described construction opening offers return air inlet, and the upper and lower of described air duct cover board is respectively arranged with air outlet;
Semiconductor cooling device, one partially passes through described construction opening, is inserted in described air channel, described semiconductor cooling device with cold scattering blower fan, be arranged at the rear of described return air inlet, so that the air-flow in room between described storing is sucked described air channel.
2. semiconductor freezer according to claim 1, wherein
The rear wall of described inner bag comprises:
Recess, is arranged at described rear wall central authorities;
Water guide structure part, is adjacent to below described recess;
Periphery, is looped around described recess and described water guide structure portion and is in same
In perpendicular;
Described recess is recessed backward relative to the perpendicular residing for described periphery, and described construction opening is arranged at the middle part of described recess;
Described air duct cover board is covered on described recess and described water guide structure part, to form described air channel with described recess.
3. semiconductor freezer according to claim 2, wherein
The width of described recess and length are greater than described water guide structure part respectively, and described recess is the turning sphering joint face tilted at the side surface that its both lateral sides is connected with described periphery;
Described water guide structure part comprises:
Dash boss, to be adjacent to below described recess, relative to the recessed surfaces outwardly convex of described recess but still the perpendicular rear be in residing for described periphery;
At least one vertical guiding gutter, from the end face of described dash boss, backward recessed relative to the protrusion surface of described dash boss to extend straight down;
Be in the V-type water leg below described guiding gutter and the delivery port being in described V-type water leg minimum point place, described V-type water leg is arranged to the water from described V-type water leg and/or described guiding gutter is guided to described delivery port, to be discharged to outside described inner bag.
4. semiconductor freezer according to claim 3, wherein
The upper end face that described recess is connected with described periphery is the scalariform face of being with knuckle, and described scalariform face comprises:
Parallel surface, described parallel surface is connected with described periphery, and described parallel surface is parallel with the recessed surfaces of described recess and between the surface of described periphery and described recessed surfaces; With
Inclined plane, described inclined plane tilts to be connected with described recessed surfaces; With
Knuckle, described knuckle is to projecting inward and be greater than 90 degree.
5. semiconductor freezer according to claim 4, wherein
Described parallel surface is provided with the upper fixing hole installing described air duct cover board;
Described dash boss is provided with the lower fixed hole installing described air duct cover board, the below of the described dash boss of described lower fixed hole between two described guiding gutters, and the perpendicular of lower fixed hole is between described dash surface and the bottom land plane of described guiding gutter;
The draw-in groove being provided with the described air duct cover board for engaging described semiconductor freezer of longitudinal separation on described side surface.
6. semiconductor freezer according to claim 1, wherein
The corresponding position of the opening of described air duct cover board and described rear wall is provided with and described cold scattering blower fan shape adapts and towards the projection of chamber interior between described storing, to form the space holding described cold scattering blower fan;
Described return air inlet is multiple, is distributed in the surface of described projection.
7. semiconductor freezer according to claim 6, wherein
Described return air inlet is along the center radial distribution of described projection, and wherein each described return air inlet is hard iron circle, and its extended line forms the concentric circles that multi-turn is the center of circle with the center of described projection.
8. semiconductor freezer according to claim 1, described semiconductor cooling device comprises:
Semiconductor chilling plate, is arranged at the outside of the rear wall of described inner bag, and its cold junction is as the low-temperature receiver of described semiconductor freezer;
Cold scattering fin assembly, it comprises:
Conduction cooling plate, is arranged at opposing in the side of described air duct cover board, thermally coupled with the cold junction of described semiconductor chilling plate;
Many cold scattering heat pipes, cold scattering heat pipe described in every root extend to relative second section parallel with described conduction cooling plate from the hot linked first section forward fold of itself and described conduction cooling plate;
Cold scattering fin, is arranged on the second section of described many cold scattering heat pipes, and it opposingly contacts in the side of described air duct cover board in described conduction cooling plate;
Described cold scattering fin is installed to be and stretches in described air channel through described construction opening.
9. semiconductor freezer according to claim 8, wherein
Described cold scattering fin has the draw-in groove with hook formation relative to the side of described air duct cover board;
The both sides of described cold scattering blower fan are provided with anchorage bar, described anchorage bar is installed in described draw-in groove, so that described cold scattering blower fan is fixed on described cold scattering fin, with the air-flow will sucked in room between described storing, after blowing to described cold scattering fin, discharged along described air channel by described air outlet through described cold scattering fin.
10. semiconductor freezer according to claim 8, also comprises:
Heat insulation layer, is arranged between described conduction cooling plate and described semiconductor chilling plate;
Cold transfer block, embeds described heat insulation layer inner;
The opposing side in described air duct cover board of described conduction cooling plate is thermally coupled by the cold junction of described cold transfer block and described semiconductor chilling plate.
11. semiconductor freezers according to claim 1, also comprise:
Heat elimination assembly, thermally coupled with the hot junction of described semiconductor chilling plate, for described hot-side heat dissipation, described heat elimination assembly comprises:
Heat-conducting plate, itself and described hot junction are thermally coupled;
Many heat radiation heat pipes, the bottom of the heat pipe that dispels the heat described in every root and described heat-conducting plate contact heat-exchanging;
Radiating fin, is arranged at described many heat radiation heat pipe tops; With
Cooling fan, is fixed on described radiating fin by retention mechanism opposing in the side of described air duct cover board, for generation of radiating airflow.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410123662.8A CN104329848B (en) | 2014-03-28 | 2014-03-28 | Semiconductor freezer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410123662.8A CN104329848B (en) | 2014-03-28 | 2014-03-28 | Semiconductor freezer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104329848A true CN104329848A (en) | 2015-02-04 |
| CN104329848B CN104329848B (en) | 2017-03-29 |
Family
ID=52404619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410123662.8A Active CN104329848B (en) | 2014-03-28 | 2014-03-28 | Semiconductor freezer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104329848B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105258382A (en) * | 2015-09-29 | 2016-01-20 | 青岛海尔特种电冰箱有限公司 | Heat exchange device and semiconductor refrigerator provided with same |
| CN105466100A (en) * | 2015-12-24 | 2016-04-06 | 青岛海尔电冰箱有限公司 | Heat exchanging device and semiconductor cooling refrigerator comprising same |
| CN107393150A (en) * | 2017-08-10 | 2017-11-24 | 湖南金码智能设备制造有限公司 | A kind of energy-saving tray of automatic vending machine |
| CN111829253A (en) * | 2020-07-01 | 2020-10-27 | 海信容声(广东)冰箱有限公司 | Refrigerator with a door |
| EP3604987A4 (en) * | 2017-03-21 | 2021-01-06 | LG Electronics Inc. | Refrigerator |
| CN113028631A (en) * | 2019-12-24 | 2021-06-25 | 宁波奥克斯电气股份有限公司 | Condensate water drainage device and air conditioner |
| CN113865189A (en) * | 2021-10-13 | 2021-12-31 | 长虹美菱股份有限公司 | Refrigerating device of beauty box |
| CN113970210A (en) * | 2020-07-24 | 2022-01-25 | 青岛海尔特种电冰柜有限公司 | Refrigeration subassembly and gradevin |
| CN113970229A (en) * | 2020-07-24 | 2022-01-25 | 青岛海尔特种电冰柜有限公司 | Refrigeration subassembly and gradevin |
| WO2022257427A1 (en) * | 2021-06-07 | 2022-12-15 | 青岛海尔电冰箱有限公司 | Aging apparatus for use in refrigerator and control method therefor, and refrigerator |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004340404A (en) * | 2003-05-13 | 2004-12-02 | Matsushita Electric Ind Co Ltd | Heat radiator for electronic refrigerator |
| CN201497248U (en) * | 2009-08-12 | 2010-06-02 | 广东德豪润达电气股份有限公司 | Refrigeration device and electronic wine cabinet |
| CN201909500U (en) * | 2010-12-14 | 2011-07-27 | 河北鸿久人生电子科技有限公司 | Air duct type semiconductor freezer |
| CN203810823U (en) * | 2014-03-28 | 2014-09-03 | 海尔集团公司 | Semiconductor refrigerating refrigerator |
-
2014
- 2014-03-28 CN CN201410123662.8A patent/CN104329848B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004340404A (en) * | 2003-05-13 | 2004-12-02 | Matsushita Electric Ind Co Ltd | Heat radiator for electronic refrigerator |
| CN201497248U (en) * | 2009-08-12 | 2010-06-02 | 广东德豪润达电气股份有限公司 | Refrigeration device and electronic wine cabinet |
| CN201909500U (en) * | 2010-12-14 | 2011-07-27 | 河北鸿久人生电子科技有限公司 | Air duct type semiconductor freezer |
| CN203810823U (en) * | 2014-03-28 | 2014-09-03 | 海尔集团公司 | Semiconductor refrigerating refrigerator |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105258382A (en) * | 2015-09-29 | 2016-01-20 | 青岛海尔特种电冰箱有限公司 | Heat exchange device and semiconductor refrigerator provided with same |
| CN105466100A (en) * | 2015-12-24 | 2016-04-06 | 青岛海尔电冰箱有限公司 | Heat exchanging device and semiconductor cooling refrigerator comprising same |
| CN105466100B (en) * | 2015-12-24 | 2018-10-12 | 青岛海尔电冰箱有限公司 | Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig |
| US11402144B2 (en) | 2017-03-21 | 2022-08-02 | Lg Electronics Inc. | Refrigerator |
| US11629903B2 (en) | 2017-03-21 | 2023-04-18 | Lg Electronics Inc. | Refrigerator |
| EP3604987A4 (en) * | 2017-03-21 | 2021-01-06 | LG Electronics Inc. | Refrigerator |
| CN107393150A (en) * | 2017-08-10 | 2017-11-24 | 湖南金码智能设备制造有限公司 | A kind of energy-saving tray of automatic vending machine |
| CN113028631A (en) * | 2019-12-24 | 2021-06-25 | 宁波奥克斯电气股份有限公司 | Condensate water drainage device and air conditioner |
| CN111829253A (en) * | 2020-07-01 | 2020-10-27 | 海信容声(广东)冰箱有限公司 | Refrigerator with a door |
| CN113970210A (en) * | 2020-07-24 | 2022-01-25 | 青岛海尔特种电冰柜有限公司 | Refrigeration subassembly and gradevin |
| CN113970229A (en) * | 2020-07-24 | 2022-01-25 | 青岛海尔特种电冰柜有限公司 | Refrigeration subassembly and gradevin |
| CN113970210B (en) * | 2020-07-24 | 2023-09-29 | 青岛海尔特种电冰柜有限公司 | Refrigeration assembly and wine cabinet |
| CN113970229B (en) * | 2020-07-24 | 2023-10-10 | 青岛海尔特种电冰柜有限公司 | Refrigeration assembly and wine cabinet |
| WO2022257427A1 (en) * | 2021-06-07 | 2022-12-15 | 青岛海尔电冰箱有限公司 | Aging apparatus for use in refrigerator and control method therefor, and refrigerator |
| CN113865189A (en) * | 2021-10-13 | 2021-12-31 | 长虹美菱股份有限公司 | Refrigerating device of beauty box |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104329848B (en) | 2017-03-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104329848A (en) | Semiconductor refrigeration refrigerator | |
| CN109764598B (en) | A kind of refrigerator | |
| CN201129897Y (en) | Refrigerator | |
| CN207922662U (en) | Air cooling refrigeration equipment | |
| CN107131684A (en) | Air condensing units and air conditioner | |
| CN104165413A (en) | Equipment cabinet air conditioner | |
| CN204177016U (en) | Refrigerator | |
| CN105276676B (en) | Air conditioner indoor unit | |
| CN111520952A (en) | Heat radiation system of semiconductor cold box | |
| CN203810823U (en) | Semiconductor refrigerating refrigerator | |
| CN205300044U (en) | Heat exchanger and air conditioning system | |
| CN213480682U (en) | Refrigerator with a door | |
| CN104729191A (en) | Air cooling refrigerator | |
| CN201488141U (en) | Heat pump type energy-saving integrated air conditioner | |
| CN207515323U (en) | Ducting assembly and refrigerator | |
| CN206875766U (en) | Air condensing units and air conditioner | |
| CN218495531U (en) | Refrigeration module and freezing and refrigerating equipment | |
| CN206430424U (en) | Seal, air channel structure and wind cooling refrigerator | |
| CN219037234U (en) | Refrigerator body module and refrigerator | |
| CN218722538U (en) | Centrifugal fan, refrigeration module and freezing and refrigerating equipment | |
| CN205593142U (en) | Self -conductance ability of swimming water collector and tuber pipe machine | |
| CN219037237U (en) | Shell of refrigeration module, refrigeration module and refrigerator | |
| CN219037238U (en) | Refrigerating module for a refrigerating device and refrigerating device | |
| CN204880638U (en) | Heat exchange device and roof machine | |
| CN218645846U (en) | Modular refrigerator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |