CN105445647A - Pneumatic positioning mechanism used for positioning BGA chip in test - Google Patents
Pneumatic positioning mechanism used for positioning BGA chip in test Download PDFInfo
- Publication number
- CN105445647A CN105445647A CN201510956899.9A CN201510956899A CN105445647A CN 105445647 A CN105445647 A CN 105445647A CN 201510956899 A CN201510956899 A CN 201510956899A CN 105445647 A CN105445647 A CN 105445647A
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- CN
- China
- Prior art keywords
- bga chip
- positioning
- locating piece
- pneumatic
- mould cavity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses a pneumatic positioning mechanism used for positioning a BGA chip in a test. The pneumatic positioning mechanism comprises a testing seat and a cylinder. The testing seat is provided with a positioning cavity used for carrying the BGA chip. The sliding block of the cylinder is provided with a pushing plate correspondingly cooperated with the position of the positioning cylinder, and the pushing plate can move forwards and backwards along the diagonal of the positioning cavity. The pushing plate is provided with a first positioning block used for pushing the BGA chip to move along the X direction of the positioning cavity, and a second positioning block used for pushing the BGA chip to move along the Y direction of the positioning cavity. The pneumatic positioning mechanism is advantageous in that the pneumatic counterpoint of the BGA chip can be carried out, and the problems such as the gap between the peripheral inner wall of the positioning cavity and the shape of the BGA chip, the corresponding conduction of the probes on the testing seat and the solder balls on the back surface of the BGA chip can be solved, the production yield and the production efficiency of the BGA chip can be improved, and at the same time, the production costs of the BGA chip can be reduced.
Description
Technical field
The present invention relates to a kind of detent mechanism, particularly a kind of pneumatic positioning mechanism for positioning bga chip in testing.
Background technology
Bga chip needs to power on to it to test its electrical specification in test process, general method of testing is placed on by bga chip in the locating mould cavity on test bench, by crimping make the tin ball at the probe on test bench (i.e. POGOPIN) and the bga chip back side one by one conducting make it be energized.But there is very large drawback in said method, locating mould cavity on test bench in order to compatible bga chip contour tolerance and easily pick and place chip, locating mould cavity surrounding inwall and bga chip profile leave certain gap, when the tin ball on bga chip and bga chip physical dimension deviation larger time, will because of the existence in these gaps, what cause that probe (i.e. POGOPIN) and the tin ball on bga chip can not be good contacts, the situation even producing dislocation occurs, in order to avoid the problems referred to above, this just needs the relative size precision between the tin ball on bga chip and bga chip profile must be very high, add the fraction defective of bga chip virtually, improve the production cost of bga chip, and reduce production efficiency.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of pneumatic positioning mechanism for positioning bga chip in testing; By this pneumatic positioning mechanism, achieve the method for carrying out pneumatic contraposition for bga chip, effectively eliminate owing to there is gap between locating mould cavity surrounding inwall and bga chip profile, cause the tin ball at probe on test bench and the bga chip back side can not the problem of conducting one by one, and the requirement of the relative size precision between tin ball on bga chip and bga chip profile is reduced by pneumatic positioning mechanism provided by the present invention, improve yield and the production efficiency of bga chip manufacture, reduce the production cost of bga chip simultaneously.
For solving the problems of the technologies described above, the present invention adopts following technical proposals:
For the pneumatic positioning mechanism positioned bga chip in testing, described detent mechanism comprises test bench and cylinder;
Described test bench is provided with the locating mould cavity for placing bga chip; The sliding shoe of described cylinder is provided with the push pedal corresponding with described locating mould cavity location matches, and this push pedal seesaws along the diagonal line of described locating mould cavity;
Described push pedal is provided with for promoting the first locating piece that bga chip moves along the X-direction of described locating mould cavity and for promoting the second locating piece that bga chip moves along the Y-direction of described locating mould cavity.
Further, described push pedal is provided with the breach corresponding with described locating mould cavity location matches, and described breach comprises the first breach limit and the second breach limit; Described first locating piece is arranged on described first breach limit, and described second locating piece is arranged on described second breach limit.
Further, between described first locating piece and the plate body of described push pedal, be provided with the first spring, between described second locating piece and the plate body of described push pedal, be provided with the second spring.Its role is to, can offset the contour tolerance of bga chip by arranging the first spring and the second spring, be i.e. no matter bga chip profile size, the first locating piece and the second locating piece can be withstood.
Further, described first locating piece can seesaw along the axial direction of the first spring, and described second locating piece can seesaw along the axial direction of the second spring.
Further, the fixed block of described cylinder is fixedly installed on a fixing base.
Further, the position of described fixing base is relative with the position of described test board fixing.
Further, described test bench is provided with the corresponding probe that to match with tin ball each on bga chip to be measured.
Principle of work of the present invention is, cylinder is utilized to drive push pedal campaign, and due to the first locating piece of being provided with in push pedal and the second locating piece, thus making the bga chip corresponding with push pedal position after the promotion being subject to the first locating piece and the second locating piece, bga chip can along the diagonal motion of himself; When push pedal be positioned at hold out against position time, bga chip can hold out against on the opposite side wall of locating mould cavity by the first locating piece and the second locating piece, thus achieve between bga chip and locating mould cavity inwall gapless location.
Present invention achieves the method for carrying out pneumatic contraposition for bga chip, effectively eliminate owing to there is gap between locating mould cavity surrounding inwall and bga chip profile, cause the tin ball at POGOPIN on test bench and the bga chip back side can not the problem of conducting one by one, and the requirement of the relative size precision between tin ball on bga chip and bga chip profile is reduced by pneumatic positioning mechanism provided by the present invention, improve yield and the production efficiency of bga chip manufacture, reduce the production cost of bga chip simultaneously.
Accompanying drawing explanation
Fig. 1 is one-piece construction schematic diagram when push pedal is positioned at origin position in the present invention.
Fig. 2 is the A portion enlarged diagram in Fig. 1.
Fig. 3 is that in the present invention, push pedal is positioned at one-piece construction schematic diagram when holding out against position.
Fig. 4 is the B portion enlarged diagram in Fig. 3.
Fig. 5 is the structural representation of push pedal in the present invention.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described.
As shown in Fig. 1 to 5, a kind of pneumatic positioning mechanism for positioning bga chip in testing, described detent mechanism comprises test bench 1 and cylinder 2; The fixed block 21 of described cylinder 2 is fixedly installed on a fixing base 3, and the position of described fixing base 3 is relative fixing with the position of described test board 1.
Described test bench 1 is provided with the locating mould cavity 11 for placing bga chip 4, described test bench 1 is also provided with the corresponding probe that to match with tin ball each on bga chip 4; The sliding shoe 22 of described cylinder 2 is provided with the push pedal 5 corresponding with described locating mould cavity 11 location matches, and this push pedal 5 seesaws along the diagonal line of described locating mould cavity 11; Further, described push pedal 5 is provided with the breach 51 corresponding with described locating mould cavity 11 location matches, and described breach 51 comprises the first breach limit 511 and the second breach limit 512;
Described push pedal 5 is provided with for promoting the first locating piece 6 that bga chip 4 moves along the X-direction of described locating mould cavity 11 and for promoting the second locating piece 7 that bga chip 4 moves along the Y-direction of described locating mould cavity 11.
Described first locating piece 6 is arranged along the X-direction of described locating mould cavity 11, and this first locating piece 6 is arranged on described first breach limit 511; Be provided with the first spring 61, first locating piece 6 between described first locating piece 6 and the plate body of described push pedal 5 to seesaw along the axial direction of the first spring 61;
Described second locating piece 7 is arranged along the Y-direction of described locating mould cavity 11, and this second locating piece 7 is arranged on described second breach limit 512; Be provided with the second spring 71 between described second locating piece 7 and the plate body of described push pedal 5, and the second locating piece 7 can seesaw along the axial direction of the second spring 71.
In reality test, when the sliding shoe 22 of cylinder 2 does not travel forward, push pedal 5 is positioned at origin position, namely the first locating piece 6 and the second locating piece 7 are away from locating mould cavity 11, now bga chip 4 is placed on the optional position in locating mould cavity 11, after the sliding shoe 22 of cylinder 2 travels forward, when push pedal 5 is positioned at and holds out against position, bga chip 4 can be held out against the opposite side wall 111 of locating mould cavity 11 by the first locating piece 6 and the second locating piece 7, on 112, thus the gapless location achieved between bga chip 4 and locating mould cavity 11 inwall, and the first spring 61 that the first locating piece 6 and the second locating piece 7 are set below and the second spring 71 can offset the contour tolerance of bga chip, reduce the relative size accuracy requirement between tin ball and bga chip profile.
The word in description orientation adopted herein " on ", D score, "left", "right" etc. are all convenience in order to illustrate based on the orientation in accompanying drawing shown in drawing, in actual device, these orientation may be different due to the disposing way of device.
In sum, embodiment of the present invention only provides a kind of embodiment of the best, technology contents of the present invention and technical characterstic disclose as above, but the personage being familiar with the technology still may do the various replacement and the modification that do not deviate from creation spirit of the present invention based on disclosed content; Therefore, protection scope of the present invention is not limited to the technology contents that embodiment discloses, therefore all equivalence changes done according to shape of the present invention, structure and principle, be all encompassed in protection scope of the present invention.
Claims (7)
1. the pneumatic positioning mechanism for positioning bga chip in testing, is characterized in that: described detent mechanism comprises test bench and cylinder;
Described test bench is provided with the locating mould cavity for placing bga chip; The sliding shoe of described cylinder is provided with the push pedal corresponding with described locating mould cavity location matches, and this push pedal seesaws along the diagonal line of described locating mould cavity;
Described push pedal is provided with for promoting the first locating piece that bga chip moves along the X-direction of described locating mould cavity and for promoting the second locating piece that bga chip moves along the Y-direction of described locating mould cavity.
2. a kind of pneumatic positioning mechanism for positioning bga chip in testing according to claim 1, it is characterized in that: preferred, described push pedal is provided with the breach corresponding with described locating mould cavity location matches, and described breach comprises the first breach limit and the second breach limit; Described first locating piece is arranged on described first breach limit, and described second locating piece is arranged on described second breach limit.
3. a kind of pneumatic positioning mechanism for positioning bga chip in testing according to claim 1 and 2, it is characterized in that: preferred, be provided with the first spring between described first locating piece and the plate body of described push pedal, between described second locating piece and the plate body of described push pedal, be provided with the second spring.
4. a kind of pneumatic positioning mechanism for positioning bga chip in testing according to claim 3, it is characterized in that: preferred, described first locating piece can seesaw along the axial direction of the first spring, and described second locating piece can seesaw along the axial direction of the second spring.
5. a kind of pneumatic positioning mechanism for positioning bga chip in testing according to claim 1, is characterized in that: preferred, the fixed block of described cylinder is fixedly installed on a fixing base.
6. a kind of pneumatic positioning mechanism for positioning bga chip in testing according to claim 5, is characterized in that: preferred, the position of described fixing base is relative with the position of described test board fixing.
7. a kind of pneumatic positioning mechanism for positioning bga chip in testing according to claim 1, is characterized in that: preferred, and described test bench is provided with the corresponding probe that to match with tin ball each on bga chip to be measured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510956899.9A CN105445647B (en) | 2015-12-18 | 2015-12-18 | A kind of pneumatic positioning mechanism for being positioned in testing to bga chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510956899.9A CN105445647B (en) | 2015-12-18 | 2015-12-18 | A kind of pneumatic positioning mechanism for being positioned in testing to bga chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105445647A true CN105445647A (en) | 2016-03-30 |
| CN105445647B CN105445647B (en) | 2019-08-06 |
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| CN201510956899.9A Active CN105445647B (en) | 2015-12-18 | 2015-12-18 | A kind of pneumatic positioning mechanism for being positioned in testing to bga chip |
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Citations (14)
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|---|---|---|---|---|
| DE4207002A1 (en) * | 1991-03-08 | 1992-09-17 | Hewlett Packard Co | Positioning system for test object carrier plate, e.g. for semiconductor devices - has carrier plate mounted on positioning device carrying connector block mounting sections and having positioning pins matching carrier plate holes |
| TW200416923A (en) * | 2003-02-27 | 2004-09-01 | Advanced Semiconductor Eng | A testing method of ball grid array package |
| CN101782384A (en) * | 2009-12-11 | 2010-07-21 | 南京熊猫电子股份有限公司 | Surface mount device (SMD) automatic conveying and positioning test mechanism |
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| CN103852604A (en) * | 2012-11-30 | 2014-06-11 | 西安上尚机电有限公司 | Novel online LED power test device |
| CN203658401U (en) * | 2013-12-26 | 2014-06-18 | 惠州市宏盛电子有限公司 | Lithium battery impedance tester and testing and positioning mechanism thereof |
| CN204177830U (en) * | 2014-09-11 | 2015-02-25 | 法特迪精密科技（苏州）有限公司 | The automatic assignment test socket of multistation |
| CN104965167A (en) * | 2015-07-21 | 2015-10-07 | 深圳市汉匠自动化科技有限公司 | Automatic circuit board detection device |
| CN205301518U (en) * | 2015-12-18 | 2016-06-08 | 苏州华兴源创电子科技有限公司 | A pneumatic positioning mechanism for testing fix a position BGA chip in |
-
2015
- 2015-12-18 CN CN201510956899.9A patent/CN105445647B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4207002A1 (en) * | 1991-03-08 | 1992-09-17 | Hewlett Packard Co | Positioning system for test object carrier plate, e.g. for semiconductor devices - has carrier plate mounted on positioning device carrying connector block mounting sections and having positioning pins matching carrier plate holes |
| TW200416923A (en) * | 2003-02-27 | 2004-09-01 | Advanced Semiconductor Eng | A testing method of ball grid array package |
| CN101782384A (en) * | 2009-12-11 | 2010-07-21 | 南京熊猫电子股份有限公司 | Surface mount device (SMD) automatic conveying and positioning test mechanism |
| CN201749132U (en) * | 2010-03-18 | 2011-02-16 | 深圳市瑞必达电源有限公司 | Test fixture |
| CN201853073U (en) * | 2010-09-17 | 2011-06-01 | 富美科技有限公司 | Chip batch quality inspection box |
| CN201844981U (en) * | 2010-10-22 | 2011-05-25 | 浙江工业大学 | Machine vision based automatic defect detecting device for printed circuit boards |
| CN201955444U (en) * | 2011-01-12 | 2011-08-31 | 上海华虹Nec电子有限公司 | Fast positioning tool for chip |
| CN202631574U (en) * | 2011-07-18 | 2012-12-26 | 黄志成 | Fine adjustment mechanism for printed circuit board |
| CN102645629A (en) * | 2012-04-24 | 2012-08-22 | 上海工程技术大学 | Three degree of freedom parallel connection positioning device of switch detection operation mechanism |
| CN103852604A (en) * | 2012-11-30 | 2014-06-11 | 西安上尚机电有限公司 | Novel online LED power test device |
| CN203658401U (en) * | 2013-12-26 | 2014-06-18 | 惠州市宏盛电子有限公司 | Lithium battery impedance tester and testing and positioning mechanism thereof |
| CN204177830U (en) * | 2014-09-11 | 2015-02-25 | 法特迪精密科技（苏州）有限公司 | The automatic assignment test socket of multistation |
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| CN105445647B (en) | 2019-08-06 |
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Address after: 215000 Qingqiu Lane 8, Suzhou Industrial Park, Suzhou City, Jiangsu Province Applicant after: Suzhou Huaxing source Polytron Technologies Inc Address before: 215000 East Fang Industrial Park, No. 1 Huayun Road, Suzhou Industrial Park, Jiangsu Province, 2nd Floor Applicant before: Suzhou HYC Electronic Technology Co., Ltd. |
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