CN205301518U - A pneumatic positioning mechanism for testing fix a position BGA chip in - Google Patents
A pneumatic positioning mechanism for testing fix a position BGA chip in Download PDFInfo
- Publication number
- CN205301518U CN205301518U CN201521065362.5U CN201521065362U CN205301518U CN 205301518 U CN205301518 U CN 205301518U CN 201521065362 U CN201521065362 U CN 201521065362U CN 205301518 U CN205301518 U CN 205301518U
- Authority
- CN
- China
- Prior art keywords
- bga chip
- locating piece
- push pedal
- positioning mechanism
- mould cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Measuring Leads Or Probes (AREA)
Abstract
The utility model discloses a pneumatic positioning mechanism for testing fix a position BGA chip in, it is including test seat and cylinder, be equipped with the location die cavity that is used for placing the BGA chip on the test seat, be equipped with on the sliding block of cylinder with the push pedal that location die cavity position matched pair was answered, and the diagonal seesaw of this push pedal along the location die cavity, be equipped with in the push pedal be used for promoting the BGA chip along the first locating piece of the X direction motion of location die cavity with be used for promoting the second locating piece of BGA chip along the Y direction motion of location die cavity. The utility model discloses a carry out pneumatic method of counterpointing to the BGA chip, the effectual elimination because there is the clearance in the location die cavity between inner wall and the BGA chip appearance all around, problem that the tin ball that results in probe and the BGA chip back in the test can not switch on has one by one improved BGA chip manufacture's yield and production efficiency, has reduced the manufacturing cost of BGA chip simultaneously.
Description
Technical field
This utility model relates to a kind of detent mechanism, particularly to a kind of pneumatic positioning mechanism for bga chip being positioned in testing.
Background technology
Bga chip needs to power on to it to test its electrical characteristic in test process, general method of testing is to be placed in the locating mould cavity on test bench by bga chip, makes the stannum ball at the probe (i.e. POGOPIN) on test bench and the bga chip back side turn on one by one by crimping and makes it be energized. but there is very big drawback in said method, locating mould cavity on test bench is for the contour tolerance of compatible bga chip and easily picks and places chip, locating mould cavity surrounding inwall and bga chip profile leave certain gap, when the stannum ball on bga chip and bga chip overall dimensions deviation are bigger, will because of the existence in these gaps, cause the contact that the stannum ball on probe (i.e. POGOPIN) and bga chip can not be good, the situation even producing dislocation occurs, in order to avoid the problems referred to above, this is accomplished by the relative size precision between the stannum ball on bga chip and bga chip profile must be significantly high, add the fraction defective of bga chip virtually, improve the production cost of bga chip, and reduce production efficiency.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of pneumatic positioning mechanism for bga chip being positioned in testing; By this pneumatic positioning mechanism, achieve the method carrying out pneumatic para-position for bga chip, effectively eliminate owing to there is gap between locating mould cavity surrounding inwall and bga chip profile, cause the problem that the stannum ball at the probe on test bench and the bga chip back side can not turn on one by one, and the requirement of relative size precision between the stannum ball on bga chip and bga chip profile is reduced by pneumatic positioning mechanism provided by the utility model, improve yield and production efficiency that bga chip manufactures, reduce the production cost of bga chip simultaneously.
For solving above-mentioned technical problem, this utility model adopts following technical proposals:
A kind of pneumatic positioning mechanism for bga chip being positioned in testing, described detent mechanism includes test bench and cylinder;
Described test bench is provided with the locating mould cavity for placing bga chip; The sliding shoe of described cylinder is provided with the push pedal corresponding with described locating mould cavity location matches, and this push pedal seesaws along the diagonal of described locating mould cavity;
Described push pedal is provided with the first locating piece for promoting bga chip to move along the X-direction of described locating mould cavity and the second locating piece for promoting bga chip to move along the Y-direction of described locating mould cavity.
Further, described push pedal is provided with the breach corresponding with described locating mould cavity location matches, and described breach includes the first breach limit and the second breach limit; Described first locating piece is arranged on described first breach limit, and described second locating piece is arranged on described second breach limit.
Further, it is provided with the first spring between described first locating piece and the plate body of described push pedal, between described second locating piece and the plate body of described push pedal, is provided with the second spring. Its role is to, by arranging the first spring and the second spring can offset the contour tolerance of bga chip, i.e. no matter bga chip profile size, the first locating piece and the second locating piece can be withstood.
Further, described first locating piece can seesaw along the axial direction of the first spring, and described second locating piece can seesaw along the axial direction of the second spring.
Further, the fixed block of described cylinder is fixedly installed on a fixing substrate.
Further, the position of described fixing substrate and the position of described test board are relatively fixed.
Further, described test bench is provided with stannum ball each with on bga chip to be measured and matches corresponding probe.
Operation principle of the present utility model is, cylinder is utilized to drive push pedal campaign, and due to the first locating piece being provided with in push pedal and the second locating piece, so that the bga chip corresponding with push pedal position is after the promotion being subject to the first locating piece and the second locating piece, bga chip can along the diagonal motion of himself; When push pedal is positioned at and holds out against position, bga chip can be held out against on the opposite side wall of locating mould cavity by the first locating piece and the second locating piece, it is achieved thereby that the gapless location between bga chip and locating mould cavity inwall.
This utility model achieves the method carrying out pneumatic para-position for bga chip, effectively eliminate owing to there is gap between locating mould cavity surrounding inwall and bga chip profile, cause the problem that the stannum ball at the POGOPIN on test bench and the bga chip back side can not turn on one by one, and the requirement of relative size precision between the stannum ball on bga chip and bga chip profile is reduced by pneumatic positioning mechanism provided by the utility model, improve yield and production efficiency that bga chip manufactures, reduce the production cost of bga chip simultaneously.
Accompanying drawing explanation
Overall structure schematic diagram when Fig. 1 is that in this utility model, push pedal is positioned at origin position.
Fig. 2 is the A portion enlarged diagram in Fig. 1.
Fig. 3 is that in this utility model, push pedal is positioned at overall structure schematic diagram when holding out against position.
Fig. 4 is the B portion enlarged diagram in Fig. 3.
Fig. 5 is the structural representation of push pedal in this utility model.
Detailed description of the invention
Below in conjunction with accompanying drawing, detailed description of the invention of the present utility model is described.
If Fig. 1 is to shown in 5, a kind of pneumatic positioning mechanism for bga chip being positioned in testing, described detent mechanism includes test bench 1 and cylinder 2;The fixed block 21 of described cylinder 2 is fixedly installed on a fixing substrate 3, and the position of described fixing substrate 3 and the position of described test board 1 are relatively fixed.
Described test bench 1 is provided with the locating mould cavity 11 for placing bga chip 4, described test bench 1 is additionally provided with stannum ball each with on bga chip 4 and matches corresponding probe; The sliding shoe 22 of described cylinder 2 is provided with the push pedal 5 corresponding with described locating mould cavity 11 location matches, and this push pedal 5 seesaws along the diagonal of described locating mould cavity 11; Further, described push pedal 5 is provided with the breach 51 corresponding with described locating mould cavity 11 location matches, and described breach 51 includes the first breach limit 511 and the second breach limit 512;
Described push pedal 5 is provided with the first locating piece 6 for promoting bga chip 4 to move along the X-direction of described locating mould cavity 11 and the second locating piece 7 for promoting bga chip 4 to move along the Y-direction of described locating mould cavity 11.
Described first locating piece 6 is arranged along the X-direction of described locating mould cavity 11, and this first locating piece 6 is arranged on described first breach limit 511; Being provided with the first spring 61 between described first locating piece 6 and the plate body of described push pedal 5, the first locating piece 6 can seesaw along the axial direction of the first spring 61;
Described second locating piece 7 is arranged along the Y-direction of described locating mould cavity 11, and this second locating piece 7 is arranged on described second breach limit 512; It is provided with the second spring 71 between described second locating piece 7 and the plate body of described push pedal 5, and the second locating piece 7 can seesaw along the axial direction of the second spring 71.
In reality is tested, when the sliding shoe 22 of cylinder 2 does not travel forward, push pedal 5 is positioned at origin position, i.e. the first locating piece 6 and the remotely located die cavity 11 of the second locating piece 7, now bga chip 4 is placed on the optional position in locating mould cavity 11, after the sliding shoe 22 of cylinder 2 travels forward, push pedal 5 is positioned at when holding out against position, bga chip 4 can be held out against the opposite side wall 111 of locating mould cavity 11 by the first locating piece 6 and the second locating piece 7, on 112, it is achieved thereby that the gapless location between bga chip 4 and locating mould cavity 11 inwall, and the first set spring 61 and the second spring 71 can offset the contour tolerance of bga chip after the first locating piece 6 and the second locating piece 7, reduce the relative size required precision between stannum ball and bga chip profile.
The word in the description orientation adopted herein " on ", D score, "left", "right" etc. the convenience that is for illustrating based on the orientation shown in drawing in accompanying drawing, in actual device, these orientation are likely to be due to the disposing way of device and different.
In sum, embodiment described in the utility model only provides the embodiment of a kind of the best, technology contents of the present utility model and technical characterstic have revealed that as above, but one skilled in the art scholar is still potentially based on the disclosed content of this utility model and does the various replacement without departing substantially from this utility model creation spirit and modification; Therefore, protection domain of the present utility model is not limited to the technology contents that embodiment is disclosed, therefore all equivalences done according to shape of the present utility model, structure and principle change, and are encompassed by protection domain of the present utility model.
Claims (7)
1. the pneumatic positioning mechanism for bga chip being positioned in testing, it is characterised in that: described detent mechanism includes test bench and cylinder;
Described test bench is provided with the locating mould cavity for placing bga chip;The sliding shoe of described cylinder is provided with the push pedal corresponding with described locating mould cavity location matches, and this push pedal seesaws along the diagonal of described locating mould cavity;
Described push pedal is provided with the first locating piece for promoting bga chip to move along the X-direction of described locating mould cavity and the second locating piece for promoting bga chip to move along the Y-direction of described locating mould cavity.
2. a kind of pneumatic positioning mechanism for bga chip being positioned in testing according to claim 1, it is characterized in that: described push pedal is provided with the breach corresponding with described locating mould cavity location matches, described breach includes the first breach limit and the second breach limit; Described first locating piece is arranged on described first breach limit, and described second locating piece is arranged on described second breach limit.
3. a kind of pneumatic positioning mechanism for bga chip being positioned in testing according to claim 1 and 2, it is characterized in that: be provided with the first spring between described first locating piece and the plate body of described push pedal, between described second locating piece and the plate body of described push pedal, be provided with the second spring.
4. a kind of pneumatic positioning mechanism for bga chip being positioned in testing according to claim 3, it is characterized in that: described first locating piece can seesaw along the axial direction of the first spring, described second locating piece can seesaw along the axial direction of the second spring.
5. a kind of pneumatic positioning mechanism for bga chip being positioned in testing according to claim 1, it is characterised in that: the fixed block of described cylinder is fixedly installed on a fixing substrate.
6. a kind of pneumatic positioning mechanism for bga chip being positioned in testing according to claim 5, it is characterised in that: the position of described fixing substrate and the position of described test board are relatively fixed.
7. a kind of pneumatic positioning mechanism for bga chip being positioned in testing according to claim 1, it is characterised in that: described test bench is provided with stannum ball each with on bga chip to be measured and matches corresponding probe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521065362.5U CN205301518U (en) | 2015-12-18 | 2015-12-18 | A pneumatic positioning mechanism for testing fix a position BGA chip in |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521065362.5U CN205301518U (en) | 2015-12-18 | 2015-12-18 | A pneumatic positioning mechanism for testing fix a position BGA chip in |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205301518U true CN205301518U (en) | 2016-06-08 |
Family
ID=56470638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521065362.5U Active CN205301518U (en) | 2015-12-18 | 2015-12-18 | A pneumatic positioning mechanism for testing fix a position BGA chip in |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205301518U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105445647A (en) * | 2015-12-18 | 2016-03-30 | 苏州华兴源创电子科技有限公司 | Pneumatic positioning mechanism used for positioning BGA chip in test |
-
2015
- 2015-12-18 CN CN201521065362.5U patent/CN205301518U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105445647A (en) * | 2015-12-18 | 2016-03-30 | 苏州华兴源创电子科技有限公司 | Pneumatic positioning mechanism used for positioning BGA chip in test |
| CN105445647B (en) * | 2015-12-18 | 2019-08-06 | 苏州华兴源创科技股份有限公司 | A kind of pneumatic positioning mechanism for being positioned in testing to bga chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE602005026171D1 (en) | METHOD AND DEVICE FOR PRODUCING A FINAL DEVICE FOR A LEAD-ACID ACCUMULATOR | |
| TW200745558A (en) | Method for manufacturing probe sheet | |
| CN203713220U (en) | Positioning device for glass printing | |
| CN205301518U (en) | A pneumatic positioning mechanism for testing fix a position BGA chip in | |
| CN105698637A (en) | Test tool for engine mounting bracket | |
| TW200736574A (en) | Position measuring device and position measuring method, mobile body driving system and mobile body driving method, pattern forming device and pattern forming method, exposure device and exposure method, and device manufacturing method | |
| CN203076876U (en) | Barrel body heat jacketing machine stator jacking device | |
| CN203764850U (en) | Shaping device for pins of electronic device | |
| CN104374262A (en) | Bend detecting platform and detecting method thereof | |
| CN101493502A (en) | Plastic case breaker over-travel test tool and using method | |
| CN104330683A (en) | Mobile phone charger test equipment | |
| CN102529127B (en) | Adjustable organic glass annealing shaping frame | |
| CN105445647A (en) | Pneumatic positioning mechanism used for positioning BGA chip in test | |
| CN203792588U (en) | Clamping and positioning mechanism for connector terminal | |
| CN206450773U (en) | One kind is used for automobile ABS wire harness high-voltage isulation electric detection means | |
| CN210719582U (en) | Compatible sealed product detects frock | |
| CN203541357U (en) | Wire bending jig | |
| CN204183114U (en) | A kind of anticollision device, collision-prevention device of laser cutting head | |
| CN204286270U (en) | Bend pipe detection platform | |
| CN203804101U (en) | Electronic component pin paper tape cutting mechanism with V-shaped notches | |
| CN104949599A (en) | Welding centering checking fixture for automobiles | |
| CN205674439U (en) | There is the high-precision injection molding mould of die location structure | |
| CN204309170U (en) | Railroad on mould | |
| CN101722264A (en) | Novel forging die | |
| CN110272190A (en) | A kind of molding positioning mechanism |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215000 Qingqiu Lane 8, Suzhou Industrial Park, Jiangsu Province Patentee after: Suzhou Huaxing source Polytron Technologies Inc Address before: 215000 East Fang Industrial Park, No. 1 Huayun Road, Suzhou Industrial Park, Jiangsu Province, 2nd Floor Patentee before: Suzhou HYC Electronic Technology Co., Ltd. |