CN105430941B - A kind of technique for improving thick copper coin pressing white edge - Google Patents
A kind of technique for improving thick copper coin pressing white edge Download PDFInfo
- Publication number
- CN105430941B CN105430941B CN201510731024.9A CN201510731024A CN105430941B CN 105430941 B CN105430941 B CN 105430941B CN 201510731024 A CN201510731024 A CN 201510731024A CN 105430941 B CN105430941 B CN 105430941B
- Authority
- CN
- China
- Prior art keywords
- prepreg
- pressing
- copper coin
- copper foil
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of technique for improving thick copper coin pressing white edge, it includes the following steps：S1, sawing sheet, copper foil, copper coin and prepreg are cut according to required size；S2, core material brown；S3, pre- lamination, copper foil to be laminated, copper coin and prepreg are stacked according to predefined procedure, and the two panels prepreg close to thick copper coin is pure glue prepreg；S4, lamination, the printed circuit boards half-finished product after pre- lamination is placed on the copper foil being layed on steel plate, and also symmetrical laying has copper foil and steel plate above printed circuit boards half-finished product；S5, pressing.Traditional prepreg of thick copper coin both sides in printed circuit board is replaced with into pure glue prepreg, it is with good adhesive property, heat resistance, there is lazy flow at the same time, it is possible to prevente effectively from pressing Hou Wutong areas produce pressing white edge, and printed circuit plate thickness can not influence circuit board performance with printed circuit board consistency of thickness of the prior art after pressing.
Description
Technical field
The invention belongs to printed circuit board production field, relates in particular to a kind of work for improving thick copper coin pressing white edge
Skill.
Background technology
With the rapid development in electronic information epoch, design manufacturer is for high-power, high current server power supply plate etc.
The demand of printed circuit board (PCB) increasingly increases, and these power panels need the characteristics such as high-fire resistance, high-cooling property, so more
Favor is designed as thick copper coin.Thick copper coin is especially pressed because of the characteristic of its copper thickness thicker (>=3OZ) in the processing process of PCB
There are many processing difficulties during conjunction.
Pressing is prepreg is heated thawing using high temperature and pressure, and makes its flowing, then is changed into cured sheets, so that will
Plate and copper foil after the etching of one or more internal layer are bonded into one piece of multiple-plate processing procedure, the pressing for thick copper coin, a master
Will the problem of be that for thick copper coin since thickness is larger, it is big easily to occur resin lack of fill, gummosis amount in bonding processes so that
Cause the exception without copper area pressing white edge occur.
The content of the invention
For this reason, the technical problems to be solved by the invention are that resin easily occurs in the pressing in the prior art to thick copper coin
Lack of fill, go without copper to this exception that pressing white edge occur, so as to propose a kind of technique for improving thick copper coin pressing white edge.
In order to solve the above technical problems, the technical scheme is that：
The present invention provides a kind of technique for improving thick copper coin pressing white edge, it includes the following steps：
S1, sawing sheet, internal layer copper foil, copper coin and prepreg are cut according to required size；
S2, core material brown, oxide layer is formed in internal layer core plate surface；
S3, pre- lamination, internal layer copper foil, copper coin and prepreg to be laminated are stacked according to predefined procedure, close to thick copper
The two panels prepreg of plate is pure glue prepreg；
S4, lamination, the printed circuit boards half-finished product after pre- lamination are placed on the copper foil being layed on steel plate, the printing
Also symmetrical laying has copper foil and steel plate above circuit boards half-finished product；
S5, pressing.
Preferably, in the step S4, in the step S4, cushion pad and aluminium are equipped between the copper foil and steel plate
Piece, aluminium flake is close to the copper foil..
Preferably, in the step S5, the technological parameter of pressing is：Pressing pressure 400PSI, press maximum temperature 220
DEG C, pressing time 170min.
Preferably, the cushion pad is PACO PLUS stripping films, its thickness is 1.6mm.
Preferably, the thickness of the copper coin is not less than 3OZ.
Preferably, the prepreg of the internal layer copper foil both sides is 71% prepregs of 1080RC, its thickness is 90 μ
m。
Preferably, the pure glue prepreg thickness is 150 μm.
Preferably, the aluminium flake thickness is 0.15mm.
Preferably, the hardness of the steel plate is 47H, thermal coefficient of expansion 16.5.
The above technical solution of the present invention has the following advantages over the prior art：It is of the present invention to improve thick copper coin pressure
The technique for closing white edge, replaces with pure glue prepreg, it has by traditional prepreg of thick copper coin both sides in printed circuit board
Good adhesive property, heat resistance, while there is lazy flow, it is possible to prevente effectively to produce pressing white in pressing Hou Wutong areas
Side, and printed circuit plate thickness can not influence circuit board with printed circuit board consistency of thickness of the prior art after pressing
Energy.During lamination, each symmetrical laying cushion pad in both sides and aluminium flake above and below the printed circuit boards half-finished product after pre- lamination, buffering
The pressure that circuit boards half-finished product is subject to during hot pressing；In bonding processes, maximal pressure force value is improved, has delayed upper high-voltage time
Section, makes prepreg resin more be substantially filled in line gap, further improves the defects of pressing white edge.
Embodiment
In order to make the content of the present invention more clearly understood, below according to specific embodiment of the invention to this hair
It is bright to be described in further detail.
Embodiment
The present embodiment provides a kind of technique for improving thick copper coin pressing white edge, it includes the following steps：
S1, sawing sheet, internal layer copper foil, thick copper coin and prepreg are cut according to required size, after cutting, remove semi-solid preparation
The prepreg powder on piece surface, the thickness of the thickness copper coin are not less than 3OZ；
S2, core material brown, oxide layer is formed with conventional brown technique in internal layer core plate surface；
S3, pre- lamination, internal layer copper foil to be laminated, thick copper coin and prepreg are stacked according to predefined procedure, close to thickness
The two panels prepreg of copper coin is the pure glue prepreg that thickness is 150 μm, and copper foil both sides are 71% prepregs of 1080RC,
Thickness is 90 μm；
S4, lamination, the printed circuit boards half-finished product after pre- lamination are placed on the copper foil being layed on steel plate, the steel plate
Hardness is 47H, and thermal coefficient of expansion 16.5, also symmetrical laying has copper foil and steel plate for the printed circuit boards half-finished product top, institute
To state and cushion pad and aluminium flake are also equipped between copper foil and steel plate, for wherein aluminium flake close to the copper foil, the thickness of aluminium flake is 0.15mm,
The cushion pad is PACO PLUS stripping films, thickness 1.6mm；The each use of steel plate is later using polishing or brushing cleaning；It is slow
Punching pad and aluminium flake, the pressure that circuit boards half-finished product is subject to when having buffered hot pressing；
S5, pressing, using pressing machine, are 400PSI, press 170min under the conditions of 220 DEG C of press maximum temperature in pressure.
Traditional prepreg of thick copper coin both sides in printed circuit board is replaced with into pure glue prepreg, it has good
Adhesive property, heat resistance, while there is lazy flow, it is possible to prevente effectively from pressing Hou Wutong areas produce pressing white edge, and
And printed circuit plate thickness can not influence circuit board performance with printed circuit board consistency of thickness of the prior art after pressing.
Obviously, the above embodiments are merely examples for clarifying the description, and the restriction not to embodiment.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or
Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change thus extended out or
Among changing still in the protection domain of the invention.
Claims (2)
1. a kind of technique for improving thick copper coin pressing white edge, it is characterised in that include the following steps：
S1, sawing sheet, internal layer copper foil, copper coin and prepreg are cut according to required size；
S2, core material brown, oxide layer is formed in internal layer core plate surface；
S3, pre- lamination, internal layer copper foil, copper coin and prepreg to be laminated are stacked according to predefined procedure, close to thick copper coin
Two panels prepreg is pure glue prepreg；
S4, lamination, the printed circuit boards half-finished product after pre- lamination are placed on the copper foil being layed on steel plate, the printed circuit
Also symmetrical laying has copper foil and steel plate above boards half-finished product；
S5, pressing；
In the step S4, cushion pad and aluminium flake are equipped between the copper foil and steel plate, aluminium flake is close to the copper foil；
In the step S5, the technological parameter of pressing is：Pressing pressure 400PSI, 220 DEG C of press maximum temperature, pressing time
170min；
The cushion pad is PACO PLUS stripping films, its thickness is 1.6mm；
The thickness of the copper coin is not less than 3OZ；
The prepreg of the internal layer copper foil both sides is 71% prepregs of 1080RC, its thickness is 90 μm；
The pure glue prepreg thickness is 150 μm；
The aluminium flake thickness is 0.15mm.
2. the technique according to claim 1 for improving thick copper coin pressing white edge, it is characterised in that the hardness of the steel plate is
47H, thermal coefficient of expansion 16.5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510731024.9A CN105430941B (en) | 2015-11-02 | 2015-11-02 | A kind of technique for improving thick copper coin pressing white edge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510731024.9A CN105430941B (en) | 2015-11-02 | 2015-11-02 | A kind of technique for improving thick copper coin pressing white edge |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105430941A CN105430941A (en) | 2016-03-23 |
| CN105430941B true CN105430941B (en) | 2018-04-24 |
Family
ID=55508788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510731024.9A Active CN105430941B (en) | 2015-11-02 | 2015-11-02 | A kind of technique for improving thick copper coin pressing white edge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105430941B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106659000A (en) * | 2016-11-17 | 2017-05-10 | 深圳崇达多层线路板有限公司 | Method for producing copper-free area between layers of printed board |
| CN106686912B (en) * | 2016-12-21 | 2019-11-29 | 皆利士多层线路版(中山)有限公司 | The preparation method of thick bottom copper multilayer circuit board and thick bottom copper multilayer circuit board |
| CN106982515A (en) * | 2017-05-26 | 2017-07-25 | 东莞翔国光电科技有限公司 | A kind of thick copper coin process for pressing of 12oz |
| CN107708338A (en) * | 2017-09-20 | 2018-02-16 | 广合科技（广州）有限公司 | A kind of PCB layer pressure merges anti-process for creping |
| CN107770975A (en) * | 2017-10-31 | 2018-03-06 | 广东骏亚电子科技股份有限公司 | A kind of anti-corrugation compression methods of PCB |
| CN108650804B (en) * | 2018-05-14 | 2022-07-19 | 深圳市深联电路有限公司 | Method for manufacturing PDU high-voltage control circuit board of new energy automobile |
| CN111818738A (en) * | 2020-07-08 | 2020-10-23 | 沪士电子股份有限公司 | Method for processing thick copper PCB by using prepreg without glass cloth |
| CN113518508A (en) * | 2021-03-17 | 2021-10-19 | 东莞联桥电子有限公司 | Improved multilayer circuit board and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104168727A (en) * | 2014-08-22 | 2014-11-26 | 广州杰赛科技股份有限公司 | Method for manufacturing multilayer PCB in plate pressing mode |
| CN104486914A (en) * | 2014-11-14 | 2015-04-01 | 皆利士多层线路版(中山)有限公司 | Inner and outer layer copper thickness-differentiated thick copper circuit board and preparation method thereof |
-
2015
- 2015-11-02 CN CN201510731024.9A patent/CN105430941B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104168727A (en) * | 2014-08-22 | 2014-11-26 | 广州杰赛科技股份有限公司 | Method for manufacturing multilayer PCB in plate pressing mode |
| CN104486914A (en) * | 2014-11-14 | 2015-04-01 | 皆利士多层线路版(中山)有限公司 | Inner and outer layer copper thickness-differentiated thick copper circuit board and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105430941A (en) | 2016-03-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105430941B (en) | A kind of technique for improving thick copper coin pressing white edge | |
| CN103722807A (en) | High-thermal-conductivity and high-pressure-resistance aluminum-based copper-clad plate and preparation method thereof | |
| WO2019014956A1 (en) | Method for manufacturing high-frequency board by mixing and pressing different board materials | |
| JP2011132535A5 (en) | ||
| CN102448251B (en) | Multilayer single-face aluminum-based circuit board and manufacturing method thereof | |
| TWI377891B (en) | ||
| CN103108485B (en) | Multilayer board and preparation method thereof | |
| CN101772267A (en) | Improvement method for wrinkled copper foil in compacting process of high-rise plates | |
| CN104394653A (en) | Manufacture method of multi-layer aluminum base sandwich printed circuit board | |
| CN102009514A (en) | Manufacturing method of sandwich plate | |
| CN204968229U (en) | Structure of lamination in advance before circuit board pressfitting | |
| CN108012468A (en) | A kind of lamination of cyanate ester resin quartz fabric multilayer board and processing technology | |
| CN107072078A (en) | A kind of solution rigid-flex combined board folds the asymmetric slab warping method caused of structure | |
| CN103025066B (en) | A kind of preparation method of metal base single-sided doubling plate | |
| CN105216400A (en) | High-thermal conductive metal base plate resin filler method, vacuum pressing-combining structure and metal substrate | |
| JP2001015933A (en) | Thermally fusible insulating sheet | |
| CN103144378A (en) | Copper-clad plate (CCL) and printed circuit board (PCB) of phenol novolac (PN) curing system and manufacturing method thereof | |
| CN105196645A (en) | Production method of ultra-thin aluminum based copper-clad plate, vacuum laminating structure and aluminum based copper-clad plate | |
| CN201922612U (en) | Press | |
| CN205291774U (en) | High thermal conductive metal substrate | |
| CN201501140U (en) | Prepreg with resin beds of asymmetric thicknesses | |
| CN110225676A (en) | A kind of production technology of multiple layer metal substrate | |
| CN207927005U (en) | A kind of wiring board consent pressing structure | |
| CN112839453A (en) | Rigid-flexible combined circuit board and preparation method thereof | |
| CN105208773B (en) | A kind of preparation method of rigid-flex combined board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |