CN103144378A - Copper-clad plate (CCL) and printed circuit board (PCB) of phenol novolac (PN) curing system and manufacturing method thereof - Google Patents
Copper-clad plate (CCL) and printed circuit board (PCB) of phenol novolac (PN) curing system and manufacturing method thereof Download PDFInfo
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Abstract
The invention relates to a copper-clad plate (CCL) and a printed circuit board (PCB) of a phenol novolac (PN) curing system and a manufacturing method thereof. The CCL of the PN curing system is in an incomplete curing state. The curing factor delta Tg of the CCL is bigger than or equal to 15 DEG C or the peel strength of the CCL is small than or equal to 0.8 newtons per millimeter (N/mm). The manufacturing method of the CCL includes a first step of overlapping a certain number of prepregs of the PN curing system and covering copper foil on the two outermost sides or one side of the prepregs to form an overlapping structure, a second step of carrying out heating on the overlapping structure in a laminating machine to enable the prepregs to generate rheological reaction, and a third step of stopping heating after glue flowing of the prepregs and before completely curing to from incompletely curing CCL of the PN curing system. The PCB of the PN curing system is provided with alveolate rough hole walls. The manufacturing of the PCB includes the steps of drilling process, glue removing process and electroplating process. The PCB of the PN curing system is in an incomplete curing state before the glue removing process is completed. The PCB of the PN curing system is processed through the glue removing process to form alveolate rough hole walls.
Description
Technical field
The present invention relates to the printed-board technology field, relate in particular to copper-clad plate, pcb board of a kind of PN curing system and preparation method thereof.
Background technology
Pcb board (Printed Circuit Board), Chinese is printed circuit board, claims again printed circuit board (PCB), printed substrate, is important electronic unit, is the supporter of electronic devices and components, is the supplier of electronic devices and components electrical connection.The industry pcb board is by traditional double-sided PCB board, progressively to multi-layer PCB board, the development of HDI plate.
Double-sided PCB board makes as the basis processes take copper-clad plate, and its traditional technological process is: sawing sheet → boring → except glue → heavy copper plating → figure transfer → graphic plating → etching → welding resistance → surface treatment → processing and forming etc.
Multi-layer PCB board, processing makes take copper-clad plate, prepreg as basic material, and it with traditional technological process is: and interior layer process (sawing sheet → figure transfers → graphic plating → etching) → pressing → outer layer process (boring → except glue → sink copper plating → figure transfer → graphic plating → etching → welding resistance → surface treatment → processing and forming etc.).
The HDI plate, processing makes take copper-clad plate, prepreg as basic material, and it with traditional technological process is: interior layer process (sawing sheet → boring → except glue → heavy copper platings → figure transfer → graphics circuitry → etching) → pressing → layer process (glue of holing → remove → sink copper plating → figure transfer → graphic plating → etching → welding resistance → surface treatment → processing and forming etc.).
Wherein, described process for pressing, it specifically comprises: the core material both sides that make after the etching in layer process are coated with the prepreg of some, and fold material at the bilateral outermost coated with the mode of Copper Foil, and then lamination is carried out in the pressurization of heating of promoting layer press.
Wherein, described copper-clad plate is generally the product of copper-clad plate producer, and it adopts the prepreg of some, and folds material at its bilateral outermost coated with the mode of Copper Foil, and then lamination is carried out in the pressurization of heating of promoting layer press.The laminating technology of making copper-clad plate is basic identical with laminating technology principle and the equipment thereof of making multi-layer PCB board, HDI plate.
Wherein, described prepreg, it is the semi-finished product of copper-clad plate factory, also can be used as merchandise sales to PCB producer for making the raw material of multi-layer PCB board, HDI plate.Prepreg, its traditional processing technology is: the reinforcing materials such as glass fabric, nonwoven, wood pulp paper are soaked with compositions of thermosetting resin, form through baking.The characteristic of compositions of thermosetting resin has determined the performance performance of prepreg, copper-clad plate and the pcb board thereof of its making to a great extent.
In the copper-clad plate industry, traditional thermosetting resin composition formula adopts the DICY(dicyandiamide) curing system, but along with the pcb board industry is more and more higher to the heat resistance requirement of copper-clad plate and pcb board, the copper-clad plate industry progressively turns to and adopts PN(linear phenolic resin Phenol Novolac) curing system, the crosslink density of PN curing system obviously increases, and its heat resistance significantly improves.But it also brings corresponding negative effect in the PCB process: except in adhesive process, because resin crosslinks density is large, be difficult to be stung erosion by liquid medicine, can not form cellular coarse hole wall, the hole copper that causes heavy copper to be electroplated is relative with the hole wall adhesion relatively poor.Particularly in the macropore of pcb board, irregular hole, after the heat treatment in pcb board processing and follow-up use procedure, easily form hole copper separation problem.As shown in Figure 4, described hole copper 200 separation problems are the situation that hole copper 200 and hole wall 400 break away from, and it brings serious hidden danger of quality for circuit turn-on of interlayer.
At present, be the hole copper separation problem in the pcb board manufacturing process of avoiding the PN curing system, industry often adopts the erosion amount of stinging that strengthens except adhesive process, perhaps once changes to except glue the method for repeatedly removing glue by traditional.The method easily causes excessively forming hole wall coarse (hole is thick) problem except the erosion of stinging of adhesive process; Hole copper plating (wicking) problem reaches the CAF(ConductiveAnodic Filament between the adjacent holes that causes thus: the ion migration) conduction problem, particularly in the less situation of pitch of holes, improve the probability of happening of CAF conducting between the hole greatly.
Summary of the invention
One of the object of the invention is to provide a kind of copper-clad plate of PN curing system of incomplete solid state, it is in incomplete solid state, the adhesive process that removes of being convenient in follow-up PCB process forms cellular coarse hole wall, and increases the adhesion of hole copper and hole wall.
Two of the object of the invention is to provide a kind of method for manufacturing cover clad laminate of PN curing system of incomplete solid state, the copper-clad plate of using the method to make is in incomplete solid state, the adhesive process that removes of being convenient in follow-up PCB process forms cellular coarse hole wall, and increases the adhesion of hole copper and hole wall.
Three of the object of the invention is to provide a kind of pcb board of PN curing system, this pcb board is with cellular coarse hole wall, the hole copper that heavy copper is electroplated is relative with the hole wall adhesion better, can solve well the hole copper separation problem of the pcb board of PN curing system, hole copper separation problem particularly appears on macropore, irregular pore structure, the situation that avoided effectively also simultaneously that the hole is thick, the CAF conducting was lost efficacy between hole copper plating, hole.
Four of the object of the invention is to provide a kind of pcb board preparation method of the PN curing system with cellular coarse hole wall.The pcb board that makes can be with cellular coarse hole wall, the hole copper that heavy copper is electroplated is relative with the hole wall adhesion better, can solve well the hole copper separation problem of the pcb board of PN curing system, hole copper separation problem particularly appears on macropore, irregular pore structure, the situation that avoided effectively also simultaneously that the hole is thick, the CAF conducting was lost efficacy between hole copper plating, hole.
For achieving the above object, the technical solution used in the present invention is as follows.
The invention provides a kind of copper-clad plate of PN curing system, the copper-clad plate of described PN curing system is incomplete solid state, and namely it solidifies factor Δ Tg 〉=15 ℃ or peel strength≤0.8N/mm.
The invention provides a kind of preparation method of copper-clad plate of PN curing system, comprise the following steps:
Step 1, the prepreg of the PN curing system of superimposed some and in the outermost both sides or one-sided coated with Copper Foil forms folded material structure;
Preferably, in described step 2, the condition of cure of lamination is: the maximum temperature of heating be 170 ℃ ~ 175 ℃, the pressurization maximum pressure be 140 ~ 420PSI and under this maximum temperature, maximum pressure retention time 10 ~ 30min.
The present invention also provides a kind of pcb board of PN curing system, and the pcb board of described PN curing system is with cellular coarse hole wall, and the porosity of described cellular coarse hole wall is 10 ~ 40%.
Described cellular coarse hole wall forms after processing except adhesive process; The pcb board of described PN curing system was incomplete solid state before machining except adhesive process.
The present invention also provides a kind of preparation method of pcb board of PN curing system, comprise bore process, remove adhesive process, electroplating technology, the pcb board of described PN curing system was incomplete solid state before machining except adhesive process, through being processed to form cellular coarse hole wall except adhesive process.
Except adhesive process adds man-hour, it stings the erosion severity control at 3 ~ 15um.
The curing factor Δ Tg of the pcb board of described PN curing system 〉=15 ℃ or peel strength≤0.8N/mm before machining except adhesive process.
More preferably, after electroplating technology, also comprise the completely crued rear curing process of described PN curing system pcb board.
Described rear curing process is the baking of heating, thereafter the curing process condition be the maximum temperature of heating at 180 ~ 190 ℃, the retention time is 40 ~ 60min.
Described rear curing process is for adopting the heat lamination of pressurization of laminating machine, curing process thereafter, the maximum temperature of heating is 140 ~ 420PSI at 180 ~ 190 ℃, the maximum pressure of pressurization, and under this maximum temperature and maximum pressure retention time 40 ~ 60min.
Beneficial effect of the present invention: the copper-clad plate of PN curing system provided by the invention, it is in incomplete solid state, and the adhesive process that removes of being convenient in follow-up PCB process forms cellular coarse hole wall, and increases the adhesion of hole copper and hole wall.The preparation method of the pcb board of PN curing system provided by the invention will deliberately be made into except the pcb board of the PN curing system before adhesive process the state of incomplete curing, then through processing except traditional PCB procedure for processing such as glue, heavy copper plating.It is in the state of incomplete curing due to the PN curing system substrate that adopts, less under the relatively complete solid state of the crosslink density of its resin, remove with this understanding adhesive process, easy cellular coarse structure when liquid medicine is stung erosion, its specific area is larger, and the adhesion of heavy copper and copper electroplating layer and hole wall strengthens thereafter.Simultaneously, it is in the PN curing system substrate that adopts under the state of incomplete curing, the cross-linking reaction of its resin is not yet completed, it is active that it has certain chemical bonding, sink with this understanding the copper electroplating technology, the resin of hole copper and hole wall except being combined with physics mode also with chemical bonds, in conjunction with more firm.Thereby the hole copper separation problem in the time of can avoiding follow-up heat treatment process.Form completely crued pcb board after can also carrying out under curing process after electroplating technology, can avoid the pcb board finished product still to be in incomplete solid state because of the upper part layered problem of the relatively poor SMT of causing of heat resistance.
In order further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation use, the present invention is limited.
Description of drawings
Below in conjunction with accompanying drawing, by the specific embodiment of the present invention is described in detail, will make technical scheme of the present invention and other beneficial effect apparent.
In accompanying drawing,
Fig. 1 is not exclusively making side's flow chart of the copper-clad plate of the PN curing system of curing of the present invention;
Fig. 2 is the cellular coarse hole wall schematic diagram of the pcb board of PN curing system of the present invention;
Fig. 3 is the block hole wall schematic diagram of the pcb board of traditional completely crued PN curing system;
Fig. 4 is the schematic diagram of pcb board macropore hole copper separation problem;
Fig. 5 is that the traditional double-sided PCB board of comparative example is made flow chart;
Fig. 6 is that the double-sided PCB board of the embodiment of the present invention 1 is made flow chart;
Fig. 7 is that the multi-layer PCB board of the embodiment of the present invention 2 is made flow chart;
Fig. 8 is that the HDI type pcb board of the embodiment of the present invention 3 is made flow chart.
The specific embodiment
Technological means and the effect thereof taked for further setting forth the present invention are described in detail below in conjunction with the preferred embodiments of the present invention and accompanying drawing thereof.
The invention provides a kind of copper-clad plate of PN curing system, be in incomplete solid state, adopt IPC ~ TM ~ 650 method of testings to carry out Tg(DSC) test, its curing factor Δ Tg 〉=15 ℃; Or adopt IPC ~ TM ~ 650 method of testings to carry out peel strength test, its peel strength≤0.8N/mm.
The copper-clad plate of the PN curing system that this kind not exclusively solidifies in the process of making pcb board, is easily forming cellular coarse hole wall except adhesive process, and specific area is larger, and the adhesion of hole copper and hole wall is better, can effectively solve hole copper separation problem.
See also the preparation method of copper-clad plate of the PN curing system of the above-mentioned incomplete curing of Fig. 1, its manufacture craft is:
Step 1, the prepreg of the PN curing system of superimposed some and in outermost both sides coated with Copper Foil, form folded material structure;
Traditional completely crued PN curing system copper-clad plate, its condition of cure is: the maximum temperature of intensification 〉=180 ℃ and retention time 〉=60min, the copper-clad plate Δ Tg of the completely crued PN curing system that it makes≤5 ℃, peel strength PS 〉=1.05N/mm.
And more preferably make the curing process condition of not exclusively solidifying the copper-clad plate of PN curing system and be: the maximum temperature of heating is 140 ~ 420PSI at 170 ℃ ~ 175 ℃, the maximum pressure of pressurization, and under this maximum temperature, maximum pressure retention time 10 ~ 30min.The Δ Tg of the PN curing system copper-clad plate of the incomplete curing that makes under this condition of cure 〉=15 ℃, peel strength is between 0.5N/mm and 0.8N/mm.Form under this condition of cure and not exclusively solidify copper-clad plate, the physical property such as the rigidity that it is whole is with to solidify copper-clad plate fully basic identical, but its PCB processing except in adhesive process, the effect of the cellular hole wall of formation is best, can effectively solve hole copper separation problem.
See also Fig. 2, the invention provides a kind of pcb board of PN curing system, with cellular coarse hole wall, described cellular coarse hole wall forms after processing except adhesive process, and the porosity of described cellular coarse hole wall is 10 ~ 40%.
To deliberately be made into except the PCB substrate of the PN curing system before adhesive process the state of incomplete curing, at this moment, the PCB substrate of the PN curing system that not exclusively solidifies has been completed the gummosis stage, and it has and solidifies the PCB substrate physical properties such as rigidity that substrate is identical basically fully.Simultaneously, not exclusively solidify PN curing system PCB substrate and solidify not yet fully, its crosslink density is relatively low, is convenient to sting erosion except the liquid medicine of adhesive process, thereby is easy to form cellular coarse hole wall.See also Fig. 3 and Fig. 4, adopt the PCB substrate of traditional completely crued PN curing system to sting erosion through the liquid medicine except adhesive process, but can only form block hole wall 400, its specific area is less, be unfavorable for the combination of hole copper 200 and hole wall 400, at this moment, therefore the situation that hole copper 200 separates with hole wall 400 easily occurs.
The present invention also provides the preparation method of the pcb board of this PN curing system, and the pcb board of described PN curing system was incomplete solid state before machining except adhesive process, through being processed to form cellular coarse hole wall except adhesive process.
Preferably, described except in adhesive process, sting the erosion severity control at 3 ~ 15um.This just is easy to form cellular coarse hole wall, and its hole copper good bonding strength can avoid macropore and irregular hole hole copper separation problem to occur.When stinging the erosion degree of depth during less than 3um, its hole wall to sting erosion in poor shape, be difficult to form cellular coarse hole wall.When stinging the erosion degree of depth greater than 15um, it has the risk of hole copper plating, and the CAF conducting that easily produces between the hole was lost efficacy.
The pcb board of PN curing system was incomplete solid state before machining except adhesive process, preferably, adopt IPC ~ TM ~ 650 method of testings to carry out Tg(DSC) test, its curing factor Δ Tg 〉=15 ℃; Or adopting IPC ~ TM ~ 650 method of testings to carry out peel strength test, its peel strength is between 0.5N/mm and 0.8N/mm.The pcb board of the PN curing system that this kind not exclusively solidifies in the process of making pcb board, is easily forming cellular coarse hole wall except adhesive process, and specific area is larger, and the adhesion of hole copper and hole wall is better, can effectively solve hole copper separation problem.
Further, still be in incomplete solid state because of the upper part layered problem of the relatively poor SMT of causing of heat resistance for avoiding the pcb board finished product, can be except curing process after setting up after adhesive process, the pcb board of PN curing system is processed into complete solid state.The pcb board of the PN curing system under solid state, adopt IPC ~ TM ~ 650 method of testings to carry out Tg(DSC fully) test, its curing factor Δ Tg≤5 ℃; Or adopt IPC ~ TM ~ 650 method of testings to carry out peel strength test, its peel strength 〉=1.05N/mm.Described rear curing process can be the baking of heating, thereafter the curing process condition be the maximum temperature of heating at 180 ~ 190 ℃, the retention time is 40 ~ 60min.Also can adopt laminating machine heat the pressurization the lamination mode carry out rear curing process, the maximum temperature of heating 180 ~ 190 ℃, the pressurization maximum pressure be 140 ~ 420PSI, with retention time 40 ~ 60min under this maximum temperature, maximum pressure, its effect is better.
For copper-clad plate of the present invention, pcb board, detect its Δ Tg, PS and hole copper separation case is tested, its test result such as following embodiment further give to illustrate in detail and describe.
Comparative example
As shown in Figure 5, adopt traditional double-sided PCB board preparation method, make the technological process of a S1170 double-sided PCB board.Select prepreg S0701 and the copper-clad plate S1170 of a PN curing system of certain company.
Step 1.1 prepares completely crued S1170 substrate,
Folded material: the resin content RC=43%S07017628 prepreg of superimposed 16, and in both sides coated with the 1OZ Copper Foil;
Lamination: the folded material structure of step 1 is pushed the laminating machine pressurization of heating, form completely crued copper-clad plate.Controlling its condition of cure is: 185 ℃ ~ 190 ℃ of time-temperatures and retention time 60min.
The S11703.21/1 copper-clad plate of the incomplete curing that it makes, and test the parameters such as its curing factor Δ Tg, peel strength PS.
Step 1.2 is carried out PCB processing to completely crued S1170 substrate,
The outer layer process of PCB: the glue of will described completely crued S11703.21/1 substrate holing → remove → sink copper plating → figure transfer → graphics circuitry → etching → welding resistance → processing and forming.
Wherein said bore process comprises the macropore of boring aperture 1.0mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, and Φ 1.6mm * 6.4mm grooved hole
Make the S1170 double-sided PCB board through the PCB processing technology, and test the parameters such as its curing factor Δ Tg, peel strength PS.Simultaneously, the macropore of aperture 1.0mm, the 2.0mm of observation dual platen pcb board, 3.0mm, 4.0mm, 5.0mm, 6.0mm, the hole copper separation case in and Φ 1.6mm * 6.4mm grooved hole.
Embodiment 1
As shown in Figure 6, adopt pcb board method of the present invention, make the technological process of a S1170 double-sided PCB board.Select prepreg S0701 and the copper-clad plate S1170 of a PN curing system of certain company.
Step 2.1, the S1170 substrate that preparation is not exclusively solidified,
Folded material: the resin content RC=50%S07017628 prepreg of superimposed 16, and in both sides coated with the 1OZ Copper Foil;
Lamination: will fold the material structure and push the laminating machine pressurization of heating, and after the prepreg gummosis, fully stop heating before solidifying, form the not exclusively copper-clad plate of curing.Controlling its condition of cure is: 170 ℃ of time-temperatures and retention time 10min.
The S11703.21/1 copper-clad plate of the incomplete curing that it makes, and test the parameters such as its curing factor Δ Tg, peel strength PS.
Step 2.2 is carried out PCB processing to the S1170 substrate of incomplete curing,
The outer layer process of PCB: the glue of will the S11703.21/1 substrate of described incomplete curing holing → remove → sink copper plating → figure transfer → graphics circuitry → etching → welding resistance → processing and forming.
Wherein said bore process comprises the macropore of boring aperture 1.0mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, and Φ 1.6mm * 6.4mm grooved hole.
Step 2.3, rear curing is processed, the S1170 double-sided PCB board that makes,
With the S1170 substrate of completing after the PCB processing technology, the drying-plate of heating carries out rear curing to be processed, and its condition: temperature is 190 ℃, and retention time 60min with the S1170 double-sided PCB board that makes, and tests it and solidifies the parameters such as factor Δ Tg, peel strength PS.Simultaneously, the macropore of aperture 1.0mm, the 2.0mm of observation dual platen pcb board, 3.0mm, 4.0mm, 5.0mm, 6.0mm, the hole copper separation case in and Φ 1.6mm * 6.4mm grooved hole.
As shown in Figure 7, the present invention makes the technological process of four layers of pcb board of a S1170.Select prepreg S0701 and the copper-clad plate S1170 of a PN curing system of certain company.
Step 3.1, the S1170 substrate that preparation is not exclusively solidified,
Folded material: the resin content RC=43%S07017628 prepreg of superimposed 8, and in both sides coated with the 1OZ Copper Foil;
Lamination: will fold the material structure and push the laminating machine pressurization of heating, and after the prepreg gummosis, fully stop heating before solidifying, form the not exclusively copper-clad plate of curing.Controlling its condition of cure is: 175 ℃ of time-temperatures and retention time 20min.
The S11701.61/1 copper-clad plate of the incomplete curing that it makes, and test the parameters such as its curing factor Δ Tg, peel strength PS.
Step 3.2 is carried out PCB processing to the S1170 substrate of incomplete curing, and form and not exclusively solidify S11703.21/1 four laminates,
Figure transfer, graphics circuitry, etch process are carried out in the S11701.61/1 copper-clad plate of not exclusively solidifying, make the S1170 core material of incomplete curing.
Lamination: each prepreg coated with 4 RC=43%S07017628 of the core material both sides that will not exclusively solidify, and the both sides outermost layer is coated with the 1OZ Copper Foil; Push the laminating machine pressurization of heating, after the prepreg gummosis, fully stop heating before solidifying, form S11703.21/1 four laminates that not exclusively solidify, and test it and solidify the parameters such as factor Δ Tg, peel strength PS.
The outer layer process of PCB: with described PN curing system substrate glue → the sink copper plating → figure transfer → graphics circuitry → etching → welding resistance → surface treatment → processing and forming of holing → remove.
Wherein said bore process comprises the macropore of boring aperture 1.0mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, and Φ 1.6mm * 6.4mm grooved hole.
Wherein said process of surface treatment is processed for spray tin.
Step 3.3, rear curing is processed, and forms four layers of pcb board of S1170,
With the S1170 substrate of completing after the PCB processing technology, the drying-plate of heating carries out rear curing to be processed, and its condition: temperature is 190 ℃, and retention time 60min with the four layers of pcb board of S1170 that make, and tests it and solidifies the parameters such as factor Δ Tg, peel strength PS.Simultaneously, the macropore of aperture 1.0mm, the 2.0mm of observation dual platen pcb board, 3.0mm, 4.0mm, 5.0mm, 6.0mm, the hole copper separation case in and Φ 1.6mm * 6.4mm grooved hole.
Embodiment 3
As shown in Figure 8, the present invention makes the technological process of four layers of HDI type pcb board of a S1170.Select prepreg S0701 and the copper-clad plate S1170 of a PN curing system of certain company.
Step 4.1, the S1170 substrate that preparation is not exclusively solidified,
Folded material: the resin content RC=43%S07017628 prepreg of superimposed 8, and in both sides coated with the 1OZ Copper Foil;
Lamination: will fold the material structure and push the laminating machine pressurization of heating, and after the prepreg gummosis, fully stop heating before solidifying, form the not exclusively copper-clad plate of curing.Controlling its condition of cure is: 175 ℃ of time-temperatures and retention time 10 ~ 30min.
The S11701.61/1 copper-clad plate of the incomplete curing that it makes, and test the parameters such as its curing factor Δ Tg, peel strength PS.
Step 4.2 is carried out PCB processing to the S1170 substrate of incomplete curing, and form and not exclusively solidify four layers of HDI plate of S11703.21/1,
Glue, heavy copper plating, figure transfer, graphics circuitry, etch process are holed, removed in the S11701.61/1 copper-clad plate of described incomplete curing, make the core material of incomplete curing.
Lamination: each prepreg coated with 1 RC=68%S07011080 of the core material both sides that will not exclusively solidify, and the both sides outermost layer is coated with the 1OZ Copper Foil; Push the laminating machine pressurization of heating, after the prepreg gummosis, fully stop heating before solidifying, form the four layers of HDI plate of S11703.21/1 that not exclusively solidify, and test it and solidify the parameters such as factor Δ Tg, peel strength PS.
The outer layer process of PCB: with described PN curing system substrate glue → the sink copper plating → figure transfer → graphics circuitry → etching → welding resistance → surface treatment → processing and forming of holing → remove.
Wherein said bore process comprises the macropore of boring aperture 1.0mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, and Φ 1.6mm * 6.4mm grooved hole.
Wherein said process of surface treatment is processed for spray tin.
Step 4.3, rear curing is processed, and forms the pcb board of four layers of HDI of S1170,
With four layers of HDI plate of S11703.21/1 of completing after the PCB processing technology, the drying-plate of heating carries out rear curing to be processed, and its condition: temperature is 190 ℃, retention time 60min, with the pcb board of four layers of HDI plate of S1170 of making, and test it and solidify the parameters such as factor Δ Tg, peel strength PS.Simultaneously, the macropore of aperture 1.0mm, the 2.0mm of observation dual platen pcb board, 3.0mm, 4.0mm, 5.0mm, 6.0mm, the hole copper separation case in and Φ 1.6mm * 6.4mm grooved hole.
Comparison of test results is as shown in table 1.
Table 1
Wherein, Δ Tg is the index of the fundamental characteristics of industry sign sheet material commonly used, its sheet material Tg1 for adopting differential scanning calorimeter DSC to test for the first time, poor with the sheet material Tg2 of test for the second time, be Δ Tg=Tg1-Tg2, the international standard of its method of testing is IPC ~ TM ~ 6502.4.25.
Wherein, PS is the index of the fundamental characteristics of industry sign sheet material commonly used, and it is write a Chinese character in simplified form for peel strength PeelStrength's, and the international standard of its method of testing is IPC ~ TM ~ 6502.4.25.
Wherein, hole copper separation case, employing is erected the mill sections observation to the hole and is learnt, and its hole copper and hole wall are separated into NG, and hole copper is combined with hole wall and well is OK.
As seen from the above table, copper-clad plate provided by the invention, pcb board and preparation method thereof can effectively increase the adhesion of hole copper and hole wall, solve the problem that hole copper separates with hole wall.
Above inventive method is the copper-clad plate of the PN curing system of applicable other models too, as S1000, S1000-2 product, IT158, IT180A product and the products such as EM825, EM827 of knowing in industry.
In sum, the copper-clad plate of PN curing system provided by the invention, it is in incomplete solid state, and the adhesive process that removes of being convenient in follow-up PCB process forms cellular coarse hole wall, and increases the adhesion of hole copper and hole wall.The preparation method of the pcb board of PN curing system provided by the invention will deliberately be made into except the pcb board of the PN curing system before adhesive process the state of incomplete curing, then through processing except traditional PCB procedure for processing such as glue, heavy copper plating.It is in the state of incomplete curing due to the PN curing system substrate that adopts, less under the relatively complete solid state of the crosslink density of its resin, remove with this understanding adhesive process, easy cellular coarse structure when liquid medicine is stung erosion, its specific area is larger, and the adhesion of heavy copper and copper electroplating layer and hole wall strengthens thereafter.Simultaneously, it is in the PN curing system substrate that adopts under the state of incomplete curing, the cross-linking reaction of its resin is not yet completed, it is active that it has certain chemical bonding, sink with this understanding the copper electroplating technology, the resin of hole copper and hole wall except being combined with physics mode also with chemical bonds, in conjunction with more firm.Thereby the hole copper separation problem in the time of can avoiding follow-up heat treatment process.Form completely crued pcb board after can also carrying out under curing process after electroplating technology, can avoid the pcb board finished product still to be in incomplete solid state because of the upper part layered problem of the relatively poor SMT of causing of heat resistance.
The above for the person of ordinary skill of the art, can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection domain of claim of the present invention.
Claims (10)
1. the copper-clad plate of a PN curing system, is characterized in that, the copper-clad plate of described PN curing system is incomplete solid state, and it solidifies factor Δ Tg 〉=15 ℃ or peel strength≤0.8N/mm.
2. the preparation method of the copper-clad plate of a PN curing system, is characterized in that, comprises the following steps:
Step 1, the prepreg of the PN curing system of superimposed some and in the outermost both sides or one-sided coated with Copper Foil forms folded material structure;
Step 2, with the pressurization of heating in laminating machine of described folded material structure, prepreg generation rheology reaction; After the prepreg gummosis, fully stop heating before solidifying, form the PN curing system copper-clad plate of not exclusively solidifying;
Preferably, in described step 2, the condition of cure of lamination is: the maximum temperature of heating be 170 ℃ ~ 175 ℃, the pressurization maximum pressure be 140 ~ 420PSI and under this maximum temperature, maximum pressure retention time 10 ~ 30min.
3. the pcb board of a PN curing system, is characterized in that, the pcb board of described PN curing system is with cellular coarse hole wall, and the porosity of described cellular coarse hole wall is 10 ~ 40%.
4. the pcb board of PN curing system as claimed in claim 3, is characterized in that, described cellular coarse hole wall forms after processing except adhesive process; The pcb board of described PN curing system was incomplete solid state before machining except adhesive process.
5. the preparation method of the pcb board of a PN curing system, comprise bore process, remove adhesive process, electroplating technology, it is characterized in that, the pcb board of described PN curing system was incomplete solid state before machining except adhesive process, through being processed to form cellular coarse hole wall except adhesive process.
6. the preparation method of the pcb board of PN curing system as claimed in claim 5, is characterized in that, except adhesive process adds man-hour, it stings the erosion severity control at 3 ~ 15um.
7. the preparation method of the pcb board of PN curing system as described in claim 5 or 6, is characterized in that, the curing factor Δ Tg of the pcb board of described PN curing system 〉=15 ℃ or peel strength≤0.8N/mm before machining except adhesive process.
8. the preparation method of the pcb board of PN curing system as described in claim 5 to 7 any one, is characterized in that, after electroplating technology, also comprises the completely crued rear curing process of described PN curing system pcb board.
9. the preparation method of the pcb board of PN curing system as claimed in claim 8, is characterized in that, described rear curing process is the baking of heating, thereafter the curing process condition be the maximum temperature of heating at 180 ~ 190 ℃, the retention time is 40 ~ 60min.
10. the preparation method of the pcb board of PN curing system as claimed in claim 8, it is characterized in that, the lamination of described rear curing process for adopting laminating machine to heat and pressurize, thereafter curing process, the maximum temperature of heating 180 ~ 190 ℃, the pressurization maximum pressure be 140 ~ 420PSI, and under this maximum temperature and maximum pressure retention time 40 ~ 60min.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310032344.6A CN103144378B (en) | 2013-01-28 | 2013-01-28 | Copper-clad plate (CCL) and printed circuit board (PCB) of phenol novolac (PN) curing system and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310032344.6A CN103144378B (en) | 2013-01-28 | 2013-01-28 | Copper-clad plate (CCL) and printed circuit board (PCB) of phenol novolac (PN) curing system and manufacturing method thereof |
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| CN103144378A true CN103144378A (en) | 2013-06-12 |
| CN103144378B CN103144378B (en) | 2015-03-25 |
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| CN201310032344.6A Expired - Fee Related CN103144378B (en) | 2013-01-28 | 2013-01-28 | Copper-clad plate (CCL) and printed circuit board (PCB) of phenol novolac (PN) curing system and manufacturing method thereof |
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| CN (1) | CN103144378B (en) |
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| CN106793517A (en) * | 2016-12-29 | 2017-05-31 | 安徽深泽电子科技有限公司 | A kind of pcb board filling holes with resin electroplates preparation method |
| CN107764736A (en) * | 2017-10-18 | 2018-03-06 | 广东生益科技股份有限公司 | Multiple-plate roughening effect evaluation method |
| CN113194640A (en) * | 2021-04-28 | 2021-07-30 | 中国科学院微电子研究所 | Manufacturing method of low-warpage high-density packaging substrate |
| CN113207245A (en) * | 2021-04-28 | 2021-08-03 | 中国科学院微电子研究所 | Method for manufacturing low-warpage printed wiring board |
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