CN105420700B - A kind of polyimide circuits plate and preparation method thereof - Google Patents
A kind of polyimide circuits plate and preparation method thereof Download PDFInfo
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- CN105420700B CN105420700B CN201410479686.7A CN201410479686A CN105420700B CN 105420700 B CN105420700 B CN 105420700B CN 201410479686 A CN201410479686 A CN 201410479686A CN 105420700 B CN105420700 B CN 105420700B
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Abstract
The invention discloses a kind of preparation method of polyimide circuits plate, this method comprises the following steps：(1) laser ablation is carried out to adhesive tape, burns the adhesive tape to form circuit；(2) adhesive tape formed with circuit is bonded on polyimide film, carries out chemical plating after surface treated again.Cause that the polyimide circuit of preparation is finer using the preparation method of polyimide circuits plate provided by the invention, and the preparation method is simple, technical process is simpler and environmentally friendly.
Description
Technical field
The invention belongs to Chemical Plating of Non metal Material field, in particular it relates to a kind of polyimide circuits plate and preparation method thereof.
Background technology
Microelectronic packaging technology develops to high speed, lightness direction, it is desirable to and baseplate material has relatively low dielectric constant,
The resistivity of metal line material is low, and deelectric transferred ability is high, and the dielectric constant of polyimides is low, flexible, and anti-electric energy power is strong,
High temperature resistant, therefore, polyimides substantially on be preferable substrate used for electronic packaging, in civil electronic device products, communication device
In be widely used.
For the polyimide substrate used at present, copper foil is pasted on polyamides usually using adhesive such as epoxy resin
Imines surface obtains substrate.This method technical maturity, product quality are more stable.But it is the high density for realizing electronic equipments
Assembling, the structure of above-mentioned copper foil can not fully meet the requirement of filming, in addition, having used the circuit substrate of adhesive
Following problems be present：1st, the etching liquor of copper foil penetrates into adhesive phase, and copper may occur in hot and humid lower application pressure
Transfer, cause short circuit；2nd, the poor dimensional stability of adhesive；3rd, the microfabrication of circuit substrate is made become difficult, it is difficult
To adapt to densification；4th, the thermal characteristics of adhesive layer is poorer than baseplate material, and heat endurance has problem, it is difficult to realizes high density
Change；5th, product easily deforms.
In addition, also generally use ink covers the part for not forming circuit on polyimides (PI) film in the prior art,
After last circuit is formed, the ink layer is difficult to clean off, and influences wiring board outward appearance.
Therefore, how without using adhesive metalized film is directly formed, and compared with conventional method, how makes preparation side
Method is simple, cost is relatively low, do not need exposure imaging and etching, environmental protection a kind of polyimide circuits plate preparation method research
Increasingly it is taken seriously.
The content of the invention
The invention aims to overcome to need to use chemical reagent during masking process is removed in the prior art
Etch with subsequent technique and easily environment is polluted, and the defects of complex process, and a kind of polyimide circuits plate is provided
Preparation method make it that the polyimide circuit for preparing is finer, and the preparation method is simple and environmental protection.
To achieve these goals, the present invention provides a kind of preparation method of polyimide circuits plate, this method include with
Lower step：
(1) laser ablation is carried out to adhesive tape, burns the adhesive tape to form circuit；
(2) adhesive tape formed with circuit is bonded on polyimide film, carries out chemical plating after surface treated again.
Present invention also offers a kind of polyimide circuits plate prepared by method described above.
Cause that the polyimide circuit of preparation is finer using the preparation method of polyimide circuits plate provided by the invention,
And the preparation method is simple, technical process is simpler, reduces the change for needing to use during preparing and removing masking process
Pollution problem of the reagent to environment is learned, and removes polyimide film in subsequent handling only need to gently tear, it is and general
Removal masking process it is different with chemical reagent, simple and environmental protection.
Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.
Embodiment
The embodiment of the present invention is described in detail below.It is it should be appreciated that described herein specific
Embodiment is merely to illustrate and explain the present invention, and is not intended to limit the invention.
According to the present invention, the invention provides a kind of preparation method of polyimide circuits plate, this method includes following step
Suddenly：
(1) laser ablation is carried out to adhesive tape, burns the adhesive tape to form circuit；
(2) adhesive tape formed with circuit is bonded on polyimide film, carried out again at chemical plating after surface treated
Reason.
According to the present invention, in step (1), described adhesive tape is not particularly limited, as long as can be good with polyimide film
It is bonded together well, in the present invention, the adhesive tape can be polyimides pressure sensitive adhesive tape and/or polyacrylic film
Pressure sensitive adhesive tape, it is preferable that the adhesive tape is polyimides (PI) pressure sensitive adhesive tape.
According to the present invention, in step (1), first adhesive tape is fixed, the device being fixed on is not particularly limited, and can be to appoint
What metallic matrix, such as in certain embodiment of the application, adhesive tape can be fixed on stainless-steel sheet, and it is fixed
Method be also not particularly limited, such as in certain embodiment of the application, clamping device can be used by adhesive tape two
Clamping.
According to the present invention, in step (1), laser ablation is carried out to adhesive tape, wherein, laser ablation can once be carved
Erosion or multiple etching, once etching can directly burn on adhesive tape forms circuit (groove), and multiple etching can be in glue
Take burn-through and form multiple circular holes, multiple circular holes may link together, it is therefore also possible to can be in adhesive tape
Upper burn-through forms circuit (groove).In the present invention, specifically etching number does not limit, as long as stainless steel steel will can be fixed on
Adhesive tape (polyimides pressure sensitive adhesive tape) on plate, which burns, forms predetermined circuit (groove).
According to the present invention, adhesive tape is burnt after laser ablation, therefore, the line formed after laser ablation on adhesive tape
The width on road (groove) is the width that laser burns, and the depth of the circuit formed after laser ablation on adhesive tape (groove) is adhesive tape
Thickness；In the present invention, the width of the circuit (groove) formed on adhesive tape refers to the size of the maximum gauge of the circular opening,
Similarly, the depth of the hole formed on adhesive tape refers to the depth of the circuit (groove) formed on tape surface；In the present invention,
In step (1), the width of the circuit (groove) formed after laser ablation on adhesive tape can be 0.2-3000 μm, be preferably
1-1000μm。
It is used that the laser that adhesive tape performs etching is not particularly limited in step (1) according to the present invention,
In the present invention, the laser can be the model LSF20 laser-beam drilling machines of Chinese workers' laser production, and the processing of the laser is joined
Number is also not particularly limited, as long as can be performed etching on adhesive tape and grill thoroughly the adhesive tape.
In the case of in the present invention, it is preferred to, used laser is ultraviolet light, visible or infrared light, wherein, wavelength model
It can be 300nm-11000nm to enclose, and laser power can be 2W-100W.
In the present invention, in the case of more preferably, used laser is infrared laser, and selects 20W optical fiber lasers；Swash
Optical wavelength is preferably 1064nm；Laser power is preferably 8-12W, more preferably 9-11W, most preferably 10W；Laser frequency can be with
It is preferably 22-28KHz for 20KHz30KHz, more preferably 25KHz；It can be 800-1200mm/s to laser machine speed, preferably
For 900-1100mm/s, more preferably 1000mm/s；The laser is operated under the parameter, can be on PI pressure sensitive adhesive tapes
Perform etching, and predetermined circuit can be formed by being burnt on the PI pressure sensitive adhesive tapes.
,, should before the adhesive tape formed with circuit is bonded on polyimide film in step (2) according to the present invention
Method also includes the polyimide film first passing through oil removal treatment, wherein, oil removal treatment, the degreasing fluid are carried out using degreasing fluid
Can be NaOH, Na2CO3Molar concentration with the mixed solution of neopelex, and the NaOH can be 0.5-
1mol/L, preferably 0.6-0.9mol/L, more preferably 0.7-0.8mol/L；The Na2CO3Molar concentration can be 0.5-
1.5mol/L, preferably 0.8-1.2mol/L, more preferably 0.9-1mol/L；The neopelex concentration can be
0.5-1.5g/L, preferably 0.8-1.2g/L, more preferably 0.9-1g/L；The condition of the oil removal treatment includes：Except oil temperature
It can be 45-55 DEG C, preferably 46-52 DEG C, more preferably 48-50 DEG C, the time can be 4-8 minutes, preferably 5-6 minutes.
Then with 50 DEG C of hot washes, then rinsed with clear water, drying is stand-by.
According to the present invention, in step (2), the adhesive tape formed with circuit is bonded on polyimide film, at surface
Chemical plating is carried out after reason again, wherein, the surface treatment can include first carrying out chemical roughening treatment, then be activated
Processing, and reduction treatment is carried out again.
According to the present invention, chemical roughening treatment is carried out using chemical coarsening solution, and the chemical coarsening solution can be hydrogen-oxygen
Change the mixed solution of sodium, hydrazine hydrate and ethylenediamine.
According to the present invention, in the chemical coarsening solution；Wherein, the concentration of the sodium hydroxide can be 20-40g/L,
Preferably 25-35g/L, more preferably 28-32g/L；The concentration of the hydrazine hydrate can be 5-15g/L, preferably 7-14g/L,
More preferably 8-12g/L；The concentration of the ethylenediamine can be 5-15g/L, preferably 7-14g/L, more preferably 8-12g/L.
According to the present invention, the adhesive tape formed with circuit is bonded on polyimide film, is then placed in chemical coarsening solution
Carry out chemical roughening treatment；Wherein, the condition of the chemical roughening treatment includes：Temperature can be 30-40 DEG C, and the time can be
1-5 minutes；Preferably, temperature is 32-38 DEG C, and the time is 1-4 minutes；It is highly preferred that temperature is 34-36 DEG C, the time is 1-3 points
Clock；In the present invention, the present inventor has found by substantial amounts of scientific experiment, during the chemical roughening treatment, temperature
In the range of above-mentioned restriction, effect is best for degree and time control, if temperature and time is too high, adhesive tape can partial exfoliation；
If temperature is low and the time is too short, easy plating leakage during Kapton chemical plating.
According to the present invention, the adhesive tape formed with circuit is bonded on polyimide film, is then placed in chemical coarsening solution
Carry out chemical roughening treatment；Activation process is carried out using ionic palladium activating solution again；Wherein, the condition of the activation includes：Temperature
It can be 25-35 DEG C, the time can be 1-6 minutes；Preferably, temperature is 27-32 DEG C, and the time is 2-5 minutes；It is highly preferred that
Temperature is 28-30 DEG C, and the time is 2-4 minutes.
According to the present invention, in the ionic palladium activating solution；Wherein, the ionic palladium activating solution can be palladium bichloride, chlorine
Change the mixed solution of ammonium, dimethylformamide and aminopyridine.
According to the present invention, when carrying out activation process using ionic palladium activating solution；Wherein, the institute in the ionic palladium activating solution
The concentration for stating palladium bichloride can be 0.01-0.15g/L, preferably 0.03-0.07g/L, more preferably 0.04-0.06g/L；It is described
The concentration of ammonium chloride can be 0.1-1.5g/L, preferably 0.3-0.7g/L, more preferably 0.4-0.6g/L；The dimethyl methyl
The concentration of acid amides can be 0.1-1.5g/L, preferably 0.3-0.7g/L, more preferably 0.4-0.6g/L；And the amino pyrrole
The concentration of pyridine can be 0.1-1.5g/L, preferably 0.3-0.7g/L, more preferably 0.4-0.6g/L.
According to the present invention, the adhesive tape formed with circuit is bonded on polyimide film, is then placed in chemical coarsening solution
Chemical roughening treatment is carried out, then activation process is carried out using ionic palladium activating solution, and reduction treatment is carried out using reducing agent again；
Wherein, include in the condition of the reduction：Temperature can be 25-35 DEG C, and the time can be 0.5-1.5 minutes；Preferably, temperature
For 27-32 DEG C, the time is 0.8-1.2 minutes；It is highly preferred that temperature is 28-30 DEG C, the time is 0.9-1.1 minutes.
According to the present invention, the glyoxalic acid as reducing agent uses as a solution, and the concentration of glyoxylic acid solution can be with
For 5-15g/L, preferably 8-12g/L, more preferably 9-11g/L.
According to the present invention, the adhesive tape formed with circuit is bonded on polyimide film, is then surface-treated, that is, is entered
Row chemical roughening treatment, activation process and reduction treatment, its object is to the electroless metal layer on Kapton, most
End form has that technical process is simple into conducting wire, lower-cost advantage.
According to the present invention, chemical plating is carried out using chemical plating fluid, wherein, the chemical plating fluid can be electroless copper
Liquid or chemical nickel-plating liquid.
According to the present invention, the chemical bronze plating liquid can be EDETATE DISODIUM, potassium ferrocyanide, thiocarbamide, detergent alkylate
The mixed solution of sodium sulfonate, formaldehyde and cupric sulfate pentahydrate.
According to the present invention, in the chemical bronze plating liquid, the concentration of the EDETATE DISODIUM can be 30-40g/L, described
The concentration of potassium ferrocyanide can be 0.001-0.1g/L, preferably 0.01-0.05g/L；The concentration of the thiocarbamide can be
0.001-0.01g/L, preferably 0.002-0.008g/L；The concentration of the neopelex can be 0.001-
0.05g/L, preferably 0.005-0.02g/L；The concentration of the formaldehyde can be 2-4g/L, preferably 2-3g/L；It is and described
The concentration of cupric sulfate pentahydrate can be 5-10g/L, preferably 6-8g/L.
According to the present invention, the chemical nickel-plating liquid can be nickel sulfate, ammonium citrate, sodium acetate, boric acid, sodium hypophosphite
With the mixed solution of thiocarbamide.
According to the present invention, in the chemical nickel-plating liquid, the concentration of the nickel sulfate is 15-20g/L, preferably 16-
18g/L；The concentration of the ammonium citrate is 15-25g/L, preferably 18-22g/L；The concentration of the sodium acetate is 5-15g/L,
Preferably 8-12g/L；The concentration of the boric acid is 15-25g/L, preferably 18-22g/L；The concentration of the sodium hypophosphite is
15-25g/L, preferably 18-22g/L；And the concentration of the thiocarbamide is 0.001-0.01g/L, preferably 0.002-0.008g/
L。
According to the present invention, the temperature that chemical plating is carried out in the chemical plating fluid is not particularly limited, can be at room temperature
Operation, the time for carrying out chemical plating are also not particularly limited, and in the present invention, the time of the chemical plating can be by being changed
Time when plating required for processing " thickness of chemical deposit " is learned to determine.
Present invention also offers have a kind of polyimide circuits plate prepared by method described above.
The present invention by polyimides (PI) pressure sensitive adhesive tape and/or polypropylene film pressure sensitive adhesive tape by being fixed on metallic matrix
On (such as stainless-steel sheet), then the incoming line graphic file on laser computer, adjusts laser, laser cabling, burns
PI pressure sensitive adhesive tapes and/or polypropylene film pressure sensitive adhesive tape are worn to form circuit；Again by the PI pressure sensitive adhesive tapes after laser cabling and/or
Polypropylene film pressure sensitive adhesive tape is bonded to be gone on the PI films of oil removing in advance, is compressed, then pressure sensitive adhesive tape by laser burns it is local just
PI films can not be covered；Then the PI pressure sensitive adhesive tapes bonded and/or polypropylene film pressure sensitive adhesive tape and PI films are put into together again
Chemical roughening (surface adjustment) is carried out in PI chemistry coarsening solution (regulator), after washing, is activated using ionic palladium activating solution, then also
Original, then chemical plating is carried out, it is remaining that preliminary show is not formed by the position that PI pressure sensitive adhesive tapes and/or polypropylene film pressure sensitive adhesive tape bond
Reveal metal level, tear the PI pressure sensitive adhesive tapes and/or polypropylene film pressure sensitive adhesive tape being bonded on PI films, formation is coated with metal level
The polyimide circuits plate of (copper or nickel).
The present invention will be described in detail by embodiment below.
In the following Examples and Comparative Examples, the laser is beaten purchased from the model LSF20 laser of Chinese workers' laser production
Hole machine.Polyimides pressure sensitive adhesive tape is purchased from Shanghai Wei Guang adhesive articles Co., Ltd；Polyimide film is purchased from E.I.Du Pont Company；Made
Chemical reagent is purchased from Jinhua major company.
Preparation example 1
It is 4cm × 4cm that polyimides pressure sensitive adhesive tape, which is reduced, and it is 5cm × 5cm that polyimide film, which is reduced,；And
PI films are subjected to oil removal treatment, wherein, the formula of degreasing fluid is as follows：NaOH molar concentration is 0.8mol/L,
Na2CO3Molar concentration be 1mol/L, the molar concentration of neopelex is 1g/L；And except oil temperature is 50 DEG C,
Time is 5-6 minutes；Then with 50 DEG C of hot washes, then rinsed with clear water, and ultraviolet light processing, drying are stand-by.
Embodiment 1
The present embodiment is used for the preparation method for illustrating the polyimide circuits plate of the present invention
(1) PI pressure sensitive adhesive tapes are fixed on stainless steel, the incoming line graphic file on laser computer, adjusted sharp
Light device, wherein, optical maser wavelength is 1064 nanometers, laser power 10W, laser frequency 25Hz, process velocity 1000mm/s
Laser ablation is carried out, PI glue band is burnt and forms circuit；
(2) PI pressure sensitive adhesive tapes are torn, the PI pressure sensitive adhesive tapes are adhesively secured on PI films, compress, make PI pressure sensitive adhesive tapes and
PI films being bonded together tightly；
Chemistry roughening：Wherein, the formula of chemical coarsening solution is as follows：Naoh concentration is 30g/L, and the concentration of hydrazine hydrate is
10g/L, the concentration of ethylenediamine is 10g/L；And the temperature of chemistry roughening is 35 DEG C, the time is 3 minutes；
By carrying out, the sample clean after chemical roughening is clean, is then activated, wherein, activating solution is activated using ionic palladium
Liquid, and it is as follows to activate formula of liquid：The concentration of palladium bichloride is 0.05g/L, and the concentration of ammonium chloride is 0.5g/L, dimethylformamide
Concentration is 0.5g/L, and the concentration of aminopyridine is 0.5g/L；And the temperature of activation is 30 DEG C, the time is 3 minutes；
Reduction：Wherein, reducing agent is the glyoxylic acid solution that concentration is 10g/L, and the temperature of reduction is 30 DEG C, and the time is
1 minute；
(3) chemical plating：Wherein, the formula of chemical bronze plating liquid is as follows：The concentration of cupric sulfate pentahydrate is 8g/L, EDETATE DISODIUM
Concentration be 35g/L, the concentration of potassium ferrocyanide is 10mg/L, and the concentration of thiocarbamide is 0.003g/L, neopelex
Concentration be 0.008g/L, the concentration of formaldehyde (mass percent concentration 37%) is 3g/L；Chemical deposit thickeies.
After chemical plating terminates, drying, PI glue band is peeled off from PI films, you can obtain the line with being inputted on laser computer
The same circuit of road graphic file.
As a result the thickness of coating that electro-coppering is prepared is 5 microns of polyimide circuits plate；And
Cause that the polyimide circuit of preparation is finer using the preparation method of polyimide circuits plate provided by the invention,
And the preparation process is simple and environmentally friendly.
Embodiment 2
The present embodiment is used for the preparation method for illustrating the polyimide circuits plate of the present invention
Polyimide circuits plate is prepared according to method same as Example 1, institute's difference is, in (3) chemical plating
During, replaced with following nickel-plating liquid formula；
Wherein, the chemical nickel plating formula of liquid is as follows：Concentration of nickel sulfate is 18g/L, and ammonium citrate concentration is 20g/L, acetic acid
Na concn is 10g/L, and boric acid concentration 20g/L, ortho phosphorous acid na concn is 20g/L, thiourea concentration 0.003g/L.
After chemical plating terminates, drying, PI glue band is peeled off from PI films, you can obtain the line with being inputted on laser computer
The same circuit of road graphic file.
As a result the thickness of coating that electronickelling is prepared is 5 microns of polyimide circuits plate；And
Cause that the polyimide circuit of preparation is finer using the preparation method of polyimide circuits plate provided by the invention,
And the preparation process is simple and environmentally friendly.
Embodiment 3
The present embodiment is used for the preparation method for illustrating the polyimide circuits plate of the present invention
Polyimide circuits plate is prepared according to method same as Example 1, institute's difference is, in step (2)：
Chemistry roughening：Wherein, the formula of chemical coarsening solution is as follows：Naoh concentration is 20g/L, the concentration of hydrazine hydrate
For 5g/L, the concentration of ethylenediamine is 5g/L；And the temperature of chemistry roughening is 30 DEG C, the time is 5 minutes；
By carrying out, the sample clean after chemical roughening is clean, is then activated, wherein, activating solution is activated using ionic palladium
Liquid, and it is as follows to activate formula of liquid：The concentration of palladium bichloride is 0.01g/L, and the concentration of ammonium chloride is 0.1g/L, dimethylformamide
Concentration is 0.1g/L, and the concentration of aminopyridine is 0.1g/L；And the temperature of activation is 25 DEG C, the time is 6 minutes；
Reduction：Wherein, reducing agent is the glyoxylic acid solution that concentration is 5g/L, and the temperature of reduction is 25 DEG C, and the time is
1.5 minute；
After chemical plating terminates, drying, PI glue band is peeled off from PI films, you can obtain the line with being inputted on laser computer
The same circuit of road graphic file.
As a result the thickness of coating that electro-coppering is prepared is 4 microns of polyimide circuits plate；And
Cause that the polyimide circuit of preparation is finer using the preparation method of polyimide circuits plate provided by the invention,
And the preparation process is simple and environmentally friendly.
Embodiment 4
The present embodiment is used for the preparation method for illustrating the polyimide circuits plate of the present invention
Polyimide circuits plate is prepared according to method same as Example 3, institute's difference is, by chemical bronze plating liquid
Replace with the chemical nickel-plating liquid in embodiment 2；
As a result the thickness of coating that electronickelling is prepared is 4 microns of polyimide circuits plate；And
Cause that the polyimide circuit of preparation is finer using the preparation method of polyimide circuits plate provided by the invention,
And the preparation process is simple and environmentally friendly.
Embodiment 5
The present embodiment is used for the preparation method for illustrating the polyimide circuits plate of the present invention
Polyimide circuits plate is prepared according to method same as Example 1, institute's difference is, in step (2)
In：
Chemistry roughening：Wherein, the formula of chemical coarsening solution is as follows：Naoh concentration is 40g/L, and the concentration of hydrazine hydrate is
15g/L, the concentration of ethylenediamine is 15g/L；And the temperature of chemistry roughening is 40 DEG C, the time is 1 minute；
By carrying out, the sample clean after chemical roughening is clean, is then activated, wherein, activating solution is activated using ionic palladium
Liquid, and it is as follows to activate formula of liquid：The concentration of palladium bichloride is 0.15g/L, and the concentration of ammonium chloride is 1.5g/L, dimethylformamide
Concentration is 1.5g/L, and the concentration of aminopyridine is 1.5g/L；And the temperature of activation is 35 DEG C, the time is 1 minute；
Reduction：Wherein, reducing agent is the glyoxylic acid solution that concentration is 15g/L, and the temperature of reduction is 35 DEG C, and the time is
0.5 minute；
As a result the thickness of coating that electro-coppering is prepared is 6 microns of polyimide circuits plate；And
Cause that the polyimide circuit of preparation is finer using the preparation method of polyimide circuits plate provided by the invention,
And the preparation process is simple and environmentally friendly.
Embodiment 6
The present embodiment is used for the preparation method for illustrating the polyimide circuits plate of the present invention
Polyimide circuits plate is prepared according to method same as Example 5, institute's difference is, by chemical bronze plating liquid
Replace with the chemical nickel-plating liquid in embodiment 2；
As a result the thickness of coating that electronickelling is prepared is 6 microns of polyimide circuits plate；And
Cause that the polyimide circuit of preparation is finer using the preparation method of polyimide circuits plate provided by the invention,
And the preparation process is simple and environmentally friendly.
Embodiment 7
The present embodiment is used for the preparation method for illustrating the polyimide circuits plate of the present invention
Polyimide circuits plate is prepared according to method same as Example 1, institute's difference is, in step (3)
In, the formula of chemical plating fluid is as follows：The concentration of cupric sulfate pentahydrate is 5g/L, and the concentration of EDETATE DISODIUM is 30g/L, ferrocyanide
The concentration of potassium is 8mg/L, and the concentration of thiocarbamide is 0.001g/L, and the concentration of neopelex is 0.001g/L, formaldehyde (matter
It is 2g/L that percent concentration, which is measured, as concentration 37%)；
As a result the thickness of coating that electro-coppering is prepared is 4 microns of polyimide circuits plate；And
Cause that the polyimide circuit of preparation is finer using the preparation method of polyimide circuits plate provided by the invention,
And the preparation process is simple and environmentally friendly.
Embodiment 8
The present embodiment is used for the preparation method for illustrating the polyimide circuits plate of the present invention
Polyimide circuits plate is prepared according to method same as Example 7, institute's difference is, by chemical bronze plating liquid
Replace with the chemical nickel-plating liquid in embodiment 2；
As a result the thickness of coating that electronickelling is prepared is 4 microns of polyimide circuits plate；And
Cause that the polyimide circuit of preparation is finer using the preparation method of polyimide circuits plate provided by the invention,
And the preparation process is simple and environmentally friendly.
Embodiment 9
The present embodiment is used for the preparation method for illustrating the polyimide circuits plate of the present invention
Polyimide circuits plate is prepared according to method same as Example 1, institute's difference is, in step (3),
The formula of chemical plating fluid is as follows：The concentration of cupric sulfate pentahydrate is 10g/L, and the concentration of EDETATE DISODIUM is 40g/L, potassium ferrocyanide
Concentration be 12mg/L, the concentration of thiocarbamide is 0.01g/L, and the concentration of neopelex is 0.01g/L, formaldehyde (quality
Percent concentration is that concentration 37%) is 4g/L；
As a result the thickness of coating that electro-coppering is prepared is 6 microns of polyimide circuits plate；And
Cause that the polyimide circuit of preparation is more smart using the preparation method of polyimide circuits plate provided by the invention
Carefully, and the preparation process is simple and environmentally friendly.
Embodiment 10
The present embodiment is used for the preparation method for illustrating the polyimide circuits plate of the present invention
Polyimide circuits plate is prepared according to method same as Example 9, institute's difference is, by chemical bronze plating liquid
Replace with the chemical nickel-plating liquid in embodiment 2；
As a result the thickness of coating that electronickelling is prepared is 6 microns of polyimide circuits plate；And
Cause that the polyimide circuit of preparation is finer using the preparation method of polyimide circuits plate provided by the invention,
And the preparation process is simple and environmentally friendly.
It was found from the result in above-described embodiment 1-10, using the preparation method of polyimide circuits plate provided by the invention
So that the polyimide circuit prepared is finer, and the preparation method is simple, and technical process is simpler, reduces prior art and exists
Prepare and remove during masking process and pollution problem of the chemical reagent that need to use of subsequent etch coating to environment, with
And in subsequent handling remove polyimide film only need to gently tear, with general remove masking process with chemical reagent not
Together, simple and environmental protection.
The preferred embodiment of the present invention described in detail above, still, the present invention are not limited in above-mentioned embodiment
Detail, in the range of the technology design of the present invention, a variety of simple variants can be carried out to technical scheme, this
A little simple variants belong to protection scope of the present invention.
It is further to note that each particular technique feature described in above-mentioned embodiment, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy no longer separately illustrates.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should equally be considered as content disclosed in this invention.
Claims (16)
1. a kind of preparation method of polyimide circuits plate, this method comprise the following steps：
(1) laser ablation is carried out to adhesive tape, burns the adhesive tape to form circuit；
(2) adhesive tape formed with circuit is bonded on polyimide film, carries out chemical plating after surface treated again；
Wherein, in step (2), the surface treatment includes first carrying out chemical roughening treatment, then carries out activation process, and
Reduction treatment is carried out again；
Wherein, the condition of the chemical roughening treatment includes：Temperature is 34-36 DEG C, and the time is 1-3 minutes.
2. according to the method for claim 1, wherein, in step (1), the adhesive tape be polyimides pressure sensitive adhesive tape and/
Or polypropylene film pressure sensitive adhesive tape.
3. according to the method for claim 1, wherein, chemical roughening treatment, and the chemistry are carried out using chemical coarsening solution
Coarsening solution is the mixed solution of sodium hydroxide, hydrazine hydrate and ethylenediamine.
4. according to the method for claim 3, wherein, in the chemical coarsening solution, the concentration of the sodium hydroxide is 20-
40g/L, the concentration of the hydrazine hydrate is 5-15g/L, and the concentration of the ethylenediamine is 5-15g/L.
5. according to the method for claim 1, wherein, activation process, and the ionic palladium are carried out using ionic palladium activating solution
Activating solution is the mixed solution of palladium bichloride, ammonium chloride, dimethylformamide and aminopyridine.
6. according to the method for claim 5, wherein, in the ionic palladium activating solution, the concentration of the palladium bichloride is
0.01-0.15g/L, the concentration of the ammonium chloride is 0.1-1.5g/L, and the concentration of the dimethylformamide is 0.1-1.5g/L,
And the concentration of the aminopyridine is 0.1-1.5g/L.
7. according to the method for claim 5, wherein, the condition of the activation process includes：Temperature is 25-35 DEG C, the time
For 1-6 minutes.
8. according to the method for claim 1, wherein, reduction treatment is carried out to it using reducing agent, and the reducing agent is
Glyoxalic acid.
9. according to the method for claim 8, wherein, the glyoxalic acid as reducing agent uses as a solution, and acetaldehyde
The concentration of acid solution is 5-15g/L.
10. according to the method for claim 8, wherein, the condition of the reduction treatment includes：Temperature is 25-35 DEG C, the time
For 0.5-1.5 minutes.
11. according to the method for claim 1, wherein, in step (2), chemical plating, institute are carried out using chemical plating fluid
It is chemical bronze plating liquid or chemical nickel-plating liquid to state chemical plating fluid.
12. according to the method for claim 11, wherein, the chemical bronze plating liquid is EDETATE DISODIUM, potassium ferrocyanide, sulphur
Urea, neopelex, the mixed solution of formaldehyde and cupric sulfate pentahydrate.
13. the method according to claim 11, wherein, in the chemical bronze plating liquid, the concentration of the EDETATE DISODIUM
For 30-40g/L, the concentration of the potassium ferrocyanide is 0.001-0.1g/L, and the concentration of the thiocarbamide is 0.001-0.01g/L,
The concentration of the neopelex is 0.001-0.05g/L, and the concentration of the formaldehyde is 2-4g/L, and five water
The concentration of copper sulphate is 5-10g/L.
14. according to the method for claim 11, wherein, the chemical nickel-plating liquid be nickel sulfate, ammonium citrate, sodium acetate,
The mixed solution of boric acid, sodium hypophosphite and thiocarbamide.
15. according to the method for claim 14, wherein, in the chemical nickel-plating liquid, the concentration of the nickel sulfate is 15-
20g/L, the concentration of the ammonium citrate are 15-25g/L, the concentration of the sodium acetate is 5-15g/L, the concentration of the boric acid is
15-25g/L, the concentration of the sodium hypophosphite are 15-25g/L and the concentration of the thiocarbamide is 0.001-0.01g/L.
16. polyimide circuits plate prepared by the method according to any one in claim 1-15.
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| CN105789549B (en) * | 2016-04-25 | 2018-08-03 | 吉林大学 | A method of preparing electrode in two-dimensional material |
| CN106179402A (en) * | 2016-07-21 | 2016-12-07 | 昆明理工大学 | A kind of preparation method of nanoporous palladium catalytic membrane |
| CN107723689A (en) * | 2016-08-12 | 2018-02-23 | 惠州大亚湾金盛科技有限公司 | A kind of ionic palladium activator |
| TWI624563B (en) * | 2017-07-14 | 2018-05-21 | 律勝科技股份有限公司 | Method of forming a metal layer on a photosensitive resin |
| CN107447207A (en) * | 2017-08-01 | 2017-12-08 | 苏州天承化工有限公司 | A kind of soft board adjustment liquid and method of roughening |
| CN107699871B (en) * | 2017-10-17 | 2018-08-14 | 南通赛可特电子有限公司 | A kind of technique preparing copper plate in silicon substrate surface using chemical copper plating solution |
| CN110923678A (en) * | 2019-12-05 | 2020-03-27 | 东莞市正为精密塑胶有限公司 | Chemical plating method for mobile phone antenna |
| CN112111731B (en) * | 2020-11-23 | 2021-02-09 | 苏州天承化工有限公司 | Chemical copper plating solution and preparation method and application thereof |
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