CN104593833A - Working solution for nickel gold electroplating of FPC panel - Google Patents
Working solution for nickel gold electroplating of FPC panel Download PDFInfo
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- CN104593833A CN104593833A CN201410821637.7A CN201410821637A CN104593833A CN 104593833 A CN104593833 A CN 104593833A CN 201410821637 A CN201410821637 A CN 201410821637A CN 104593833 A CN104593833 A CN 104593833A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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Abstract
The invention discloses a working solution for nickel gold electroplating of an FPC panel. The working solution comprises the components in percentage by weight: 0.1-5 percent of an anti-stripping agent, 10-50 percent of a buffer agent boric acid, 10-50 percent of a fluxing wetting agent, 2-5 percent of a softening agent saccharin sodium salt, 2-5 percent of a complexing agent EDTA, 0.2-5 percent of an anode activator and the balance of purified water. According to the PET base material flexible copper-clad plate treated by the working solution disclosed by the invention, the condition that the nickel-plated PET base material and the copper foil do not drop to be stripped can be effectively guaranteed. The yield of the FPC panel nickel gold electroplating process of PET base materials can be greatly improved. Therefore, large-scale FPC panels of the PET base materials are possibly subjected to nickel gold electroplating treatment.
Description
Technical field
The present invention relates to the working fluid for FPC sheet material electronickelling gold.
Background technology
At electronics manufacturing, copper-clad plate, as the base material of widespread use and line material, often needs to carry out anti-oxidation process to its surface, to meet the requirement of follow-up welding or processing.The industrial technique being applied to copper metallic face process has a lot, as electronickelling gold, OSP(Organic Solderability coating), spray tin, chemical nickel and gold, leaching silver etc.Wherein namely nickel-gold electroplating process is electronickelling after completing circuit graphicprocessing and copper facing and electrogilding technique.This technique can be subject to the erosion of extraneous corrodibility or oxidizing atmosphere by available protecting copper face, reaches anti-oxidation effect, has again good weldability simultaneously.This manufacturing process is simple, stable performance, has been widely used in the surface treatment of copper-clad plate in printed circuit board production.Along with having mercy on property of FPC(printed-wiring board (PWB)) fast development of industry and the Application and Development of new technologies and materials, PET base material becomes the first-selected base material of FPC copper-clad plate due to PI base material that the innate advantage such as with low cost, pliability is good has progressively replaced traditional F PC.And when the FPC employing PET base material carries out the process of electronickelling gold surface, because the tackiness agent between PET base material and Copper base material can be peeled off by bubbling due to the evolving hydrogen reaction of electroplating cathode, cause Copper Foil to come off from PET base material.FPC sheet material condemnation factor when carrying out the process of electronickelling gold of current PET base material is very high, so be difficult to produce in enormous quantities.Namely the present invention is FPC sheet material for the solving PET base material problem that comes off of Copper Foil and researching and developing when carrying out electronickelling plating.
Summary of the invention
The object of the present invention is to provide a kind of working fluid of electronickelling, adopt benzimidizole derivatives sodium salt and yellow prussiate of soda, add in nickel plating working fluid with the ratio of weight ratio 0.5 ~ 2:1, effectively can stop the stripping that PET base material and Copper Foil occur because cathode hydrogen evolution reacts.
The FPC sheet material electronickelling working fluid of PET base material of the present invention, includes the component of following weight per-cent: anti-stripper 0.1 ~ 5%, buffer reagent boric acid 10 ~ 50%, hydrotropy wetting agent 10 ~ 50%, softening agent soluble saccharin 2 ~ 5%, complexing agent EDTA2 ~ 5%, anode activation agent 0.2 ~ 5%, all the other are purified water.
Described anti-stripper is the benzimidizole derivatives sodium salt of weight ratio 0.5 ~ 2:1 and mixing of yellow prussiate of soda.
Described hydrotropy wetting agent is DMF.
Described anode activation agent is selected from least one in nickel sulfamic acid, nickelous chloride, nickelous bromide and nickelous iodide.
The benzimidizole derivatives sodium salt that the present invention uses and yellow prussiate of soda, can form the nickel coating of homogeneous soft, can provide good weldability and bonding force on copper surface.
For the nickel plating working fluid of the present invention's preparation, for strengthening the stability of nickel plating working liquid ph further and preventing big current noble potential district from burning, boric acid can be added.
For the hydrotropy wetting agent added in nickel plating working fluid, the wettability of nickel plating working fluid can be strengthened, also can not increase the danger of the inflammableness of nickel plating working fluid, explosivity etc.
For the nickel plating working fluid of the present invention's preparation, for strengthening the flexibility of institute's nickel layer further, can soluble saccharin be added, effectively can reduce the stress of nickel layer.
For the nickel plating working fluid of the present invention's preparation, for slowing down cupric ion that copper face dissolves for the impact of plating solution, complexing agent EDTA can be added, effectively can reduce the content of cupric ion in nickel plating solution.
For the nickel plating working fluid of the present invention's preparation, for strengthening the wettability of nickel plating working fluid further, thus making nickel layer more homogeneous smooth and avoid pin-hole phenomena, anode activation agent DMF can be added.
Benzimidizole derivatives sodium salt and yellow prussiate of soda in the aqueous solution of pH value about 2.0 ~ 5.0, are aided in other pharmaceutical chemicalss as softening agent, complexing agent, buffer reagent, wetting agent by the present invention, composite in final nickel plating working fluid together.After this nickel plating working fluid process, copper face can generate the even nickel coating of one deck half light, and this coating has good flexibility and weldability, strong with the layer gold bonding force of rear processing procedure.
The nickel plating working fluid of benzimidizole derivatives sodium salt and yellow prussiate of soda preparation is adopted to can be applicable to the substrate of PET material with the present invention, also can be used for the substrate of PI material, when processing such sample, S type nickel anode need be used, process liquid temperature is generally about 10 ~ 70 DEG C, the electroplating time of nickel plating working fluid about 30 seconds ~ 60 minutes.The current density of nickel plating working fluid be 1-8A/dm2 after the process of electronickelling working fluid, sample also must enter follow-up craft of gilding through washing, dry, activation subsequently.
Having mercy on property of PET base material copper-clad plate through process of the present invention can effectively ensure ablation not to occur between PET base material and Copper Foil after nickel plating.The yield of the FPC plate nickel-gold electroplating process of PET base material can be increased substantially.Thus make PET base material FPC plate carry out electronickelling gold to be in enormous quantities treated as possibility.
Embodiment
When implementing nickel plating working fluid process copper face, generally all need through several steps such as oil removing → washing → microetch → washing → nickel plating → washings → air-dry → activate → gold-plated, treatment temp is all between 40 ~ 60 DEG C, and the treatment time is between 30 seconds ~ 5 minutes.Carry out gold-plated after nickel plating again, naked eyes can judge whether Copper Foil and PET base material are peeled off.
embodiment 1
Choose the nickel plating working fluid of 2-amyl group benzo imidazole natrium and yellow prussiate of soda preparation with the ratio of weight ratio 1:1, auxiliary cushion agent, wetting agent, complexing agent, buffer reagent preparation nickel plating working fluid 1L, shown in concrete consumption sees the following form.
The electronickelling working fluid process copper face of the component preparation more than in table, treating processes is according to several steps such as oil removing → washing → microetch → washing → nickel plating → washings → air-dry → activate → gold-plated, and Nickel Plating Treatment temperature is 55 DEG C, and the treatment time is 5 minutes.Gold-plated again after having processed, PET base material and copper face are not peeled off.
embodiment 2
Choose the nickel plating working fluid of 2-amyl group benzo imidazole natrium and yellow prussiate of soda preparation with the ratio of weight ratio 1:1, auxiliary cushion agent, wetting agent, complexing agent, buffer reagent preparation nickel plating working fluid 1L, shown in concrete consumption sees the following form.
The electronickelling working fluid process copper face of the component preparation more than in table, treating processes is according to several steps such as oil removing → washing → microetch → washing → nickel plating → washings → air-dry → activate → gold-plated, and Nickel Plating Treatment temperature is 55 DEG C, and the treatment time is 5 minutes.Gold-plated again after having processed, PET base material and copper face are not peeled off.
embodiment 3
Choose the nickel plating working fluid of 2-amyl group benzo imidazole natrium and yellow prussiate of soda preparation with the ratio of weight ratio 1:1, auxiliary cushion agent, wetting agent, complexing agent, buffer reagent preparation nickel plating working fluid 1L, shown in concrete consumption sees the following form.
The electronickelling working fluid process copper face of the component preparation more than in table, treating processes is according to several steps such as oil removing → washing → microetch → washing → nickel plating → washings → air-dry → activate → gold-plated, and Nickel Plating Treatment temperature is 55 DEG C, and the treatment time is 5 minutes.Gold-plated again after having processed, PET base material and copper face are not peeled off.
embodiment 4
Choose the nickel plating working fluid of 2-amyl group benzo imidazole natrium and yellow prussiate of soda preparation with the ratio of weight ratio 1:2, auxiliary cushion agent, wetting agent, complexing agent, buffer reagent preparation nickel plating working fluid 1L, shown in concrete consumption sees the following form.
The electronickelling working fluid process copper face of the component preparation more than in table, treating processes is according to several steps such as oil removing → washing → microetch → washing → nickel plating → washings → air-dry → activate → gold-plated, and Nickel Plating Treatment temperature is 55 DEG C, and the treatment time is 5 minutes.Gold-plated again after having processed, PET base material and copper face are not peeled off.
comparative example
With the nickel plating working fluid of market FPC electronickelling additive preparation (not containing 2-amyl group benzo imidazole natrium and yellow prussiate of soda), auxiliary cushion agent soluble saccharin, wetting agent ethylene glycol, buffer reagent boric acid, anode activation agent nickel sulfamic acid and nickelous bromide preparation nickel plating working fluid 1L, shown in concrete consumption sees the following form.
The electronickelling working fluid process copper face of the component preparation more than in table, treating processes is according to several steps such as oil removing → washing → microetch → washing → nickel plating → washings → air-dry → activate → gold-plated, and Nickel Plating Treatment temperature is 55 DEG C, and the treatment time is 5 minutes.Gold-plated again after having processed, PET base material and copper face are obviously peeled off.
Claims (4)
1. for the working fluid of FPC sheet material electronickelling gold, include the component of following weight per-cent: anti-stripper 0.1 ~ 5%, buffer reagent boric acid 10 ~ 50%, hydrotropy wetting agent 10 ~ 50%, softening agent soluble saccharin 2 ~ 5%, complexing agent EDTA2 ~ 5%, anode activation agent 0.2 ~ 5%, all the other are purified water.
2. as claimed in claim 1 for the working fluid of FPC sheet material electronickelling gold, it is characterized in that: described anti-stripper is the benzimidizole derivatives sodium salt of weight ratio 0.5 ~ 2:1 and mixing of yellow prussiate of soda.
3. as claimed in claim 1 for the working fluid of FPC sheet material electronickelling gold, it is characterized in that: described hydrotropy wetting agent is DMF.
4. as claimed in claim 1 for the working fluid of FPC sheet material electronickelling gold, it is characterized in that: described anode activation agent is selected from least one in nickel sulfamic acid, nickelous chloride, nickelous bromide and nickelous iodide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410821637.7A CN104593833A (en) | 2014-12-26 | 2014-12-26 | Working solution for nickel gold electroplating of FPC panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410821637.7A CN104593833A (en) | 2014-12-26 | 2014-12-26 | Working solution for nickel gold electroplating of FPC panel |
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| CN104593833A true CN104593833A (en) | 2015-05-06 |
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| CN201410821637.7A Pending CN104593833A (en) | 2014-12-26 | 2014-12-26 | Working solution for nickel gold electroplating of FPC panel |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109137007A (en) * | 2017-06-15 | 2019-01-04 | 罗门哈斯电子材料有限责任公司 | Environmentally friendly nickel electroplating composition and method |
| CN109137006A (en) * | 2017-06-15 | 2019-01-04 | 罗门哈斯电子材料有限责任公司 | Environmentally friendly nickel electroplating composition and method |
| CN109280945A (en) * | 2018-06-08 | 2019-01-29 | 深圳市瑞世兴科技有限公司 | PCB/FPC the dry film pre-treatment anti-oxidation reinforcing agent of Metal Substrate copper face and its processing method |
| CN111005045A (en) * | 2019-12-31 | 2020-04-14 | 西安西工大超晶科技发展有限责任公司 | Preparation method of titanium and titanium alloy surface coating |
-
2014
- 2014-12-26 CN CN201410821637.7A patent/CN104593833A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109137007A (en) * | 2017-06-15 | 2019-01-04 | 罗门哈斯电子材料有限责任公司 | Environmentally friendly nickel electroplating composition and method |
| CN109137006A (en) * | 2017-06-15 | 2019-01-04 | 罗门哈斯电子材料有限责任公司 | Environmentally friendly nickel electroplating composition and method |
| CN109137006B (en) * | 2017-06-15 | 2020-07-07 | 罗门哈斯电子材料有限责任公司 | Environmentally friendly nickel electroplating compositions and methods |
| CN109137007B (en) * | 2017-06-15 | 2020-07-07 | 罗门哈斯电子材料有限责任公司 | Environmentally friendly nickel electroplating compositions and methods |
| CN109280945A (en) * | 2018-06-08 | 2019-01-29 | 深圳市瑞世兴科技有限公司 | PCB/FPC the dry film pre-treatment anti-oxidation reinforcing agent of Metal Substrate copper face and its processing method |
| CN111005045A (en) * | 2019-12-31 | 2020-04-14 | 西安西工大超晶科技发展有限责任公司 | Preparation method of titanium and titanium alloy surface coating |
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Application publication date: 20150506 |