CN105408063A - 低密度抛光垫 - Google Patents
低密度抛光垫 Download PDFInfo
- Publication number
- CN105408063A CN105408063A CN201480042621.4A CN201480042621A CN105408063A CN 105408063 A CN105408063 A CN 105408063A CN 201480042621 A CN201480042621 A CN 201480042621A CN 105408063 A CN105408063 A CN 105408063A
- Authority
- CN
- China
- Prior art keywords
- polishing
- micro element
- polishing pad
- diameter pattern
- polyurethane material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 229
- 239000000463 material Substances 0.000 claims abstract description 103
- 239000011148 porous material Substances 0.000 claims abstract description 103
- 229920002635 polyurethane Polymers 0.000 claims abstract description 66
- 239000004814 polyurethane Substances 0.000 claims abstract description 66
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 61
- 238000000034 method Methods 0.000 claims abstract description 52
- 238000009826 distribution Methods 0.000 claims description 55
- 239000000203 mixture Substances 0.000 claims description 54
- 239000003795 chemical substances by application Substances 0.000 claims description 32
- 238000004519 manufacturing process Methods 0.000 claims description 29
- 238000010438 heat treatment Methods 0.000 claims description 24
- 230000002902 bimodal effect Effects 0.000 claims description 19
- 239000003431 cross linking reagent Substances 0.000 claims description 15
- 239000011159 matrix material Substances 0.000 claims description 13
- 239000000945 filler Substances 0.000 claims description 12
- 239000012948 isocyanate Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- -1 aromatic diamine compound Chemical class 0.000 claims description 4
- 230000001186 cumulative effect Effects 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- 150000002513 isocyanates Chemical group 0.000 claims description 3
- 238000013459 approach Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 4
- 239000004088 foaming agent Substances 0.000 description 37
- 238000000465 moulding Methods 0.000 description 21
- 238000005266 casting Methods 0.000 description 16
- 239000002243 precursor Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 238000005987 sulfurization reaction Methods 0.000 description 4
- 238000000227 grinding Methods 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 210000005056 cell body Anatomy 0.000 description 2
- QCCDYNYSHILRDG-UHFFFAOYSA-K cerium(3+);trifluoride Chemical compound [F-].[F-].[F-].[Ce+3] QCCDYNYSHILRDG-UHFFFAOYSA-K 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 235000012222 talc Nutrition 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- ITRNXVSDJBHYNJ-UHFFFAOYSA-N tungsten disulfide Chemical compound S=[W]=S ITRNXVSDJBHYNJ-UHFFFAOYSA-N 0.000 description 2
- 206010000060 Abdominal distension Diseases 0.000 description 1
- 101000598921 Homo sapiens Orexin Proteins 0.000 description 1
- 101001123245 Homo sapiens Protoporphyrinogen oxidase Proteins 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- 102100029028 Protoporphyrinogen oxidase Human genes 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 125000006157 aromatic diamine group Chemical group 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 208000024330 bloating Diseases 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000004005 microsphere Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 210000003934 vacuole Anatomy 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/04—Zonally-graded surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
- B24D11/005—Making abrasive webs
- B24D11/006—Making abrasive webs without embedded abrasive particles
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Abstract
Description
Claims (61)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/955,398 US20150038066A1 (en) | 2013-07-31 | 2013-07-31 | Low density polishing pad |
US13/955,398 | 2013-07-31 | ||
PCT/US2014/047065 WO2015017138A1 (en) | 2013-07-31 | 2014-07-17 | Low density polishing pad |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105408063A true CN105408063A (zh) | 2016-03-16 |
CN105408063B CN105408063B (zh) | 2018-01-30 |
Family
ID=51263570
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201480042621.4A Active CN105408063B (zh) | 2013-07-31 | 2014-07-17 | 低密度抛光垫 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20150038066A1 (zh) |
EP (1) | EP3027363B1 (zh) |
JP (3) | JP6517802B2 (zh) |
KR (1) | KR101801693B1 (zh) |
CN (1) | CN105408063B (zh) |
SG (1) | SG11201600242PA (zh) |
TW (1) | TWI579106B (zh) |
WO (1) | WO2015017138A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112091817A (zh) * | 2020-09-08 | 2020-12-18 | 中国航发贵州黎阳航空动力有限公司 | 一种薄壁环形零件端面研磨工具 |
WO2021257136A1 (en) * | 2020-06-19 | 2021-12-23 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
KR102630261B1 (ko) | 2014-10-17 | 2024-01-29 | 어플라이드 머티어리얼스, 인코포레이티드 | 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 cmp 패드 구성 |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US9586304B2 (en) * | 2014-12-19 | 2017-03-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Controlled-expansion CMP PAD casting method |
US10005172B2 (en) * | 2015-06-26 | 2018-06-26 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Controlled-porosity method for forming polishing pad |
JP6940495B2 (ja) | 2015-10-30 | 2021-09-29 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法 |
US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
CN113146464A (zh) | 2016-01-19 | 2021-07-23 | 应用材料公司 | 多孔化学机械抛光垫 |
JP7148226B2 (ja) | 2016-09-21 | 2022-10-05 | 東友ファインケム株式会社 | 赤色硬化性樹脂組成物 |
US10596763B2 (en) | 2017-04-21 | 2020-03-24 | Applied Materials, Inc. | Additive manufacturing with array of energy sources |
US20180345449A1 (en) * | 2017-06-06 | 2018-12-06 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pads for improved removal rate and planarization |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
KR101949905B1 (ko) | 2017-08-23 | 2019-02-19 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
JP7273796B2 (ja) * | 2017-08-25 | 2023-05-15 | スリーエム イノベイティブ プロパティズ カンパニー | 表面突起研磨パッド |
EP3683019B1 (en) * | 2017-09-11 | 2024-07-10 | SK enpulse Co., Ltd. | Porous polyurethane polishing pad and method for manufacturing same |
KR102088919B1 (ko) | 2017-09-11 | 2020-03-13 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
KR101949911B1 (ko) | 2017-09-11 | 2019-02-19 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
KR102054309B1 (ko) | 2018-04-17 | 2019-12-10 | 에스케이씨 주식회사 | 다공성 연마 패드 및 이의 제조방법 |
KR102058877B1 (ko) | 2018-04-20 | 2019-12-24 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
WO2020050932A1 (en) | 2018-09-04 | 2020-03-12 | Applied Materials, Inc. | Formulations for advanced polishing pads |
KR20200079865A (ko) | 2018-12-26 | 2020-07-06 | 에스케이씨 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
KR102202076B1 (ko) | 2018-12-26 | 2021-01-12 | 에스케이씨 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
KR102185265B1 (ko) | 2018-12-26 | 2020-12-01 | 에스케이씨 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
TWI735101B (zh) | 2018-12-26 | 2021-08-01 | 南韓商Skc索密思股份有限公司 | 用於研磨墊之組成物、研磨墊及用於製備其之方法 |
KR102283399B1 (ko) | 2018-12-26 | 2021-07-30 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
KR20200079847A (ko) | 2018-12-26 | 2020-07-06 | 에스케이씨 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
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KR102277418B1 (ko) | 2019-05-21 | 2021-07-14 | 에스케이씨솔믹스 주식회사 | 가교 밀도가 향상된 연마패드 및 이의 제조방법 |
US11207757B2 (en) | 2019-06-17 | 2021-12-28 | Skc Solmics Co., Ltd. | Composition for polishing pad, polishing pad and preparation method of semiconductor device |
KR102237367B1 (ko) | 2019-06-17 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법 |
KR102237362B1 (ko) | 2019-06-17 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법 |
KR102237351B1 (ko) | 2019-06-17 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법 |
KR102237357B1 (ko) | 2019-06-17 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법 |
KR102197481B1 (ko) | 2019-06-27 | 2020-12-31 | 에스케이씨 주식회사 | 연마패드 및 이의 제조방법 |
KR102273097B1 (ko) | 2019-10-23 | 2021-07-05 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
KR102188525B1 (ko) | 2019-10-29 | 2020-12-08 | 에스케이씨 주식회사 | 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법 |
KR102304965B1 (ko) | 2019-10-30 | 2021-09-24 | 에스케이씨솔믹스 주식회사 | 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법 |
TWI741753B (zh) | 2019-10-29 | 2021-10-01 | 南韓商Skc索密思股份有限公司 | 研磨墊、製造該研磨墊之方法及使用該研磨墊以製造半導體裝置之方法 |
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KR102287235B1 (ko) | 2019-10-30 | 2021-08-06 | 에스케이씨솔믹스 주식회사 | 가교도가 조절된 연마패드 및 이의 제조방법 |
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KR102300050B1 (ko) | 2019-11-15 | 2021-09-08 | 에스케이씨솔믹스 주식회사 | 연마패드로부터 재생된 폴리올 및 이의 제조방법 |
KR102298111B1 (ko) | 2019-11-15 | 2021-09-03 | 에스케이씨솔믹스 주식회사 | 재생 폴리올을 포함하는 폴리우레탄 연마패드 및 이의 제조방법 |
KR102300038B1 (ko) | 2019-11-15 | 2021-09-08 | 에스케이씨솔믹스 주식회사 | 연마패드로부터 재생된 폴리올 조성물 및 이의 제조방법 |
KR102293765B1 (ko) * | 2019-11-21 | 2021-08-26 | 에스케이씨솔믹스 주식회사 | 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법 |
KR102177748B1 (ko) | 2019-11-28 | 2020-11-11 | 에스케이씨 주식회사 | 다공성 연마 패드 및 이의 제조방법 |
US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
US11667061B2 (en) * | 2020-04-18 | 2023-06-06 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming leveraged poromeric polishing pad |
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KR20200105790A (ko) | 2020-09-01 | 2020-09-09 | 에스케이씨 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
US20240100648A1 (en) * | 2022-09-22 | 2024-03-28 | Cmc Materials Llc | Chemical mechanical polishing pads with a disulfide bridge |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6368200B1 (en) * | 2000-03-02 | 2002-04-09 | Agere Systems Guardian Corporation | Polishing pads from closed-cell elastomer foam |
CN102227289A (zh) * | 2008-12-26 | 2011-10-26 | 东洋橡胶工业株式会社 | 研磨垫及其制造方法 |
US20120302148A1 (en) * | 2011-05-23 | 2012-11-29 | Rajeev Bajaj | Polishing pad with homogeneous body having discrete protrusions thereon |
WO2013058183A1 (ja) * | 2011-10-18 | 2013-04-25 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
CN103153540A (zh) * | 2010-10-15 | 2013-06-12 | 内克斯普拉纳公司 | 具有多模态孔径分布的抛光垫 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5885312A (en) * | 1997-06-17 | 1999-03-23 | Speedfam Corporation | Grinding composition using abrasive particles on bubbles |
US6231942B1 (en) * | 1998-01-21 | 2001-05-15 | Trexel, Inc. | Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby |
TWI228522B (en) * | 1999-06-04 | 2005-03-01 | Fuji Spinning Co Ltd | Urethane molded products for polishing pad and method for making same |
US20020016139A1 (en) * | 2000-07-25 | 2002-02-07 | Kazuto Hirokawa | Polishing tool and manufacturing method therefor |
US8062098B2 (en) * | 2000-11-17 | 2011-11-22 | Duescher Wayne O | High speed flat lapping platen |
JP2005517290A (ja) * | 2002-02-06 | 2005-06-09 | アプライド マテリアルズ インコーポレイテッド | 渦電流モニタリングシステムを備えた化学機械的研磨の為の方法及び装置 |
US6841221B2 (en) * | 2002-02-20 | 2005-01-11 | Congoleum Corporation | Heat activated coating texture |
EP1590127A1 (en) * | 2003-01-10 | 2005-11-02 | 3M Innovative Properties Company | Pad constructions for chemical mechanical planarization applications |
US6960120B2 (en) * | 2003-02-10 | 2005-11-01 | Cabot Microelectronics Corporation | CMP pad with composite transparent window |
JP2004345014A (ja) * | 2003-05-21 | 2004-12-09 | Hitachi Chem Co Ltd | 研磨用パッドとそれを用いた研磨方法 |
US20050017122A1 (en) * | 2003-07-23 | 2005-01-27 | Conitex-Sonoco Llc | Apparatus and method for forming enlarged base on yarn carrier, and yarn carrier with enlarged base |
US7074115B2 (en) * | 2003-10-09 | 2006-07-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad |
JP2006128563A (ja) * | 2004-11-01 | 2006-05-18 | Toyo Tire & Rubber Co Ltd | 半導体ウエハ研磨用研磨パッドおよび半導体デバイスの製造方法 |
EP1704965A1 (de) * | 2005-03-24 | 2006-09-27 | Solvay Fluor GmbH | Schleifmittelzusatz |
JP4986129B2 (ja) * | 2007-01-15 | 2012-07-25 | 東洋ゴム工業株式会社 | 研磨パッド |
JP5117147B2 (ja) * | 2007-09-11 | 2013-01-09 | 富士紡ホールディングス株式会社 | 研磨パッドおよび研磨パッドの製造方法 |
EP2271463A4 (en) * | 2008-04-01 | 2013-11-27 | Innopad Inc | POLISHING CUSHION WITH CONTROLLED CAVITY |
EP2182024A3 (en) * | 2008-10-30 | 2011-04-20 | Rohm and Haas Company | Flexible acrylic foam composition |
JP5521243B2 (ja) * | 2009-07-03 | 2014-06-11 | 日本発條株式会社 | 研磨保持用パッド |
US20120009458A1 (en) * | 2010-07-12 | 2012-01-12 | Wu Donald P H | Connecting structure for exteriorly connecting a battery cell and a load |
JP5738731B2 (ja) * | 2011-09-22 | 2015-06-24 | 東洋ゴム工業株式会社 | 研磨パッド |
-
2013
- 2013-07-31 US US13/955,398 patent/US20150038066A1/en not_active Abandoned
-
2014
- 2014-07-17 EP EP14747270.8A patent/EP3027363B1/en active Active
- 2014-07-17 CN CN201480042621.4A patent/CN105408063B/zh active Active
- 2014-07-17 KR KR1020167002464A patent/KR101801693B1/ko active IP Right Grant
- 2014-07-17 JP JP2016531739A patent/JP6517802B2/ja active Active
- 2014-07-17 WO PCT/US2014/047065 patent/WO2015017138A1/en active Application Filing
- 2014-07-17 SG SG11201600242PA patent/SG11201600242PA/en unknown
- 2014-07-30 TW TW103126073A patent/TWI579106B/zh active
-
2016
- 2016-12-02 JP JP2016234679A patent/JP6415521B2/ja active Active
-
2018
- 2018-12-20 JP JP2018238139A patent/JP2019077036A/ja not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6368200B1 (en) * | 2000-03-02 | 2002-04-09 | Agere Systems Guardian Corporation | Polishing pads from closed-cell elastomer foam |
CN102227289A (zh) * | 2008-12-26 | 2011-10-26 | 东洋橡胶工业株式会社 | 研磨垫及其制造方法 |
CN103153540A (zh) * | 2010-10-15 | 2013-06-12 | 内克斯普拉纳公司 | 具有多模态孔径分布的抛光垫 |
US20120302148A1 (en) * | 2011-05-23 | 2012-11-29 | Rajeev Bajaj | Polishing pad with homogeneous body having discrete protrusions thereon |
WO2013058183A1 (ja) * | 2011-10-18 | 2013-04-25 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021257136A1 (en) * | 2020-06-19 | 2021-12-23 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
CN112091817A (zh) * | 2020-09-08 | 2020-12-18 | 中国航发贵州黎阳航空动力有限公司 | 一种薄壁环形零件端面研磨工具 |
CN112091817B (zh) * | 2020-09-08 | 2022-06-17 | 中国航发贵州黎阳航空动力有限公司 | 一种薄壁环形零件端面研磨工具 |
Also Published As
Publication number | Publication date |
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WO2015017138A1 (en) | 2015-02-05 |
JP2016525459A (ja) | 2016-08-25 |
EP3027363A1 (en) | 2016-06-08 |
KR101801693B1 (ko) | 2017-11-27 |
KR20160027075A (ko) | 2016-03-09 |
EP3027363B1 (en) | 2020-01-15 |
CN105408063B (zh) | 2018-01-30 |
TWI579106B (zh) | 2017-04-21 |
SG11201600242PA (en) | 2016-02-26 |
JP2019077036A (ja) | 2019-05-23 |
TW201509595A (zh) | 2015-03-16 |
JP6517802B2 (ja) | 2019-05-22 |
JP2017042910A (ja) | 2017-03-02 |
JP6415521B2 (ja) | 2018-10-31 |
US20150038066A1 (en) | 2015-02-05 |
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