CN105405969A - 相变化记忆体结构的制造方法 - Google Patents
相变化记忆体结构的制造方法 Download PDFInfo
- Publication number
- CN105405969A CN105405969A CN201510718881.5A CN201510718881A CN105405969A CN 105405969 A CN105405969 A CN 105405969A CN 201510718881 A CN201510718881 A CN 201510718881A CN 105405969 A CN105405969 A CN 105405969A
- Authority
- CN
- China
- Prior art keywords
- layer
- phase
- heating material
- material layer
- change memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 111
- 238000010438 heat treatment Methods 0.000 claims abstract description 96
- 238000000034 method Methods 0.000 claims abstract description 56
- 230000008859 change Effects 0.000 claims abstract description 31
- 238000000059 patterning Methods 0.000 claims description 35
- 229920002120 photoresistant polymer Polymers 0.000 claims description 25
- 230000015572 biosynthetic process Effects 0.000 claims description 18
- 230000004888 barrier function Effects 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 7
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 5
- 229910003481 amorphous carbon Inorganic materials 0.000 claims description 4
- 238000003701 mechanical milling Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 abstract description 3
- 238000004220 aggregation Methods 0.000 abstract 1
- 230000002776 aggregation Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 226
- 239000000758 substrate Substances 0.000 description 12
- 238000005229 chemical vapour deposition Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 238000005240 physical vapour deposition Methods 0.000 description 5
- 239000011241 protective layer Substances 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 4
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 4
- 229910010037 TiAlN Inorganic materials 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910017083 AlN Inorganic materials 0.000 description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- MRPWWVMHWSDJEH-UHFFFAOYSA-N antimony telluride Chemical compound [SbH3+3].[SbH3+3].[TeH2-2].[TeH2-2].[TeH2-2] MRPWWVMHWSDJEH-UHFFFAOYSA-N 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002360 explosive Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 2
- 229960000909 sulfur hexafluoride Drugs 0.000 description 2
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910005872 GeSb Inorganic materials 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- CBJZJSBVCUZYMQ-UHFFFAOYSA-N antimony germanium Chemical compound [Ge].[Sb] CBJZJSBVCUZYMQ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012940 design transfer Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002362 mulch Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/861—Thermal details
- H10N70/8613—Heating or cooling means other than resistive heating electrodes, e.g. heater in parallel
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
Abstract
Description
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510718881.5A CN105405969B (zh) | 2015-10-29 | 2015-10-29 | 相变化记忆体结构的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510718881.5A CN105405969B (zh) | 2015-10-29 | 2015-10-29 | 相变化记忆体结构的制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105405969A true CN105405969A (zh) | 2016-03-16 |
CN105405969B CN105405969B (zh) | 2018-02-06 |
Family
ID=55471341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510718881.5A Active CN105405969B (zh) | 2015-10-29 | 2015-10-29 | 相变化记忆体结构的制造方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105405969B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110098325A (zh) * | 2019-05-23 | 2019-08-06 | 江苏时代全芯存储科技股份有限公司 | 相变化记忆体及其制造方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101114614A (zh) * | 2006-07-26 | 2008-01-30 | 奇梦达股份公司 | 形成集成电路的方法 |
CN102208330A (zh) * | 2010-03-29 | 2011-10-05 | 海力士半导体有限公司 | 形成精细图案的方法 |
CN102263057A (zh) * | 2010-05-31 | 2011-11-30 | 海力士半导体有限公司 | 在半导体器件中形成接触孔的方法 |
CN102376878A (zh) * | 2010-08-05 | 2012-03-14 | 中芯国际集成电路制造(上海)有限公司 | 相变存储器底部电极的制作方法 |
CN102468427A (zh) * | 2010-11-01 | 2012-05-23 | 中芯国际集成电路制造(上海)有限公司 | 相变存储器的制作方法 |
US20130109148A1 (en) * | 2011-10-28 | 2013-05-02 | Samsung Electronics Co., Ltd. | Methods of forming a pattern and methods of manufacturing semiconductor devices using the same |
US20150041753A1 (en) * | 2012-07-12 | 2015-02-12 | Micron Technology, Inc. | Nano-scale electrical contacts, memory devices including nano-scale electrical contacts, and related structures and devices |
CN104798201A (zh) * | 2012-11-21 | 2015-07-22 | 美光科技公司 | 用于形成窄垂直柱的方法及具有窄垂直柱的集成电路装置 |
-
2015
- 2015-10-29 CN CN201510718881.5A patent/CN105405969B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101114614A (zh) * | 2006-07-26 | 2008-01-30 | 奇梦达股份公司 | 形成集成电路的方法 |
CN102208330A (zh) * | 2010-03-29 | 2011-10-05 | 海力士半导体有限公司 | 形成精细图案的方法 |
CN102263057A (zh) * | 2010-05-31 | 2011-11-30 | 海力士半导体有限公司 | 在半导体器件中形成接触孔的方法 |
CN102376878A (zh) * | 2010-08-05 | 2012-03-14 | 中芯国际集成电路制造(上海)有限公司 | 相变存储器底部电极的制作方法 |
CN102468427A (zh) * | 2010-11-01 | 2012-05-23 | 中芯国际集成电路制造(上海)有限公司 | 相变存储器的制作方法 |
US20130109148A1 (en) * | 2011-10-28 | 2013-05-02 | Samsung Electronics Co., Ltd. | Methods of forming a pattern and methods of manufacturing semiconductor devices using the same |
US20150041753A1 (en) * | 2012-07-12 | 2015-02-12 | Micron Technology, Inc. | Nano-scale electrical contacts, memory devices including nano-scale electrical contacts, and related structures and devices |
CN104798201A (zh) * | 2012-11-21 | 2015-07-22 | 美光科技公司 | 用于形成窄垂直柱的方法及具有窄垂直柱的集成电路装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110098325A (zh) * | 2019-05-23 | 2019-08-06 | 江苏时代全芯存储科技股份有限公司 | 相变化记忆体及其制造方法 |
CN110098325B (zh) * | 2019-05-23 | 2022-09-23 | 北京时代全芯存储技术股份有限公司 | 相变化记忆体及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN105405969B (zh) | 2018-02-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100401546C (zh) | 相变存储器及其制造方法 | |
US7419881B2 (en) | Phase changeable memory device and method of formation thereof | |
US7390691B2 (en) | Increasing phase change memory column landing margin | |
US20130200328A1 (en) | Phase change memory devices | |
US9466792B2 (en) | Memory device and method for fabricating the same | |
CN105336851B (zh) | 相变化记忆体结构的制造方法 | |
KR20140026155A (ko) | 반도체 메모리 소자 및 그 제조 방법 | |
CN109786550B (zh) | 相变化记忆体及其制造方法 | |
CN105405969A (zh) | 相变化记忆体结构的制造方法 | |
CN105428525B (zh) | 相变化记忆体及其制造方法 | |
CN105098070A (zh) | 相变化记忆体的制备方法 | |
CN105428533B (zh) | 相变化记忆体的制造方法 | |
CN105428529A (zh) | 相变化记忆体及其制造方法 | |
CN105226181A (zh) | 相变化记忆体及其制造方法 | |
KR20050031160A (ko) | 상변환 기억 소자 및 그 형성 방법 | |
CN105609632B (zh) | 相变化记忆体及其制造方法 | |
KR101178835B1 (ko) | 상변환 기억 소자의 제조방법 | |
CN105098069A (zh) | 相变化记忆体的制备方法 | |
CN105489757A (zh) | 相变化记忆体结构与其制造方法 | |
CN109888095B (zh) | 相变化记忆体及其制造方法 | |
US20230122498A1 (en) | Phase change memory cell having pillar bottom electrode with improved thermal insulation | |
CN107845726B (zh) | 制造相变化记忆体的方法 | |
KR20110011862A (ko) | 상변화 메모리 소자 제조 방법 | |
KR20100007193A (ko) | 상변화 기억 소자 및 그 형성 방법 | |
KR20160006544A (ko) | 반도체 장치 및 그 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170628 Address after: No. 188 East Huaihe Road, Huaiyin District, Jiangsu, Huaian Applicant after: Jiangsu times all core storage technology Co.,Ltd. Applicant after: BEING ADVANCED MEMORY TAIWAN LIMITED Address before: 315195 Zhejiang city of Ningbo province Yinzhou Industrial Park (New Yinzhou District Jiang Shan Zhen Zhang Yu Cun) Applicant before: NINGBO ADVANCED MEMORY TECHNOLOGY Corp. Applicant before: BEING ADVANCED MEMORY TAIWAN LIMITED |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: No. 601, Changjiang East Road, Huaiyin District, Huaian, Jiangsu Co-patentee after: BEING ADVANCED MEMORY TAIWAN LIMITED Patentee after: JIANGSU ADVANCED MEMORY TECHNOLOGY Co.,Ltd. Address before: 223001 No. 188 Huaihe East Road, Huaiyin District, Huaian City, Jiangsu Province Co-patentee before: BEING ADVANCED MEMORY TAIWAN LIMITED Patentee before: Jiangsu times all core storage technology Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 802, unit 4, floor 8, building 2, yard 9, FengHao East Road, Haidian District, Beijing Patentee after: Beijing times full core storage technology Co.,Ltd. Patentee after: BEING ADVANCED MEMORY TAIWAN LIMITED Address before: 223001 No. 601, Changjiang East Road, Huaiyin District, Huai'an City, Jiangsu Province Patentee before: JIANGSU ADVANCED MEMORY TECHNOLOGY Co.,Ltd. Patentee before: BEING ADVANCED MEMORY TAIWAN LIMITED |
|
CP03 | Change of name, title or address | ||
TR01 | Transfer of patent right |
Effective date of registration: 20221012 Address after: 802, unit 4, floor 8, building 2, yard 9, FengHao East Road, Haidian District, Beijing Patentee after: Beijing times full core storage technology Co.,Ltd. Address before: Room 802, unit 4, floor 8, building 2, yard 9, FengHao East Road, Haidian District, Beijing 100094 Patentee before: Beijing times full core storage technology Co.,Ltd. Patentee before: BEING ADVANCED MEMORY TAIWAN LIMITED |
|
TR01 | Transfer of patent right |