CN105374952A - OLED member manufacture method and OLED member and application - Google Patents
OLED member manufacture method and OLED member and application Download PDFInfo
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- CN105374952A CN105374952A CN201510934622.6A CN201510934622A CN105374952A CN 105374952 A CN105374952 A CN 105374952A CN 201510934622 A CN201510934622 A CN 201510934622A CN 105374952 A CN105374952 A CN 105374952A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
Abstract
The invention discloses an OLED member manufacture method, comprising steps of coating monomer macromolecules solution on a first substrate, heating a first substrate to form a first high-molecular film substrate, forming a first water blocking layer on the first high-molecular film substrate, forming a first electrode layer on the first water blocking layer, forming an organic luminous layer on the first electrode layer, forming a second electrode layer on the organic luminous layer, providing a second substrate, coating the monomer macromolecules solution, heating the second substrate in order to form a second high-molecular film substrate, forming a second water blocking layer on the second high-molecular film substrate, forming a glue adhesive layer on the second water blocking layer, performing counterpoint fit on the first substrate and the second substrate, solidifying an adhesive layer and stripping the first substrate and the second substrate to obtain the OLED member. The invention also provides an OLED member and the application. The OLED member manufacture method is simple in technology and low in the cost.
Description
Technical field
The present invention relates to organic electroluminescent light field, particularly relate to a kind of manufacture method of OLED and OLED and application.
Background technology
Organic electroluminescence device (OrganicLight-EmittingDiodes is called for short OLED) is selfluminous element, and it has light weight, ultra-thin, theoretical luminous efficiency is high, and more important point to make flexibility, no matter being illumination or display field, will be following developing direction.Wherein, FOLED device (flexible OLED) possesses the advantage such as wide viewing angle, high brightness of Conventional OLED devices, simultaneously because the substrate of FOLED device has good flexible material, compare and use the Conventional OLED devices of glass substrate more frivolous, more shock-resistant, and the preparation of FOLED device can adopt the mode of production of volume to volume, thus significantly can reduce manufacturing cost.
In FOLED device, the selection of flexible substrate decides the process route of whole device, production cost, display quality and product reliability, is the basis of exploitation FOLED device.But in Traditional flexible OLED, due under the state that is attached to one another at bearing substrate and flexible base, board, need to perform complicated lift-off processing, and bearing substrate was once use, just should abandon, not only cause cost to increase, and make manufacturing process complicated, be unfavorable for increasing work efficiency and yields.
Summary of the invention
In order to solve above-mentioned the deficiencies in the prior art, the invention provides the manufacture method of a kind of technique OLED simple, with low cost.Present invention also offers a kind of OLED and application.
Technical problem to be solved by this invention is achieved by the following technical programs:
A manufacture method for OLED, comprises the following steps:
One first substrate is provided;
On first substrate, be coated with monomer small molecule solution, heat described first substrate to form the first polymer film substrate;
One first water blocking layer is formed on described first polymer film substrate;
The first electrode layer is formed on described first water blocking layer;
Organic luminous layer is formed on described first electrode layer;
The second electrode lay is formed on described organic luminous layer;
Second substrate is provided;
On second substrate, be coated with monomer small molecule solution, heat described second substrate to form the second polymer film substrate;
One second water blocking layer is formed on described second polymer film substrate;
An adhesive layer is formed on described second water blocking layer;
Contraposition laminating is carried out in the side on described second substrate with the side described first substrate with the second electrode lay with the second water blocking layer;
Solidify described adhesive layer, and remove described first substrate and second substrate, obtain OLED.
A manufacture method for OLED, comprises the following steps:
One first substrate is provided;
On first substrate, be coated with monomer small molecule solution, heat described first substrate to form the first polymer film substrate;
One first water blocking layer is formed on described first polymer film substrate;
The first electrode layer is formed on described first water blocking layer;
Organic luminous layer is formed on described first electrode layer;
The second electrode lay is formed on described organic luminous layer;
One second water blocking layer is formed on described the second electrode lay and the first water blocking layer;
Remove described first substrate, obtain OLED.
Further, described monomer Small molecular is diamines monomer and dianhydride class combination of monomers or many amine monomers and many acid anhydrides class combination of monomers or alcohols or carboxylic acid type monomer's combination.
Further, described first electrode layer is transparent ITO or IZO layer, and described the second electrode lay is metal electrode layer; Or described the second electrode lay is transparent ITO or IZO layer, and described first electrode layer is metal electrode layer.
Further, described water blocking layer is SiNx, SiO
2and Al
2o
3wherein any layer or any two-layer combination.
Further, described metal electrode layer is any layer or its mixed layer of Mo, Al, Ag, Au.
Further, described adhesive layer is marine glue adhesion coating.
Further, described marine glue adhesion coating is epoxy or acrylic adhesive layer.
A kind of OLED, comprising:
First polymer film substrate, it adds thermosetting by monomer Small molecular;
First water blocking layer, is formed on described first polymer film substrate;
First electrode layer, is formed on described first water blocking layer;
Organic luminous layer, is formed on described first electrode layer;
The second electrode lay, is formed on described organic luminous layer;
Second polymer film substrate, it adds thermosetting by monomer Small molecular;
Second water blocking layer, is formed on described second polymer film substrate;
Adhesive layer, is formed on described second water blocking layer; Wherein,
Contraposition laminating is carried out by the described adhesive layer of solidification in the side on described second substrate with the side described first substrate with the second electrode lay with the second water blocking layer fixing.
A kind of OLED, comprising:
First polymer film substrate, it adds thermosetting by monomer Small molecular;
First water blocking layer, is formed on described first polymer film substrate;
First electrode layer, is formed on described first water blocking layer;
Organic luminous layer, is formed on described first electrode layer;
The second electrode lay, is formed on described organic luminous layer;
Second water blocking layer, is formed on described the second electrode lay and the first water blocking layer.
Further, described monomer Small molecular is diamines monomer and dianhydride class combination of monomers or many amine monomers and many acid anhydrides class combination of monomers or alcohols or carboxylic acid type monomer's combination.
Further, described first electrode layer is transparent ITO or IZO layer, and described the second electrode lay is metal electrode layer; Or described the second electrode lay is transparent ITO or IZO layer, and described first electrode layer is metal electrode layer.
Further, described water blocking layer is the wherein any layer of SiNx and SiO2 or any two-layer combination.
Further, described metal electrode layer is any layer or its mixed layer of Mo, Al, Ag, Au.
Further, described adhesive layer is marine glue adhesion coating.
Further, described marine glue adhesion coating is epoxy or acrylic adhesive layer.
A kind of OLED application on an electronic device manufactured by described OLED manufacture method.
The present invention has following beneficial effect:
(1) mode that the present invention is polymerized by monomer Small molecular above forms macromolecule fexible film at bearing substrate (first substrate and second substrate), then made by simple water blocking layer, with waterproof adhesive layer, formation OLED encapsulates, finally direct OLED to be peeled off from bearing substrate, form flexible OLED devices; Solve existing flexible base, board on bearing substrate after film forming, little with the adhesion of bearing substrate, easily depart from from bearing substrate in OLED manufacturing process, and cause fraction defective and affect the problem of production efficiency;
(2) polymer film substrate is formed owing to utilizing monomer small molecule solution to be polymerized on bearing substrate, therefore be combined by weak chemical bonding effect between fexible film and bearing substrate, after device completes making, directly film can be peeled off from bearing substrate, do not need special peel-off device, therefore manufacture craft is simple, with low cost, enhance productivity simultaneously, also reduce the fraction defective that brings of stripping technology and unsteadiness;
(3) during OLED encapsulation, directly adopt waterproof adhesive layer, not docile drier or thin-film package mode, therefore encapsulate gimmick fairly simple, with low cost;
(4) during embody rule, then this OLED is covered on curved surface carrier, forms curved surface OLED; Directly can adhere on curved surface carrier, avoid repeatedly bending and cause device impaired, and Application comparison is convenient.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet that one embodiment of the invention manufactures the method for OLED;
Fig. 2 is the structural representation of one embodiment of the invention oled substrate;
Fig. 3 is the structural representation of one embodiment of the invention cover plate;
Fig. 4 is the structural representation before the solidification of fitting relative to cover plate of one embodiment of the invention oled substrate;
Fig. 5 is the structural representation after the solidification of fitting relative to cover plate of one embodiment of the invention oled substrate;
Fig. 6 is the schematic flow sheet that another embodiment of the present invention manufactures the method for OLED;
Fig. 7 is the structural representation of another embodiment of the present invention OLED.
Embodiment
Below in conjunction with drawings and Examples, the present invention will be described in detail.
Embodiment 1
Please refer to Fig. 1 to Fig. 5, the invention provides a kind of manufacture method of OLED, comprise the following steps:
Step 11, provide a first substrate 11; On first substrate 11, be coated with monomer small molecule solution, heat described first substrate 11 to form the first polymer film substrate 12;
Described first substrate 11 is preferably glass substrate, also can be other hard substrates; Described coating processes can be spin coating, silk-screen or roller coating etc.; By heating first substrate 11, impel monomer Small molecular polymerization reaction take place, form the first polymer film substrate 12, first polymer film substrate 12 molecule and first substrate 11 carrier due to weak chemical bonding effect (hydrogen bond action etc.), stick on first substrate 11 carrier.
Described monomer Small molecular can be that diamines monomer and dianhydride class combination of monomers, many amine monomers and many acid anhydrides class combination of monomers, alcohols, carboxylic acid type monomer combine or the monomer molecule of other polymerizable film forming combines; The present embodiment preferably adopts diamines monomer and dianhydride class combination of monomers.Described heating-up temperature is 200 ~ 400 DEG C, heating time 1 ~ 3h, heating atmosphere can be normal atmospheric environment, also can be pure N
2environment.After heating, the polymerization of monomer Small molecular forms first polymer film substrate 12 of thickness between 4 ~ 40 μm.
Step 12, on described first polymer film substrate 12, form first water blocking layer 13 of a thickness about 50 ~ 1000nm;
The material that described first water blocking layer 13 is selected need possess insulating properties, is short-circuited, possesses certain oxygen ability that blocks water simultaneously between the polymer film substrate preventing monomer Small molecular from being formed and electrode layer.Concrete, described first water blocking layer 13 can be insulative inorganic material, its by sputtering, the mode of chemical deposition or hot evaporation formed, also can be insulating organic polymer material, it be formed through baking-curing technique by being coated with organic polymer precursor material.The present embodiment is preferably SiNx, SiO
2and Al
2o
3deng any layer in inorganic thin film or any two-layer above combination.
Step 13, on described first water blocking layer 13, form the first electrode layer 14, organic luminous layer 15 and the second electrode lay 16 successively, obtained oled substrate, as shown in Figure 2;
Described first electrode layer 14 is preferably the transparent anode conductive layer of transparent ITO or IZO layer etc., described the second electrode lay 16 is preferably the metallic cathode conductive layer of any layer or its mixed layer etc. of Mo, Al, Ag, Au, described first electrode layer 14 and/or the second electrode lay 16 are formed by modes such as magnetron sputtering or CVD modes, and by etch process (can make dry etching, also can be wet etching), transparent anode conductive layer, metallic cathode conductive layer are made into target pattern; Described organic luminous layer 15 comprises: the electron transfer layer be located at the hole transmission layer on the first electrode layer 14, be located at the luminescent layer 15 on hole transmission layer and be located on luminescent layer 15, its by vacuum evaporation or typography successively film forming on the first electrode layer 14.
Described oled substrate is end ray structure, and described in its light transmission sent, the first electrode layer 14 and the first polymer film substrate 12 penetrate.
It should be noted that, the first electrode layer 14 and the second electrode lay 16 can be exchanged according to actual conditions.After the first electrode layer 14 and the second electrode lay 16 are exchanged mutually, then this oled substrate is top ray structure, and described in its light transmission sent, the first electrode layer 14 and the second polymer film substrate 18 penetrate.
Step 14, provide second substrate 17; On second substrate 17, be coated with monomer small molecule solution, heat described second substrate 17 to form the second polymer film substrate 18;
Described second substrate 17 is preferably glass substrate, also can be other hard substrates; Described coating processes can be spin coating, silk-screen or roller coating etc.; By heating second substrate 17, impel monomer Small molecular polymerization reaction take place, form the second polymer film substrate 18, second polymer film substrate 18 molecule and second substrate 17 carrier due to weak chemical bonding effect (hydrogen bond action etc.), stick on second substrate 17 carrier.
Described monomer Small molecular can be that diamines monomer and dianhydride class combination of monomers, many amine monomers and many acid anhydrides class combination of monomers, alcohols, carboxylic acid type monomer combine or the monomer molecule of other polymerizable film forming combines; The present embodiment preferably adopts diamines monomer and dianhydride class combination of monomers.Described heating-up temperature is 200 ~ 400 DEG C, heating time 1 ~ 3h, heating atmosphere can be normal atmospheric environment, also can be pure N
2environment.After heating, the polymerization of monomer Small molecular forms second polymer film substrate 18 of thickness between 4 ~ 40 μm.
Step 15, on described second polymer film substrate 18, form second water blocking layer 19 of a thickness about 50 ~ 1000nm;
The material that described second water blocking layer 19 is selected need possess insulating properties, is short-circuited, possesses certain oxygen ability that blocks water simultaneously between the polymer film substrate preventing monomer Small molecular from being formed and electrode layer.Concrete, described second water blocking layer 19 can be insulative inorganic material, its by sputtering, the mode of chemical deposition or hot evaporation formed, also can be insulating organic polymer material, it be formed through baking-curing technique by being coated with organic polymer precursor material.The present embodiment is preferably SiNx, SiO
2and Al
2o
3deng any layer in inorganic thin film or any two-layer above combination.
Step 16, on described second water blocking layer 19, form the adhesive layer 10 of a thickness about 10 ~ 50 μm, obtained cover plate, as shown in Figure 3;
Described adhesive layer 10 is preferably marine glue adhesion coating, can be the marine glue such as epoxy, acrylic acid series adhesion coating 10, be formed by modes such as silk-screen, bat printing or spin coating modes.The present embodiment is preferably epoxy marine glue adhesion coating.
Step 17, contraposition laminating is carried out in the side on described second substrate 17 with the side described first substrate 11 with the second electrode lay 16 with the second water blocking layer 19, namely oled substrate is relative with cover plate fits, as shown in Figure 4; Setting curing temperature 80 ~ 120 DEG C, curing time, 0.5 ~ 5h, solidified described adhesive layer 10, and directly removed described first substrate 11 and second substrate 17, obtained OLED, as shown in Figure 5.
Described curing mode can be the mode such as UV or heating, to encapsulate OLED; Because first substrate 11 and the first polymer film substrate 12 and second substrate 17 are all be combined by weak chemical bonding effect with the second polymer film substrate 18, after device package completes, directly polymer film substrate can be peeled off from first substrate 11 or second substrate 17, not need special peel-off device.
During specific implementation, also comprise the step of the COG/FPC being attached at the first electrode layer 14 be positioned on described first water blocking layer 13.
After device completes making, the first polymer film substrate and the second polymer film substrate carry out laminating encapsulation through marine glue adhesion coating, without the need to using drier or thin-film package mode, make encapsulation gimmick simpler, and cost are lower; Simultaneously owing to utilizing monomer small molecule solution to form polymer film substrate in the upper polymerization of bearing substrate (first substrate and second substrate), combined by weak chemical bonding effect between therefore flexible polymer film substrate and bearing substrate, directly polymer film substrate can be peeled off from bearing substrate, do not need special peel-off device, therefore manufacture craft is simple, with low cost, enhance productivity simultaneously, also reduce the fraction defective that brings of stripping technology and unsteadiness; Obtained OLED has good pliability, effectively can stop again the infiltration of steam, oxygen, packaging effect is good, solve existing flexible base, board on bearing substrate after film forming, little with the adhesion of bearing substrate, easily depart from from bearing substrate in OLED manufacturing process, and cause fraction defective and affect the problem of production efficiency.
Embodiment 2
Please refer to Fig. 6, invention further provides a kind of manufacture method of OLED, the manufacture method difference of itself and embodiment 1 is: retain step 11 ~ 13, then on the second electrode lay and the first water blocking layer, second water blocking layer of a thickness about 50 ~ 1000nm is directly formed after completing step 13, as encapsulating film; Directly remove described first substrate, obtain OLED.
The material that described second water blocking layer is selected need possess insulating properties, is short-circuited, possesses certain oxygen ability that blocks water simultaneously between the polymer film substrate preventing monomer Small molecular from being formed and electrode layer.Concrete, described second water blocking layer can be insulative inorganic material, its by sputtering, the mode of chemical deposition or hot evaporation formed, also can be insulating organic polymer material, it be formed through baking-curing technique by being coated with organic polymer precursor material.The present embodiment is preferably SiNx, SiO
2and Al
2o
3deng any layer in inorganic thin film or any two-layer above combination.
During specific implementation, also comprise the step of the COG/FPC being attached at the first electrode layer be positioned on described first water blocking layer.
After device completes making, directly form the second water blocking layer thereon, as simple and easy encapsulating film, make encapsulation gimmick simpler, and cost is lower; Simultaneously owing to utilizing monomer small molecule solution to form polymer film substrate in the upper polymerization of bearing substrate (first substrate), combined by weak chemical bonding effect between therefore flexible polymer film substrate and bearing substrate, directly polymer film substrate can be peeled off from bearing substrate, do not need special peel-off device, therefore manufacture craft is simple, with low cost, enhance productivity simultaneously, also reduce the fraction defective that brings of stripping technology and unsteadiness; Obtained OLED has good pliability, effectively can stop again the infiltration of steam, oxygen, packaging effect is good, solve existing flexible base, board on bearing substrate after film forming, little with the adhesion of bearing substrate, easily depart from from bearing substrate in OLED manufacturing process, and cause fraction defective and affect the problem of production efficiency.
Embodiment 3
As shown in Figure 5, present invention also offers a kind of OLED, comprising: the first polymer film substrate 12; The second polymer film substrate 18 be oppositely arranged with this first polymer film substrate 12; Be formed in the first water blocking layer 13 on described first polymer film substrate 12; Be formed in the first electrode layer 14 on described first water blocking layer 13; Be formed in the organic luminous layer 15 on described first electrode layer 14; Be formed in the second electrode lay 16 on described organic luminous layer 15; Be formed in the second water blocking layer 19 on described second polymer film substrate 18; And the adhesive layer 10 be formed on described second water blocking layer 19; Contraposition laminating is carried out by the described adhesive layer 10 of solidification in the side on described second substrate with the side described first substrate with the second electrode lay 16 with the second water blocking layer 19 fixing.
During specific implementation, also comprise the step of the COG/FPC being attached at the first electrode layer be positioned on described first water blocking layer.
It should be noted that, first polymer film substrate and the second polymer film substrate heat by monomer Small molecular and form, monomer Small molecular is coated on bearing substrate (first substrate and second substrate) by advance, after heated polymerizable is shaping, owing to being combined by weak chemical bonding effect between polymer film substrate and bearing substrate, directly polymer film substrate can be peeled off from bearing substrate, not need special peel-off device.
Described monomer Small molecular can be that diamines monomer and dianhydride class combination of monomers, many amine monomers and many acid anhydrides class combination of monomers, alcohols, carboxylic acid type monomer combine or the monomer molecule of other polymerizable film forming combines; The present embodiment preferably adopts diamines monomer and dianhydride class combination of monomers.Described heating-up temperature is 200 ~ 400 DEG C, heating time 1 ~ 3h, heating atmosphere can be normal atmospheric environment, also can be pure N
2environment.After heating, the polymerization of monomer Small molecular forms first polymer film substrate of thickness between 4 ~ 40 μm or the second polymer film substrate.
Described first water blocking layer or second water blocking layer thickness preferably 50 ~ 1000nm, its material selected need possess insulating properties, is preferably SiNx, SiO
2and Al
2o
3deng any layer in inorganic thin film or any two-layer combination.
Described first electrode layer is preferably the transparent anode conductive layer of transparent ITO or IZO layer etc., and described the second electrode lay is preferably the metallic cathode conductive layer of any layer of Mo, Al, Ag, Au or its mixed layer etc.; Described organic luminous layer comprises: the electron transfer layer be located at the hole transmission layer on the first electrode layer, be located at the luminescent layer on hole transmission layer and be located on luminescent layer, its by vacuum evaporation or typography successively film forming on the first electrode layer.This oled substrate is end ray structure, and described in its light transmission sent, the first electrode layer and the first polymer film substrate penetrate.
It should be noted that the first electrode layer and the second electrode lay can be exchanged according to actual conditions.After the first electrode layer and the second electrode lay are exchanged mutually, then this oled substrate is top ray structure, the first electrode layer described in its light transmission sent and the injection of the second polymer film substrate.
Described adhesive layer is preferably the marine glue adhesion coating of thickness about 10 ~ 50 μm, can be the marine glue such as epoxy, acrylic acid series adhesion coating, be formed by modes such as silk-screen, bat printing or spin coating modes.
Embodiment 4
Please refer to Fig. 7, a kind of OLED, is characterized in that, comprising: the first polymer film substrate 21; Be formed in the first water blocking layer 22 on described first polymer film substrate 21; Be formed in the first electrode layer 23 on described first water blocking layer 22; Be formed in the organic luminous layer 24 on described first electrode layer 23; Be formed in the second electrode lay 25 on described organic luminous layer 24; Be formed in the second water blocking layer 26 on described the second electrode lay 25 and the first water blocking layer 22.
It should be noted that, the material that each part of the present embodiment OLED is used and the conditional parameter each part identical with embodiment 3 material used thereof and conditional parameter identical, do not repeat them here.
Embodiment 3
Present invention also offers a kind of OLED application on an electronic device manufactured by described OLED manufacture method, this OLED can directly be covered on curved surface carrier, forms curved surface OLED, and Application comparison is convenient, simple to operate.
The above embodiment only have expressed embodiments of the present invention; it describes comparatively concrete and detailed; but therefore can not be interpreted as the restriction to the scope of the claims of the present invention; in every case the technical scheme adopting the form of equivalent replacement or equivalent transformation to obtain, all should drop within protection scope of the present invention.
Claims (10)
1. a manufacture method for OLED, comprises the following steps:
One first substrate is provided;
On first substrate, be coated with monomer small molecule solution, heat described first substrate to form the first polymer film substrate;
One first water blocking layer is formed on described first polymer film substrate;
The first electrode layer is formed on described first water blocking layer;
Organic luminous layer is formed on described first electrode layer;
The second electrode lay is formed on described organic luminous layer;
Second substrate is provided;
On second substrate, be coated with monomer small molecule solution, heat described second substrate to form the second polymer film substrate;
One second water blocking layer is formed on described second polymer film substrate;
An adhesive layer is formed on described second water blocking layer;
Contraposition laminating is carried out in the side on described second substrate with the side described first substrate with the second electrode lay with the second water blocking layer;
Solidify described adhesive layer, and remove described first substrate and second substrate, obtain OLED.
2. a manufacture method for OLED, comprises the following steps:
One first substrate is provided;
On first substrate, be coated with monomer small molecule solution, heat described first substrate to form the first polymer film substrate;
One first water blocking layer is formed on described first polymer film substrate;
The first electrode layer is formed on described first water blocking layer;
Organic luminous layer is formed on described first electrode layer;
The second electrode lay is formed on described organic luminous layer;
One second water blocking layer is formed on described the second electrode lay and the first water blocking layer;
Remove described first substrate, obtain OLED.
3. the manufacture method of OLED according to claim 1 and 2, is characterized in that, described monomer Small molecular is diamines monomer and dianhydride class combination of monomers or many amine monomers and many acid anhydrides class combination of monomers or alcohols or carboxylic acid type monomer's combination.
4. the manufacture method of OLED according to claim 1 and 2, is characterized in that, described water blocking layer is SiNx, SiO
2and Al
2o
3wherein any layer or any two-layer combination.
5. the manufacture method of OLED according to claim 1 and 2, is characterized in that, described first electrode layer is transparent ITO or IZO layer, and described the second electrode lay is metal electrode layer; Or described the second electrode lay is transparent ITO or IZO layer, and described first electrode layer is metal electrode layer.
6. the manufacture method of OLED according to claim 1, is characterized in that, described adhesive layer is marine glue adhesion coating.
7. an OLED, is characterized in that, comprising:
First polymer film substrate, it adds thermosetting by monomer Small molecular;
First water blocking layer, is formed on described first polymer film substrate;
First electrode layer, is formed on described first water blocking layer;
Organic luminous layer, is formed on described first electrode layer;
The second electrode lay, is formed on described organic luminous layer;
Second polymer film substrate, it adds thermosetting by monomer Small molecular;
Second water blocking layer, is formed on described second polymer film substrate;
Adhesive layer, is formed on described second water blocking layer; Wherein,
Contraposition laminating is carried out by the described adhesive layer of solidification in the side on described second substrate with the side described first substrate with the second electrode lay with the second water blocking layer fixing.
8. an OLED, is characterized in that, comprising:
First polymer film substrate, it adds thermosetting by monomer Small molecular;
First water blocking layer, is formed on described first polymer film substrate;
First electrode layer, is formed on described first water blocking layer;
Organic luminous layer, is formed on described first electrode layer;
The second electrode lay, is formed on described organic luminous layer;
Second water blocking layer, is formed on described the second electrode lay and the first water blocking layer.
9. the OLED according to claim 7 or 8, is characterized in that, described monomer Small molecular is diamines monomer and dianhydride class combination of monomers or many amine monomers and many acid anhydrides class combination of monomers or alcohols or carboxylic acid type monomer's combination.
10. the OLED application on an electronic device of an OLED manufacture method manufacture as claimed in claim 1 or 2.
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|---|---|---|---|
| CN201510934622.6A CN105374952A (en) | 2015-12-15 | 2015-12-15 | OLED member manufacture method and OLED member and application |
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|---|---|---|---|
| CN201510934622.6A CN105374952A (en) | 2015-12-15 | 2015-12-15 | OLED member manufacture method and OLED member and application |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106450044A (en) * | 2016-11-28 | 2017-02-22 | 武汉华星光电技术有限公司 | OLED (organic light emitting diode) device and method for manufacturing same |
| CN107230686A (en) * | 2016-03-24 | 2017-10-03 | 上海和辉光电有限公司 | A kind of display device and its method for packing |
| CN108134013A (en) * | 2017-12-15 | 2018-06-08 | 昆山维信诺科技有限公司 | Flexible display panels and display device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020150745A1 (en) * | 2001-04-16 | 2002-10-17 | Martin Peter M. | Multilayer plastic substrates |
| TWI321241B (en) * | 2005-09-14 | 2010-03-01 | Ind Tech Res Inst | Flexible pixel array substrate and method of fabricating the same |
| US20120100647A1 (en) * | 2010-10-22 | 2012-04-26 | Samsung Mobile Display Co., Ltd. | Method of manufacturing flexible display device |
| US20120161197A1 (en) * | 2010-12-23 | 2012-06-28 | Samsung Mobile Display Co., Ltd. | Flexible organic light-emitting display device and method of manufacturing the same |
| US20140021499A1 (en) * | 2012-07-19 | 2014-01-23 | Samsung Display Co., Ltd. | Flexible display apparatus and method of fabricating the same |
| CN104183783A (en) * | 2013-05-24 | 2014-12-03 | 三星显示有限公司 | Organic Light-Emitting Display Apparatus Having a Flexible Substrate |
| CN104576970A (en) * | 2013-10-12 | 2015-04-29 | 昆山工研院新型平板显示技术中心有限公司 | Manufacturing method of flexible display device and flexible display device manufactured by adopting same |
| WO2015130588A1 (en) * | 2014-02-28 | 2015-09-03 | Corning Incorporated | Flexible display device packages and methods of manufacturing |
-
2015
- 2015-12-15 CN CN201510934622.6A patent/CN105374952A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020150745A1 (en) * | 2001-04-16 | 2002-10-17 | Martin Peter M. | Multilayer plastic substrates |
| TWI321241B (en) * | 2005-09-14 | 2010-03-01 | Ind Tech Res Inst | Flexible pixel array substrate and method of fabricating the same |
| US20120100647A1 (en) * | 2010-10-22 | 2012-04-26 | Samsung Mobile Display Co., Ltd. | Method of manufacturing flexible display device |
| US20120161197A1 (en) * | 2010-12-23 | 2012-06-28 | Samsung Mobile Display Co., Ltd. | Flexible organic light-emitting display device and method of manufacturing the same |
| US20140021499A1 (en) * | 2012-07-19 | 2014-01-23 | Samsung Display Co., Ltd. | Flexible display apparatus and method of fabricating the same |
| CN104183783A (en) * | 2013-05-24 | 2014-12-03 | 三星显示有限公司 | Organic Light-Emitting Display Apparatus Having a Flexible Substrate |
| CN104576970A (en) * | 2013-10-12 | 2015-04-29 | 昆山工研院新型平板显示技术中心有限公司 | Manufacturing method of flexible display device and flexible display device manufactured by adopting same |
| WO2015130588A1 (en) * | 2014-02-28 | 2015-09-03 | Corning Incorporated | Flexible display device packages and methods of manufacturing |
Non-Patent Citations (3)
| Title |
|---|
| 吴懿平等: "《电子组装技术》", 31 December 2006 * |
| 洪定一: "《炼油与石化工业技术进展2012》", 30 September 2012 * |
| 陈平等: "《高分子合成材料学》", 31 August 2010 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107230686A (en) * | 2016-03-24 | 2017-10-03 | 上海和辉光电有限公司 | A kind of display device and its method for packing |
| CN106450044A (en) * | 2016-11-28 | 2017-02-22 | 武汉华星光电技术有限公司 | OLED (organic light emitting diode) device and method for manufacturing same |
| CN106450044B (en) * | 2016-11-28 | 2019-02-12 | 武汉华星光电技术有限公司 | The production method and OLED device of OLED device |
| CN108134013A (en) * | 2017-12-15 | 2018-06-08 | 昆山维信诺科技有限公司 | Flexible display panels and display device |
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