CN105024018A - Flexible display and manufacturing method thereof - Google Patents
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- CN105024018A CN105024018A CN201410176745.3A CN201410176745A CN105024018A CN 105024018 A CN105024018 A CN 105024018A CN 201410176745 A CN201410176745 A CN 201410176745A CN 105024018 A CN105024018 A CN 105024018A
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Abstract
The invention discloses a flexible display and a manufacturing method thereof. The manufacturing method comprises the steps of A, carrying out surface treatment on a middle area of a carrier substrate so as to enable the middle area of the carrier substrate to have a hydrophobic property; B, evenly coating a polymer solution at the surface of the carrier substrate, then heating to enable the polymer solution to be cured through cross-linking, and forming a polymer film; C, carrying out surface treatment on the periphery of the polymer film so as to enhance adhesion between the polymer film and the carrier substrate; D, forming a blocking layer, a TFT (thin film transistor) array layer, an OLED (organic light emitting diode) layer and a packaging layer on the polymer film in sequence, and then stripping the flexible display from the carrier substrate along a cutting line. The method disclosed by the invention not only ensures that the flexible display has good adhesion when being manufactured, but also ensures that a display device is stripped easily from the carrier substrate after the flexible display is manufactured. Meanwhile, an adhesive does not need to be used, the preparation process of the device is simplified, and the temperature resistant performance of the flexible substrate is improved, thereby being suitable for manufacturing high-resolution flexible displays.
Description
Technical field
The present invention relates to flexible display apparatus field, particularly relate to a kind of flexible display and preparation method thereof.
Background technology
Flexible display is the study hotspot of each colleges and universities of recent domestic and research structure, and Ye Shi all big enterprises fall over each other the emphasis of layout.Various advanced manufacture craft and technology constantly progress, make flexible display not only screen size constantly increase, and display quality also improves constantly, Samsung, LG Deng great factory release flexible AMOLED(active matrix organic light-emitting diode (AMOLED) panel one after another) show model machine.Compared with regular display, flexible display has plurality of advantages: lightweight, volume is little, slimming, easy to carry; High-low temperature resistant, shock-resistant, shock resistance are stronger, and adaptable operational environment is wider; Rollable, profile has more the aesthetic feeling of Art Design; Adopt the coil type production technology of typography, cost is cheaper; Low in energy consumption, more energy-conservation; Organic material is environmental protection more.Flexible display is by flexible substrate material as device bearing substrate, and requires that electrode layer, TFT matrix, display device and encapsulated layer all have certain bending radius to realize flexibility.
At present, the production technology of Flexible Displays product is mainly divided into two classes: the first kind adopts R2R(roll to roll) production technology, namely directly display device is prepared on flexible substrates by the mode of printing, but owing to being subject to the restriction of printing technology and display ink material, the display device prepared does not reach the requirement of high accuracy display, and yields is low, poor reliability; Equations of The Second Kind adopts S2S(sheet to sheet) production technology, the method of rear stripping is first attached in conjunction with flexible base, board, first flexible base, board is attached on hard carrier substrate and prepares display device, hard substrate is peeled off again after having prepared display device, take out flexible display device, this technique does not affect the making precision of display device, and making apparatus and technique and the traditional TFT-LCD of making similar, too large adjustment need not be done, therefore apply closer to volume production in a short time.
Adopt S2S production technology to combine attaching the method making flexible display peeled off is way commonplace at present, but this method needs additionally to use bonding agent, and adhesive performance, attaching and stripping technology are required harsh, in whole manufacturing process bonding agent must by substrate and carrier firmly bonding, uniform ground attach bubble-free, stripping means on device performance without impact and peel off after bonding agent noresidue.The more important thing is that flexible substrate substrate must acid and alkali-resistance, organic solvent (solvent that all TFT engineerings are used), visible light transmissivity is high, and can tolerate TFT high-temperature technology, and other mechanicalnesses and stability all have higher requirement.
But existing S2S production technology is difficult to accomplish, when ensureing to have good cementability between carrier substrate and thin polymer film, can also easily be stripped down by thin polymer film, and bonding agent noresidue.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of flexible display and preparation method thereof, be intended to solve existing process for manufacturing flexible display and be difficult to ensure between carrier substrate and thin polymer film, to have the good cementability convenient problem peeled off again.
Technical scheme of the present invention is as follows:
A manufacture method for flexible display, wherein, comprises step:
A, surface treatment is carried out to carrier substrate zone line, make carrier substrate zone line be hydrophobicity;
B, at the even coated polymer solution of carrier substrate surface, then heating make it crosslinking curing, formed thin polymer film;
C, surface treatment is carried out to thin polymer film surrounding, increase the cementability of thin polymer film surrounding and carrier substrate;
D, form barrier layer, tft array layer, oled layer and encapsulated layer successively on the polymer film, then along line of cut flexible display cut from carrier substrate and strip down.
The manufacture method of described flexible display, wherein, in described steps A, specifically comprises the surface-treated step of carrier substrate zone line:
First mask process is carried out to the surrounding of carrier substrate, then adopt the zone line of fluoro-gas low temperature plasma bombardment carrier substrate.
The manufacture method of described flexible display, wherein, in described steps A, specifically comprises the surface-treated step of carrier substrate zone line:
First mask process is carried out to the surrounding of carrier substrate, then adopt the zone line of atmosphere low-temperature plasma bombardment carrier substrate, then add hydrophober at the zone line of carrier substrate.
The manufacture method of described flexible display, wherein, described hydrophober is dimethicone.
The manufacture method of described flexible display, wherein, in described step C, surface-treated step is carried out to thin polymer film surrounding and specifically comprises:
First mask process is carried out to the zone line of thin polymer film, then uv-exposure process is carried out to thin polymer film surrounding, make the cross-linking reaction of thin polymer film surrounding complete.
The manufacture method of described flexible display, wherein, in described step C, surface-treated step is carried out to thin polymer film surrounding and specifically comprises:
First mask process is carried out to the zone line of thin polymer film, then pulse microwave heat treated is carried out to thin polymer film surrounding, make thin polymer film surrounding high-temperature oxydation, improve the cementability of thin polymer film and carrier substrate.
The manufacture method of described flexible display, wherein, in described step C, barrier layer is the alternating structure that organic material/inorganic material is formed, or the alternating structure that inorganic material/inorganic material is formed.
The manufacture method of described flexible display, wherein, described organic material/inorganic material alternating structure is parylene/SiN
x/ parylene/SiN
x.
The manufacture method of described flexible display, wherein, described inorganic material/inorganic material alternating structure is SiN
x/ SiO
2/ SiN
x.
A kind of flexible display, wherein, adopts manufacture method as above to make.
Beneficial effect: the present invention is by adopting the mode of mask, in conjunction with the surface treatment to carrier substrate, thus make the zone line of carrier substrate be hydrophobicity, and surface treatment is carried out to the thin polymer film surrounding formed, make thin polymer film surrounding bonding with carrier substrate firmly, thin polymer film zone line then cementability is poor, namely ensure that make flexible display time there is good cementability, in turn ensure that after completing, easily from carrier substrate, display device is stripped down, the present invention is simultaneously without the need to using bonding agent, simplify device preparation technology, improve flexible base, board heat resistance, be suitable for making high-resolution flexible display.
Accompanying drawing explanation
Fig. 1 is the flow chart of the manufacture method preferred embodiment of a kind of flexible display of the present invention.
Fig. 2 carries out surface-treated schematic flow sheet to carrier substrate in manufacture method of the present invention.
Fig. 3 is the schematic flow sheet making thin polymer film in manufacture method of the present invention on carrier substrate.
Fig. 4 carries out surface-treated schematic flow sheet to thin polymer film in manufacture method of the present invention.
Fig. 5 is structural representation when forming barrier layer and encapsulated layer in manufacture method of the present invention on the polymer film.
Fig. 6 is the structural representation of the barrier layer in Fig. 5.
Fig. 7 is by structural representation when display device cutting and stripping in manufacture method of the present invention.
Fig. 8 is the structural representation of the flexible display of the top light emitting that manufacture method of the present invention finally obtains.
Fig. 9 is the structural representation of the flexible display of the bottom-emission that manufacture method of the present invention finally obtains.
Embodiment
The invention provides a kind of flexible display and preparation method thereof, for making object of the present invention, technical scheme and effect clearly, clearly, the present invention is described in more detail below.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Refer to Fig. 1, Fig. 1 is the flow chart of the manufacture method preferred embodiment of a kind of flexible display of the present invention, and as shown in the figure, it comprises step:
S1, surface treatment is carried out to carrier substrate zone line, make carrier substrate zone line be hydrophobicity;
S2, at the even coated polymer solution of carrier substrate surface, then heating make it crosslinking curing, formed thin polymer film;
S3, surface treatment is carried out to thin polymer film surrounding, increase the cementability of thin polymer film surrounding and carrier substrate;
S4, form barrier layer, tft array layer, oled layer and encapsulated layer successively on the polymer film, then along line of cut flexible display cut from carrier substrate and strip down.
In embodiments of the present invention, by carrying out surface treatment to carrier substrate zone line, carrier substrate zone line is made to be hydrophobicity, and then conveniently thin polymer film and carrier substrate are peeled off, again surface treatment is carried out to thin polymer film surrounding in addition, increase the cementability of thin polymer film surrounding and carrier substrate, in turn ensure that like this in manufacturing process, display device uniform ground bubble-free, so the manufacture craft of the embodiment of the present invention has taken into account cementability and easy fissility, simultaneously again without the need to using traditional bonding agent, so simplify manufacture craft, improve flexible base, board heat resistance.
Polymer in the embodiment of the present invention is easily preferably PI solution, PI material itself has higher glass transition temperature (Tg), higher material breakdown temperature (Td), coordinate TFT high temperature engineering, the tft array that manufacturability can be excellent, realize the flexible AMOLED display of high-resolution.
As the preferred embodiment of the present invention, in described step S1, the surface treatment step of carrier substrate zone line is specifically comprised:
As shown in Figure 2, first mask process (MASK1) is carried out to the surrounding of carrier substrate 100, then the zone line of fluoro-gas low temperature plasma bombardment carrier substrate 100 is adopted, bombardment time controls at 15 ~ 45min, such as 30min, thus the zone line on carrier substrate 100 surface forms hydrophobic surface 110.Mask process wherein refers to carries out covering treatment to selected region, thus makes follow-up processing procedure can only affect region beyond selected region, refers to the zone line on carrier substrate 100 outside mask process region at the present embodiment.
In the present embodiment, carrier substrate 100 is preferably display level electronic glass, on electronic glass surface, its hydrophilicity is from the alkali metal ion on surface, hydroxyl, the hydrolysis tendency of silicon dioxide and minute crack, and containing a large amount of active particles in fluoro-gas low temperature plasma, when bombarding glass surface, the chemical bond of the various groups of glass surface can be opened, thus form sputtering effect, the alkali metal ion of removing glass surface, the hydrophilic radical such as hydroxyl and silicon dioxide, thus reach and make the zone line of carrier substrate 100 be hydrophobic object, the cementability of such thin polymer film and hydrophobic surface is poor, be conducive to device to strip down from carrier substrate 100.
As the preferred embodiment of the present invention, in described step S1, the surface treatment step of carrier substrate zone line is comprised:
First mask process (MASK1) is carried out to the surrounding of carrier substrate 100, then the zone line of atmosphere low-temperature plasma bombardment carrier substrate 100 is adopted, bombardment time controls at 15 ~ 45min, such as 30min, add hydrophober at the zone line of carrier substrate 100 again, thus the zone line on carrier substrate 100 surface forms hydrophobic surface 110.Described hydrophober is dimethicone.
In the present embodiment, after utilizing atmosphere low-temperature plasma to bombard carrier substrate 100 surface, also add hydrophober, thus glass surface is reacted, generate hydrophobic film, to form hydrophobic surface.Hydrophober is wherein preferably dimethicone, under the effect of plasma, dimethicone chemical bond rupture generates methyl and another macromolecular radical, the two can react with the surface of electronic glass under the prerequisite of displacement hydroxyl, generate the hydrophobic film of one deck densification, strengthen the hydrophobicity of electronic glass zone line.
After surface treatment is carried out to the zone line of carrier substrate 100, as shown in Figure 3, then at whole carrier substrate 100 surface uniform coated polymer solution, such as PI solution, then be sent in high temperature oven, carry out high-temperature heating treatment, make polymer solution generation crosslinking curing, form thin polymer film 200 i.e. flexible substrate, the coating method of polymer solution can be spin-coating method (Spin), the methods such as knife coating (slit) or ink jet printing (inkjet printing), and control the thickness of polymer solution coating, the characterisitic parameter such as uniformity and surface roughness.In addition, nitrogen can be passed in high temperature oven, avoid at high temperature polymer solution and carrier substrate 100 that the performance that interfacial reaction affects thin polymer film 200 occurs.
Above-mentioned two embodiments are the surface treatments for carrier substrate 100, make thin polymer film 200 poor with the cementability of carrier substrate 100 zone line, in order to prevent thin polymer film 200 bonding insecure with carrier substrate 100 surrounding, embodiment to polymeric film surface process is provided below, to strengthen the cementability of thin polymer film surrounding and carrier substrate, prevent thin polymer film in subsequent technique process curling, the phenomenon such as to peel off.
As the preferred embodiment of the present invention, in described step S3, surface-treated step is carried out to thin polymer film surrounding and specifically comprises:
As shown in Figure 4, first mask process (MASK2) is carried out to the zone line of thin polymer film 200, then uv-exposure process is carried out to thin polymer film 200 surrounding, make the cross-linking reaction of thin polymer film 200 surrounding complete.The present embodiment carries out uv-exposure process to thin polymer film 200 surrounding, time for exposure controls at 10 ~ 30min, such as 20min, thus make the cross-linking reaction of thin polymer film 200 surrounding complete, organic polymer rearranges, and makes thin polymer film form polymer latex 210, promotes the state of cure of thin polymer film 200 further, strengthen thin polymer film 200 and the cementability of carrier substrate 100, make bonding evenly smooth, bubble-free.
As the preferred embodiment of the present invention, in described step S3, surface-treated step is carried out to thin polymer film surrounding and specifically comprises:
First mask process (MASK2) is carried out to the zone line of thin polymer film 200, again pulse microwave heat treated is carried out to thin polymer film 200 surrounding, make thin polymer film 200 surrounding high-temperature oxydation, temperature conditions controls at 250 ~ 450 DEG C, processing time controls at 1 ~ 3 hour, such as, process 2 hours under 300 DEG C of temperature conditions, to improve the cementability of thin polymer film 200 and carrier substrate 100.The present embodiment is the form utilizing pulse microwave to heat, thin polymer film 200 surrounding is carried out high temperature oxidation process, thus thin polymer film 200 surrounding and carrier substrate 100 interface are reacted, strengthen bonded energy, improve the cementability of thin polymer film 200 and carrier substrate 100.
Because the water oxygen permeability of thin polymer film 200 is high; to the stability of OLED and have a strong impact on useful life; so need to form barrier layer 300 on thin polymer film 200; as shown in Figure 5; with prevent water oxygen through, device is protected, as the preferred embodiment of the present invention; described barrier layer 300 is the alternating structure that organic material/inorganic material is formed, or the alternating structure that inorganic material/inorganic material is formed.Preferably, described organic material/inorganic material alternating structure is parylene/SiN
x/ parylene/SiN
x; Further, as shown in Figure 6, described inorganic material/inorganic material alternating structure is SiN
x(310)/SiO
2(320)/SiN
x(310).Then on barrier layer 300, making the tft array for driving flexible display device, such as Oxide-TFT, according to the difference of TFT technological temperature, needing the flexible substrate material selecting heat resistance different.Then each layer organic material of evaporation and electrode material, makes OLED display device, forms AMOLED layer 400 by tft array layer and oled layer, finally makes encapsulated layer 500, plays the impact of protection flexible display from steam, oxygen, dust and stress.
After above-mentioned element manufacturing completes, as shown in Figure 7, can be cut by flexible display along line of cut and strip down, wherein, preferably, line of cut be the corresponding zone line of carrier substrate water repellent region of thin polymer film and the line of demarcation of peripheral regions.Because carrier substrate 100 is poor with the cementability of the zone line of thin polymer film 200, so adopt mechanical system to be separated with carrier by device easily, simultaneously due to without the need to using bonding agent, simplify manufacture craft, also need not consider the residue problem of bonding agent, also improve flexible base, board heat resistance.
In addition, select the PI solution that light transmittance is different, also can be made into the flexible display of top emitting (top light emitting) as shown in Figure 8 or the flexible display of bottom emitting (bottom-emission) as shown in Figure 9, specifically can select as required to make dissimilar flexible display.
Based on said method, the present invention also provides a kind of flexible display, and it adopts described manufacture method to make.
In sum, the present invention is by adopting the mode of mask, in conjunction with the surface treatment to carrier substrate, thus make the zone line of carrier substrate be hydrophobicity, and surface treatment is carried out to the thin polymer film surrounding formed, make thin polymer film surrounding bonding with carrier substrate firmly, thin polymer film zone line then cementability is poor, namely ensure that make flexible display time there is good cementability, in turn ensure that after completing, easily from carrier substrate, display device is stripped down, the present invention is simultaneously without the need to using bonding agent, simplify device preparation technology, improve flexible base, board heat resistance, be suitable for making high-resolution flexible display.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to claims of the present invention.
Claims (10)
1. a manufacture method for flexible display, is characterized in that, comprises step:
A, surface treatment is carried out to carrier substrate zone line, make carrier substrate zone line be hydrophobicity;
B, at the even coated polymer solution of carrier substrate surface, then heating make it crosslinking curing, formed thin polymer film;
C, surface treatment is carried out to thin polymer film surrounding, increase the cementability of thin polymer film surrounding and carrier substrate;
D, form barrier layer, tft array layer, oled layer and encapsulated layer successively on the polymer film, then along line of cut flexible display cut from carrier substrate and strip down.
2. the manufacture method of flexible display according to claim 1, is characterized in that, in described steps A, specifically comprises the surface-treated step of carrier substrate zone line:
First mask process is carried out to the surrounding of carrier substrate, then adopt the zone line of fluoro-gas low temperature plasma bombardment carrier substrate.
3. the manufacture method of flexible display according to claim 1, is characterized in that, in described steps A, specifically comprises the surface-treated step of carrier substrate zone line:
First mask process is carried out to the surrounding of carrier substrate, then adopt the zone line of atmosphere low-temperature plasma bombardment carrier substrate, then add hydrophober at the zone line of carrier substrate.
4. the manufacture method of flexible display according to claim 3, is characterized in that, described hydrophober is dimethicone.
5. the manufacture method of flexible display according to claim 1, is characterized in that, in described step C, carries out surface-treated step specifically comprise thin polymer film surrounding:
First mask process is carried out to the zone line of thin polymer film, then uv-exposure process is carried out to thin polymer film surrounding, make the cross-linking reaction of thin polymer film surrounding complete.
6. the manufacture method of flexible display according to claim 1, is characterized in that, in described step C, carries out surface-treated step specifically comprise thin polymer film surrounding:
First mask process is carried out to the zone line of thin polymer film, then pulse microwave heat treated is carried out to thin polymer film surrounding, make thin polymer film surrounding high-temperature oxydation, improve the cementability of thin polymer film and carrier substrate.
7. the manufacture method of flexible display according to claim 1, is characterized in that, in described step C, barrier layer is the alternating structure that organic material/inorganic material is formed, or the alternating structure that inorganic material/inorganic material is formed.
8. the manufacture method of flexible display according to claim 7, is characterized in that, described organic material/inorganic material alternating structure is parylene/SiN
x/ parylene/SiN
x.
9. the manufacture method of flexible display according to claim 7, is characterized in that, described inorganic material/inorganic material alternating structure is SiN
x/ SiO
2/ SiN
x.
10. a flexible display, is characterized in that, adopts the manufacture method as described in any one of claim 1 to 9 to make.
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| US20230165048A1 (en) * | 2019-09-02 | 2023-05-25 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method of manufacturing display panel |
| US11917860B2 (en) * | 2019-09-02 | 2024-02-27 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method of manufacturing display panel |
| CN114824035A (en) * | 2021-01-19 | 2022-07-29 | 东莞市中麒光电技术有限公司 | LED display module and manufacturing method thereof |
| CN114824035B (en) * | 2021-01-19 | 2023-09-15 | 东莞市中麒光电技术有限公司 | LED display module and manufacturing method thereof |
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