CN105353847B - A kind of metal-polymer composite microstructure heat spreader structures towards CPU application - Google Patents
A kind of metal-polymer composite microstructure heat spreader structures towards CPU application Download PDFInfo
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- CN105353847B CN105353847B CN201510647156.3A CN201510647156A CN105353847B CN 105353847 B CN105353847 B CN 105353847B CN 201510647156 A CN201510647156 A CN 201510647156A CN 105353847 B CN105353847 B CN 105353847B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
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Abstract
A kind of metal-polymer composite microstructure heat spreader structures towards CPU application, which includes metal base plate, the radiating fin with micro-structure, metal side plate, metal medium plate, blower unit, fan；Metal base plate, metal side plate and metal medium plate are both provided with the rectangular channel of the fixed radiating fin with micro-structure.Radiation proof paint is coated with outside metal side plate, the effective influence for reducing cabinet inside component to cpu heat.Radiating fin with micro-structure effectively increases heat dissipation area and improves the radianting capacity of radiator, to improve heat dissipation performance.Blower unit can make the air into fin more uniform, improve heat convection ability.The temperature field of entire radiator can be made preferably to cooperate with speed field energy recirculation hole on recirculation hole and metal medium plate in metal side plate, to improve heat convection ability.The present invention can be effectively reduced cpu temperature and extend the CPU service life, and processing efficiency save the cost can be improved.
Description
Technical field
The present invention relates to the heat radiation structure design of CPU, specifically a kind of metal-polymer towards CPU application is compound micro-
The background technique of structured heat sink.
Background technique
Low cost can be produced in current market with keen competition, the cpu heat of high-performance effect ratio is related to enterprise
The final and decisive juncture of industry.Radiator is the important composition component of computer, and the quality of radiator heat-dissipation performance is related to that CPU's uses the longevity
Life.The CPU use of time generates certain heat, goes if heat is not to be released in time, and accumulation slowly, heat can rise, and cause
CPU component burns out or reduces the service life.The power of cpu chip was constantly increasing in recent years, and calorific value also exists
It is continuous to increase, and cpu chip will will constantly subtract towards miniaturization or miniaturization, the size of cpu chip
Small, function, concentration also will be improved constantly, therefore calorific value will constantly increase.Traditional radiator is
It is unable to satisfy high efficient heat exchanging, at low cost and heat exchange environment is more complicated and strict requirements.Present metal heat sink be all from
The structure and material for changing radiator or the volume for increasing radiator set out and carry out the optimization design of cpu heat, but existing
Metal heat sink be all greater than heat dissipation capacity there is heat conduction amount the problem of, and processing cost is high, low efficiency, now existing
Water-cooled radiator the problem of there is leakage and blockings, can not widely it apply in cpu heat field.It is well known that
In cpu heat, radiator can not be preferably only improved by improving the optimization etc. of the revolving speed and progress structure of fan
Performance, make the performance of radiator become worse instead sometimes.The bottom center region gas of common flat type cpu heat
The flow velocity of body is almost nil, therefore the radiator bottom that air cannot directly be contacted with CPU carries out heat convection, at this time in the area
Domain will will form high-temperature area, the final performance for influencing CPU.
Being compared based on the metal-polymer composite microstructure radiator of micro-structure radiator with conventional scale radiator is had
Higher heat transfer coefficient, higher heat transfer efficiency, higher heat flow, lower response time；At the same time, compared to by gold
Belong to the metal micro structure heat exchanger that material is fabricated, metal-polymer composite microstructure radiator needs less processing charges
With, the process-cycle is relatively short, processing efficiency is relatively high, and under same volume, quality is smaller.Metal-polymer is compound
Micro-structure radiator can quickly export heat, the polymer wing with micro-structure by the high thermal conductivity of metal
Heat can be quickly dispersed into air by piece.Since metal-polymer composite microstructure radiator is with so superior
Performance, therefore metal-polymer composite microstructure radiator is in the cpu chip of golf calorific value, it will it obtains extensively and practical
Utilization.
Summary of the invention
In view of the above-mentioned problems of the prior art, the present invention is from temperature field and speed field-synergy theory and heat conduction amount and dissipates
The principle that heat balances each other, which is set out, proposes a kind of perfect heat-dissipating, cpu heat structure high in machining efficiency, at low cost.
To achieve the goals above, the technical solution adopted by the present invention is that: it is a kind of towards CPU application metal-polymer
Composite microstructure radiator, the structure include metal base plate 1, the radiating fin 2 with micro-structure, metal medium plate 3 and metal side
Plate 4, the blower unit 5 being mounted on the radiating fin with micro-structure, fan 6；Metal medium plate 3 and metal side plate 4 are to solid
Surely the radiating fin 2 of micro-structure is had；Radiating fin 2 with micro-structure is mounted on metal base plate 1, and uses metal medium plate
3 and metal side plate 4 be fixed；Metal medium plate 3 and metal side plate 4 are fixed by welding on metal base plate 1；With micro-structure
Radiating fin 2 on blower unit 5 is installed；Fan 6 is mounted on blower unit 5.
Multiple rectangular channels 12 for installing metal medium plate, multiple for installing band are provided on the metal base plate 1
There are rectangular channel 13, the multiple rectangular channels 14 for being used to install metal side plate of the radiating fin of micro-structure；For installing metal medium plate
Rectangular channel 12 centre of metal base plate 1 is set, the rectangular channel 14 for installing metal side plate is arranged in the two of metal base plate 1
Side, the rectangular channel 13 for installing the radiating fin with micro-structure are arranged in the rectangular channel 12 for installing metal medium plate and use
Between the rectangular channel 14 of installation metal side plate；Above-mentioned three kinds of rectangular channels be uniformly arranged on entire metal base plate 1 and with it is whole
A metal base plate 1 uses integrated molding, and material is the highly heat-conductive materials such as aluminium or copper；The metal base plate 1 is rectangle
Plate.
The side metal side plate 4 is aluminum rectangular slab, and inside is provided with for installing with micro-structure radiating fin
Rectangular channel 42 in the metal side plate of piece, the rectangular channel 42 in metal side plate are evenly arranged in the side of metal side plate 4, through whole
A metal side plate 4, therefore the radiating fin 2 with micro-structure can be effectively fixed in the metal side plate, and can be effective
Improve the capacity of heat transmission of the CPU radiator structure.The outer surface of the metal side plate 4 is coated with radiation shielding coating, which applies
Material is anti-radiation insulation paint and has anti-radiation insulation effect, therefore the metal side plate for being coated with radiation shielding coating can be effective
Cabinet inside hot-air is reduced back to cpu heat inside and reduces influence of the internal component to cpu heat, thus effectively
The heat dissipation performance of ground raising cpu heat.
The metal medium plate 3 is aluminum rectangular slab, and two sides are provided with for the fixed radiating fin for having micro-structure
Rectangular channel 31 on the metal medium plate 3 of piece can effectively fix the radiating fin 2 with micro-structure, and can be effective
Improve the capacity of heat transmission of the CPU radiator structure.
The radiating fin 2 with micro-structure is metal-polymer composite construction, and intermediate portion is divided into copper or aluminium
The rectangular metal substrate 21 on micro-structure radiating fin of matter, the two sides of the radiating fin 2 with micro-structure be with
The polymer architecture 22 of micro-structure has been evenly arranged micro-structure 23 on each polymer architecture 22, and each radiating fin passes through microinjection
Assembling is prepared to reduce the thermal contact resistance of radiator in mould；The radiating fin 2 with micro-structure can be effective
Increase heat dissipation area and improve the radianting capacity of radiator, to reduce the usage amount of metal, while the cpu heat can be made
The heat conduction amount and heat dissipation amount phase equilibrium of structure.For the ease of installation, the bottom and the left and right sides of the radiating fin 2 with micro-structure
Micro-structure is all not provided with according to the shape for the rectangular channel arranged on metal base plate 1, metal side plate 4 and metal medium plate 3
23.Radiating fin 2 with micro-structure is pasted into metal base plate 1, metal side plate 4, metal medium plate 3 by heat conductive silica gel respectively
Together.
The blower unit 5 is the rectangle polymeric shells of end-cover-free, is evenly equipped with multiple deflectors 51, deflector
51 from the horizontal by tilt angle, the tilt angle deflector 51 consistent, described with angle when air-flow outflow fan 6
The air mobility status that cpu heat structure can effectively be improved keeps air the flowing to more evenly flowed out from fan 6 scattered
Inside hot device, the blower unit 5 is bolted in metal side plate 4.
The radiating fin 2 with micro-structure is evenly arranged with according to field-synergy theory with structured radiating fin
On to recirculation hole 24, can effectively improve the air mobility status of cpu heat inside configuration, so that entire heat dissipation
The temperature field of device is preferably cooperateed with speed field energy, the final effective heat dissipation performance for improving CPU radiator structure.It should be with knot
The centre for being uniformly arranged in the radiating fin 2 with micro-structure from top to bottom to recirculation hole 24 on the radiating fin of structure, makes
Obtaining the air inside cpu heat can preferably flow between a radiating fin 2 with micro-structure.
4 bottom of metal side plate be provided in multiple metal side plates to recirculation hole 41, can make in radiator
The hot-air in portion quickly flows out inside radiator；The metal side plate 4 can with enable from fan flow out air
Radiator bottom is reached, then recirculation hole 41 is flowed out from the metal side plate of metal side plate bottom, avoids air from dissipating
Two sides outflow, may finally effectively improve the heat-sinking capability of the heat spreader structures at the top of hot device.This uniformly sets recirculation hole
It sets in the place for not being disposed with rectangular channel, and its size, position and quantity are set by actual application.
The metal base plate 1 be provided with around directly being contacted with CPU on multiple metal base plates to recirculation hole 11,
The flow resistance of radiator bottom center region can be effectively reduced, to effectively improve the flow velocity of the regional air, changed
The mobility status of kind air, it is final to improve heat convection ability.This is uniformly arranged in recirculation hole and is not provided with rectangular channel
Place, and be located on the slightly big square of size ratio CPU.
A kind of metal-polymer composite microstructure heat spreader structures towards CPU application of the present invention are utilized
The principle of temperature field and speed field-synergy theory and heat conduction amount and the amount phase equilibrium that radiates is provided with the various raising CPU that are conducive to and radiates
The structure of device performance effectively raises the heat dissipation performance of cpu heat.The centre of radiating fin with micro-structure is gold
Belong to, two sides are that the polymer architecture with micro-structure is effectively increased heat dissipation area and improves radiance, and has micro- knot
It is provided among the radiating fin of structure to recirculation hole, effectively improves the mobility status of radiator inner air, outside is coated with
The metal side plate of anti-radiation insulation paint effectively reduces cabinet inside hot-air back to radiator inside and reduces in cabinet
Influence of the parts to radiator, the final heat dissipation performance for improving radiator.Metal side plate and metal medium plate and metal base plate
On the collaboration degree that can effectively improve velocity field and temperature field to recirculation hole.Radiating fin with micro-structure uses
Assembling is prepared in the mould of microinjection, improves production efficiency and reduces production cost.The present invention can reduce the work of CPU
Temperature, effectively extends the service life of CPU, while reducing the processing cost of cpu heat, increases economic efficiency.
Detailed description of the invention
Fig. 1 is the three-dimensional structure schematic diagram of structure of the invention
Fig. 2 is the structure chart of structure of the invention metal base plate
Fig. 3 is the main view of radiating fin of the structure of the invention with micro-structure
Fig. 4 is the top view of radiating fin of the structure of the invention with micro-structure
Fig. 5 is the left view of radiating fin of the structure of the invention with micro-structure
Fig. 6 is the main view of structure of the invention metal side plate
Fig. 7 is the top view of structure of the invention metal side plate
Fig. 8 is the structure chart of structure of the invention metal medium plate
Fig. 9 is the main view of structure of the invention blower unit
Figure 10 is the top view of structure of the invention blower unit
1, metal base plate in figure；2, with the radiating fin of micro-structure；3, metal medium plate；4, metal side plate；5, air inducing fills
It sets；6, fan；11, on metal base plate to recirculation hole, 12, the rectangular channel for installing metal medium plate；13, it is had for installing
The rectangular channel of micro-structure radiating fin；14, for installing the rectangular channel of metal side plate；21, on micro-structure radiating fin
Metal substrate；22, with the polymer architecture of micro-structure；23, micro-structure；24, on structured radiating fin to circulation
Hole；31, the rectangular channel on metal medium plate；41, in metal side plate to recirculation hole；42, the rectangular channel in metal side plate；51, it leads
Flowing plate.
Specific embodiment
A kind of metal-polymer composite microstructure radiator towards CPU can be used for the cooling of CPU, gold in the present embodiment
Category bottom plate 1 is the square structure base board of copper or aluminum, and a height of 795mm of length and width is provided with multiple for installing with micro-structure
Radiating fin rectangular channel 13, rectangular channel is having a size of 35mm2mmmm；Preferential rectangle slot number is 32, and is provided with more
A rectangular channel 14 for installing metal side plate and the rectangular channel 13 for installing metal medium plate, the size of the rectangular channel are
9mm3mmmm；With CPU directly contact place around be provided on multiple metal base plates to recirculation hole 11, metal base plate
On the diameter to recirculation hole 11 be 5mm, be evenly arranged on the square of size 3mm big ratio CPU.Metal base plate 1 passes through thermal conductive silicon
Rouge is pasted on CPU, and is fixed by screws on computer main board.The metal side plate 4 is the aluminium of size 75mm × 3mm
Matter substrate, a height of 52mm, it is 52mm × 2mm that one side, which has been evenly arranged length and width, and depth is the rectangular channel in the metal side plate of 1mm
42.The other side is coated with anti-radiation insulation paint, bottom be evenly provided in the metal side plate that multiple diameters are 5mm to circulation
Hole 41.The metal medium plate 3 is the aluminum substrate having a size of 79mm × 3mm, and a height of 52mm, two sides are arranged with length and width and are
52mm × 2mm, depth are rectangular channel 31 on the metal medium plate of 1mm.The middle section of the radiating fin 2 with micro-structure is
Rectangular slab having a size of 35mm × 1mm is with the metal substrate 21 on micro-structure radiating fin, a height of 52mm, two sides be with
The polymer architecture 22 of micro-structure, it is preferred that micro-structure 23 is triangular prism structure, and the bottom surface of triangular prism is that bottom edge side length is
The isosceles triangle of 0.5mm, a height of 1.2mm in bottom edge, a height of 50mm；For the ease of installation, the radiating fin 2 with micro-structure
Bottom and left and right ends be not provided with micro-structure, not the place of micro-structure be apart from bottom end 2mm and left and right ends 1mm
Place.It is 5mm to recirculation hole that the preferential middle part in the radiating fin with micro-structure is provided with diameter from top to down
24.The wind plant 5 is the rectangle polymeric shells of end-cover-free, and having a size of 79mm × 79mm × 10mm, wall thickness is
2mm, inside be evenly equipped with multiple deflectors 51, the quantity of preferential deflector is 16, the deflector 51 and level side
To at certain tilt angle, inclination angle is consistent with the angle of air flowed out from fan, and the preferential angular dimension is
50°.The size of deflector 51 is 75mm × 10mm × 2mm.
Claims (5)
1. a kind of metal-polymer composite microstructure radiator towards CPU application, it is characterised in that: the structure includes metal
Bottom plate (1), the radiating fin (2) with micro-structure, metal medium plate (3) and metal side plate (4) are mounted on dissipating with micro-structure
Blower unit (5), fan (6) on hot fin；Metal medium plate (3) and metal side plate (4) are to fixed dissipating with micro-structure
Hot fin (2)；Radiating fin (2) with micro-structure is mounted on metal base plate (1), and with metal medium plate (3) and metal
Side plate (4) is fixed；Metal medium plate (3) and metal side plate (4) are fixed by welding on metal base plate (1)；With micro- knot
Blower unit (5) are installed on the radiating fin (2) of structure；Fan (6) is mounted on blower unit (5)；
Multiple rectangular channels (12) for installing metal medium plate, multiple for installing band are provided on the metal base plate (1)
There are rectangular channel (13), the multiple rectangular channels (14) for being used to install metal side plate of the radiating fin of micro-structure；For installing metal
In the centre of metal base plate (1), the rectangular channel (14) for installing metal side plate is arranged in gold for rectangular channel (12) setting of middle plate
The two sides for belonging to bottom plate (1), for installing rectangular channel (13) setting for having the radiating fin of micro-structure for installing in metal
Between the rectangular channel (12) of plate and the rectangular channel (14) for being used to install metal side plate；Above-mentioned three kinds of rectangular channels are uniformly arranged in whole
Integrated molding is used on a metal base plate (1) and with entire metal base plate (1), material is the highly heat-conductive materials such as aluminium or copper；
The metal base plate (1) is rectangular slab；
The blower unit (5) is the rectangle polymeric shells of end-cover-free, is evenly equipped with multiple deflectors (51), deflector
(51) from the horizontal by tilt angle, the tilt angle water conservancy diversion consistent, described with angle when air-flow outflow fan (6)
Plate (51) can effectively improve the air mobility status of cpu heat structure, enable the air flowed out from fan (6) more evenly
Flow to inside radiator, the blower unit (5) is bolted on metal side plate (4)；
The radiating fin (2) with micro-structure is evenly provided with the structured heat dissipation of multiple bands according to field-synergy theory
On fin to recirculation hole (24), with can effectively improve CPU heat dissipation to recirculation hole (24) on structured radiating fin
The air mobility status of device inside configuration, so that the temperature field of entire radiator is preferably cooperateed with speed field energy, finally
The effective heat dissipation performance for improving CPU radiator structure；This on structured radiating fin to recirculation hole (24) from top to bottom
It is uniformly arranged in the centre of the radiating fin (2) with micro-structure, the air inside cpu heat is preferably existed
It is flowed between a radiating fin (2) with micro-structure.
2. a kind of metal-polymer composite microstructure radiator towards CPU application according to claim 1, feature
Be: described metal side plate (4) bottom be provided in multiple metal side plates to recirculation hole (41), can make in radiator
The hot-air in portion quickly flows out inside radiator；The metal side plate (4) can with make from fan flow out air
Radiator bottom can be reached, then from flowing out in the metal side plate of metal side plate bottom to recirculation hole (41), avoids air
Two sides are flowed out at the top of from radiator, may finally effectively improve the heat-sinking capability of the heat spreader structures；This is uniform to recirculation hole
The place for not being disposed with rectangular channel is set, and its size, position and quantity are set by actual application；
The metal base plate (1) be provided with around directly being contacted with CPU on multiple metal base plates to recirculation hole (11),
The flow resistance of radiator bottom center region can be effectively reduced, to effectively improve the flow velocity of the regional air, changed
The mobility status of kind air, it is final to improve heat convection ability；This is uniformly arranged in recirculation hole and is not provided with rectangular channel
Place, and be located on the slightly big square of size ratio CPU.
3. a kind of metal-polymer composite microstructure radiator towards CPU application according to claim 1, feature
Be: the metal side plate (4) is aluminum rectangular slab, and inside, which is provided with, has micro-structure radiating fin for installing
Rectangular channel (42) in metal side plate, the rectangular channel (42) in metal side plate are evenly arranged in the side of metal side plate (4), run through
Entire metal side plate (4), therefore the metal side plate can be effectively fixed the radiating fin (2) with micro-structure, and can be with
Effectively improve the capacity of heat transmission of the CPU radiator structure；The outer surface of the metal side plate (4) is coated with radiation shielding coating, should
Radiation shielding coating is anti-radiation insulation paint and has anti-radiation insulation effect, therefore the metal side plate for being coated with radiation shielding coating can
Effectively to reduce cabinet inside hot-air back to cpu heat inside and reduce influence of the internal component to cpu heat,
To effectively improve the heat dissipation performance of cpu heat.
4. a kind of metal-polymer composite microstructure radiator towards CPU application according to claim 1, feature
Be: the metal medium plate (3) is aluminum rectangular slab, and two sides are provided with for the fixed radiating fin for having micro-structure
Rectangular channel, can effectively fix the radiating fin (2) with micro-structure, and can effectively improve CPU heat dissipation knot
The capacity of heat transmission of structure.
5. a kind of metal-polymer composite microstructure radiator towards CPU application according to claim 1, feature
Be: the radiating fin (2) with micro-structure is metal-polymer composite construction, and intermediate portion is divided into copper or aluminium
The rectangular metal substrate (21) on micro-structure radiating fin of matter, the two sides of the radiating fin (2) with micro-structure are
Polymer architecture (22) with micro-structure has been evenly arranged micro-structure (23), each radiating fin on each polymer architecture (22)
It is prepared by being assembled in microinjection mould to reduce the thermal contact resistance of radiator；The radiating fin with micro-structure
(2) it can effectively increase heat dissipation area and improve the radianting capacity of radiator, to reduce the usage amount of metal, while can be with
Make the heat conduction amount and heat dissipation amount phase equilibrium of the cpu heat structure；For the ease of installation, the radiating fin (2) with micro-structure
Bottom and the left and right sides according to the shape of the rectangular channel arranged on metal base plate (1), metal side plate (4) and metal medium plate (3)
Shape is all not provided with micro-structure (23)；Radiating fin (2) with micro-structure respectively with metal base plate (1), metal side plate
(4), metal medium plate (3) is pasted together by heat conductive silica gel.
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| CN201510647156.3A CN105353847B (en) | 2015-10-08 | 2015-10-08 | A kind of metal-polymer composite microstructure heat spreader structures towards CPU application |
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| CN108007258A (en) * | 2017-10-18 | 2018-05-08 | 衢州学院 | The heat transfer of metal-containing polymer combined type micro-structure heat exchanger and forming method |
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| CN2643378Y (en) * | 2003-09-09 | 2004-09-22 | 珍通科技股份有限公司 | Flow guiding apparatus |
| CN100499983C (en) * | 2006-09-08 | 2009-06-10 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN101340799A (en) * | 2007-07-06 | 2009-01-07 | 北京航空航天大学 | Streamline shaped heat radiator for electronic equipment |
| CN101111143A (en) * | 2007-08-22 | 2008-01-23 | 上海阜康变频科技有限公司 | Compound energy-saving heat radiating device |
| CN202396128U (en) * | 2011-12-14 | 2012-08-22 | 河北冠泰铝材有限公司 | U-shaped embedded type radiator |
| CN203327467U (en) * | 2013-07-11 | 2013-12-04 | 酷码科技股份有限公司 | Heat-dissipating module |
| CN203775589U (en) * | 2014-03-13 | 2014-08-13 | 熊猫电子集团有限公司 | Novel fin cooling device |
| CN204227973U (en) * | 2014-11-12 | 2015-03-25 | 昆山海益博散热器有限公司 | Heat pipe radiating fin array radiator |
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