CN209710564U - A kind of new radiator - Google Patents
A kind of new radiator Download PDFInfo
- Publication number
- CN209710564U CN209710564U CN201822025567.0U CN201822025567U CN209710564U CN 209710564 U CN209710564 U CN 209710564U CN 201822025567 U CN201822025567 U CN 201822025567U CN 209710564 U CN209710564 U CN 209710564U
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- CN
- China
- Prior art keywords
- heat
- cooling fin
- radiation tooth
- graphene layer
- utility
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of new radiators, including cooling fin and pedestal, the cooling fin is fixed on the base, the heatsink upper surface is continuous radiation tooth, several layers graphene layer is coated on the radiation tooth, several heat-dissipating pipes are equipped in the cooling fin lower surface, each heat-dissipating pipe is arranged side by side；Have the characteristics that occupy little space, light-weight, heat utilization efficiency is high, structure is simple, good heat dissipation effect；The graphene layer of heatsink upper surface coating has excellent heating conduction, also there is the plasticity as organic plastics, and there are also special hot propertys, chemical stability, can widely be used on fever electronic equipment or device, it is easy to use, it is applied widely.
Description
Technical field
The utility model relates to heat sink technology fields, more particularly, to a kind of new radiator.
Background technique
Existing electronic product television set, laptop, mobile phone etc. need to install radiator structure to radiate,
It to ensure the normal operation of machine, prevents certain components from working and shortening the working life in high temperature, therefore exists to by electronics
The demand for the technology that the heat that product generates effectively is dissipated.If good radiating treatment cannot be carried out to electronic product in time,
It not only will affect the use of electronic product, but also security risk may occur, so just needing to carry out electronic product timely
Heat dissipation, have many radiators currently on the market, heat dissipation blower be such as added, but the way will increase the volume of product, and
And certain energy can be also consumed, also have paste heat dissipation film in high power device at present, the heat dissipation effect of the heat dissipation film in the market is not
Ideal and storage is inconvenient.
Existing market portioned product by heat dissipation film be added metal group material carry out heat conduction and heat radiation, especially copper and
Aluminium, although the thermal coefficient of copper is 398W/mK, weight is big, oxidizable etc. to limit its application, and the thermal coefficient of aluminium
For 237W/mK, it is difficult meet the needs of existing product is to heat conduction and heat radiation；Existing market portioned product also has by heat dissipation film
Natural graphite material is added and artificial synthesized graphite material carries out heat conduction and heat radiation, but its effect is all general.How heat dissipation is improved
Effect is a problem to be solved.
Utility model content
The main purpose of the utility model is to overcome above-mentioned shortcomings, provide a kind of new radiator.
The technical solution of the utility model are as follows: a kind of new radiator, including cooling fin and pedestal, the cooling fin are fixed
On pedestal, the heatsink upper surface is continuous radiation tooth, and several layers graphene layer is coated on the radiation tooth, described to dissipate
Several heat-dissipating pipes are equipped in backing lower surface, each heat-dissipating pipe is arranged side by side.
Further, the graphene layer with a thickness of 10-100 μm.
Further, the spacing between the radiation tooth is 0.01-0.2mm.
Further, the height of the radiation tooth is 0.1-2mm.
Compared with prior art, the utility model has the advantages that
1, new radiator provided by the utility model, heatsink upper surface are continuous radiation tooth, are coated on radiation tooth
Several layers graphene layer, the thermal coefficient of graphene layer are the several of the metal materials such as silver, copper, gold, aluminium up to 5300W/mK
Times, due to the excellent thermal coefficient of graphene, substantially increase the heat dissipation effect of radiator；And the utility model passes through surface
Graphene layer, enable graphene faster with air exchange heat, more good radiating efficiency, and performance is steady
It is fixed reliable, there is good flexility and high EMI shielding efficiency, meet European Union Rohs instruction, meet the nocuousness such as halogen-free
Content of material requirement；At the same time, cooling fin and pedestal can be not necessarily to post-processing with single injection-molded, it is easy to accomplish it is extensive,
Mass production.
2, in new radiator provided by the utility model, it is equipped with several heat-dissipating pipes in cooling fin lower surface, passes through
The setting of heat-dissipating pipe, not only increases surface area, is conducive to radiate, while multiple heat-dissipating pipes are arranged side by side, and can effectively improve scattered
The integral strength of backing simplifies structure, has saved cost compared to other setting heat dissipation channel, when hot-fluid flows through heat-dissipating pipe,
Rapid cooling can be achieved.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the new radiator of the utility model；
Description of symbols: 1 is cooling fin, and 11 be radiation tooth, and 12 be heat-dissipating pipe, and 2 be pedestal；
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The preferred embodiment of the utility model is described in detail with reference to the accompanying drawing, so that the advantages of the utility model
It is easier to be readily appreciated by one skilled in the art with feature, to make apparent define to the protection scope of the utility model.
Embodiment 1
Fig. 1 is the structural schematic diagram of the new radiator in the present embodiment, in conjunction with reference Fig. 1, a kind of new radiator, and packet
Including cooling fin 1 and pedestal 2, wherein cooling fin 1 is fixed on pedestal 2, and 1 upper surface of cooling fin is continuous radiation tooth 11,
In, the spacing between radiation tooth 11 is 0.01-0.2mm, and the height of radiation tooth 11 is 0.1-2mm, the density and height of radiation tooth
It can specifically be adjusted according to actual needs；On radiation tooth 11 coat several layers graphene layer, wherein graphene layer with a thickness of
10-100μm；Five heat-dissipating pipes 11 are equipped in 1 lower surface of cooling fin, each heat-dissipating pipe 11 is arranged side by side, in the present embodiment, heat dissipation
11 cross sectional shape of pipe is circle.
In the present embodiment, several layers graphene layer is coated on radiation tooth, because the thermal coefficient of graphene layer is up to 5300W/
MK, compared to other metal materials, heating conduction is more preferable, and graphene layer has good thermal diffusivity and is easy the effect of storage
Fruit；Compared to graphite material, then compensate for the surface strength caused by graphite material is low, be easy to fall off the deficiencies of, mechanicalness
It can be more preferable.
In the present embodiment, the setting of heat-dissipating pipe is not only increased surface area, and is radiated using free convection, is not needed
Increase additional fan, solve the cooling requirements of high heat electronic component using free convection, is conducive to radiate, while multiple
Heat-dissipating pipe is arranged side by side, and can effectively improve the integral strength of cooling fin, compared to other setting heat dissipation channel, simplifies structure,
Cost is saved, when hot-fluid flows through heat-dissipating pipe, it can be achieved that rapid cooling.
The present embodiment is preferred, and cooling fin 1 and pedestal 2 are integrated injection molding and form, and is not necessarily to post-processing, easy to accomplish big
Scale, mass production.
The present embodiment is preferred, cooling fin use aluminum alloy material, be substantially better than on heat dissipation performance aluminium die-casting material or
Ferrous material.
In use, the graphene layer coated on radiation tooth converts heat energy into infrared ray, and then by heat away, dissipate simultaneously
Heat pipe transfers heat in air, to achieve the purpose that radiator heat-dissipation.
New radiator provided in this embodiment has the characteristics that occupy little space, light-weight, heat utilization efficiency is high, structure
Simply, good heat dissipation effect.The graphene layer of heatsink upper surface coating has excellent heating conduction, also has as organic plastics
The same plasticity, and there are also special hot propertys, chemical stability, can widely be used in fever electronic equipment or device
It is easy to use on part, it is applied widely.
The above is only the preferred embodiments of the utility model, and therefore it does not limit the scope of the patent of the utility model, all
Equivalent structure or equivalent flow shift made based on the specification and figures of the utility model, is applied directly or indirectly in
Other related technical areas are also included in the patent protection scope of the utility model.
Claims (4)
1. a kind of new radiator, which is characterized in that including cooling fin (1) and pedestal (2), the cooling fin (1) is fixed on bottom
On seat (2), cooling fin (1) upper surface is continuous radiation tooth (11), coats several layers graphene layer on the radiation tooth,
Several heat-dissipating pipes (12) are equipped in cooling fin (1) lower surface, each heat-dissipating pipe (12) is arranged side by side.
2. new radiator according to claim 1, which is characterized in that the graphene layer with a thickness of 10-100 μm.
3. new radiator according to claim 1, which is characterized in that the spacing between the radiation tooth (11) is
0.01-0.2mm。
4. new radiator according to claim 1-3, which is characterized in that the height of the radiation tooth (11) is
0.1-2mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822025567.0U CN209710564U (en) | 2018-12-04 | 2018-12-04 | A kind of new radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822025567.0U CN209710564U (en) | 2018-12-04 | 2018-12-04 | A kind of new radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209710564U true CN209710564U (en) | 2019-11-29 |
Family
ID=68637089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822025567.0U Expired - Fee Related CN209710564U (en) | 2018-12-04 | 2018-12-04 | A kind of new radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209710564U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115415759A (en) * | 2022-09-09 | 2022-12-02 | 安徽艾格赛特电机科技有限公司 | Exciter rectifying ring radiating fin and processing method thereof |
-
2018
- 2018-12-04 CN CN201822025567.0U patent/CN209710564U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115415759A (en) * | 2022-09-09 | 2022-12-02 | 安徽艾格赛特电机科技有限公司 | Exciter rectifying ring radiating fin and processing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191129 Termination date: 20201204 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |