CN106793717B - Heat radiation structure and virtual reality product - Google Patents
Heat radiation structure and virtual reality product Download PDFInfo
- Publication number
- CN106793717B CN106793717B CN201710172927.7A CN201710172927A CN106793717B CN 106793717 B CN106793717 B CN 106793717B CN 201710172927 A CN201710172927 A CN 201710172927A CN 106793717 B CN106793717 B CN 106793717B
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- heat
- trapezoid
- heating component
- air duct
- heat conducting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat radiation structure and a virtual reality product, wherein the heat radiation structure comprises a trapezoid air duct arranged on a product shell, and a graphene heat conducting fin is arranged on the outer side of the trapezoid air duct; the heating component is arranged above the graphene heat conducting sheet; the graphene heat conducting strip is characterized by further comprising conductive foam arranged on the graphene heat conducting strip, wherein the conductive foam is arranged around the heating component, and a preset distance is reserved between the conductive foam and the heating component. The graphene heat conducting fin can rapidly transfer heat generated by the heating component to the trapezoid air channel, when air flows upwards along the trapezoid air channel, cold air is heated, the phenomenon of air convection enhancement can be formed through temperature difference, and the heat can be rapidly diffused along the trapezoid air channel, so that the heat of the trapezoid air channel can be rapidly diffused and discharged. The conductive foam is compressed to play a role in sealing the heating component from electromagnetic interference and static electricity of a human body, and structures such as radiating fins, shielding covers and the like are removed between the heating component and the radiating structure, so that contact thermal resistance in the heat transfer process is reduced.
Description
Technical Field
The invention relates to the technical field of virtual reality, in particular to a heat dissipation structure and a virtual reality product.
Background
The problem of heat dissipation is always a common problem of consumer electronics products, and for virtual reality products, the problem of heat dissipation is more plagued by the complex architecture, smaller space, larger power consumption. At present, many heat dissipation structures of virtual reality products mostly adopt the shield cover to encapsulate the heating element, and the clearance between shield cover and the heating element, shield cover and the fin is filled through the heat conduction gasket, thereby the heat that the heating element gives off carries out heat exchange with the external world through the fan and realizes the heat dissipation. The heat radiation of the virtual reality product is not facilitated because of more conductive media and large contact thermal resistance between the heating component and the radiating fin.
Disclosure of Invention
The invention aims to provide a heat dissipation structure so as to solve the defect that the heat dissipation effect of the heat dissipation structure of the existing virtual reality product is poor.
Therefore, the invention provides a heat dissipation structure which is arranged between a product shell and a heating component, wherein the heat dissipation structure comprises a trapezoid air duct arranged on the product shell, a graphene heat conducting sheet is arranged on the outer side of the trapezoid air duct, and the heating component is arranged above the graphene heat conducting sheet; the graphene heat conducting strip is characterized by further comprising conductive foam arranged on the graphene heat conducting strip, wherein the conductive foam is arranged around the heating component, and a preset distance is reserved between the conductive foam and the heating component.
The invention also provides a virtual reality product, which comprises the heat dissipation structure.
Compared with the prior art, the invention has the advantages and positive effects that: the invention provides a heat radiation structure and a virtual reality product, wherein the heat radiation structure is arranged between a product shell and a heating component, the heat radiation structure comprises a trapezoid air duct arranged on the product shell, a graphene heat conducting sheet is arranged on the outer side of the trapezoid air duct, and the heating component is arranged above the graphene heat conducting sheet; the graphene heat conducting strip is characterized by further comprising conductive foam arranged on the graphene heat conducting strip, wherein the conductive foam is arranged around the heating component, and a preset distance is reserved between the conductive foam and the heating component. The heating component is arranged above the graphene heat conducting sheet, and the graphene heat conducting sheet has extremely high heat conductivity and radiation coefficient, so that heat generated by the heating component can be rapidly transferred to the trapezoid air duct. The heat can be transferred to the outside of the product through the trapezoid air duct, and the trapezoid air duct radiates heat by virtue of natural convection in a natural cooling state; the air inlet is arranged below the trapezoid air duct, the air outlet is arranged above the trapezoid air duct, and air outside the trapezoid air duct flows to the upper side along the lower side of the trapezoid air duct; the trapezoid air duct has vertical gradient, and according to chimney effect, when air flows upwards along the trapezoid air duct, air is heated, can form the phenomenon that air convection strengthens through temperature difference for the air can diffuse very fast along the trapezoid air duct, thereby can be with the quick diffusion of the heat in trapezoid air duct discharge. In addition, the radiating structure avoids using the radiating hole to radiate heat, and the sealing of the cavity of the product can be realized by virtue of the trapezoid air duct, so that the effective dustproof effect can be realized. The heat radiation structure uses the conductive foam to replace the shielding cover used by the existing heat radiation structure, the weight of products can be reduced, the conductive foam plays a role of sealing the heating component from electromagnetic interference and static electricity of a human body through being compressed, and on the other hand, the conductive foam does not participate in heat conduction, so that the heat resistance of the heat radiation structure is reduced, and the effect of optimizing heat radiation is achieved.
Other features and advantages of the present invention will become apparent upon review of the detailed description of the invention in conjunction with the drawings.
Drawings
FIG. 1 is a schematic diagram of a heat dissipating structure according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a trapezoid air duct with a heat dissipation structure according to an embodiment of the present invention;
FIG. 3 is a schematic view of a trapezoid air duct with a heat dissipation structure according to an embodiment of the present invention;
FIG. 4 is a schematic view of a portion of a heat dissipating structure according to the present invention;
FIG. 5 is a schematic diagram of the heat-conducting foam compression front and rear structures of the heat dissipation structure of the present invention;
FIG. 6 is a schematic diagram of one embodiment of a virtual reality product of this invention;
fig. 7 is an exploded view of one embodiment of a virtual reality product of this invention.
Detailed Description
The following detailed description of the invention is provided in detail, with the understanding that the embodiments described herein are merely illustrative and explanatory of the invention and are not intended to limit the invention.
As shown in fig. 1-5, the heat dissipation structure of the present embodiment is disposed between the product housing 60 and the heat generating component 30, and the heat dissipation structure includes a trapezoidal air duct 10 disposed on the product housing 60, and a graphene heat conducting sheet 20 is disposed outside the trapezoidal air duct 10; the heat generating part 30 is disposed above the graphene heat conducting sheet 20; the graphene heat conducting strip comprises a graphene heat conducting strip 20, and is characterized by further comprising conductive foam 40 arranged on the graphene heat conducting strip 20, wherein the conductive foam 40 is arranged around the heat generating component 30, and a preset distance is reserved between the conductive foam 40 and the heat generating component 30. The predetermined distance may be design dependent, such as 0.1mm,0.5mm, etc.
The heat generating component 30 may be a main chip or a power chip, etc. that emits heat.
The heating part 30 is disposed above the graphene heat-conducting sheet 20, and the graphene heat-conducting sheet 20 has extremely high heat conductivity and emissivity, so that heat generated by the heating part 30 can be rapidly transferred to the trapezoid air duct 10. The heat can be transferred to the outside of the product through the trapezoid air duct 10, and the trapezoid air duct 10 radiates heat by virtue of natural convection in a natural cooling state; as shown in fig. 2 and 3, the lower part of the trapezoid air duct 10 is an air inlet, the upper part is an air outlet, and air flows to the upper part along the lower part of the trapezoid air duct 10; according to the chimney effect, when air flows upwards along the trapezoid air duct 10, the air is heated, and the phenomenon of air convection enhancement is formed by the temperature difference, so that the air can be quickly diffused along the trapezoid air duct 10, and the heat of the trapezoid air duct 10 can be quickly diffused and discharged. In addition, the radiating structure of the embodiment avoids using radiating holes to radiate heat, and sealing of the cavity of the product can be realized by virtue of the trapezoidal air duct 10, so that an effective dustproof effect can be realized. The heat dissipation structure of the embodiment uses the conductive foam 40 to replace the shielding cover used by the existing heat dissipation structure, so that the weight of a product can be reduced, the conductive foam 40 plays a role in sealing the heating component 30 from electromagnetic interference and static electricity of a human body through being compressed, and on the other hand, the conductive foam 40 does not participate in heat conduction, so that the thermal resistance of the heat dissipation structure is reduced, and the effect of optimizing heat dissipation is achieved; the conductive foam 40 and the heating component 30 are spaced at a predetermined distance, so that a certain compression space can be reserved for the conductive foam 40, and the conductive foam 40 can play a role in sealing and shielding. The heat dissipation structure and the heat generating component 30 of the present embodiment can eliminate the structures such as the heat sink and the shielding case, and can reduce the contact thermal resistance in the heat transfer process.
In summary, the heat dissipation structure of this embodiment can realize effectual heat dissipation, can play dustproof effect simultaneously, can also reduce product weight.
In some embodiments, the thickness of the conductive foam 40 is greater than the thickness of the heat-generating component 30. The thickness of the compressed conductive foam 40 is still greater than the height of the heating component 30 in the compressed state of the conductive foam 40 in the packaging process, so that a good sealing or packaging function can be achieved.
The missile foam 40 of some embodiments is annular, and the heating component 30 is located inside the conductive foam 40.
The upper and lower directions defined in this embodiment are determined by the view direction relationships shown in fig. 2 and 3, and are not limited to this embodiment, but are used to clearly reflect the air outlet and the air inlet of the trapezoidal air duct 10.
As shown in fig. 2 and 3, the trapezoidal duct 10 includes a boss 11 provided on the product housing 60 and connection portions 12 provided on both sides of the boss 11, and the boss 11 and the two connection portions 12 and part of the product housing 60 constitute a trapezoid.
The height of the trapezoid is 10mm-15mm, preferably 13mm, the height of the trapezoid corresponding to D in fig. 2.
The trapezium is isosceles trapezoid, the length of the upper bottom and the length of the lower bottom of the isosceles trapezoid respectively correspond to B and A in the figure 3, B is 1.5-2 times of A, and B is smaller than 100mm; according to the thermal cloud diagram in the thermal simulation of the product model, an effective heat dissipation area is formed within 50mm near the heat source, so that effective heat dissipation can be realized when the length B of the upper bottom of the trapezoid air duct 10 is smaller than 100mm.
The minimum included angle of the isosceles trapezoid is 50-60 degrees, and the minimum included angle of the isosceles trapezoid corresponds to alpha in fig. 3.
The area of the air outlet of the trapezoid air duct 10 is S, s=bd, and s=q/(7.4×10) according to the air duct design requirement -5 H×Δt 1.5 ) Wherein Q is the total heat dissipation capacity of the virtual reality product, H is the height of the virtual reality product, and Δt is the difference between the internal and external air temperatures of the virtual reality product.
The trapezoid air duct 10 of the embodiment is a symmetrical isosceles trapezoid, so that heat can be uniformly transferred and dispersed to the trapezoid air duct 1, uniformity and consistency of air flow can be guaranteed, air flow resistance is reduced, and air can uniformly and rapidly flow along the trapezoid air duct 10, so that heat can be more favorably diffused and discharged.
The trapezoidal duct 10 is integrally formed with the product housing 60.
The shape of the graphene heat conducting fin 20 is matched with that of the trapezoid air duct 10, so that heat transfer between the graphene heat conducting fin 20 and the trapezoid air duct 10 is more uniform and rapid, and heat conduction efficiency is improved.
The graphene heat conducting strip 20 is adhered to the outer side of the trapezoid air duct 10, in this embodiment, the graphene heat conducting strip 20 is adhered to the outer side of the protruding portion 11 of the trapezoid air duct 10, preferably, a positioning column (not shown in the figure) is arranged on the outer side of the protruding portion 11, and the graphene heat conducting strip 20 can be positioned, so that the graphene heat conducting strip 20 can be stably arranged on the outer side of the protruding portion 11.
A heat conducting silica gel 50 is arranged between the heating component 30 and the graphene heat conducting strip 20, the thickness of the heat conducting silica gel 50 is 0.4mm-0.6mm, and the thickness of the heat conducting silica gel 50 corresponds to C in fig. 1. The heating component 30 is connected with the graphene heat conducting strip 20 through the heat conducting silica gel 50, heat conduction is conducted between the heating component 30 and the graphene heat conducting strip 20 by means of the heat conducting silica gel 50, and compared with heat conduction conducted by means of air in the prior art, the heat conducting silica gel 50 can reduce contact thermal resistance between the heating component 30 and the graphene heat conducting strip 20, shortens a heat conduction path and improves heat conduction efficiency. The thickness of the heat conducting silica gel 50 is 0.4mm-0.6mm, preferably 0.5mm, which can meet the requirement of improving the heat conducting efficiency and the assembly requirement of the heat radiating structure.
The invention provides a virtual reality product, which comprises a heat dissipation structure of the embodiment, and fig. 6 and 7 are schematic structural diagrams of an embodiment of the virtual reality product of the invention, wherein the virtual reality product of the embodiment comprises a product front shell 70, a product outer shell 60, a product rear shell 80, a PCB board 90 and the heat dissipation structure of the embodiment, the product front shell 70 and the product outer shell 60 are arranged on the product rear shell 80, and the PCB board 90 is arranged above a heating component 30; the trapezoid air duct 10 is disposed on the product housing 60, and the trapezoid air duct 10 is located at a side close to the product rear case 80, a gap is formed between the trapezoid air duct 10 and the product rear case 80, and wind outside the virtual reality product can enter from the gap and flow along the trapezoid air duct 10. The virtual reality product of this embodiment has adopted the heat radiation structure of this embodiment to dispel the heat for the virtual reality product of this embodiment radiating effect is good, light in weight, has better dustproof efficiency.
In addition, the virtual reality product may also adopt other structures in fig. 1 to 7 described above.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be apparent to one skilled in the art that modifications may be made to the technical solutions described in the foregoing embodiments, or equivalents may be substituted for some of the technical features thereof; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.
Claims (10)
1. A heat dissipation structure provided between a product case and a heat generating component, characterized in that,
the heat dissipation structure comprises a trapezoid air duct arranged on the product shell, a graphene heat conducting sheet is arranged on the outer side of the trapezoid air duct, and the heating component is arranged above the graphene heat conducting sheet;
the graphene heat conducting strip is characterized by further comprising conductive foam arranged on the graphene heat conducting strip, wherein the conductive foam is arranged around the heating component, and a preset distance is reserved between the conductive foam and the heating component.
2. The heat dissipating structure of claim 1, wherein,
the thickness of the conductive foam is larger than that of the heating component.
3. The heat dissipating structure of claim 1,
the trapezoid air duct comprises a protruding portion arranged on the product shell and connecting portions arranged on two sides of the protruding portion, and the protruding portion, the two connecting portions and part of the product shell form a trapezoid.
4. The heat dissipating structure of claim 3 wherein,
the height of the trapezoid is 10mm-15mm.
5. The heat dissipating structure of claim 3 wherein,
the trapezoid is an isosceles trapezoid, the length of the upper bottom of the isosceles trapezoid is 1.5-2 times of the length of the lower bottom, and the length of the upper bottom is smaller than 100mm.
6. The heat dissipating structure of claim 1,
the trapezoid air duct and the product shell are integrally formed.
7. The heat dissipating structure of claim 1,
the graphene heat conducting fin is matched with the trapezoid air duct in shape.
8. The heat dissipating structure of claim 1,
the graphene heat conducting sheets are adhered to the outer side of the trapezoid air duct.
9. The heat dissipating structure of claim 1,
and heat conduction silica gel is arranged between the heating component and the graphene heat conduction sheet, and the thickness of the heat conduction silica gel is 0.4mm-0.6mm.
10. A virtual reality product is characterized in that,
the virtual reality product comprises a heat dissipating structure as claimed in any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710172927.7A CN106793717B (en) | 2017-03-22 | 2017-03-22 | Heat radiation structure and virtual reality product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710172927.7A CN106793717B (en) | 2017-03-22 | 2017-03-22 | Heat radiation structure and virtual reality product |
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| Publication Number | Publication Date |
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| CN106793717A CN106793717A (en) | 2017-05-31 |
| CN106793717B true CN106793717B (en) | 2023-07-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710172927.7A Active CN106793717B (en) | 2017-03-22 | 2017-03-22 | Heat radiation structure and virtual reality product |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109765995B (en) * | 2018-11-19 | 2022-02-22 | 国网浙江杭州市富阳区供电有限公司 | A safety cover that is used for mixed reality equipment of wear-type to resist magnetic interference |
| CN112715370A (en) * | 2020-12-29 | 2021-04-30 | 泌阳县夏南牛科技开发有限公司 | Device for heating for breeding of Xianan calf |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101150101A (en) * | 2007-10-23 | 2008-03-26 | 华为技术有限公司 | Integrated heat radiation method, system and corresponding heat radiation device |
| CN101990367A (en) * | 2009-08-06 | 2011-03-23 | 技嘉科技股份有限公司 | Adjustable hot air cover |
| CN206585887U (en) * | 2017-03-22 | 2017-10-24 | 歌尔科技有限公司 | A kind of radiator structure and virtual reality products |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7280359B2 (en) * | 2003-12-11 | 2007-10-09 | Matsushita Electric Industrial Co., Ltd. | Heat-radiating structure of electronic apparatus |
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2017
- 2017-03-22 CN CN201710172927.7A patent/CN106793717B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101150101A (en) * | 2007-10-23 | 2008-03-26 | 华为技术有限公司 | Integrated heat radiation method, system and corresponding heat radiation device |
| CN101990367A (en) * | 2009-08-06 | 2011-03-23 | 技嘉科技股份有限公司 | Adjustable hot air cover |
| CN206585887U (en) * | 2017-03-22 | 2017-10-24 | 歌尔科技有限公司 | A kind of radiator structure and virtual reality products |
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| CN106793717A (en) | 2017-05-31 |
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