CN105349820A - Copper-based electrical contact composite material and discharge plasma sintering process thereof - Google Patents
Copper-based electrical contact composite material and discharge plasma sintering process thereof Download PDFInfo
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- CN105349820A CN105349820A CN201510838724.8A CN201510838724A CN105349820A CN 105349820 A CN105349820 A CN 105349820A CN 201510838724 A CN201510838724 A CN 201510838724A CN 105349820 A CN105349820 A CN 105349820A
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- copper
- composite material
- lanthanum
- discharge plasma
- plasma sintering
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 50
- 239000010949 copper Substances 0.000 title claims abstract description 50
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 49
- 238000005245 sintering Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000002131 composite material Substances 0.000 title claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 41
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 25
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 25
- 238000002360 preparation method Methods 0.000 claims abstract description 20
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 15
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract description 13
- 238000000498 ball milling Methods 0.000 claims abstract description 12
- 239000000843 powder Substances 0.000 claims abstract description 12
- 239000012535 impurity Substances 0.000 claims abstract description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 32
- 238000007747 plating Methods 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 18
- 229910052759 nickel Inorganic materials 0.000 claims description 16
- QJWDYDSKKWMXSO-UHFFFAOYSA-N lanthanum Chemical compound [La].[La] QJWDYDSKKWMXSO-UHFFFAOYSA-N 0.000 claims description 14
- FQVNUZAZHHOJOH-UHFFFAOYSA-N copper lanthanum Chemical compound [Cu].[La] FQVNUZAZHHOJOH-UHFFFAOYSA-N 0.000 claims description 6
- 238000002791 soaking Methods 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- 229910000858 La alloy Inorganic materials 0.000 claims description 3
- 241000080590 Niso Species 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 claims description 3
- 235000012054 meals Nutrition 0.000 claims description 3
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims description 2
- 229940040526 anhydrous sodium acetate Drugs 0.000 claims description 2
- 238000000889 atomisation Methods 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims description 2
- -1 nickel salt Chemical class 0.000 claims description 2
- 239000001509 sodium citrate Substances 0.000 claims description 2
- 239000001488 sodium phosphate Substances 0.000 claims description 2
- 229910000162 sodium phosphate Inorganic materials 0.000 claims description 2
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 claims description 2
- 229940038773 trisodium citrate Drugs 0.000 claims description 2
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 11
- 229910052709 silver Inorganic materials 0.000 abstract description 10
- 239000004332 silver Substances 0.000 abstract description 10
- 230000003647 oxidation Effects 0.000 abstract description 9
- 238000007254 oxidation reaction Methods 0.000 abstract description 9
- 239000000956 alloy Substances 0.000 abstract description 2
- 230000003628 erosive effect Effects 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 abstract 1
- 239000002994 raw material Substances 0.000 abstract 1
- 230000004584 weight gain Effects 0.000 description 6
- 235000019786 weight gain Nutrition 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000011812 mixed powder Substances 0.000 description 5
- 230000004927 fusion Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 150000002910 rare earth metals Chemical class 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
Abstract
The invention relates to a copper-based electrical contact composite material for middle and low voltage appliance switches, in particular to a method for preparing the copper-based electrical contact composite material through a discharge plasma sintering process. The copper-based composite material is composed of, by weight, 0.5%-4% of bismuth, 0.05%-0.4% of lanthanum, 0.05%-0.3% of a carbon nano tube (nickelized), and the balance copper and unavoidable impurities. The copper-based composite material is prepared through the preparation method of alloy powder preparation, burdening, ball milling and discharge plasma sintering; the discharge plasma sintering process is adopted and has the characteristics of being high in heating speed, short in sintering time, high in density of an obtained material, good in property and the like, so that the discharge plasma sintering process is important to realizing material preparation with high quality, high efficiency, low consumption and low cost. The copper serves as a substrate, so that the main raw material is abundant in resource, and the electrical and thermal conductibility, electric erosive resistance, oxidation resistance and the like of the material are comparable to those of a silver-based electrical contact material, and the essential requirements of electrical contact and the like for the material by workpieces can be met.
Description
Technical field
The present invention relates to a kind of copper base electric contact composite material of mesolow electric switch, particularly adopt discharge plasma sintering process to prepare the novel method of copper base electric contact composite material.
Background technology
Light current contact member is the key part of instrument, plays an important role to life-span of instrument and working reliability, in order to ensure light current contact working reliability, generally adopts noble silver and alloy material thereof to make both at home and abroad.In recent years, in order to reduce the loss of silver metal, people constantly seek new joint silver, for silver-colored technological approaches.The most close with silver on the electricity of copper and thermal conductive property, so copper is as electro-conductive material, replace the most suitable element of silver, but as the major obstacle of contact material, copper is that copper-based material surface is easily oxidized under Atmospheric Condition, and its oxide compound (CuO and Cu
2o) there is very low specific conductivity, sharply increase the contact resistance of element, material is in use easily generated heat, directly affect working reliability and the life-span of electric switch, make copper and general copper alloy be difficult to apply as contact material.In addition, general copper alloy still can not meet the requirement of electrical contact member comprehensive electrochemical properties aspect.There is more serious problem of oxidation because of electrical contact surface in current existing copper-graphite composite conducting material, so its application is limited, and application of only succeeding in vacuum switch pilot circuit.Due to the switch force that low-tension switch is less, this makes the oxide film of electrical contact Surface Creation not easily be destroyed, and due to its existence, contact member conductivity is worsened.In addition, in present silver contact, the main cadmium metal that adds is as low melting point constituent element, and to improve the performances such as resistance fusion welding, but cadmium constituent element has very large toxicity, prohibits the use in the world.
At present, every employing powder metallurgic method prepares the preparation technology of matrix material, employing be cold sintering, warm-pressing sintering method, hot pressing sintering method etc.Above processing method sintering is consuming time longer, and production efficiency is low, and material property is subject to certain restriction.Discharge plasma sintering (SPS) is a kind of novel Fast Sintering technology that development in recent years is got up, this technology directly passes into pulsed current between pressurization powder particle, the plasma body produced instantaneously by spark discharge heats, utilize body to heat and surface active, realize supper-fast densification sintering.It is fast that this technique has heat-up rate, sintering time is short, uniform crystal particles, be conducive to controlling few sintering heterogeneous microstructure, obtain the features such as material density is high, performance is good, for preparing material that is high-quality and efficient, low consumption low cost, there is outstanding advantages and function.
Summary of the invention
The object of the present invention is to provide a kind of cheap, aboundresources, density are high, conductive and heat-conductive good, contact resistance is little and stable, oxidation-resistance and good mechanical properties the copper base electric contact composite material of easily processing preparation, with the silver-based electric contact material that fictitious hosts is high.Another object of the present invention is to provide the one of above-mentioned materials to prepare forming method fast, and make the material of preparation have better properties.
The present invention is realized by following measures:
Copper base electric contact composite material of the present invention is made up of the material of following weight percent: 0.5-4% bismuth, 0.05-0.4% lanthanum, 0.05-0.3% carbon nanotube (nickel plating), and all the other are copper and other inevitable impurity.
Copper base electric contact composite material of the present invention, it preferably consists of: 2% bismuth, 0.1% lanthanum, 0.1% carbon nanotube (nickel plating), and all the other are copper and other inevitable impurity.
A kind of copper base electric contact composite material discharge plasma sintering process of the present invention, its concrete steps are:
(1) first, atomization is adopted to be become by lanthanum lanthanum content to be the lanthanum-copper alloy powder of 0.1-0.4% with copper, according to described composition proportion, be that 100-200 object copper-lanthanum alloy powder, bismuth meal and nickel-plating carbon nanotube carries out ball milling and mix powder 3-7 hour by granularity, drum's speed of rotation is that per minute 200-400 turns;
(2) the above-mentioned powder mixed is put into mould and carry out discharge plasma sintering.Original pressure is 5-25MPa, and sintering temperature is 400-800 DEG C, and soaking time is 5-8min.Apply pressure when reaching predetermined temperature, dwell pressure is 10-50MPa, and temperature rise rate is 70-90 DEG C/min, samples after being cooled to 200 DEG C.In whole sintering process maintenance sintering chamber, low vacuum is in 10Pa.
In preparation method of the present invention, ball milling pellet used is agate ball, and ratio of grinding media to material is 15:1.
In preparation method of the present invention, nickel-plating carbon nanotube adopts chemically coated nickel method, and its concrete steps are: first carry out oxide treatment with 68% concentrated nitric acid to carbon nanotube, and the time is 10min; In the NaOH solution of 0.04g/mL, soak 10min again, temperature is 80 DEG C, filters washing; Successively carbon nanotube is inserted clear water subsequently and deionized water carries out ultrasonic cleaning, then use the NiSO of 0.053g/mL
4in soaking at room temperature 10min; After filtering washing, use KBH
4the Ni of reduction carbon nanotube adsorption
2+; Cleaned carbon nanotube is placed in plating solution 30min, and 200mL beaker selected by coating bath, is placed in electric-heated thermostatic water bath, and temperature is 80 DEG C, does not add stirring.
In preparation method of the present invention, consisting of of chemical nickel plating plating solution used: NiSO
46H
2o (single nickel salt) 0.0425g/mL, NaH
2pO
2h2O (inferior sodium phosphate) 0.028g/mL, NaC
6h
5o
72H
2o (Trisodium Citrate) 0.0625g/mL, NaAc (sodium acetate, anhydrous) 0.05g/mL, pH are 6.0-6.3.
The present invention selects copper as material matrix, and metallic copper is cheap compared with silver, and resource is abundanter, and the erosion of its electrical and thermal conductivity, resistance fusion welding, electric current and wear resistance all can match in excellence or beauty with silver, can meet the requirement of contact material matrix.Consider the composite request such as contact material mechanical property, integrated exposure electrical property, Rare Earth Lanthanum is added to improve antioxidant property in Copper substrate, add low melting point constituent element bismuth ablative with the anti-electric-arc improving material, with the addition of appropriate carbon nanotube, to improve the electrical properties such as the resistance fusion welding of material, and obtaining good mechanical property, this mainly utilizes carbon nanotube to have the features such as high strength, high-modulus and good electrical and thermal conductivity; Because the interface cohesion of carbon nanotube and copper is bad, and the combination of metallic nickel and metallic copper is good, and carbon nanotube nickel plating significantly improves the combination of metallic copper and carbon nanotube.
During copper base electric contact composite material of the present invention is mainly used in low electrical load the low-voltage apparatus such as power switch, rly., direct-current contactor, air switch in.The resistance fusion welding of material of the present invention can be strong, and oxidation resistent susceptibility, arc extinction performance are good, and wear resisting property is good, and electrical contact performance is close with silver-based electric contact material, is the cheaper alternative of silver alloy electrical contact material conventional in low Medium voltage switch or circuit breaker.Adopt above-mentioned matrix material prepared by discharge plasma sintering preparation method of the present invention, the density of material is high, and material has excellent electrical property and mechanical property, and preparation technology is simple, and preparation efficiency is high.
Embodiment
Embodiment 1:
The composition weight proportion of the present embodiment material is: 2% bismuth, 0.1% lanthanum, 0.1% carbon nanotube (nickel plating), and all the other are copper and other inevitable impurity.
According to composition and ratio and step of preparation process, first, Rare Earth Lanthanum is become with copper lanthanum content is 0.4%, granularity is 100-400 object copper-lanthanum alloy powder; Then add that granularity is 200 object bismuth meals, carbon nanotube (nickel plating), copper powder are made into required ratio and carry out ball milling mixing, Ball-milling Time is 3 hours, and rotating speed is 400 turns/min, the agate ball that ball milling pellet used is, ratio of grinding media to material is 15:1; Mix rear SPS-2040 agglomerating plant sinter molding, original pressure is 5MPa, and temperature rise rate is 80 DEG C/min, and sintering temperature is 600 DEG C, and soaking time is 6min.Apply pressure 50MPa when reaching top temperature, release when cooling to 400 DEG C, samples after being cooled to 200 DEG C.In sintering process maintenance stove, low vacuum is in 10Pa.Through above technological process, make copper base electric contact composite material.
This material fundamental property: density 98.70%; Specific conductivity 54.6%IACS; Hardness 52(HB); The oxidation weight gain 3.18mg/cm of 20h is oxidized under 400 DEG C of Atmospheric Conditions
2(fine copper be 5mg/cm
2).
Embodiment 2:
The composition weight proportion of the present embodiment material is: 2% bismuth, 0.1% lanthanum, 0.1% carbon nanotube (nickel plating), and all the other are copper and other inevitable impurity.
Carry out ball milling according to this composition and ratio and the same step of preparation process of embodiment 1 and parameter, mixed powder, discharge plasma sintering, its original pressure is 15MPa.Through above technological process, make copper base electric contact composite material.
This material fundamental property: density 97.25%; Specific conductivity 53.25%IACS; Hardness 48(HB); The oxidation weight gain 3.40mg/cm of 20h is oxidized under 400 DEG C of Atmospheric Conditions
2.
Embodiment 3:
The composition weight proportion of the present embodiment material is: 2% bismuth, 0.1% lanthanum, 0.1% carbon nanotube (nickel plating), and all the other are copper and other inevitable impurity.
Carry out ball milling according to this composition and ratio and the same step of preparation process of embodiment 1 and parameter, mixed powder, discharge plasma sintering, its original pressure is 25MPa.Through above technological process, make copper base electric contact composite material.
This material fundamental property: density 96.60%; Specific conductivity 51.00%IACS; Hardness 43(HB); The oxidation weight gain 3.63mg/cm of 20h is oxidized under 400 DEG C of Atmospheric Conditions
2.
Embodiment 4:
The composition weight proportion of the present embodiment material is: 2% bismuth, 0.1% lanthanum, 0.1% carbon nanotube (nickel plating), and all the other are copper and other inevitable impurity.
Carry out ball milling according to this composition and ratio and the same step of preparation process of embodiment 1 and parameter, mixed powder, discharge plasma sintering, its sintering temperature is 500 DEG C.Through above technological process, make copper base electric contact composite material.
This material fundamental property: density 99.10%; Specific conductivity 55.70%IACS; Hardness 56(HB); The oxidation weight gain 2.86mg/cm of 20h is oxidized under 400 DEG C of Atmospheric Conditions
2.
Embodiment 5:
The composition weight proportion of the present embodiment material is: 2% bismuth, 0.4% lanthanum, 0.1% carbon nanotube (nickel plating), and all the other are copper and other inevitable impurity.
Ball milling is carried out, mixed powder, discharge plasma sintering according to this composition and ratio and the same step of preparation process of embodiment 4 and parameter.Through above technological process, make copper base electric contact composite material.
This material fundamental property: density 98.30%; Specific conductivity 44%IACS; Hardness 58(HB); The oxidation weight gain 3.56mg/cm of 20h is oxidized under 400 DEG C of Atmospheric Conditions
2.
Embodiment 6:
The composition weight proportion of the present embodiment material is: 2% bismuth, 0.1% lanthanum, 0.3% carbon nanotube (nickel plating), and all the other are copper and other inevitable impurity.
Ball milling is carried out, mixed powder, discharge plasma sintering according to this composition and ratio and the same step of preparation process of embodiment 4 and parameter.Through above technological process, make copper base electric contact composite material.
This material fundamental property: density 97.68%; Specific conductivity 40%IACS; Hardness 55(HB); The oxidation weight gain 3.68mg/cm of 20h is oxidized under 400 DEG C of Atmospheric Conditions
2.
Claims (6)
1. a copper base electric contact composite material and discharge plasma sintering process thereof.
2. a kind of copper base electric contact composite material according to claim 1, is characterized in that the material composition of following weight percent: 0.5-4% bismuth, 0.05-0.4% lanthanum, 0.05-0.3% carbon nanotube (nickel plating), all the other are copper and other inevitable impurity.
3. a kind of copper base electric contact composite material according to claim 2, it preferably consists of: 2% bismuth, 0.1% lanthanum, 0.1% carbon nanotube (nickel plating), and all the other are copper and other inevitable impurity.
4. a kind of copper base electric contact composite material and vacuum hot-pressing process thereof according to claim 1, is characterized in that adopting following steps:
(1) first, atomization is adopted to be become by lanthanum lanthanum content to be the lanthanum-copper alloy powder of 0.1-0.4% with copper, according to described composition proportion, be that 100-300 object copper-lanthanum alloy powder, bismuth meal and nickel-plating carbon nanotube carries out ball milling and mix powder 3-7 hour by granularity, drum's speed of rotation is that per minute 200-400 turns;
(2) the above-mentioned powder mixed is put into mould and carry out discharge plasma sintering; Original pressure is 5-25MPa, and sintering temperature is 400-800 DEG C, and soaking time is 5-8min; Apply pressure when reaching predetermined temperature, dwell pressure is 10-50MPa, and temperature rise rate is 70-90 DEG C/min, samples after being cooled to 200 DEG C; In whole sintering process maintenance sintering chamber, low vacuum is in 10Pa.
5. preparation method according to claim 4, is characterized in that in step (1), and nickel-plating carbon nanotube plating solution used consists of: NiSO
46H
2o (single nickel salt) 0.0425g/mL, NaH
2pO
2h2O (inferior sodium phosphate) 0.028g/mL, NaC
6h
5o
72H
2o (Trisodium Citrate) 0.0625g/mL, NaAc (sodium acetate, anhydrous) 0.05g/mL, pH are 6.0-6.3.
6. preparation method according to claim 4, is characterized in that in step (2), and optimum sintering process parameter is: original pressure is 5MPa, and sintering temperature is 500 DEG C, and soaking time is 6min, and dwell pressure is 50MPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510838724.8A CN105349820A (en) | 2015-11-27 | 2015-11-27 | Copper-based electrical contact composite material and discharge plasma sintering process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510838724.8A CN105349820A (en) | 2015-11-27 | 2015-11-27 | Copper-based electrical contact composite material and discharge plasma sintering process thereof |
Publications (1)
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|---|---|
| CN105349820A true CN105349820A (en) | 2016-02-24 |
Family
ID=55325879
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|---|---|---|---|
| CN201510838724.8A Pending CN105349820A (en) | 2015-11-27 | 2015-11-27 | Copper-based electrical contact composite material and discharge plasma sintering process thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106282628A (en) * | 2016-08-31 | 2017-01-04 | 北京理工大学 | A kind of preparation method of carbon nanotube reinforced copper-base composite material |
| CN107653387A (en) * | 2017-10-09 | 2018-02-02 | 常州帝君金属构件厂 | A kind of preparation method of light current copper-based electric contact material |
| CN109822095A (en) * | 2019-04-04 | 2019-05-31 | 哈尔滨工程大学 | Shape memory alloy particles enhance Cu-base composites and preparation method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104988438A (en) * | 2015-07-24 | 2015-10-21 | 湖北工业大学 | High-strength and high-conductivity carbon nano tube strengthening copper-based composite material and preparing method thereof |
-
2015
- 2015-11-27 CN CN201510838724.8A patent/CN105349820A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104988438A (en) * | 2015-07-24 | 2015-10-21 | 湖北工业大学 | High-strength and high-conductivity carbon nano tube strengthening copper-based composite material and preparing method thereof |
Non-Patent Citations (2)
| Title |
|---|
| CHU ET AL.: ""Thermal Properties of Carbon Nanotube-Copper Composites for Thermal Management Applications"", 《NANOSCALE RES LETT》 * |
| 郭忠全 等: ""纳米碳管增强铜基电接触材料制备的优化设计"", 《电子元件与材料》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106282628A (en) * | 2016-08-31 | 2017-01-04 | 北京理工大学 | A kind of preparation method of carbon nanotube reinforced copper-base composite material |
| CN107653387A (en) * | 2017-10-09 | 2018-02-02 | 常州帝君金属构件厂 | A kind of preparation method of light current copper-based electric contact material |
| CN109822095A (en) * | 2019-04-04 | 2019-05-31 | 哈尔滨工程大学 | Shape memory alloy particles enhance Cu-base composites and preparation method |
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Application publication date: 20160224 |