CN105283289A

CN105283289A - Resin-molding die and resin-molding device

Info

Publication number: CN105283289A
Application number: CN201480033965.9A
Authority: CN
Inventors: 川口诚; 田岛真也; 中岛谦二
Original assignee: Yamada Most Advanced Science & Technology Co Ltd
Current assignee: Yamada Most Advanced Science & Technology Co Ltd; Apic Yamada Corp
Priority date: 2013-06-14
Filing date: 2014-04-25
Publication date: 2016-01-27
Anticipated expiration: 2034-04-25
Also published as: CN105283289B; KR20160021240A; SG11201508701YA; JP6062810B2; TWI593538B; KR20210011070A; KR102208459B1; KR102301482B1; WO2014199733A1; JP2015000520A; TW201446458A

Abstract

The present invention addresses the problem of providing a resin-molding die that allows clamping without exerting excessive stress on the workpiece, regardless of the existence and magnitude of variations in the thickness of the workpiece. As a means for solving the problem, the height of a workpiece support (37) is adjusted by a thickness-varying mechanism to match the thickness of a substrate (1), and the height of a cavity recess (32) is adjusted by a cavity-height-varying mechanism to match the height of a semiconductor chip (5) before molding resin is injected into the cavity.

Description

Resin moulded module and resin molding apparatus

Technical field

Carry out resin moulded resin molding apparatus with the present invention relates to holding workpiece.

Background technology

Applicant in this case has proposed a kind of transmission building mortion like this: when carrying out resin seal to slim semiconductor device, carry out the gauge in Blister pack portion according to sought thickness, the thin encapsulation body that there is not the non-fill area of resin can be produced in batches.

Specifically, under remain at die cavity block the state having retreated the retreating position of predetermined thickness from the gauge of formed products, utilize fixture to clamp the workpiece being moved to molding die, under the state that this holder workpiece, make plunger work, in die cavity recess, fill molten resin and maintain the 1st maintenance pressure.After potting resin, die cavity block is released to the shaping position corresponding with the gauge of formed products further in die cavity recess, residual resin in this die cavity recess is returned to the thruster of supply cylinder from cast gate, thus is adjusted to the amount of resin matched with the gauge of sought formed products.In addition, make plunger task again, under the state that maintain the 2nd maintenance pressure higher than the 1st maintenance pressure, make sealing resin be heating and curing (patent document 1).

Prior art document

Patent document

Patent document 1: Japanese Unexamined Patent Publication 2009-190400 publication

Summary of the invention

the problem that invention will solve

But, in the molding die used in above-mentioned patent document 1, utilization is movably provided with the patrix of patrix inserts and carrys out holding workpiece for the counterdie of the rigid structure loading workpiece (substrate etc.), therefore, such as no problem as single layer substrate, the deviation of thickness is less at workpiece, but when the deviation of thickness as multiple substrate is larger, chucking power between fixture and substrate produces deviation, moulded resin can produce burr, and shaping quality likely reduces.

Such as, at the goods making workpiece be shaped from moulded resin exposure, have in the goods of radiating part specifically, likely cause shaping quality to reduce by resin burr.

In addition, when strengthening mold clamp force for suppressing resin burr, nip stress that can be excessive to workpiece effect, workpiece is damaged or damage likely.In addition, when goods in slimmings such as memories, forming thickness can be subject to the impact of thickness of workpiece, there is the situation being difficult to forming thickness is shaped equably.

Whether the present invention solves the problem of above-mentioned conventional art, provide the thickness of no matter workpiece to have deviation, partially extent how can not both to the workpiece effect excessive stress ground resin moulded module that clamps and utilize this resin moulded module to make matched moulds balance and stability and do not produce the resin molding apparatus that improve shaping quality of burr.

for the scheme of dealing with problems

The present invention in order to achieve the above object, has following structure.

Namely, a kind of resin moulded module, it is characterized in that, this resin moulded module is used for carrying out resin moulded to the workpiece being equipped with second component at the first component, wherein, this resin moulded module comprises: a mould, and it utilizes the die cavity block forming mold cavity bottoms and the first inserts surrounding this die cavity block ground configuration to form die cavity recess, and this die cavity recess is configured for the die cavity holding described second component; Another mould, it comprises work mounting s portion for supporting described workpiece and second inserts adjacent with described work mounting s portion; Supply cylinder and plunger, this supply cylinder and plunger are assembled in any one in a described mould and another mould, for supplying moulded resin; Die cavity alterable height mechanism, it moves along mould opening and closing direction by making described die cavity block, correspondingly changes the height of described die cavity recess with the height of described second component; And thickness of slab changeable mechanism, it moves along mould opening and closing direction relative to described second inserts by making described work mounting s portion, the height in described work mounting s portion is correspondingly changed with the thickness of described first component, before injecting described moulded resin to described die cavity, correspondingly utilize described thickness of slab changeable mechanism to adjust the height in described work mounting s portion with the thickness of described first component, and correspondingly utilize the height of die cavity recess described in the institutional adjustment of described die cavity alterable height with the height of described second component.

Adopt above-mentioned resin moulded module, the size of the departure of deviation, thickness of workpiece whether is had regardless of the thickness on mould opening and closing direction for all workpiece (the first component, second component), owing to adjusting the height in work mounting s portion and die cavity recess, therefore, can not both matched moulds balance and stability be made to the excessive stress of workpiece effect and prevent resin burr burr.

In addition, also can be that described die cavity alterable height mechanism is provided with cotter mechanism, this cotter mechanism utilizes drive source to make movable ramp blocks move and regulate the position on the mould opening and closing direction of described die cavity block.

In this case, due to the position control high precision int on the mould opening and closing direction of die cavity block can be made, therefore, it is possible to reduce the stress acted on workpiece (second component) when clamping mould as much as possible, high-precision shaping quality can be maintained.

In addition, also can be that, in described die cavity alterable height mechanism, the one in described die cavity block and described first inserts or both floating supports are in the die sleeve of a described mould.

In this case, by the amount of floating along with mould on-off action adjustment die cavity block and/or the first inserts, the degree of depth (from substrate to the height of die cavity block) of die cavity can be changed instantaneously.Particularly, even if the height and position apart from the first component of second component exists deviation, the floating structure of die cavity block and/or the first inserts also can be utilized to absorb differing from of resin capacity and carry out resin moulded.

In addition, also can be that described thickness of slab changeable mechanism is provided with cotter mechanism, this cotter mechanism utilizes drive source to make movable ramp blocks move and regulate the position on the mould opening and closing direction in described work mounting s portion.

In this case, due to the position control high precision int on the mould opening and closing direction in work mounting s portion can be made, therefore, it is possible to reduce the stress acted on workpiece (the first component) when clamping mould as much as possible, high-precision shaping quality can be maintained.

Further preferably, be provided with illusory die cavity at the clamping face of described first inserts, hold described residual resin from described die cavity recess to described illusory die cavity.

Thereby, it is possible to will wash away to illusory die cavity being filled into the space produced in the moulded resin of die cavity recess and promoting shaping quality.It is possible to be lifted at the resin filling carried out when underfill is molded especially.

In addition, also can be possess closed block at described first inserts in the position than described illusory die cavity outer circumferential side side, this closed block stops discharging air by the pressing clamping face relative with this closed block.

In this case, can utilize on the opportunity expected closed block stop from pressure reduction space discharge air and prevent that resin from leaking from illusory die cavity, resin in die cavity do not fill.

Preferably, possess the mechanism of decompressor, before a described mould and another mould mold closing, this mechanism of decompressor forms the enclosure space cut off with space outerpace, by decompression in this enclosure space is formed the pressure reduction space comprising described die cavity.

Thus, the air remained in die cavity is discharged, is difficult to produce space in moulded resin.

In addition, also can be, possesses intermediate plate, the resin stream that this intermediate plate is formed with the through hole for holding described second component and is communicated with this through hole, and described in being superimposed on across the gap be supported between the first component peripheral end in described work mounting s portion and described second inserts, another mould clamping face uses.

In this case, first component (such as substrate) does not need the gold-plated of liner, even if use filler fine and the moulded resin that low viscous mobility is higher, also need not worry that moulded resin leaks into the gap between the first component and mould and causes the slip of mould bad.

In addition, also can be that described in the ratio of described intermediate plate, the position of the first component outer circumferential side side is provided with illusory die cavity, holds described residual resin from described through hole to described illusory die cavity.In this case, when the position than the first component outer circumferential side side forms illusory die cavity, the acquisition number of the formed products on the first component (such as substrate) can be increased and promote the utilization rate of substrate.

In addition, when forming illusory die cavity in the through hole of through intermediate plate, useless resin becomes the easy demoulding.

In addition, also can be, possess inclining rotary mechanism, the guiding face of the directed block of this inclining rotary mechanism guided, described die cavity block can be made to fascinate, and the side that the guiding of this guide stopper face and described die cavity block same is connected to the workpiece bearing surface of described second component contrary is oppositely disposed.

Thus, even if the second component (such as semiconductor chip) being equipped on the first component (such as substrate) produces, also can not across mold release film and die cavity block Partial Touching, die cavity block is imitated the inclination of second component and fascinates, therefore, can not to the stress of second component overaction, second component can not damage or breakage.

In addition, the described second component press surface of described die cavity block also can be formed as convex surface part, and the surrounding of this convex surface part is formed as the male and fomale(M&F) being formed with concave part.

In this case, the convex surface part of such as die cavity block can be utilized to press the light-emitting area of semiconductor chip and make it expose, fill the lower silicones (white resin) of viscosity to the concave part surrounded around it and utilize molded the shaping expeditiously of transmission to surround the reflector of light-emitting area.

In addition, when possessing the described mould clamping face the mold release film of absorption maintenance that cover and comprise described die cavity recess, moulded resin can not directly be contacted with die cavity recess, safeguards, and can prevent resin leakage therefore, it is possible to alleviate mould.In addition, be connected to workpiece by the die cavity block forming mold cavity bottoms across mold release film, workpiece surface damage can be prevented.

In addition, the feature of resin molding apparatus is, possesses any one resin moulded module aforesaid, and comprise Workpiece supply portion, described resin moulded module holding workpiece is utilized to carry out resin moulded pressure portion, and the incorporating section of formed products, before injecting described moulded resin to described die cavity, the actuating quantity of described die cavity alterable height mechanism is correspondingly being set with the thickness of described first component and the height of described second component, after height and position on the mould opening and closing direction of described die cavity block is set in precalculated position, carry out resin moulded with clamping described first component.

Adopting above-mentioned resin molding apparatus, can reducing as much as possible when clamping resin moulded module as the first component of workpiece, the stress of second component effect.

Also can be adjacent to be provided with liquid resin supply unit with described pressure portion, supply nozzle be retreated and moves and supply liquid resin in the supply cylinder of the molding die of the die sinking at place of described pressure portion.In this case, the underfill transmitting the semiconductor chip that the molded liquid resinous flip-over type realizing have employed low-viscosity epoxy class is installed can be utilized to be molded, or the shaping quality of the LED, reflector etc. that are made up of the silicones that viscosity is lower can be improved and seek long lifetime.

In addition, being not limited to liquid resin, also can be compressing tablet resin.

the effect of invention

Adopt above-mentioned the present invention, a kind of thickness of no matter workpiece can be provided whether to have deviation, deviation size how to the resin moulded module of the excessive stress ground holding workpiece of workpiece effect, this resin moulded module can not both be utilized to provide a kind of matched moulds balance and stability and do not produce the resin molding apparatus that improve shaping quality of resin burr.

Accompanying drawing explanation

Fig. 1 is the layout structure figure of the resin molding apparatus of embodiment 1.

Fig. 2 A and Fig. 2 B is the die cut view of the shaping actions of the molding die that embodiment 1 is described.

Fig. 3 C and Fig. 3 D is the die cut view of the shaping actions of the molding die that the then shaping actions shown in Fig. 2 A and Fig. 2 B is described.

Fig. 4 E is the die cut view of the shaping actions of the molding die that the then shaping actions shown in Fig. 3 C and Fig. 3 D is described.

Fig. 5 A and Fig. 5 B is the die cut view of the shaping actions of the molding die that embodiment 2 is described.

Fig. 6 A and Fig. 6 B is the die cut view of the shaping actions of the molding die that embodiment 3 is described.

Fig. 7 A and Fig. 7 B is the die cut view of the shaping actions of the molding die that embodiment 4 is described.

Fig. 8 A ~ Fig. 8 C is the die cut view of the shaping actions of the molding die that embodiment 5 is described.

Fig. 9 A ~ Fig. 9 C is the die cut view of the shaping actions of the molding die that embodiment 6 is described.

Figure 10 is the layout structure figure of the resin molding apparatus of embodiment 7.

Figure 11 A ~ Figure 11 C is the die cut view of the liquid resin supply action of the molding die that embodiment 7 is described.

Detailed description of the invention

Below, together the preferably embodiment of resin molding apparatus of the present invention is described in detail with accompanying drawing.In the following embodiments, illustratively illustrate that employing is formed with die cavity recess in patrix side and is formed with the transmission building mortion of the molding die of supply cylinder in counterdie side.In addition, in transmission building mortion, counterdie is set to moveable die, patrix is set to fixed mould to be described.

[embodiment 1]

As shown in Figure 1, the resin molding apparatus of present embodiment comprise Workpiece supply portion A, for the preheating part B of pre-heated work pieces, for carrying out resin moulded pressure portion C to workpiece, resin moulded after formed products incorporating section D and conveying mechanism E.Pressure portion C possesses pressure apparatus, and this pressure apparatus is provided with and carries out resin moulded molding die for holding workpiece.Conveying mechanism E plays and moves into workpiece to pressure portion C, take out of the conveying effect of formed products from pressure portion C.

(Workpiece supply portion A)

In FIG, Workpiece supply portion A possesses the accumulator for receiving magazine, and this magazine is accommodated with the substrate (lead frame, resin substrate etc.) 1 being formed as such as rectangular shape.Such as setting table 2 is arranged in Face to face in the mode of two group by the substrate 1 that push rod is released from each magazine.In addition, also can utilize push rod that substrate 1 is rearranged in turntable Face to face from magazine, and substrate 1 is transplanted on setting table 2 from this turntable, this magazine is to be accommodated with this substrate 1 by the mode of aliging with being oriented a direction of substrate 1.

In the side of setting table 2, be provided with the compressing tablet supply unit 4 for supplying flake 3 matchingly with the planar configuration of the supply cylinder of molding die.The substrate 1 of setting table 2 is kept by conveying mechanism E described later (loading machine 16) and transfers to preheating part B.In addition, the flake 3 of compressing tablet supply unit 4 is loaded machine 16 and keeps and transfer to pressure portion C.

Be equivalent to " the first component " of the present invention and the substrate 1 being formed as such as rectangular shape installed the goods (reference Fig. 2 B) that (flip-over type installations, wire-bonded installation etc.) be equivalent to the semiconductor chip 5 of " second component " of the present invention as the workpiece (be formed product) of resin moulded object.In addition, substrate 1 carry one deck or multi-lager semiconductor chip 5 goods, substrate 1 carry semiconductor device goods, carry imaging apparatus at substrate 1 and engage the goods etc. of transparent glass at the sensitive surface of imaging apparatus and also become object.In addition, as " the first component " of the present invention, the component of the various tabulars that resin substrate, ceramic substrate, metal substrate, lead frame, carrier and wafer can be used such.As " second component " of the present invention, except semiconductor chip, also can use the such various components of the such electronic unit of projection of heat sink, wiring and the lead frame used to dispel the heat, electrical connection.Thus, " workpiece " of the present invention refers to that at these " the first component " upper lift-launch is superimposed with the workpiece of the state of " second component ".If resin moulded form exists, and each boarded parts is one by one contained in each die cavity to carry out resin moulded situation, the multiple boarded parts being installed on substrate are contained in a die cavity unify to carry out resin moulded situation with regard to also existing.Utilize these structures, also can be described later resin moulded and seal in the mode making the end face of the end face of the first component and second component expose by carrying out.

(preheating part B)

Next substrate 1 is supplied by the loading machine 16 conveying mechanism E described later from test desk transfer to the not shown heat block being arranged on preheating part B from Workpiece supply portion A.Heat block is preheated to predetermined temperature under the state loading substrate 1.Preferably, heat block be set to the cover being opened and closed formula around it cover and suppress the structure of the impact for other unit.Substrate 1 after preheating is loaded machine 16 and keeps and carry to pressure portion C.

(pressure portion C)

Pressure portion C possesses pressure apparatus 6, and this pressure apparatus 6 carries out resin moulded for driven for opening and closing molding die 19 (with reference to Fig. 2 A) with clamping the workpiece be preheated.Pressure apparatus 6 comprise pressure mechanism for promoting molding die 19 described later along mould opening and closing direction and for be filled in molding die 19 from supply cylinder 35 from supply cylinder 35 to die cavity recess 32 (with reference to Fig. 2 A) in the transmission mechanism of resin of melting.

Pressure apparatus 6 comprises the die cavity alterable height mechanism for promoting die cavity block 23 (with reference to Fig. 2 A) along mould opening and closing direction and the thickness of slab changeable mechanism for promoting work mounting s portion 37 (with reference to Fig. 2 A) along mould opening and closing direction.Die cavity alterable height mechanism possesses patrix drive division 7, and this patrix drive division 7 such as relatively changes the height of die cavity recess by the inserts component (die cavity block 23) along mould opening and closing direction promotion patrix.This patrix drive division 7 has the servo motor described later 31 of the corresponding quantity with the quantity of the die cavity arranged relative to a substrate (being in other words the quantity of die cavity block 23), is configured to the height that can adjust die cavity respectively.Thus, when forming multiple (such as three) resin seal region in rectangular substrate 1, equal number (being three in this case) servo motor 31 and driving mechanism described later also can be comprised.

In addition, thickness of slab changeable mechanism possesses the counterdie drive division 8 (with reference to Fig. 2 A) of the inserts component (work mounting s portion 37) for promoting counterdie along mould opening and closing direction.Be set as, before die cavity injection molding resin, adjust the actuating quantity of die cavity alterable height mechanism and thickness of slab changeable mechanism according to workpiece 1, the height and position on the mould opening and closing direction of die cavity recess 32 is relatively become precalculated position.That is, before die cavity injection molding resin, correspondingly set die cavity alterable height mechanism with the height of semiconductor chip 5, and correspondingly set thickness of slab changeable mechanism with the thickness of substrate 1.

In addition, in the present embodiment, utilize and carry out resin moulded method by the die face of mold release film 10 molded mould (resin moulded face).Therefore, pressure apparatus 6 possesses the film feed mechanism 9 for the die face supply mold release film 10 to molding die.Film feed mechanism 9 possesses in the both sides of molding die for supplying the donor rollers 9a of the mold release film 10 and takers-in 9b for batching mold release film 10 to die face (upper die face).But, also can adopt the structure not using mold release film 10 to carry out the die face of molded mould.In addition, the structure not possessing mold release film 10 can also be adopted.Such as, also at the containment member of the periphery of die cavity block 23 configuration resin, metal ring-type, the thermal expansion of sealing component can be utilized eliminate the gap between patrix inserts block 26 described later, thus prevents resin from spilling from this gap.

(formed products incorporating section D)

Formed products incorporating section D comprise for arrange resin moulded after formed products 11 setting unit 12, for removing the cast gate disconnecting unit (Japanese: ゲート Block レイ Network) 13 of the useless resin of cast gate etc. and the incorporating section 14 for receiving the formed products 11 being removed useless resin from formed products 11.Formed products 11 is accommodated in the magazine 15 of storage, and the magazine 15 being accommodated with formed products is contained in accumulator successively.

(conveying mechanism E)

Conveying mechanism E comprises for moving into the loading machine 16 of workpiece and the unloader 17 for taking out of formed products 11 from pressure portion to pressure portion C.Workpiece supply portion A, preheating part B, pressure portion C and the formed products incorporating section D support by blocking links each other and assembles resin molding apparatus.Inside the device of each unit, be respectively equipped with guide portion 18, undertaken assembling by the mode that guide portion 18 is linked with straight line each other and form guide rail.Loading machine 16 and unloader 17 are set to respectively and can move back and forth along guide rail.Loading machine 16 and unloader 17 are set to can to retreat motion point-blank from the precalculated position guide portion 18 towards Workpiece supply portion A, preheating part B, pressure portion C, formed products incorporating section D.

Thus, by changing the structure of unit, the structural form of resin molding apparatus can be changed while maintaining state guide portion 18 linked each other.Such as, the example shown in Fig. 1 is the example being provided with two pressure apparatus 6, but also can form the resin molding apparatus of the multiple stage pressure apparatus 6 being linked with separate unit or more than 3.Also the structure equally with multiple stage liquid resin supply unit described later F can be set to.

The summary of resin moulded action is described.The workpiece (substrate 1) being arranged at setting table 2 in Workpiece supply portion A is loaded machine 16 and mentions and keep, and moves to preheating part B in this condition, be prepared heating before resin-molding along guide portion 18.

On the other hand, carry out unloader 17 from pressure apparatus 6 take out resin moulded after formed products 11 action while, loading machine 16 moves and mentions flake 3 from compressing tablet supply unit 4 on guide rail, and mentions substrate 1 from preheating part B.Then, loading machine 16 moves to the side of pressure apparatus 6, enters into the molding die in this pressure apparatus 6, substrate 1 and flake 3 being supplied to die sinking.Utilize heater (not shown) heated substrates 1 and the flake 3 of being located at molding die.At loading machine 16 after pressure apparatus 6 exits, utilize molding die 19 (with reference to Fig. 3 C) holding workpiece, to holding semiconductor chip 5 and the die cavity recess 32 (with reference to Fig. 3 D) forming die cavity fills the moulded resin of melting, carry out resin moulded to semiconductor chip 5.

After resin moulded, unloader 17 enters into the molding die of die sinking from the side of pressure apparatus 6, mentions formed products and takes out of formed products 11 from pressure apparatus 6.Unloader 17 moves along guide rail, by taking out of next formed products 11 transfer to the setting unit 12 of formed products incorporating section D, being then transplanted on cast gate disconnecting unit 13 from setting unit 12 and carrying out cast gate disconnection thus remove useless resin, and formed products 11 is accommodated in incorporating section 14.In addition, when adopting liquid resin as moulded resin, also can arrange the thickness measure portion of formed products 11 and measure the thickness of resin moulded part, the measurement result according to the thickness of this resin moulded part adjusts quantity delivered.

As above, from Workpiece supply portion A successively supplying substrate 1, and carry out resin moulded to substrate 10 in pressure portion C, in the D of formed products incorporating section, receive formed products 11.

In the resin molding apparatus of present embodiment, by resin moulded to carry out after driving molding die with the mode of the thickness of workpiece (substrate 1 and semiconductor chip 5) holding workpiece accordingly, the stress acting on workpiece because of mould clamping can be reduced as much as possible, thus do not carry out resin moulded accurately with not producing resin burr.

Then, the structure of the molding die that resin molding apparatus possesses is described with reference to Fig. 2.Molding die 19 comprises patrix 20 (mould) and counterdie 21 (another mould).

The structure of patrix 20 is described with reference to Fig. 2 A.In patrix 20, the die cavity block 23 forming mold cavity bottoms is supported on patrix die sleeve block (チェイス Block ロッ Network) 22 by spring 24 suspention.Inclined-plane 23a is formed in the side contrary with workpiece bearing surface of die cavity block 23.Die cavity block 23 is arranged on the inclined-plane 25a of the 1st movable ramp blocks 25 between this die cavity block 23 and patrix die sleeve block 22 mode to make its inclined-plane 23a be superimposed on is supported (cotter mechanism).

In addition, patrix inserts block 26 (the 1st inserts) is supported with at patrix die sleeve block 22 in rigid body shape.Die cavity block 23 is inserted into through hole 26a in the mode of the bottom of the die cavity recess being formed in patrix inserts block 26 and being formed and is suspended supporting.In addition, the state (acting on recuperative state) also die cavity block 23 can extended from natural length with spring 24 is supported on the 1st movable ramp blocks 25.In this case, die cavity block 23 is mutually abutted by the 1st movable ramp blocks 25 and inclined-plane and is supported by rigidity (rigid body).Patrix inserts block 26 to be provided with quarter form die cavity recess 32 recess 26b, on mould resin reservoir (Japanese: mo(u)ld top half カ Le) the resin stream such as 26c and patrix cross gate 26d, carve at patrix clamping face and be provided with illusory die cavity 26e.In addition, as long as the semiconductor chip 5 that flip-over type is installed, the degree of depth connecting the groove portion (circulation cast gate: スルーゲート) of illusory die cavity 26e and die cavity recess 32 just can be formed less than the gap (being in other words the part of underfill) between itself and substrate 1.In this case, preferentially underfill can be carried out 5 times to semiconductor chip with compared with illusory die cavity 26e potting resin, therefore ideal.In addition, the patrix sealing ring 27 for being closed in the gap between the outer peripheral face of patrix inserts block 26 and the internal face of patrix die sleeve block 22 is corresponding thereto provided with.Patrix sealing ring 27 in order to realize the decompressor 29 of two systems described later, 58 respective functions arrange.That is, patrix sealing ring 27 is utilized to attract mold release film 10 and utilize decompressor 58 to be arranged in the space that die cavity reduces pressure in order to distinguish.

Be provided with patrix at patrix die sleeve block 22 and attract path 28.Patrix attracts path 28 to be connected with decompressor 29.The suction hole (not shown) of the gap between patrix die sleeve block 22 and patrix inserts block 26, gap between patrix inserts block 26 and die cavity block 23 and the clamping face that is formed at patrix inserts block 26 attracts path 28 to be connected with patrix and is connected to decompressor 29.Mold release film 10 utilizes attracting mechanism to be held in by absorption the patrix clamping face comprising die cavity block 23, and this attracting mechanism make use of the suction hole (not shown) be formed on patrix clamping face, gap between die cavity block 23 and patrix inserts block 26.As mold release film 10, preferred employing have the heating-up temperature standing molding die 19 heat resistance, easily peel off from die face and there is the membrane material of flexibility, extensibility, such as PTFE, ETFE, PET, FEP, fluorine-containing glass fabric, polypropylene, polyvinylidene chloride etc.

1st movable ramp blocks 25 is formed with inclined-plane 25a, and this inclined-plane 25a has predetermined angle of inclination in the mode of the thickness of slab reduction (or increasing) along with advancing towards die cavity block 23.1st movable ramp blocks 25 is linked to servo motor 31 (patrix drive division 7) by helical axis 30.When being started to predetermined direction by servo motor 31, the be fitted together to by helical axis 30 spiral the 1st movable ramp blocks 25 is moved along the bottom advance and retreat of patrix die sleeve block 22.Thus, die cavity block 23 can adjust the height and position (upper surface part) on the mould opening and closing direction of die cavity recess 32 across mold release film 10.In addition, servo motor 31 can with being configured dividually by the wall of the mould heated in patrix 20.In addition, in order to prevent from being caused by mould heating, promote maintainability, servo motor 31 also can be configured to remove the link between itself and helical axis 30 as required.

Then, the structure of counterdie 21 is described with reference to Fig. 2 A.Counterdie 21 utilizes known clamping die sinking/mold closing, and this clamping makes the counterdie movable platen of mounting counterdie die sleeve block 33 be elevated by the drive transmission mechanism driven by drive source (electro-motor) (linkage or the helical axis etc. such as toggle link).In addition, also can be set to and finely tune drive volume by utilizing the bight of more than three ball screw frameworks supporting counterdie movable platen and correct the structure of counterdie movable platen relative to the inclination of the stationary platen of supporting patrix.In these cases, the lifting action of counterdie 21 at random can set translational speed, plus-pressure etc., at random can set flowing velocity, the resin pressure of moulded resin in the action of filling moulded resin to die cavity recess 32 and the course of action pushing back residual resin described later from die cavity recess 32.Therefore, clamping also can be utilized to control these conditions, therefore, it is possible to simplification device structure.

Counterdie inserts block 34 (the 2nd inserts) is assembled with at counterdie die sleeve block 33.Be assembled with the supply cylinder 35 of tubular at the central portion of counterdie inserts block 34, this supply cylinder 35 can load moulded resin (flake 3).The upper surface of counterdie inserts block 34 is formed as concordant with the upper surface supplying cylinder 35.The plunger 36 utilizing known transmission driving mechanism to move up and down is provided with in supply cylinder 35.Plunger 36 employing and multiple supply cylinder 35 are provided with the multi-plunger of many accordingly at rest pad (not shown).Be provided with not shown elastic component at the support of each plunger 36, each plunger 36 can utilize the elasticity of elastic component be shifted slightly and avoid excessive pressing force, and complies with the deviation of the amount of resin of compressing tablet when keeping pressure.

At the upper surface of counterdie die sleeve block 33, be adjacent to the both sides of counterdie inserts block 34 the work mounting s portion 37 that is respectively equipped with for loading workpiece.The goods that workpiece adopts the one side being provided with semiconductor chip 5 at the one side of substrate 1 to be molded.Work mounting s portion 37 is arranged on spring 38 floating support between itself and the upper surface of counterdie die sleeve block 33.

Constant inclined surface block 57 and the 2nd movable ramp blocks 39 is superimposedly provided with between work mounting s portion 37 and counterdie die sleeve block 33.The inclined-plane 57a being formed in the lower surface of constant inclined surface block 57 is supported on counterdie die sleeve block 33 (cotter mechanism) with superimposed state with the inclined-plane 39a of the upper surface being formed in the 2nd movable ramp blocks 39.Work mounting s portion 37 can be set to spring 38 under the contracted state of natural length (acting on state with resilience) by the structure supported.2nd movable ramp blocks 39 is linked to servo motor 41 (counterdie drive division 8) by helical axis 40.When being started to predetermined direction by servo motor 41, the be fitted together to by helical axis 40 spiral the 2nd movable ramp blocks 39 is moved along the bottom advance and retreat of counterdie die sleeve block 33.Thereby, it is possible to correspondingly adjust the position on the mould opening and closing direction in work mounting s portion 37 with the thickness of slab of workpiece (substrate 1), such as, be adjusted to upper surface of base plate roughly concordant with counterdie clamping face.That is, regardless of the thickness of substrate 1, by making the upper surface of substrate 1 exceed identical amount than counterdie clamping face, all becoming can not damaged substrate 1 and can prevent the suitable clamp position of resin leakage.Work mounting s portion 37 ramp blocks 57 that is fixed supports rigidly, but also can form gap between itself and constant inclined surface block 57.In this case, the flexure of spring 38 is utilized can not to clamp with applying excessive chucking power substrate 1.In addition, also can correspondingly change the different work mounting s portion 37 of thickness from the thickness of workpiece (substrate 1) and adjust thickness of slab.Further, work mounting s portion 37 also can have not shown Attraction structure.In this case, even be easy to the substrate 1 producing strain because being preheated, also can clamp with the state flatly kept by being adsorbed on work mounting s portion 37.Thus, even thinner and be easy to produce the substrate 1 of warpage, also can reliably keep and can not reliably clamp with misplacing.

In addition, counterdie sealing ring 42 is provided with in the circumferential position of counterdie die sleeve block 33 (counterdie 21).In addition, counterdie die sleeve block 33 is provided with counterdie and attracts path 43.Counterdie attracts path 43 to be connected with decompressor 58.Counterdie attract path 43 with the position opening than counterdie sealing ring 42 inner circumferential side side.When by molding die 19 mold closing, become the state that patrix die sleeve block 22 and counterdie die sleeve block 33 clamp counterdie sealing ring 42, between patrix 20 and counterdie 21, form the enclosure space that periphery is closed.When starting decompressor 58, path 43 is attracted to form pressure reduction space by counterdie.

At this, reference Fig. 2 A and Fig. 2 B, Fig. 3 C and Fig. 3 D, Fig. 4 E illustrate the on-off action carried out along with resin moulded action of above-mentioned molding die 19.Fig. 2 A represents the state of molding die 19 die sinking.Decompressor 29 works, and mold release film 10 is held in patrix clamping face by absorption.In the present embodiment, before molding die 19 mold closing, such as, correspondingly finely tune the actuating quantity of die cavity alterable height mechanism and thickness of slab changeable mechanism with the thickness of workpiece (substrate 1 and semiconductor chip 5).

Namely, servo motor 31 is correspondingly started with the height of semiconductor chip 5, by helical axis 30, the 1st movable ramp blocks 25 is slided (forward travel or setback) to any one direction, adjust to the height and position that die cavity block 23 can not press semiconductor chip 5 with applying excessive stress.

In addition, servo motor 41 is correspondingly started with the thickness of slab of substrate 1, by helical axis 40, the 2nd movable ramp blocks 39 is slided (forward travel or setback) to any one direction, adjust to the height and position that work mounting s portion 37 can not clamp substrate 1 with applying excessive stress.

Then, in fig. 2b, utilize loading machine 16 (with reference to Fig. 1) by the counterdie 21 of Workpiece supply to the molding die 19 of die sinking.That is, the substrate 1 being provided with semiconductor chip 5 is moved to work mounting s portion 37, in supply cylinder 35, loads flake 3.Now, owing to utilizing counterdie drive division 8 to have adjusted thickness of slab in advance, therefore, substrate 1 supports as roughly concordant with counterdie clamping face by work mounting s portion 37.In addition, semiconductor chip 5 also can wire-bonded be installed.In this case, can carry out the flat being bonded to the inner side of lead-in wire in semiconductor chip 5 clamping such shape for lugs by being formed in die cavity block 23, even wire-bonded is provided with the workpiece of semiconductor chip 5, also can form clampingly.

Then, in fig. 3 c, counterdie 21 is made to increase and by molding die 19 mold closing.Now, also can or start simultaneously with holding action before mould holding action, decompressor 58 works and attract action from counterdie attracts path 43.When patrix die sleeve block 22 is connected to counterdie sealing ring 42, between patrix 20 and counterdie 21, form enclosure space, utilize the attraction action attracting path 43 to carry out from counterdie to form pressure reduction space.

Carry out holding action further, patrix inserts block 26 is connected to counterdie inserts block 34 and substrate 1 across mold release film 10, and die cavity block 23 is when mold release film 10 is connected to semiconductor chip 5, and holding action completes.In addition, the actuating quantity of die cavity alterable height mechanism and thickness of slab changeable mechanism can also be finely tuned after by molding die 19 mold closing.

Then, in fig. 3d, make transmission mechanism work, boost plunger 36 and the moulded resin of melting is pressed and delivered to die cavity recess 32 by upper mould resin reservoir 26c, patrix cross gate 26d.Now, because the upper surface of semiconductor chip 5 is pressed by die cavity block 23, therefore, as long as the semiconductor chip 5 that flip-over type is installed, just underfill can be carried out to importing molten resin between itself and substrate 1.That is, the molded bottom can carrying out carrying out underfill in molding die 19 fills (MUF).In addition, even if the molten resin in the region immediately below the semiconductor chip 5 being filled in underfill exists space, also by washing away space from die cavity recess 32 to illusory die cavity 26e overflow moulded resin, thus the resin filling in die cavity can be promoted.The bubble being mixed into moulded resin also by preferentially flowing than resin and be discharged to pressure reduction space via not shown exhaust passage after overflow, can attract path 43 to attract by counterdie and is discharged.In addition, utilize the action of thickness of slab changeable mechanism, regardless of the thickness of substrate 1, moulded resin can both be washed away via the groove portion of uniform depth to illusory die cavity 26e.That is, distortion under the effect of chucking power can be prevented due to the material of substrate 1 and to heave in groove portion thus to cause reducing the such situation of sectional area.Thus, even if the thickness of each workpiece exists deviation, also while illusory die cavity 26e overflow, also can prevent resin leakage reliably making moulded resin, therefore, regardless of the thickness of workpiece, reliably can both discharge space, making shaping stay in grade.

Fig. 4 E represents and not only carries out molded bottom filling to the semiconductor chip 5 being arranged on substrate 1, also makes this semiconductor chip 5 exposed to not carry out the molded operation of overflow.This operation can be at random implemented according to the goods necessary condition of workpiece.In fig. 3d, if the semiconductor chip 5 that flip-over type is installed, then after having carried out underfill and be molded, that is, make moulded resin to after illusory die cavity 26e overflow, start patrix drive division 7, make die cavity block 23 rise and expand the volume of die cavity recess 32.Specifically, starting servo motor 31, slides in the direction the 1st movable ramp blocks 25 being kept out of the way by helical axis 30 to the plan-position from die cavity block 23.Thus, die cavity block 23 along inclined-plane 25a inclination and rise, between itself and semiconductor chip 5, form gap (cavity volume) and fill moulded resin.By carrying out overflow molding process after having carried out underfill operation in advance like this, compared with carrying out the situation of these operations, not filling in underfill can be prevented more reliably simultaneously.

In addition, in order to improve the fillibility of underfill further, also repeatedly moving up and down of die cavity block 23 can be carried out.In this case, drive servo motor 31 by positive and negative rotation and make the 1st movable ramp blocks 25 advance and retreat motion by helical axis 30, namely can repeat the state of Fig. 3 D and Fig. 4 E.In addition, also by repeatedly carrying out moving up and down of plunger 36 simultaneously, resin can be returned from die cavity recess 32 to the thruster of supply cylinder 35.Thus, by increasing the amount of flow of moulded resin, be easy to be filled into the spatial portion as gap.In addition, adopt as embodiment described later utilize mold closing action to change the structure of the height of die cavity block 23 time, promptly can repeat, the higher shaping of fillibility can be carried out at short notice.

Adopt above-mentioned molding die 19, even if there is deviation in the thickness of substrate, by the height and position utilizing thickness of slab guiding mechanism to change work mounting s portion 37, also the upper surface of substrate 1 can be adjusted to consistent with mould clamping face, even if there is deviation in the height (comprising stacked height) apart from substrate 1 of semiconductor chip 5 in each workpiece, by the height and position utilizing die cavity stop dog regulating mechanism to change die cavity block 23, also forming thickness can be adjusted to constant.

Thus, whether there is the size of deviation, departure in a thickness direction regardless of workpiece (substrate 1, semiconductor chip), can not both clamp with making matched moulds balance and stability the excessive stress of workpiece effect.When both die cavity block 23 and work mounting s portion 37 are provided with for regulating the cotter mechanism of the position on mould opening and closing direction, the position control high precision int on the mould opening and closing direction in die cavity block 23 and work mounting s portion 37 can be made, therefore, the stress to workpiece effect when clamping mould can being reduced as much as possible, high-precision shaping quality can be maintained.

In addition, the space produced in the moulded resin of filling to die cavity recess 32 can be washed away to illusory die cavity and promote shaping quality.Particularly can promote the resin filling carried out when underfill is molded.

Thus, can provide a kind of forming thickness evenly and do not produce burr, the resin molding apparatus that improves shaping quality.

[embodiment 2]

Then, another example of resin molding apparatus is described.Because apparatus structure is shared, therefore, be mainly described centered by the variation point of molding die.Identical Reference numeral is marked to the component identical with embodiment 1 and quotes explanation.

In Fig. 5 A and Fig. 5 B, sandwiched intermediate plate 44 between patrix 20 and counterdie 21 and to carry out resin moulded this point different.The 1st through hole 44a be communicated with supply cylinder 35 and the 2nd through hole 44c (being equivalent to die cavity) for holding semiconductor chip 5 be communicated with cast gate 44b (resin stream), the cast gate 44b be communicated with patrix cross gate 26d and the circulation cast gate 44d (resin stream) being communicated with the 2nd through hole 44c and illusory die cavity 26e is formed at intermediate plate 44.Intermediate plate 44 such as adopts thickness of slab and consistent, the resin moulded region of the height of the semiconductor chip 5 of workpiece and the consistent parts of the 2nd through hole 44c.

In fig. 5, as prerequisite, servo motor 31 is correspondingly started with the height of semiconductor chip 5 according to the measurement result of workpiece calibration portion B, by helical axis 30, the 1st movable ramp blocks 25 is slided (forward travel or setback) to any one direction, adjust to the height and position that die cavity block 23 can not press semiconductor chip 5 with applying excessive stress in advance.

In addition, servo motor 41 is correspondingly started with the thickness of slab of substrate 1, by helical axis 40, the 2nd movable ramp blocks 39 is slided (forward travel or setback) to any one direction, adjust to the height and position that work mounting s portion 37 can not clamp substrate 1 with applying excessive stress in advance.

Then, utilizing loading machine 16 that substrate 1 is placed in work mounting s portion 37, after cylinder 35 loaded flake 3 to supply, making intermediate plate 44 across being superimposed on counterdie clamping face with gap between the peripheral end of substrate 1 and counterdie inserts block 34.Now, intermediate plate 44 with the 1st through hole 44a with supply cylinder 35 contraposition and in the 2nd through hole 44c the mode of holding semiconductor chip 5 carry out contraposition and be placed in counterdie clamping face.Also can feed unit be set and utilize conveying mechanism alone to supply intermediate plate 44 to molding die 19, but loading machine 16 and flake 3 also can be utilized together to supply intermediate plate 44.

Then, counterdie 21 is made to increase and by molding die 19 mold closing.When patrix die sleeve block 22 is connected to counterdie sealing ring 42, between patrix 20 and counterdie 21, form enclosure space, utilize the attraction action attracting path 43 to carry out from counterdie to form pressure reduction space.Carry out holding action further, patrix inserts block 26 is connected to intermediate plate 44 across mold release film 10, and die cavity block 23 is when mold release film 10 is connected to semiconductor chip 5, and holding action completes.

Then, in figure 5b, make transmission mechanism work, boost plunger 36 and moulded resin by melting is pressed and delivered to the 2nd through hole 44c by the 1st through hole 44a, upper mould resin reservoir 26c, patrix cross gate 26d, cast gate 44b.Now, the gap striden across between substrate 1 and mould is injected directly into the 2nd through hole 44c forming die cavity to the moulded resin of melting by the upper surface of intermediate plate 44.In addition, if the semiconductor chip 5 that flip-over type is installed, because its upper surface is pressed by die cavity block 23, be molded therefore, it is possible to carry out underfill to importing molten resin between semiconductor chip 5 and substrate 1.In addition, by make moulded resin from the 2nd through hole 44c by circulation cast gate 44d to illusory die cavity 26e overflow, space (filling) can be washed away and the resin filling that promotes in die cavity.

In this case, do not need to make to need some position of peeling off easily to peel off as cross gate, illusory die cavity etc. after molding and carry out gold-plated to substrate 1, need not worry that moulded resin leaks into the gap between substrate 1 and counterdie inserts block 34 and causes the slip of mould bad yet.

[embodiment 3]

The present embodiment uses intermediate plate 44 this point to be same with embodiment 2, but it is different to addition of inclining rotary mechanism 45 this point to patrix 20.Specifically, between the 1st movable ramp blocks 25 and the die cavity block 23 being connected to semiconductor chip 5 across mold release film 10, guide stopper 46 is provided with.Guide stopper 46 utilizes spring 24 to suspend in midair and is supported on patrix die sleeve block 22.Between die cavity block 23 and guide stopper 46, namely contrary with workpiece bearing surface side side elasticity be provided with power output more much smaller than spring 24 by pressing spring 47, between die cavity block 23 and guide stopper 46, form gap.In addition, this gap might not be required, but in order to the resistance to sliding reducing die cavity block 23 and guide stopper 46, die cavity block 23 is fascinated swimmingly, expects to arrange small gap.

Be formed with convex surface part 23d (guiding face) at the opposite face central portion relative with guide stopper 46 of die cavity block 23, be formed with the concave part chimeric with convex surface part 23d at the opposite face central portion relative with die cavity block 23 of guide stopper 46 and (guide face; Not shown).Die cavity block 23 is imitated the height tolerance of this semiconductor chip 5 (inclination) when being connected to multiple (or single) semiconductor chip 5 across mold release film 10 and becomes suitable heeling condition, presses under the state of fascinating centered by convex surface part 23d.When patrix 20 and counterdie 21 complete clamping, being compressed by pressing spring 47 between die cavity block 23 and guide stopper 46, is clamped under the state that convex surface part 23d and concave part (not shown) are fitted together to and eliminate the rigidity (rigid body) in gap.In this case, also can form convex surface part 23d by sphere, make the center of this sphere consistent with the end face towards semiconductor chip 5 in die cavity block 23.Thus, even if clamp semiconductor chip 5 while die cavity block 23 tilts, also can not produce the stress on shear direction in this semiconductor chip 5 clamp, therefore more desirable.But, also convex surface part 23d can be arranged on guide stopper 46 side.

In fig. 6, as prerequisite, correspondingly start servo motor 31 according to the measurement result of workpiece calibration portion B with the height of semiconductor chip 5, adjust to the height and position that die cavity block 23 can not press semiconductor chip 5 with applying excessive stress in advance.Thickness of slab that is same and substrate 1 correspondingly starts servo motor 41, adjusts to the height and position that work mounting s portion 37 can not clamp substrate 1 with applying excessive stress in advance.

Then, utilize loading machine 16 that substrate 1 is placed in work mounting s portion 37, and after cylinder 35 loaded flake 3 to supply, make intermediate plate 44 be superimposed on counterdie clamping face across the gap between the peripheral end of substrate 1 and counterdie inserts block 34.

Then, counterdie 21 is made to increase and by molding die 19 mold closing.When patrix die sleeve block 22 is connected to counterdie sealing ring 42, between patrix 20 and counterdie 21, form enclosure space, utilize the attraction action attracting path 43 to carry out from counterdie to form pressure reduction space.Carry out holding action further, patrix inserts block 26 is connected to intermediate plate 44 across mold release film 10, die cavity block 23 is when mold release film 10 is connected to semiconductor chip 5, and under the state utilizing inclining rotary mechanism 45 to make die cavity block 23 fascinate centered by convex surface part 23d, holding action completes.

Then, in fig. 6b, make transmission mechanism work, boost plunger 36 and the moulded resin of melting is pressed and delivered to the 2nd through hole 44c by the 1st through hole 44a, upper mould resin reservoir 26c, patrix cross gate 26d, cast gate 44b.Now, because the upper surface of semiconductor chip 5 is pressed by die cavity block 23, therefore, if the semiconductor chip 5 that flip-over type is installed, then can carry out underfill to importing molten resin between itself and substrate 1 and be molded.

In addition, by making moulded resin pass through circulation cast gate 44d to illusory die cavity 26e overflow from the 2nd through hole 44c, can space be washed away and promote the resin filling in die cavity.

According to above content, even if the semiconductor chip 5 being arranged on substrate 1 produces, it also can not across mold release film 10 and die cavity block 23 Partial Touching, die cavity block 23 is imitated the inclination of semiconductor chip 5 and fascinates, therefore, stress can not be produced at semiconductor chip 5, need not worry to cause chip to damage or damaged or generation burr.Thus, shaping quality rises.In addition, can fascinate by making die cavity block 23 like this, even pair of lead wires frame is easy to the workpiece tilted owing to forming with clamping different elements as be made up of the packaging body of converter pair of lead wires frame clamping IGBT (InsulatedGateBipolarTransistor) and FWD (FreeWheelingDiode), also reliably burr can be prevented.In addition, in this shaping example, be configured in downside lead frame be equivalent to " the first component " of the present invention, IGBT, FWD and be configured in upside lead frame be equivalent to " second component " of the present invention.

[embodiment 4]

In fig. 7, in the clamping face of patrix inserts block 26, be provided with illusory die cavity 26e than substrate opposite face position in the outer part.In addition, also can be provided with the lockweight 48 (closed block) of motion of can retreating in the part of the ratio illusory die cavity 26e outer circumferential side side of clamping face, this lockweight 48 makes decompression action stop by the part relative with this lockweight 48 across mold release film 10 of the clamping face of pressing counterdie inserts block 34.Also the driving mechanism such as solenoid, cylinder body can be utilized to carry out advance and retreat motion to make lockweight 48.

Adopt said structure, owing to will illusory die cavity 26e do not formed on substrate 1, therefore, it is possible to increase the acquisition number of the formed products 11 on substrate 1 and promote the utilization rate of substrate 1.In addition, on the opportunity expected, such as, under the state that the moulded resin of illusory die cavity 26e by overflow fills up, air can not be discharged in molding die 19, also can prevent resin from spilling.In addition, being formed darker by the exhaust passage (not shown) being used for the air of discharging from die cavity by extending outside from illusory die cavity 26e, can be easy to discharge air, therefore, it is possible to quickly and reliably reduce pressure and prevent from not filling.

In addition, Fig. 7 B is the embodiment that have employed intermediate plate 44, but illusory die cavity 44e is arranged on the position than substrate opposite face outer circumferential side side.Illusory die cavity 44e is formed by through hole, and residual resin is held from the 2nd through hole 44c by circulation cast gate 44d overflow.In addition, patrix inserts block 26, be provided with lockweight 48 than the clamping face of illusory die cavity 44e outer circumferential side side, this lockweight 48 presses the part relative with this lockweight 48 across mold release film 10 of the clamping face of intermediate plate 44.Adopt said structure, when illusory die cavity 44e is formed in outside substrate 1, the groove portion that be connected with die cavity recess 32 with illusory die cavity 44e need not be formed at substrate 1, therefore, it is possible to the acquisition number of formed products 11 on increase substrate 1 and promote the utilization rate of substrate 1.In addition, when illusory die cavity 44e is formed as the through hole of through intermediate plate 44, only utilize pin to wait (not shown) to extrude to be filled in useless resin in illusory die cavity 44e just can the demoulding, also can make the easy demoulding of useless resin.In addition, the structure possessing illusory die cavity 26e and illusory both die cavity 44e can be also set to.

[the 5th embodiment]

Then, another example of resin molding apparatus is described.Mainly be described centered by the variation point of molding die.Identical Reference numeral is marked to the component identical with embodiment 1 and quotes explanation.In embodiment 1 ~ embodiment 4, as die cavity alterable height mechanism, die cavity block 23 is supported by cotter mechanism, but as shown in Figure 8 A, is supported on patrix die sleeve block 22 die cavity block 23 rigid body shape.In addition, patrix inserts block 26 also can be suspended in midair supporting by spring 49.Cotter mechanism is not set at patrix 20, is only provided with the cotter mechanism be made up of the work mounting s portion 37 of counterdie 21 and the 2nd movable ramp blocks 39.

The holding action of molding die 19 is described, in fig. 8 a, servo motor 41 is correspondingly started with the thickness of slab of substrate 1,2nd movable ramp blocks 39 is slided (forward travel or setback) to any one direction by helical axis 40, adjusts to the height and position that work mounting s portion 37 can not clamp substrate 1 with applying excessive stress in advance.The counterdie 21 of the molding die 19 having utilized loading machine 16 (with reference to Fig. 1) to die sinking in this condition supplies workpiece.Now, owing to utilizing counterdie drive division 8 to have adjusted thickness of slab in advance, therefore, substrate 1 supports as concordant with counterdie clamping face or slightly higher than counterdie clamping face by work mounting s portion 37.

Then, in the fig. 8b, counterdie 21 is made to increase and by molding die 19 mold closing.Now, also can or start simultaneously with holding action before mould holding action, decompressor 58 works and attract action from counterdie attracts path 43.When patrix die sleeve block 22 is connected to counterdie sealing ring 42, between patrix 20 and counterdie 21, form enclosure space, utilize the attraction action attracting path 43 to carry out from counterdie to form pressure reduction space.

Carry out holding action, patrix inserts block 26 is connected to counterdie inserts block 34 and substrate 1 across mold release film 10.

When carrying out holding action further, as shown in Figure 8 C, Compress Spring 49 under the state that patrix inserts block 26 is connected to counterdie inserts block 34 and substrate 1, die cavity block 23 is connected to semiconductor chip 5 across mold release film 10.In this case, by Compress Spring 49, detect the chucking power produced as reaction force for counterdie movable platen, when becoming predetermined chucking power, holding action completes.

Thus, move along mould opening and closing direction to make die cavity block 23 relatively be elevated relative to patrix inserts block 26, the clamping that counterdie movable platen is elevated plays function as die cavity alterable height mechanism.Then, make transmission mechanism work and boost plunger 36, the moulded resin of pressurized delivered melting and be injected into die cavity recess 32.In this case, by means of only completing mold closing action before die cavity recess 32 injection molding resin, just die cavity height can correspondingly set with the height of semiconductor chip 5.

In addition; in order to eliminate the gap between substrate 1 and counterdie inserts block 34, the pressing mechanism of the wall of the counterdie inserts 34 substrate 1 being pressed on supply cylinder 35 side from outside also can be set as required, substrate 1 is physically out of shape and eliminates the conquassation mechanism (Japanese: つぶ Machine Agencies) etc. in gap.Thereby, it is possible to the moulded resin preventing mobility higher as much as possible leaks.

In addition, die cavity block 23 be rigid body shape be supported on patrix die sleeve block 22, but also can to support by spring suspended.In this case, also can by patrix inserts block 26 rigid body shape be supported on patrix die sleeve block 22, before clamping completes and utilize die cavity block 23 clamped semiconductor chip 5 after complete mold closing.

Adopt said structure, by means of only the amount of floating making the counterdie 21 rising scheduled volume corresponding to the height of semiconductor chip 5 just can adjust die cavity block 23 and/or patrix inserts block 26 (fixture) in the mold closing course of action of molding die 19.Thus, the other action not carrying out the depth location (from substrate 1 to the height of die cavity block 23) adjusting die cavity just can set.That is, by means of only making counterdie 21 rise to the position correspondingly set with the height of semiconductor chip 5, just can not clamp with applying excessive pressing force workpiece, utilizing simple structure can play the effect same with the above embodiments.

[embodiment 6]

In figure 9 a, die cavity block 23 and patrix inserts block 26 utilize spring 24,49 to suspend in midair respectively and are supported on patrix die sleeve block 22.In addition, the semiconductor chip bearing surface of die cavity block 23 is formed as prominent shape projecting around it downwards.That is, around convex surface part 23b and its, concave part 23c is formed with.In addition, similarly to Example 5, at patrix 20, cotter mechanism is not set, is only provided with the cotter mechanism be made up of the work mounting s portion 37 of counterdie 21 and the 2nd movable ramp blocks 39.

The holding action of molding die 19 is described, in figure 9 a, servo motor 41 is correspondingly started with the thickness of slab of substrate 1,2nd movable ramp blocks 39 is slided (forward travel or setback) to any one direction by helical axis 40, adjusts to the height and position that work mounting s portion 37 can not clamp substrate 1 with applying excessive stress.The counterdie 21 of the molding die 19 having utilized loading machine 16 (with reference to Fig. 1) to die sinking in this condition supplies workpiece.Now, owing to utilizing counterdie drive division 8 to have adjusted thickness of slab in advance, therefore, substrate 1 supports as concordant with counterdie clamping face or slightly higher than counterdie clamping face by work mounting s portion 37.

Then, in figures 9 b and 9, counterdie 21 is made to increase and by molding die 19 mold closing.Now, also can or start simultaneously with holding action before mould holding action, decompressor 58 works and attract action from counterdie attracts path 43.When patrix die sleeve block 22 is connected to counterdie sealing ring 42, between patrix 20 and counterdie 21, form enclosure space, utilize the attraction action attracting path 43 to carry out from counterdie to form pressure reduction space.

Carry out holding action, patrix inserts block 26 is connected to counterdie inserts block 34 and substrate 1 across mold release film 10.In addition, when the convex surface part 23b being formed at die cavity block 23 is connected to each semiconductor chip 5 across mold release film 10, holding action completes.Now, can utilize the flexure of spring 24 avoid die cavity block 23 press semiconductor chip 5 excessive pressing force, the flexure of spring 49 can be utilized to avoid patrix inserts block 26 to press the excessive pressing force of substrate 1.Thus; as use the LED element of upper surface luminescence as semiconductor chip 5 situation need also to prevent while the upper surface protecting semiconductor chip 5 more reliably in chip upper surface overlap clamp time, also can improve shaping quality.

In Fig. 9 C, make transmission mechanism work, boost plunger 36 and moulded resin by melting is pressed and delivered to die cavity recess 32 by upper mould resin reservoir 26c, patrix cross gate 26d.Now, because the upper surface of each semiconductor chip 5 is pressed by the convex surface part 23b of die cavity block 23, therefore, if the semiconductor chip 5 that flip-over type is installed, then except can carry out to importing molten resin between itself and substrate 1 underfill molded except, the mode also can surrounding the upper surface part of each semiconductor chip 5 to fill moulded resin to concave part 23c be carried out resin moulded.Pass through circulation cast gate 26f to illusory die cavity 26e overflow by the moulded resin being filled into die cavity recess 32, can space be washed away and promote the resin filling in die cavity.

Adopt said structure, the convex surface part 23b of die cavity block 23 can be utilized to press the light-emitting area as the LED element of semiconductor element 5 and make it expose, and fill the lower silicones (white resin) of viscosity to the concave part 23c surrounded around it and utilize molded the shaping expeditiously of transmission to surround the reflector of light-emitting area.In addition, reflector may not be the structure of the height improved around light-emitting area, also can form the reflector of the height concordant with light-emitting area.In this case, the semiconductor chip bearing surface of die cavity block 23 is formed as flat condition.

[embodiment 7]

Then, another example of resin molding apparatus is described.Identical Reference numeral is marked to the component identical with embodiment 1 and quotes explanation.Below, be mainly described centered by different structures.

As shown in Figure 10, in resin molding apparatus, independent and be adjacent to be provided with liquid resin supply unit F with pressure portion C relative to substrate supply unit (Workpiece supply portion A).Specifically, liquid resin supply unit F is arranged on pressure portion C each other.Same with Fig. 1, the support by blocking links in guide portion 18 continuous print mode each other and assembles resin molding apparatus.

The structure of molding die 19 is described as mode similarly to Example 1, but also can be the molding die 19 of other embodiments.

The structure of liquid resin supply unit F is described with reference to Figure 11 A.Distributor (liquid resin feedway) 50 has not shown pedestal, be arranged at the travel mechanism of this pedestal (comprise guide rail etc. and form) and the rotating mechanism that can rotate on the travelling carriage being located at travel mechanism.Distributor 50 makes after the syringe 51 kept along vertical rotates to position corresponding with 2 pressure apparatus 6 respectively, to make it retreat molding die 19 in and move and supply liquid resin.

Distributor 50 comprise be filled with liquid resinous syringe 51, for the liquid resin flowing of extruding from syringe 51 pipe 52 and be configured in pipe 52 tip side and for the mechanism 53 of dripping of supply cylinder 35 that liquid resin is dripped to.The pipe 52 be connected with the syringe 51 being held in not shown main distributor in vertical to be spent and extended towards horizontal direction bending roughly 90 from vertical.

In addition, mechanism 53 of dripping has and is arranged on from the end (becoming supply port) of horizontal direction pipe 52 bending below vertical and the cooling body 56 clamping pipe 52 and the resin acceptance division 55 of the pinch valve 54 of its locking, motion of can retreating below tube opening and being used for will be cooled around pipe 52.Pinch valve 54 by airtight for pipe 52, prevents liquid resin drip in the moment except the liquid resin that drips, thus prevents liquid resin from contacting with extraneous air and deteriorated, or prevents air from entering in pipe 52.In addition, resin acceptance division 55 is kept out of the way below the opening of pipe 52 when dripping liquid resin, receives the liquid resin dripped below the opening being in addition positioned at pipe 52.Resin acceptance division 55 except liquid resin from dripping, also can prevent the heating of the top end opening to pipe 52 except preventing when entering into molding die 19.

The surrounding of pipe 52 cools mechanism 53 is positioned at the inside of the pressure apparatus 6 of high temperature to drip when supplying liquid resin and suppresses liquid resinous reaction to use by cooling body 56.Cooling body 56 both can be such as the structure utilizing the cooling-part of air cooling, water-cooled will to cool in the housing arranged in the mode of containing tube 52, also can be by making cold-producing medium by the structure cooled by liquid resin direct in the heavy wall of pipe 52, and these structures can be adopted simultaneously.In addition, also the such cooling element of Peltier element (cooling-part) can be set in housing and pipe 52 is cooled.

Then, an example of the liquid resin supply action of distributor 50 is described.

As prerequisite, correspondingly start servo motor 31 with the height of semiconductor chip 5, adjust to the height and position that die cavity block 23 can not press semiconductor chip 5 with applying excessive stress in advance.Equally, correspondingly start servo motor 41 with the thickness of slab of substrate 1, adjust to the height and position that work mounting s portion 37 can not clamp substrate 1 with applying excessive stress in advance.

Then, utilize loading machine 16 that substrate 1 is supplied to work mounting s portion 37.In addition, as shown in Figure 11 A, make not shown rotating mechanism work and distributor 50 is rotated towards the pressure apparatus 6 of supply, attitude being changed to mechanism 53 of dripping can with between the molding die 19 of to be front enter in pinch valve 54 side die sinking.Now, pinch valve 54 is still closed, and resin acceptance division 55 is in the state will closed immediately below the opening of pipe 52.In addition, start cooling device 56 and be set to the state that the liquid resin in killer tube 52 reacts.

Then, as shown in Figure 11 B, make not shown travel mechanism's work and distributor 50 is moved in the mode that the pressure apparatus 6 towards supply is close.Now, the mechanism 53 that is configured to drip enters into the molding die 19 of the die sinking of pressure apparatus 6, and the pinch valve 54 being arranged on the top ends of pipe 52 is in directly over supply cylinder 35.And open clip pipe valve 54 after the position making resin acceptance division 55 below the opening of pipe 52 is kept out of the way, from syringe 51 to supplying in cylinder 35 the resin moulded required liquid resin that drips once.

After the liquid resin of the aequum that drips terminates, closed clip pipe valve 54 and resin acceptance division 55 is moved to the position below the opening of pipe 52.And, make the work of not shown travel mechanism, distributor 50 is moved in the mode certainly supplying the pressure apparatus 6 that finishes and leave.Thus, mechanism 53 of dripping keeps out of the way from molding die 19.

Then, similarly to Example 1, in fig. 3 c, counterdie 21 is made to increase and by molding die 19 mold closing.Carry out holding action further, patrix inserts block 26 is connected to counterdie inserts block 34 and substrate 1 across mold release film 10, and die cavity block 23 is when mold release film 10 is connected to semiconductor chip 5, and holding action completes.

Then, same with Fig. 3 D, make transmission mechanism work, boost plunger 36 and liquid resin is pressed and delivered to die cavity recess 32 by upper mould resin reservoir 26c, patrix cross gate 26d, underfill can be carried out and be molded.The liquid resin being filled into die cavity recess 32, by illusory die cavity 26e overflow, can wash away space and promote the resin filling in die cavity.

Adopt said structure, can utilize to transmit and molded be embodied as the gap that is filled into fine projection and filler becomes fine and the molded bottom adopting the liquid resin of low-viscosity epoxy class to carry out is filled.Or the filling rate of filler can be utilized lower and the lens, reflector etc. of the silicones that viscosity is lower formation LED, shaping quality can be improved and seek long lifetime.

The molding die utilizing patrix die cavity, counterdie to supply cylinder layout type describes above-mentioned resin molding apparatus, but can be counterdie die cavity, can be the molding die of patrix supply cylinder, the configuration of counterdie die cavity.

In addition, using fixed mould as patrix 20, moveable die is illustrated as counterdie 21, but be not limited thereto, also can using fixed mould as counterdie 21, moveable die as patrix 20.

In addition, as workpiece, except not only flip-over type, also wire-bonded is installed on substrate 1 and installs except semiconductor chip 5 on substrate 1, the light-emitting components such as White LED also can be used at sealing resin to be namely mixed into the element etc. of fluorophor.And, as workpiece, the substrate etc. of the switch element (IGBT, MOS-FET etc.), the element (CPU, MPU etc.) along with golf calorific value, the semiconductor element (LED etc.) with input and output portion, the sensor (ccd sensor, cmos sensor, fingerprint sensor, MEMS etc.) carrying out the I/O of signal etc. being equipped with power circuit and adopting also can be used.Further, as workpiece, the wafer being equipped with the such electronic unit of projection, solder ball also can be used to carry out the shaping of wafer-level packaging body.In this case, can carry out utilizing die cavity block 32 clamp projection, solder ball and suitably clamp projection, wafer-level packaging body that solder ball carries out sealing is shaped.

In addition, as moulded resin, to using such as solid-state flake 3, liquid resinous example is illustrated, but the various resins that particulate resins, powdery resin also can be used such.In addition, molding die 19 also can be applied to individually or generally multiple semiconductor element be carried out to the shaping of mapping type (Japanese: マップタイプ) of resin seal, the shaping of matrix type (Japanese: マトリッ Network スタイプ).

In addition, counterdie inserts block 34 is located at by supply cylinder 35, but also can be located at patrix 20 side.In addition, in such a configuration, molding die also can configure upside down.

In addition, as die cavity alterable height mechanism, to utilizing cotter mechanism to drive the structure of die cavity block 23 to be illustrated, but the present invention is not limited thereto.Such as, a cotter mechanism also can be utilized to drive patrix inserts block 26.In this case, die cavity block 23 rigidity (rigid body) being supported on patrix die sleeve block 22, by making patrix inserts block 26 be elevated, die cavity height can being changed.In addition, to die cavity height uses cotter mechanism in order to change, the example of clamping is illustrated, but other drive source Direct driver die cavity block 23, the patrix inserts block 26 such as hydraulic pressure, ball-screw can also be utilized.

In addition, as thickness of slab changeable mechanism, to arranging work mounting s portion 37 respectively at two substrates 1 across plunger 36, utilizing each self-driven structure of cotter mechanism to be illustrated, but the present invention is not limited thereto.Such as also can be set to the structure possessed making the cotter mechanism be elevated respectively with the work mounting s portion 37 of these substrates 1 equal number when the both sides of plunger 36 configure multiple substrate 1.Specifically, servo motor 41, the cotter mechanism of counterdie drive division 8 is configured in the same manner as patrix drive division 7.In other words, by being configured to by counterdie drive division 8 overturn in the vertical direction with patrix drive division 7, also thickness can be adjusted more meticulously for the thickness of substrate 1.Such as, also can be set to following structure: respectively configure a substrate 1 in the left and right of three plungers 36 being arranged in row as shown in Figure 1, utilize after the thickness of slab respective with total six substrates 1 correspondingly have adjusted the height in work mounting s portion 37 respectively together with molding die 19 mold formed.

Claims

1. a resin moulded module, is characterized in that,

This resin moulded module is used for carrying out resin moulded to the workpiece being equipped with second component at the first component, wherein,

This resin moulded module comprises:

One mould, it utilizes the die cavity block forming mold cavity bottoms and the first inserts surrounding this die cavity block ground configuration to form die cavity recess, and this die cavity recess is configured for the die cavity holding described second component;

Another mould, it comprises work mounting s portion for supporting described workpiece and second inserts adjacent with described work mounting s portion;

Supply cylinder and plunger, this supply cylinder and plunger are assembled in any one in a described mould and another mould, for supplying moulded resin;

Die cavity alterable height mechanism, it moves along mould opening and closing direction by making described die cavity block, correspondingly changes the height of described die cavity recess with the height of described second component; And

Thickness of slab changeable mechanism, it moves along mould opening and closing direction relative to described second inserts by making described work mounting s portion, correspondingly changes the height in described work mounting s portion with the thickness of described first component,

Before injecting described moulded resin to described die cavity, correspondingly utilize described thickness of slab changeable mechanism to adjust the height in described work mounting s portion with the thickness of described first component, and correspondingly utilize the height of die cavity recess described in the institutional adjustment of described die cavity alterable height with the height of described second component.

2. resin moulded module according to claim 1, wherein,

Described die cavity alterable height mechanism is provided with cotter mechanism, and this cotter mechanism utilizes drive source to make movable ramp blocks move and regulate the position on the mould opening and closing direction of described die cavity block.

3. resin moulded module according to claim 1, wherein,

In described die cavity alterable height mechanism, the one in described die cavity block and described first inserts or both floating supports are in the die sleeve of a described mould.

4. the resin moulded module according to any one of claims 1 to 3, wherein,

Described thickness of slab changeable mechanism is provided with cotter mechanism, and this cotter mechanism utilizes drive source to make movable ramp blocks move and regulate the position on the mould opening and closing direction in described work mounting s portion.

5. the resin moulded module according to any one of Claims 1 to 4, wherein,

Be provided with illusory die cavity at the clamping face of described first inserts, hold described residual resin from described die cavity recess to described illusory die cavity.

6. resin moulded module according to claim 5, wherein,

The position of this resin moulded module illusory die cavity outer circumferential side side described in the ratio of described first inserts possesses closed block, and this closed block stops discharging air by the pressing clamping face relative with this closed block.

7. the resin moulded module according to any one of claim 1 ~ 6, wherein,

This resin moulded module possesses the mechanism of decompressor, and before a described mould and another mould mold closing, this mechanism of decompressor forms the enclosure space cut off with space outerpace, by decompression in this enclosure space is formed the pressure reduction space comprising described die cavity.

8. the resin moulded module according to any one of claim 1 ~ 7, wherein,

This resin moulded module possesses intermediate plate, the resin stream that this intermediate plate is formed with the through hole for holding described second component and is communicated with this through hole, and described in being superimposed on across the gap be supported between the first component peripheral end in described work mounting s portion and described second inserts, another mould clamping face uses.

9. resin moulded module according to claim 8, wherein,

Described in the ratio of described intermediate plate, the position of the first component outer circumferential side side is provided with illusory die cavity, holds described residual resin from described through hole to described illusory die cavity.

10. the resin moulded module according to any one of claim 1 ~ 9, wherein,

This resin moulded module possesses inclining rotary mechanism, the guiding face of the directed block of this inclining rotary mechanism guided, described die cavity block can be made to fascinate, and the side that the guiding of this guide stopper face and described die cavity block same is connected to the workpiece bearing surface of described second component contrary is oppositely disposed.

11. resin moulded modules according to any one of claim 1 ~ 10, wherein,

The described second component press surface of described die cavity block is formed as convex surface part, and the surrounding of this convex surface part is formed as the male and fomale(M&F) being formed with concave part.

12. resin moulded modules according to any one of claim 1 ~ 11, wherein,

This resin moulded module possesses mold release film, and the covering of this mold release film comprises a described mould clamping face of described die cavity recess and absorption is held in a described mould clamping face.

13. 1 kinds of resin molding apparatus, is characterized in that,

This resin molding apparatus possesses the resin moulded module according to any one of claim 1 ~ 12, and comprises Workpiece supply portion, utilizes described resin moulded module holding workpiece to carry out resin moulded pressure portion and the incorporating section of formed products, wherein,

Before injecting described moulded resin to die cavity, correspondingly setting the actuating quantity of described die cavity alterable height mechanism with the thickness of described first component and the height of described second component and after the height and position on the mould opening and closing direction of die cavity block is set in precalculated position, carry out resin moulded with clamping described first component.

14. resin molding apparatus according to claim 13, wherein,

Be adjacent to be provided with liquid resin supply unit with described pressure portion, supply nozzle is retreated motion and supply liquid resin in the supply cylinder of the molding die of the die sinking at place of described pressure portion.