CN105234585A - Lead-free aluminum copper alloy brazing material - Google Patents
Lead-free aluminum copper alloy brazing material Download PDFInfo
- Publication number
- CN105234585A CN105234585A CN201510769055.3A CN201510769055A CN105234585A CN 105234585 A CN105234585 A CN 105234585A CN 201510769055 A CN201510769055 A CN 201510769055A CN 105234585 A CN105234585 A CN 105234585A
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- China
- Prior art keywords
- lead
- brazing material
- copper alloy
- free
- rare earth
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a lead-free aluminum copper alloy brazing material. The lead-free aluminum copper alloy brazing material comprises, by mass, 11.3-14.5% of Zn, 4.2-5.9% of Al, 2.5-4.5% of Cr, 8.2-16.3% of Ag, 5.7-6.4% of Ni, 0.50-0.65% of Bi, 7.5-8.5% of Sn, 3.2-4.2% of rare earth elements, and the balance Cu. The lead-free aluminum copper alloy brazing material has good wetting spreading performance for materials like lead-free easily-cut aluminum copper alloy containing Bi, lead-free easily-cut copper alloy containing Si, lead-free easily-cut copper alloy containing Sb and lead-free easily-cut copper alloy containing Mg; the solidus temperature is 640-650 DEG C; the liquidus temperature is 770-780 DEG C; the elongation of the brazing material is greater than or equal to 15%; the tensile strength of the brazing material is greater than or equal to 300 MPa; the tensile strength of a brazing seam is greater than or equal to 220 MPa; the electrical conductivity (international annealed copper standard IACS) of the brazing material is greater than or equal to 80%.
Description
Technical field
The present invention relates to a kind of unleaded aluminium copper cored solder, belong to new material technology field.
Background technology
Along with the fast development of China's manufacturing industry, the continuous progress of manufacture level, output steady-state growth, particularly the continuous of silver price is risen in recent years, has higher requirement to " cost performance " of silver solder.As the mass percentage of silver reduces by 1% in silver solder, the material cost of 60 yuans can be saved.Meanwhile, along with the progress of the industry manufacturing technologies such as motor, electrical equipment, refrigeration, the plasticity of solder, intensity are had higher requirement.Therefore, the problem reducing silver content in BAg25CuZn silver solder must be researched and solved, also will improve plasticity and the intensity index of BAg25CuZn system silver solder simultaneously.
Summary of the invention
The object of the invention is to, a kind of unleaded aluminium copper cored solder is provided, changes the existence form of Zn in solder by alloying, improve the wetability of solder, intensity and electric conductivity.
The unleaded aluminium copper cored solder of one provided by the invention, brazing material comprises following component by mass percentage: Zn:11.3-14.5%, Al:4.2-5.9%, Cr:2.5-4.5%, Ag:8.2-16.3%, Ni:5.7-6.4%, Bi:0.50-0.65%, Sn:7.5-8.5%, rare earth element: 3.2-4.2%, all the other are Cu.
Further restriction technical scheme of the present invention: aforesaid unleaded aluminium copper cored solder, the chemical composition mass percentage of described rare earth element is: Nd:7-11%, Ce:12-18%, Ho:16-19%, Dy:5-12%, and surplus is La.
Aforesaid unleaded aluminium copper cored solder, described brazing material comprises following component by mass percentage: Zn:11.3%, Al:4.2%, Cr:2.5%, Ag:8.2%, Ni:5.7%, Bi:0.50%, Sn:7.5%, rare earth element: 3.2%, and all the other are Cu; The chemical composition mass percentage of its rare earth elements is: Nd:7.5%, Ce:12%, Ho:16%, Dy:5%, and surplus is La.
Further, aforesaid unleaded aluminium copper cored solder, described brazing material comprises following component by mass percentage: Zn:14.5%, Al:5.9%, Cr:4.5%, Ag:16.3%, Ni:6.4%, Bi:0.65%, Sn:8.5%, rare earth element: 4.2%, all the other are Cu; The chemical composition mass percentage of its rare earth elements is: Nd:11%, Ce:18%, Ho:19%, Dy:12%, and surplus is La.
Beneficial effect of the present invention: the present invention all has good wetting and spreading performance to containing the lead-free free-cutting aluminium copper of Bi, the Lead free cutting copper alloys containing Si, the Lead free cutting copper alloys containing Sb and the material such as Lead free cutting copper alloys containing Mg, solidus temperature is 640-650 DEG C, liquidus temperature is 770-780 DEG C, solder percentage elongation >=15%, solder tensile strength >=300MPa, brazed seam tensile strength >=220MPa, solder conductance (IACS) >=80%.
Detailed description of the invention
embodiment 1
The present embodiment provides a kind of unleaded aluminium copper cored solder, and described brazing material comprises following component by mass percentage: Zn:11.3%, Al:4.2%, Cr:2.5%, Ag:8.2%, Ni:5.7%, Bi:0.50%, Sn:7.5%, rare earth element: 3.2%, all the other are Cu; The chemical composition mass percentage of its rare earth elements is: Nd:7.5%, Ce:12%, Ho:16%, Dy:5%, and surplus is La.
embodiment 2
The present embodiment provides a kind of unleaded aluminium copper cored solder, and described brazing material comprises following component by mass percentage: Zn:14.5%, Al:5.9%, Cr:4.5%, Ag:16.3%, Ni:6.4%, Bi:0.65%, Sn:8.5%, rare earth element: 4.2%, all the other are Cu; The chemical composition mass percentage of its rare earth elements is: Nd:11%, Ce:18%, Ho:19%, Dy:12%, and surplus is La.
In addition to the implementation, the present invention can also have other embodiments.All employings are equal to the technical scheme of replacement or equivalent transformation formation, all drop on the protection domain of application claims.
Claims (4)
1. a unleaded aluminium copper cored solder, it is characterized in that: brazing material comprises following component by mass percentage: Zn:11.3-14.5%, Al:4.2-5.9%, Cr:2.5-4.5%, Ag:8.2-16.3%, Ni:5.7-6.4%, Bi:0.50-0.65%, Sn:7.5-8.5%, rare earth element: 3.2-4.2%, all the other are Cu.
2. unleaded aluminium copper cored solder according to claim 1, it is characterized in that: the chemical composition mass percentage of described rare earth element is: Nd:7-11%, Ce:12-18%, Ho:16-19%, Dy:5-12%, surplus is La.
3. unleaded aluminium copper cored solder according to claim 2, it is characterized in that: described brazing material comprises following component by mass percentage: Zn:11.3%, Al:4.2%, Cr:2.5%, Ag:8.2%, Ni:5.7%, Bi:0.50%, Sn:7.5%, rare earth element: 3.2%, all the other are Cu; The chemical composition mass percentage of its rare earth elements is: Nd:7.5%, Ce:12%, Ho:16%, Dy:5%, and surplus is La.
4. unleaded aluminium copper cored solder according to claim 2, it is characterized in that: described brazing material comprises following component by mass percentage: Zn:14.5%, Al:5.9%, Cr:4.5%, Ag:16.3%, Ni:6.4%, Bi:0.65%, Sn:8.5%, rare earth element: 4.2%, all the other are Cu; The chemical composition mass percentage of its rare earth elements is: Nd:11%, Ce:18%, Ho:19%, Dy:12%, and surplus is La.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510769055.3A CN105234585A (en) | 2015-11-12 | 2015-11-12 | Lead-free aluminum copper alloy brazing material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510769055.3A CN105234585A (en) | 2015-11-12 | 2015-11-12 | Lead-free aluminum copper alloy brazing material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105234585A true CN105234585A (en) | 2016-01-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510769055.3A Pending CN105234585A (en) | 2015-11-12 | 2015-11-12 | Lead-free aluminum copper alloy brazing material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105234585A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111151916A (en) * | 2019-12-26 | 2020-05-15 | 浙江大学 | Foil brazing filler metal for brazing sintered neodymium-iron-boron permanent magnet material and preparation method |
| CN111644777A (en) * | 2020-05-12 | 2020-09-11 | 江苏集萃先进金属材料研究所有限公司 | Low-temperature packaging material for ultrathin uniform-temperature plate and preparation method thereof |
-
2015
- 2015-11-12 CN CN201510769055.3A patent/CN105234585A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111151916A (en) * | 2019-12-26 | 2020-05-15 | 浙江大学 | Foil brazing filler metal for brazing sintered neodymium-iron-boron permanent magnet material and preparation method |
| CN111644777A (en) * | 2020-05-12 | 2020-09-11 | 江苏集萃先进金属材料研究所有限公司 | Low-temperature packaging material for ultrathin uniform-temperature plate and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160113 |