CN105185753A - 一种基于ltcc技术的单只裸声表面波芯片微型封装 - Google Patents
一种基于ltcc技术的单只裸声表面波芯片微型封装 Download PDFInfo
- Publication number
- CN105185753A CN105185753A CN201510498477.1A CN201510498477A CN105185753A CN 105185753 A CN105185753 A CN 105185753A CN 201510498477 A CN201510498477 A CN 201510498477A CN 105185753 A CN105185753 A CN 105185753A
- Authority
- CN
- China
- Prior art keywords
- acoustic wave
- surface acoustic
- wave chip
- ltcc
- naked
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510498477.1A CN105185753A (zh) | 2015-08-13 | 2015-08-13 | 一种基于ltcc技术的单只裸声表面波芯片微型封装 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510498477.1A CN105185753A (zh) | 2015-08-13 | 2015-08-13 | 一种基于ltcc技术的单只裸声表面波芯片微型封装 |
Publications (1)
Publication Number | Publication Date |
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CN105185753A true CN105185753A (zh) | 2015-12-23 |
Family
ID=54907744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201510498477.1A Pending CN105185753A (zh) | 2015-08-13 | 2015-08-13 | 一种基于ltcc技术的单只裸声表面波芯片微型封装 |
Country Status (1)
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CN (1) | CN105185753A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107301982A (zh) * | 2017-05-11 | 2017-10-27 | 西安空间无线电技术研究所 | 基于ltcc的cga一体化封装结构及其实现方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1495997A (zh) * | 2002-09-20 | 2004-05-12 | 富士通媒体部品株式会社 | 滤波器器件 |
JP2006066978A (ja) * | 2004-08-24 | 2006-03-09 | Kyocera Corp | 弾性表面波装置および通信装置 |
CN101590790A (zh) * | 2009-06-18 | 2009-12-02 | 上海交通大学 | 表面横向波动模式轮胎压力传感器 |
CN101644608A (zh) * | 2009-05-20 | 2010-02-10 | 中国科学院声学研究所 | 一种集成式的声表面波无线温度传感器 |
CN101986563A (zh) * | 2010-10-18 | 2011-03-16 | 华为技术有限公司 | 声表面滤波器及其制造方法 |
CN201781464U (zh) * | 2010-09-14 | 2011-03-30 | 湖南省新化县鑫星电子陶瓷有限责任公司 | 一种片式石英晶体谐振器 |
CN103138709A (zh) * | 2013-01-17 | 2013-06-05 | 天津大学 | 射频滤波器和射频多工器 |
CN103954823A (zh) * | 2014-05-14 | 2014-07-30 | 中国科学院声学研究所 | 声表面波电流传感器 |
CN104641556A (zh) * | 2012-09-19 | 2015-05-20 | 株式会社村田制作所 | 滤波器装置 |
-
2015
- 2015-08-13 CN CN201510498477.1A patent/CN105185753A/zh active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1495997A (zh) * | 2002-09-20 | 2004-05-12 | 富士通媒体部品株式会社 | 滤波器器件 |
JP2006066978A (ja) * | 2004-08-24 | 2006-03-09 | Kyocera Corp | 弾性表面波装置および通信装置 |
CN101644608A (zh) * | 2009-05-20 | 2010-02-10 | 中国科学院声学研究所 | 一种集成式的声表面波无线温度传感器 |
CN101590790A (zh) * | 2009-06-18 | 2009-12-02 | 上海交通大学 | 表面横向波动模式轮胎压力传感器 |
CN201781464U (zh) * | 2010-09-14 | 2011-03-30 | 湖南省新化县鑫星电子陶瓷有限责任公司 | 一种片式石英晶体谐振器 |
CN101986563A (zh) * | 2010-10-18 | 2011-03-16 | 华为技术有限公司 | 声表面滤波器及其制造方法 |
CN104641556A (zh) * | 2012-09-19 | 2015-05-20 | 株式会社村田制作所 | 滤波器装置 |
CN103138709A (zh) * | 2013-01-17 | 2013-06-05 | 天津大学 | 射频滤波器和射频多工器 |
CN103954823A (zh) * | 2014-05-14 | 2014-07-30 | 中国科学院声学研究所 | 声表面波电流传感器 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107301982A (zh) * | 2017-05-11 | 2017-10-27 | 西安空间无线电技术研究所 | 基于ltcc的cga一体化封装结构及其实现方法 |
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CB03 | Change of inventor or designer information |
Inventor after: Li Kai Inventor after: Wan Fei Inventor after: Yang Sichuan Inventor after: Chen Minghe Inventor after: Huang Xin Inventor before: Li Hong Inventor before: Wan Fei Inventor before: Yang Sichuan Inventor before: Chen Minghe Inventor before: Huang Xin |
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CB03 | Change of inventor or designer information | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151223 |
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RJ01 | Rejection of invention patent application after publication |