CN105143345A - 环氧树脂组合物和使用该组合物的发光装置 - Google Patents
环氧树脂组合物和使用该组合物的发光装置 Download PDFInfo
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- CN105143345A CN105143345A CN201480021974.6A CN201480021974A CN105143345A CN 105143345 A CN105143345 A CN 105143345A CN 201480021974 A CN201480021974 A CN 201480021974A CN 105143345 A CN105143345 A CN 105143345A
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- epoxy resin
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- 150000001875 compounds Chemical class 0.000 claims abstract description 89
- 239000004593 Epoxy Substances 0.000 claims abstract description 60
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 38
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 33
- 125000005373 siloxane group Chemical group [SiH2](O*)* 0.000 claims abstract description 11
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 5
- 150000003921 pyrrolotriazines Chemical class 0.000 claims description 20
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 12
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- 125000005350 hydroxycycloalkyl group Chemical group 0.000 claims description 2
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- 238000007711 solidification Methods 0.000 abstract description 2
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- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 description 7
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- BLPODHBKBPRTPG-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]phenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CC=2C=C(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C=C(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C=2)=C1 BLPODHBKBPRTPG-UHFFFAOYSA-N 0.000 description 1
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
- C08G59/3281—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
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- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34926—Triazines also containing heterocyclic groups other than triazine groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/06—Triglycidylisocyanurates
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Abstract
根据本发明的一个实施方式,本发明提供一种环氧树脂组合物,其包括:三嗪衍生物环氧化合物;包含脂环族环氧基团和硅氧烷基团的硅氧烷化合物;和固化剂;其中所述环氧树脂组合物包含相对于100重量份的硅氧烷化合物10至70重量份的硅氧烷基团,由此提供具有优异的耐热性、耐光性和超耐湿性,且具有对硅的良好剪切粘附并且能够半固体化的组合物。
Description
技术领域
本发明涉及环氧树脂组合物,并且更具体地涉及用于发光装置的环氧树脂组合物。
背景技术
包括发光元件如发光二极管(LED)的发光装置被用作各种应用的光源。随着半导体技术的发展,加速了发光元件朝向更高输出的趋势。因此,存在对于具有优异的耐光性、耐热性和超耐湿性(excessmoisturetolerance)的树脂组合物的需求,以便稳定地应付大量的光与热。
为了这个目的,使用了含有三嗪衍生物的环氧树脂组合物。这样的环氧树脂组合物具有优异的半固体化(semi-solidification)性能,但不能满足耐光性、耐热性和超耐湿性所需要的水平。具体而言,环氧树脂组合物容易受到黄化变色的影响,具有对有机硅的较差剪切粘附以及光透射持久率(lighttransmissionpersistencyrate)随时间而劣化,由此不利地影响使用该环氧树脂组合物的发光装置的可靠性。
发明公开内容
技术问题
因此,本发明的目的是提供一种环氧树脂组合物和使用该组合物的发光装置。
技术解决方案
根据本发明的一个实施方式,提供环氧树脂组合物,其包括:三嗪衍生物环氧化合物;包含脂环族环氧基团和硅氧烷基团的硅氧烷化合物;和固化剂;其中所述环氧树脂组合物包含相对于100重量份的硅氧烷化合物10至70重量份的硅氧烷基团。
三嗪衍生物环氧化合物包含异氰脲酸酯环,并且硅氧烷化合物由下式表示:
环氧基环烷基-CH2O-CO-羟基环烷基-OSiR1R2O-(SiR3R4O)n-SiR5R6O-羟基环烷基-CO-CH2O-环氧基环烷基
在此,R1至R6的每一个独立地选自H、Cl、Br、F、C1-C3烷基、C2-C3烯基和C2-C3炔基;并且n是正整数,其中环氧基环烷基或羟基环烷基的环烷基独立地为具有5至20个碳原子的环烷基。
该三嗪衍生物环氧化合物是三缩水甘油异氰脲酸酯(TGIC),并且该硅氧烷化合物由下式表示:
在此,R1至R6的每一个独立地选自H、Cl、Br、F、C1-C3烷基、C2-C3烯基和C2-C3炔基;并且n是正整数。
R1至R6的每一个独立地为甲基;并且2≤n≤8。
环氧树脂组合物包含相对于100重量份的环氧树脂组合物5至50重量份的三嗪衍生物环氧化合物和硅氧烷化合物。
此外,环氧树脂组合物包含相对于100重量份的三嗪衍生物环氧化合物和硅氧烷化合物10至60重量份的硅氧烷化合物。
根据本发明的另一个实施方式,提供一种发光装置,其包括:包含固化材料的模制体;和安装在所述模制体上的发光元件。固化材料包含环氧树脂组合物。环氧树脂组合物包含:三嗪衍生物环氧化合物;含有脂环族环氧基团和硅氧烷基团的硅氧烷化合物;和固化剂;其中环氧树脂组合物包含相对于100重量份的硅氧烷化合物10至70重量份的硅氧烷基团。
模制体包括凹陷部分,凹陷部分包括底侧和旁侧(lateralside)。发光元件安装在所述凹陷部分的底侧并且用密封构件密封。
发明的有益效果
根据本发明的实施方式,能够提供具有优异的耐光性、耐热性和超耐湿性,且能够半固体化并具有对有机硅的良好剪切粘附的环氧树脂组合物。因此,该环氧树脂组合物即使在长期暴露于过量的热或光下也能够防止黄化变色并且保持耐热性和耐光性,由此提供具有高效率的发光装置。
附图简要说明
图1示出了根据本发明的一个实施方式的发光装置。
图2示出包括根据本发明的一个实施方式的发光装置的发光设备。
图3示出包括根据本发明的一个实施方式的发光装置的背光组件。
本发明的最佳实施方式
因为本发明允许各种改变和众多的实施方式,将在附图中说明具体实施方式并对其进行详细描述。然而,本发明并不限定于特定的实施方式,并应被解释为包括包含在本发明的精神和范围内的所有修改、等价方式和替换方式。
虽然顺序数字如“第一”、“第二”等将被用于描述各种组件,但是这些组件不受这些术语的限制。该术语仅用于将一个组件与另一个组件区分。例如,在不脱离本发明构思的教导的情况下,第一组件可以称为第二组件,同样地,第二组件也可以被称为第一组件。此处使用的术语“和/或”包括一个或更多个相关所列项目的任何和所有组合。
本申请中使用的术语仅出于描述实施方式的目的,并且不旨在限制于示例性实施方式。本文所用的单数的表达方式也旨在包括复数的表达方式,除非其在上下文中具有明确相反的含义。在本申请中应该理解的是,在说明书中使用的术语“包括”和/或“具有”表示存在所描述的特征、数字、步骤、操作、组件、元件或其组合,但不排除存在或附加一个或多个其它特征、数字、步骤、操作、组件、元件或其组合。
除非另有不同定义,本文使用的包括技术和科学术语的所有术语具有与本发明所属领域的普通技术人员通常理解的术语相同的含义。应当理解的是,在通常使用的字典中定义的术语具有与相关技术中的术语相同的含义。只要在本申请中没有明确定义,该术语不应被解释为一个理想的或过于***的含义。
还应当理解的是,当将元件如层、膜、区域(region)或板等置于另一元件“之上”时,该元件可能被“直接”置于另一元件“之上”,或可能存在***元件。与之相比,当一个元件被“直接”置于另一元件“之上”时,不存在***元件。
下文中将参照附图详细描述本发明的实施方式,其中相同的附图标记将在所有不同的附图中指示相同或相似的组件,并且不再重复描述。
在整个说明书中,单位“重量%”与“重量份”是可交换使用的。
根据本发明的一个实施方式,环氧树脂组合物包括环氧化合物和固化剂。在这方面中,环氧化合物包括三嗪衍生物环氧化合物和包含脂环族环氧基和硅氧烷基的硅氧烷化合物。相对于10重量份的环氧化合物,环氧树脂组合物可以包含1至100重量份,优选为3至50重量份,更优选5至15重量份的量的固化剂。当相对于10重量份的环氧化合物包含1至100重量份的量的固化剂时,可以改善环氧树脂组合物的耐光性、耐热性、超耐湿性和固化性。并且,硅氧烷化合物包含10重量%到70重量%的硅氧烷基。
根据本发明的一个实施方式,环氧树脂组合物相对于环氧树脂组合物的总重量可以包括5重量%至50重量%的环氧化合物。在这方面中,环氧化合物包括三嗪衍生物环氧树脂化合物,和包括脂环族环氧基和硅氧烷基的硅氧烷化合物(以下称为“硅氧烷化合物”)。相对于环氧树脂组合物的总重量,不到5重量%的环氧化合物含量导致耐光性、耐热性和超耐湿性的劣化。相对于环氧树脂组合物的总重量,大于50重量%的环氧化合物含量导致较差的固化性。
在这方面中,相对于环氧化合物的总重量可以包含10重量%至60重量%的量的硅氧烷化合物。相对于环氧化合物的总重量,小于10重量%的硅氧烷化合物的含量劣化对发光元件中包括的有机硅填料的剪切粘附。相对于环氧化合物的总重量,大于60重量%的硅氧烷化合物的含量可以提供优异的耐热性和超耐湿性,但是难以半固体化。
在这方面,三嗪衍生物环氧化合物可以包含异氰脲酸酯环。包含异氰脲酸酯环的环氧化合物具有优异的耐光性和电绝缘性。三嗪衍生物环氧化合物可以是例如三缩水甘油异氰脲酸酯(TGIC),如下式1所表示的:
[式1]
硅氧烷化合物可以由下面的式2表示:
[式2]
环氧基环烷基-CH2O-CO-羟基环烷基-OSiR1R2O-(SiR3R4O)n-SiR5R6O-羟基环烷基-CO-CH2O-环氧基环烷基
在此,R1至R6的每一个独立地选自H、Cl、Br、F、C1-C3烷基、C2-C3烯基和C2-C3炔基;并且n是正整数。在这方面中,四个环烷基的每一个可以独立地为具有5至20个碳原子的环烷基。在整个说明书中,环氧基环烷基可以表示环脂族环氧基。
硅氧烷化合物还可以通过以下的式3来表示:
[式3]
在此,R1至R6的每一个独立地选自H、Cl、Br、F、C1-C3烷基、C2-C3烯基和C2-C3炔基。并且,n可以被指定为满足以下条件:相对于式3的含量,式4的含量为10重量%至70重量%、优选30重量%至60重量%,更优选35重量%至55重量%。在整个说明书中,式4可以被称为“硅氧烷基”。
[式4]
低于式3的硅氧烷化合物的10重量%的式4的硅氧烷化合物含量可能导致对发光元件中包括的有机硅填料的剪切粘附的劣化。高于式3的硅氧烷化合物的70重量%的式4的硅氧烷化合物含量可能导致难以半固体化。如果R1至R6的每一个为甲基,则n可以为1至16范围内的正整数,优选为2至8、更优选2至6、最优选3至5。即使R1至R6的任何一个均不是甲基,那么n可以被赋予不同值,以使相对于100重量%的式3的硅氧烷化合物包含10重量%至70重量%的量的式4的硅氧烷基。
根据本发明的一个实施方式,环氧树脂组合物可以进一步包括另一环氧化合物。例如,环氧树脂组合物可以进一步包括选自以下的至少一种:双酚A型环氧树脂、双酚F型环氧树脂、双酚环氧树脂(例如,3,3',5,5'四甲基-4,4'-联苯酚环氧树脂,或4,4'-联苯酚环氧树脂),酚醛清漆环氧树脂、甲酚酚醛清漆型环氧树脂、双酚A型酚醛环氧树脂、萘二酚环氧树脂、三苯基醇甲烷环氧树脂、四苯基醇乙烷环氧树脂和通过使苯酚二环戊二烯酚醛环氧树脂的芳香环氢化而得到的环氧树脂。
根据本发明的一个实施方式,环氧树脂组合物可以包括固化剂。相对于环氧树脂组合物的总重量可以包含5重量%至50重量%的量的固化剂。相对于环氧树脂组合物的总重量低于5重量%的固化剂含量导致固化缺陷和可靠性的劣化。相对于环氧树脂组合物的总重量大于50重量%的固化剂含量由于未反应的固化剂而最终导致超耐湿性的劣化。
包含在环氧树脂组合物中的固化剂可以是基于酸酐的固化剂。
基于酸酐的固化剂的实例可以包括选自以下的任何一种:十二碳烯基琥珀酸酐、聚(己二酸酐)、聚(壬二酸酐)、聚(癸二酸酐)、聚(乙基十八烷酸)酐、聚(苯基十六烷酸)酐、甲基四氢邻苯二甲酸酐、甲基六氢邻苯二甲酸酐、六氢邻苯二甲酸酐、无水甲基腐植酸(anhydrousmethylhymicacid)、四氢邻苯二甲酸酐、三烷基四氢邻苯二甲酸酐、甲基环己烯二碳酸酐、甲基环己烯四碳酸酐、邻苯二甲酸酐、无水偏苯三酸、无水苯均四酸、二苯甲酮四碳酸酐、乙二醇双偏苯三酸酯、hetic酐(heticanhydride)、纳迪克酸酐(nadicanhydride)、无水甲基纳迪克酸、5-(2,5-二氧代四氢-3-呋喃基)-3-甲基-3-环己烷-1,2-二碳酸酐、3,4-二羧基-1,2,3,4-四氢-1-萘琥珀酸二酐、1-甲基二羧基-1,2,3,4-四氢-1-萘琥珀酸二酐、以及它们的混合物。
环氧树脂组合物可以还包括固化促进剂。相对于环氧树脂组合物的总重量可以包括0.1重量%至2重量%的固化促进剂。固化促进剂的实例可以包括选自以下的任何一种:叔胺、咪唑、其有机羧酸酯、有机羧酸的金属盐、金属-有机螯合物、芳香锍盐、有机膦化合物、其盐、基于磷的固化促进剂(例如2-乙基-4-甲基咪唑、甲基三丁基鏻-二甲基磷酸酯、叔鏻溴化物等)、以及它们的混合物。
环氧树脂组合物可以包括0.1重量%至10重量%的添加剂。添加剂的实例可以包括分散剂、流平剂和抗氧化剂等等。抗氧化剂的实例可以包括选自以下的至少一种:基于酚的抗氧化剂、基于磷的抗氧化剂和基于硫的抗氧化剂。
基于酚的抗氧化剂的实例可以包括2,6-二叔丁基对甲酚、丁基化的羟基苯甲醚、2,6-二叔丁基-对乙基苯酚、硬脂基-β-(3,5-二叔丁基-4-羟基苯基)丙酸酯、2,2'-亚甲基双(4-甲基-6-叔丁基苯酚)、4,4'-亚丁基双(3-甲基-6-叔丁基苯酚)(4,4'-butyllidenebis(3-methyl-6-t-butylphenol))、3,9-双[1,1-二甲基-2-{β-(3-叔丁基-4-羟基-5-甲基苯基)丙酰基氧}乙基]2,4,8,10-四氧螺环[5,5]十一烷、1,1,3-三(2-甲基-4-羟基-5-叔丁基苯基)丁烷、1,3,5-三甲基2,4,6-三(3,5-二叔丁基4-羟基苄基)苯等。
基于磷的抗氧化剂的实例可以包括亚磷酸三苯基酯、亚磷酸二苯基烷基酯、亚磷酸苯基二烷基酯、亚磷酸三(壬基苯基)酯、亚磷酸三月桂基酯、亚磷酸三-十八烷基酯、二硬脂基季戊四醇二亚磷酸酯、三(2,4-二叔丁基苯基)亚磷酸酯、二异癸基季戊四醇二亚磷酸酯、二(2,4-二叔丁基苯基)季戊四醇二亚磷酸酯、三硬脂基山梨糖醇三磷酸酯和四(2,4-二叔丁基苯基)-4,4'-联苯二亚磷酸酯等。
基于硫的抗氧化剂的实例可以包括二月桂基-3,3'-硫代二丙酸酯、二肉豆蔻基-3,3'-硫代二丙酸酯(dimiristyl-3,3'-thiodipropionate)和二硬脂基-3,3'-硫代二丙酸酯等。
这些抗氧化剂可以单独或以其混合物使用。
环氧树脂组合物可以包括0.1重量%至10重量%的脱模剂。脱模剂可以促进将环氧树脂组合物模制之后的脱模。脱模剂的实例可以包括选自以下的任何一种:酯蜡(例如巴西棕榈蜡、褐煤酸、硬脂酸、高级脂肪酸、高级脂肪酸金属盐、褐煤酸酯等)、聚乙烯蜡、聚烯烃蜡以及它们的混合物。
根据本发明的一个实施方式,环氧树脂组合物可以应用至发光装置。例如,根据本发明的一个实施方式的环氧树脂组合物可以用于形成、模制或密封发光装置。
图1示出根据本发明的一个实施方式的发光装置。
参考图1,发光装置100包括由包含根据本发明的一个实施方式的环氧树脂组合物的固化材料形成的模制体110;以及安装在该模制体110上的发光元件120。
模制体110包括由底侧和旁侧构成的凹陷部分。发光元件120安装在凹陷部分的底侧并用密封构件130密封。
发光元件120具有一对电极,正和负。正电极和负电极通过导线140分别连接到引线112和114。密封构件130可以包括三嗪衍生物环氧化合物或硅氧烷化合物的至少一种。
在整个说明书中,发光装置可以与发光元件封装体互换使用。
根据本发明的一个实施方式,发光装置可用于各种应用,如发光设备、用于显示器的背光组件(BLU)、UHD(超高清晰度)电视、便携计算机、平板电脑、相机和移动电话等。
图2示出包括根据本发明的一个实施方式的发光装置的发光设备。
参考图2,发光设备200包括发光模块210、壳体220以及连接器终端230。
发光模块210容纳在壳体220中。连接器终端230连接至壳体220,以从外部电源(未示出)提供用于发光模块210的电能。虽然示例了连接器终端230通过使用插座被连接至外部电源,但是这并非意欲限制本发明。
发光模块210包括基板212和至少一个发光元件封装体214。至少一个发光元件封装体214被安装在基板212上。发光元件封装体214可以包括发光元件和包括根据本发明的一个实施方式的环氧树脂组合物的模制体。
图3示出包括根据本发明的一个实施方式的发光装置的背光组件。
参考图3,背光组件300包括导光面板310、发光模块320、反射构件330和底盖340。
导光面板310使光发生漫射以形成表面光源。发光模块320(其是待安装背光组件的显示器的光源)提供用于导光面板310的光。发光模块320包括基板322和至少一个发光元件封装体324。发光元件封装体324可以安装在基板322上。发光元件封装体324可以包括发光元件和包括根据本发明的一个实施方式的环氧树脂组合物的模制体。
反射构件330被形成于导光板310下方以将入射光反射在导光面板310的底侧上,使得光朝上以增强背光组件的亮度。
底盖340容纳导光面板310、发光模块320以及反射构件330。为了这个目的,底盖340可以是上侧开口的盒子的形式,其给出不是为了限制本发明。
以下,将参照实施例和比较例更详细地描述本发明。
<实施例1>
混合物由30重量%的式1的环氧化合物、20重量%的式3的环氧化合物(其中,R1至R6的每一个独立地为甲基;并且n为1以满足式4的有机硅化合物为式3的环氧化合物的10重量%)、47重量%的固化剂、1重量%的固化促进剂,1重量%的添加剂和1重量%的脱模剂制成,然后使其经受热处理,得到实施例1的最终产物。
<实施例2>
混合物由30重量%的式1的环氧化合物、20重量%的式3的环氧化合物(其中,R1至R6的每一个独立地为甲基;并且n为2以满足式4的有机硅化合物为式3的环氧化合物的30重量%)、47重量%的固化剂、1重量%的固化促进剂,1重量%的添加剂和1重量%的脱模剂制成,然后使其经受热处理,得到实施例2的最终产物。
<实施例3>
混合物由30重量%的式1的环氧化合物、20重量%的式3的环氧化合物(其中,R1至R6的每一个独立地为甲基;并且n为5以满足式4的有机硅化合物为式3的环氧化合物的50重量%)、47重量%的固化剂、1重量%的固化促进剂,1重量%的添加剂和1重量%的脱模剂制成,然后使其经受热处理,得到实施例3的最终产物。
<实施例4>
混合物由30重量%的式1的环氧化合物、20重量%的式3的环氧化合物(其中,R1至R6的每一个独立地为甲基;并且n为14以满足式4的有机硅化合物为式3的环氧化合物的70重量%)、47重量%的固化剂、1重量%的固化促进剂,1重量%的添加剂和1重量%的脱模剂制成,然后使其经受热处理,得到实施例4的最终产物。
<比较例1>
混合物由50重量%的式1的环氧化合物、47重量%的固化剂、1重量%的固化促进剂,1重量%的添加剂和1重量%的脱模剂制成,然后使其经受热处理,得到比较例1的最终产物。
<比较例2>
混合物由50重量%的式3的环氧化合物(其中,R1至R6的每一个独立地为甲基;并且n为5以满足式4的有机硅化合物为式3的环氧化合物的50重量%)、47重量%的固化剂、2重量%的固化促进剂和添加剂、和1重量%的脱模剂制成,然后使其经受热处理,得到比较例2的最终产物。
使实施例1至4和比较例1和2的最终产品的每一个模制并在有机硅上固化,然后测量对于有机硅的剪切粘附。此外,使实施例1至4和比较例1和2的最终产品的每一个暴露于波长为450nm的光以测量初始的光透射率。最后,使实施例1至4和比较例1和2的最终产品的每一个在175℃下暴露于波长为450nm的光24个小时以测量光透射持久率。测量结果示于表1中。
表1
测试序号 | 剪切粘附 | 初始的光透射率 | 光透射持久率 |
实施例1 | △ | 91% | 92% |
实施例2 | △ | 92% | 92% |
实施例3 | O | 92% | 94% |
实施例4 | O | 91% | 90% |
比较例1 | X | 90% | 90% |
比较例2 | O | 93% | 89% |
参照表1,作为比较例1的仅包含三嗪衍生物环氧化合物的环氧树脂组合物具有对有机硅的较差剪切粘附,低水平的初始光透射率和为90%或更低的光透射持久率。此外,作为比较例2的仅包含硅氧烷化合物的环氧树脂组合物具有对有机硅的良好剪切粘附和良好的初始光透射率,但是具有为90%或更低的低的光透射持久率。
反之,作为实施例1至4的包含三嗪衍生物环氧化合物和式3的硅氧烷化合物二者的环氧树脂组合物具有优异的对有机硅的剪切粘附、初始光透射率和光透射持久率。具体而言,在实施例3的组合物的情况下,即当包含三嗪衍生物环氧化合物和式3的硅氧烷化合物二者并且式3的硅氧烷化合物含有约50重量%的硅氧烷基团时,环氧树脂组合物可以具有最优异的对有机硅的剪切粘附、初始光透射率和光透射持久率。
虽然本发明已经参照其优选实施方式进行了具体说明和描述,但是可以做出各种修改或变化而不脱离本发明的范围。
100:发光装置
110:模制体
120:发光
130:密封构件
Claims (8)
1.一种环氧树脂组合物,其包含:
三嗪衍生物环氧化合物;
硅氧烷化合物,其包含环脂族环氧基团和硅氧烷基团;和
固化剂;
其中所述环氧树脂组合物包含相对于100重量份的硅氧烷化合物10至70重量份的硅氧烷基团。
2.如权利要求1所述的环氧树脂组合物,其中所述三嗪衍生物环氧化合物包含异氰脲酸酯环,所述硅氧烷化合物由下式表示:
环氧基环烷基-CH2O-CO-羟基环烷基-OSiR1R2O-(SiR3R4O)n-SiR5R6O-羟基环烷基-CO-CH2O-环氧基环烷基
其中R1至R6的每一个独立地选自H、Cl、Br、F、C1-C3烷基、C2-C3烯基和C2-C3炔基;n是正整数,
其中所述环氧基环烷基或所述羟基环烷基的环烷基独立地为具有5至20个碳原子的环烷基。
3.如权利要求2所述的环氧树脂组合物,其中所述三嗪衍生物环氧化合物是三缩水甘油异氰脲酸酯(TGIC),所述硅氧烷化合物由下式表示:
其中R1至R6的每一个独立地选自H、Cl、Br、F、C1-C3烷基、C2-C3烯基和C2-C3炔基;并且n是正整数。
4.如权利要求3所述的环氧树脂组合物,其中R1至R6的每一个独立地为甲基;并且2≤n≤8。
5.如权利要求4所述的环氧树脂组合物,其中所述环氧树脂组合物包含相对于100重量份的环氧树脂组合物5至50重量份的三嗪衍生物环氧化合物和硅氧烷化合物。
6.如权利要求5所述的环氧树脂组合物,其中所述环氧树脂组合物包含相对于100重量份的三嗪衍生物环氧化合物和硅氧烷化合物10至60重量份的硅氧烷化合物。
7.一种发光装置,其包括:
包含固化材料的模制体;和
安装在所述模制体上的发光元件,
其中所述固化材料包含环氧树脂组合物,所述环氧树脂组合物包含:三嗪衍生物环氧化合物、含有脂环族环氧基团和硅氧烷基团的硅氧烷化合物和固化剂,
其中所述环氧树脂组合物包含相对于100重量份的硅氧烷化合物10至70重量份的硅氧烷基团。
8.如权利要求7所述的发光装置,其中所述模制体包括凹陷部分,所述凹陷部分包括底侧和旁侧,
其中所述发光元件安装在所述凹陷部分的底侧并且用密封构件密封。
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KR20140102476A (ko) | 2014-08-22 |
KR102007194B1 (ko) | 2019-08-05 |
WO2014126366A1 (en) | 2014-08-21 |
CN105143345B (zh) | 2017-11-24 |
US20160005937A1 (en) | 2016-01-07 |
US9812618B2 (en) | 2017-11-07 |
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