CN105127612A - Lead-free solder paste - Google Patents
Lead-free solder paste Download PDFInfo
- Publication number
- CN105127612A CN105127612A CN201510622740.3A CN201510622740A CN105127612A CN 105127612 A CN105127612 A CN 105127612A CN 201510622740 A CN201510622740 A CN 201510622740A CN 105127612 A CN105127612 A CN 105127612A
- Authority
- CN
- China
- Prior art keywords
- lead
- parts
- tin cream
- powder
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses lead-free solder paste which comprises the following components: 80 parts of tin powder, 6 parts of silver powder, 3 parts of copper powder, 6 parts of tin-silver alloy, 4 parts of tin-copper alloy and 1 part of scaling powder. With the adoption of the lead-free solder paste provided by the invention, the advantages of uniform dispersion, high easiness in welding, high firmness in welding spots, long service life, stable performance, extensive sources and high safety in use and the like are achieved, and a wide market prospect in popularization of lead-free solder paste is further achieved.
Description
Technical field
The present invention relates to electrophile field, particularly relate to a kind of lead-free tin cream.
Background technology
Tin cream is widely used in field of industrial production, tin cream has certain viscosity at normal temperatures, can be bonded at commitment positions by the beginning of electronic devices and components, under welding temperature, along with the volatilization of solvent and portions additive, welded components and parts are formed permanent connection together with printed circuit pad solder.
Wherein fusing point tin cream many employings tin Pb-Sn paste of being greater than 200 degrees Celsius, has certain injury, harm environment to human body, is unfavorable for permanent use.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of lead-free tin cream, by adopting the powdered granule Homogeneous phase mixing of tin, copper, silver and alloy thereof, form the solder(ing) paste of stable and uniform, be uniformly dispersed, upper weldering be easy, solder joint firmly, long service life, stable performance, wide material sources, use safety, lead-free tin cream universal on have market prospects widely.
For solving the problems of the technologies described above, the invention provides a kind of lead-free tin cream, composition proportion comprises:
Glass putty 80 parts,
6 parts, silver powder,
Copper powder 3 parts,
Sn-ag alloy 6 parts,
Gun-metal 4 parts,
Scaling powder 1 part.
In a preferred embodiment of the present invention, the particle size range of described glass putty, silver powder, copper powder is 25-30 micron.
In a preferred embodiment of the present invention, the particle size range of described sn-ag alloy, gun-metal is 35-45 micron.
In a preferred embodiment of the present invention, described scaling powder comprises activator, thixotropic agent, resin and solvent.
In a preferred embodiment of the present invention, the fusing point of described lead-free tin cream is 215-220 DEG C.
The invention has the beneficial effects as follows: lead-free tin cream of the present invention have be uniformly dispersed, upper weldering is easy, solder joint firmly, long service life, stable performance, wide material sources, the advantage such as use safety, lead-free tin cream universal on have market prospects widely.
Detailed description of the invention
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the present invention comprises:
A kind of lead-free tin cream, composition proportion comprises:
Glass putty 80 parts,
6 parts, silver powder,
Copper powder 3 parts,
Sn-ag alloy 6 parts,
Gun-metal 4 parts,
Scaling powder 1 part, adopts tin, copper, silver and alloy thereof to replace traditional tin Pb-Sn paste, nontoxic, wide material sources, use safety.
Preferably, the particle size range of described glass putty, silver powder, copper powder is 25-30 micron.
Preferably, the particle size range of described sn-ag alloy, gun-metal is 35-45 micron, adopt the powdered granule Homogeneous phase mixing of metal and alloy thereof, form the solder(ing) paste of stable and uniform, be uniformly dispersed, upper weldering is easy, solder joint firmly, long service life, stable performance.
Preferably, described scaling powder comprises activator, thixotropic agent, resin and solvent, wherein activator effectively can be removed the oxidation material of welding position, reduce the surface tension of tin cream, thixotropic agent effectively can regulate the viscosity of tin cream and printing performance, effectively prevent from occurring the situations such as hangover, adhesion in welding, resin be mainly used in improving tin cream adhesiveness, prevent from reoxidizing, appropriate solvent adds the service life can played in the whipping process of tin cream and regulate uniform effect, effectively improve tin cream.
Preferably, the fusing point of described lead-free tin cream is 215-220 DEG C, and upper tin is easy, solder joint is firm.
The beneficial effect of lead-free tin cream of the present invention is:
One, by adopting tin, copper, silver and alloy thereof to replace traditional tin Pb-Sn paste, nontoxic, wide material sources, use safety;
Two, by adopting the powdered granule Homogeneous phase mixing of metal and alloy thereof, form the solder(ing) paste of stable and uniform, be uniformly dispersed, upper weldering is easy, solder joint firmly, long service life, stable performance.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (5)
1. a lead-free tin cream, is characterized in that, composition proportion comprises:
Glass putty 80 parts,
6 parts, silver powder,
Copper powder 3 parts,
Sn-ag alloy 6 parts,
Gun-metal 4 parts,
Scaling powder 1 part.
2. lead-free tin cream according to claim 1, is characterized in that, the particle size range of described glass putty, silver powder, copper powder is 25-30 micron.
3. lead-free tin cream according to claim 1, is characterized in that, the particle size range of described sn-ag alloy, gun-metal is 35-45 micron.
4. lead-free tin cream according to claim 1, is characterized in that, described scaling powder comprises activator, thixotropic agent, resin and solvent.
5. lead-free tin cream according to claim 1, is characterized in that, the fusing point of described lead-free tin cream is 215-220 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510622740.3A CN105127612A (en) | 2015-09-28 | 2015-09-28 | Lead-free solder paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510622740.3A CN105127612A (en) | 2015-09-28 | 2015-09-28 | Lead-free solder paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105127612A true CN105127612A (en) | 2015-12-09 |
Family
ID=54713361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510622740.3A Pending CN105127612A (en) | 2015-09-28 | 2015-09-28 | Lead-free solder paste |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105127612A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020155024A1 (en) * | 2000-10-27 | 2002-10-24 | H-Technologies Group, Inc. | Lead-free solder compositions |
| US20030003011A1 (en) * | 2001-06-15 | 2003-01-02 | Rikiya Kato | Lead-free solder balls and method for the production thereof |
| CN1506188A (en) * | 2002-12-06 | 2004-06-23 | �Ҵ���˾ | Structure and method for leadless welding flux electronic packaging interconnection |
| US20040217152A1 (en) * | 2000-08-22 | 2004-11-04 | Senju Metal Industry Co., Ltd. | Lead-free solder paste for reflow soldering |
| CN1565790A (en) * | 2003-06-16 | 2005-01-19 | 倪潮春 | Lead free tin cream and preparation process |
| CN1681618A (en) * | 2002-09-18 | 2005-10-12 | 国际商业机器公司 | Solder hierarchy for lead free solder joint |
| CN101244491A (en) * | 2008-03-21 | 2008-08-20 | 天津市青禾科技发展有限公司 | Lead-free solder solder paste for electronic industry and method for manufacturing soldering fluid |
| CN104043911A (en) * | 2014-06-27 | 2014-09-17 | 深圳市汉尔信电子科技有限公司 | Lead-free solder capable of achieving evenly organized soldering spots and soldering method thereof |
-
2015
- 2015-09-28 CN CN201510622740.3A patent/CN105127612A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040217152A1 (en) * | 2000-08-22 | 2004-11-04 | Senju Metal Industry Co., Ltd. | Lead-free solder paste for reflow soldering |
| US20020155024A1 (en) * | 2000-10-27 | 2002-10-24 | H-Technologies Group, Inc. | Lead-free solder compositions |
| US20030003011A1 (en) * | 2001-06-15 | 2003-01-02 | Rikiya Kato | Lead-free solder balls and method for the production thereof |
| CN1681618A (en) * | 2002-09-18 | 2005-10-12 | 国际商业机器公司 | Solder hierarchy for lead free solder joint |
| CN1506188A (en) * | 2002-12-06 | 2004-06-23 | �Ҵ���˾ | Structure and method for leadless welding flux electronic packaging interconnection |
| CN1565790A (en) * | 2003-06-16 | 2005-01-19 | 倪潮春 | Lead free tin cream and preparation process |
| CN101244491A (en) * | 2008-03-21 | 2008-08-20 | 天津市青禾科技发展有限公司 | Lead-free solder solder paste for electronic industry and method for manufacturing soldering fluid |
| CN104043911A (en) * | 2014-06-27 | 2014-09-17 | 深圳市汉尔信电子科技有限公司 | Lead-free solder capable of achieving evenly organized soldering spots and soldering method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151209 |