JP2015174129A - Liquid metal joining material and joining method therefor - Google Patents
Liquid metal joining material and joining method therefor Download PDFInfo
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本発明は、常温に於いて液体状態となる金属又は金属化合物を主成分とする導電性接合材に関する。 The present invention relates to a conductive bonding material mainly composed of a metal or a metal compound that is in a liquid state at room temperature.
一般に、電子部品等の通電性を要する接合には、はんだ合金を主成分とする接合材や導電性物質を硬化性樹脂に含有させた導電性ペースト等が用いられている。
また、最近では電子機器の発達が目覚ましく、スマートフォン向けのフレキシブルＯＬＥＤパネルに代表されるように、薄く形状を変化させることができる構造を取るものもみられ、それら電子機器の接合に求められる形状や特性も多様化している。
In general, a bonding material mainly composed of a solder alloy, a conductive paste containing a conductive material in a curable resin, or the like is used for bonding that requires electrical conductivity, such as an electronic component.
Recently, the development of electronic devices has been remarkable, and some of them have thin structures that can be changed in shape, as represented by flexible OLED panels for smartphones. Shapes and characteristics required for joining these electronic devices Are also diversifying.
一方、導電性接合に於いても、多様化する接合対象に応じた形状や用途の提案がなされている。
例えば、はんだ合金を主成分とする接合材の場合、従来のディップはんだ付けの他、ペーストタイプ、ボールタイプ、並びにリボンタイプ等の形状に加工され、多様化する用途に応じて使い分けられている。
しかし、はんだ合金を主成分とする接合材の場合、はんだ合金を溶融する温度に加熱することが接合の必須条件となっている。
また、導電性物質を硬化性樹脂に含有させた導電性ペーストの場合も、樹脂が硬化する温度に加熱する必要が接合の条件となっている。
On the other hand, in the conductive bonding, there are proposals for shapes and uses according to diversified bonding objects.
For example, in the case of a joining material mainly composed of a solder alloy, it is processed into shapes such as a paste type, a ball type, and a ribbon type in addition to the conventional dip soldering, and is used properly according to diversified applications.
However, in the case of a joining material mainly composed of a solder alloy, heating to a temperature at which the solder alloy is melted is an essential condition for joining.
In the case of a conductive paste containing a conductive substance in a curable resin, it is necessary to heat the resin to a temperature at which the resin is cured.
このように、従来の導電性を要する接合材の場合、接合時に加熱することが必要となり、接合する対象物に負荷をかけているのが現状である。
一方では、今後益々電子機器の多様化が予想される中、それに対応した導電性を必要とする接合材も求められており、当然のことながら、熱負荷によるストレスを嫌う電子部品や導電性を必要とする部材の接合材が必要となっている。
また、生体等加熱ができない環境下での導電性を必要とする接合に用いることができる接合材も求められている。
As described above, in the case of a conventional bonding material that requires electrical conductivity, it is necessary to heat at the time of bonding, and the current situation is that a load is applied to the objects to be bonded.
On the other hand, as the diversification of electronic devices is expected in the future, there is also a need for bonding materials that require electrical conductivity corresponding to them. A joining material for the necessary members is required.
There is also a need for a bonding material that can be used for bonding that requires electrical conductivity in an environment where heating such as a living body cannot be performed.
本発明は、熱負荷によるストレスを嫌う電子部品や生体等、加熱ができない環境下での導電性を必要とする接合に用いることのできる接合材及び接合方法の提供を目的とする。 An object of this invention is to provide the joining material and joining method which can be used for the joining which requires the electroconductivity in the environment which cannot heat, such as an electronic component and a biological body which dislike the stress by heat load.
本発明者は、上記目的を達成すべく鋭意検討を重ねた結果、液状金属に着目し、加熱を必要としない条件で接合界面層に金属間化合物層を形成する組成を見出し、本発明を完成するに至った。 As a result of intensive studies to achieve the above object, the present inventors have focused on liquid metal, found a composition for forming an intermetallic compound layer in a bonding interface layer under conditions that do not require heating, and completed the present invention. It came to do.
すなわち、本発明は、ガリウム（Ｇａ）、インジウム（Ｉｎ）、及びスズ（Ｓｎ）の共晶合金であるガリンスタン、及び当該組成に特定の金属であるＧａ、Ｉｎ、Ｓｎ、Ｎａ、Ｋ、Ｒｂ、Ｃｓ、Ｐ、Ｃｕ、Ａｇ、Ａｕ、Ｎｉ、Ａｌ、Ｂｉ、Ｔｉ、及びＳｂから選ばれる１種又は２種以上を含有させて、接合界面に金属化合物である金属間化合物層を形成させることにより、高い接合信頼性と接合界面の浸食を防ぐ優れた接合特性を有する液状金属接合材、並びに当該液状金属接合材を用いた接合方法である。 That is, the present invention relates to galinstan which is a eutectic alloy of gallium (Ga), indium (In), and tin (Sn), and Ga, In, Sn, Na, K, Rb, which are metals specific to the composition. By containing one or more selected from Cs, P, Cu, Ag, Au, Ni, Al, Bi, Ti, and Sb, and forming an intermetallic compound layer that is a metal compound at the bonding interface A liquid metal bonding material having high bonding reliability and excellent bonding characteristics that prevent erosion of the bonding interface, and a bonding method using the liquid metal bonding material.
本発明によれば、接合時に加熱を必要としない接合材であるため、熱負荷によるストレスを嫌う電子部品や導電性を必要とする部材、生体等加熱ができない環境下での導電性を必要とする接合が可能になり、接合界面では金属間化合物層を形成するために従来のはんだ接合と同様の信頼性の高い効果も期待でき、多様化する電子機器の接合等に広く応用が期待できる。 According to the present invention, since it is a bonding material that does not require heating at the time of bonding, it is necessary to have electrical conductivity in an environment where heating is not possible, such as electronic parts that dislike stress due to heat load, members that require conductivity, and living bodies. As a result of the formation of an intermetallic compound layer at the bonding interface, it can be expected to have the same highly reliable effect as conventional solder bonding, and can be widely applied to diversified electronic devices.
以下に、本発明について詳細に説明する。
従来、加熱を必要としない接着には、特許文献１で開示されているように硬化タイプの樹脂が使用されている。
また、水銀やガリンスタン等の液状金属に代表される導電性を有する材質は、特許文献２で開示されているように単なる導電材として、また、特許文献３で開示されているようにスイッチ装置の導電性流体として使用されている。
しかし、特許文献１の技術は導電性を有したものではなく、特許文献２及び特許文献３では、確かに液状金属が導電材として用いられていることが例示されているが、電子部品等への接合を目的としたものではない。
The present invention is described in detail below.
Conventionally, for bonding that does not require heating, a curable resin is used as disclosed in
In addition, a conductive material typified by a liquid metal such as mercury or galinstan is used as a mere conductive material as disclosed in
However, the technique of
本発明は、接合界面に金属化合物層を形成すること並びに接合界面の腐食を防止する効果を有した液状金属接合材、及び当該接合材を用いた接合方法である。
なお、本発明の液状金属接合材の性状に関して、液状とはＪＩＳ−８７０３で定められている常温、即ち２０℃±１５℃（５℃〜３５℃）で、流動性を有した状態のことを言う。
The present invention is a liquid metal bonding material having an effect of forming a metal compound layer at a bonding interface and preventing corrosion of the bonding interface, and a bonding method using the bonding material.
In addition, regarding the properties of the liquid metal bonding material of the present invention, the liquid state is a state having fluidity at a normal temperature defined in JIS-8703, that is, 20 ° C. ± 15 ° C. (5 ° C. to 35 ° C.). say.
本発明に使用できる液状金属接合材は、接合界面に金属化合物層を形成する液状金属であれば特に制限はない。
図１を用いて説明すると、本発明の液状金属接合材を用いて電子部品等を接合した場合、液状金属接合材３と電子部品４の接合界面５には、金属化合物層６が形成される。
通常、はんだ等の金属接合材を用いて接合した場合、接合界面には金属化合物が形成されることにより、接合強度が向上することが知られている。
本発明の液状金属接合材を用いた場合も、はんだ接合時の接合界面に形成される金属化合物と同様の作用を有し、接合信頼性が向上すると考えられる。
そして、本発明の液状金属接合材の組成としては、ガリウム（Ｇａ）、インジウム（Ｉｎ）、及びスズ（Ｓｎ）の共晶合金であるガリンスタン、及び液状組成を有する範囲に於いてガリンスタンにＧａ、Ｉｎ、Ｓｎ、Ｎａ、Ｋ、Ｒｂ、Ｃｓ、Ｐ、Ｃｕ、Ａｇ、Ａｕ、Ｎｉ、Ａｌ、Ｂｉ、Ｔｉ、及びＳｂから選ばれる１種又は２種以上を適量添加した合金が例示できる。
すなわち、本発明の液状金属接合材がガリンスタン、及び液状組成を有する範囲に於いてガリンスタンにＧａ、Ｉｎ、Ｓｎ、Ｎａ、Ｋ、Ｒｂ、Ｃｓ、Ｐ、Ｃｕ、Ａｇ、Ａｕ、Ｎｉ、Ａｌ、Ｂｉ、Ｔｉ、及びＳｂから選ばれる１種又は２種以上を適量添加した合金組成であるため、一般的な電子基板材質のＣｕ及び一般的な電子部品接合部表面であるＣｕ、Ｎｉ及びＡｕ等と接合界面に於いて金属化合物である金属間化合物の層を形成し、形成した金属間化合物層が接合部に存在する液状金属接合材となじみ、導電性が高く、接合信頼特性に優れた接合を生じると考えられる。
また、本発明の液状金属接合材の組成であるＳｎ、Ｉｎ、Ｃｕ等と接合界面に於いて化合物を形成する成分を添加した場合に形成する金属化合物である金属間化合物は、接合対象の浸食を防止する効果も有すると考えられ、接合材としてより高い接合特性が期待できる。
The liquid metal bonding material that can be used in the present invention is not particularly limited as long as it is a liquid metal that forms a metal compound layer at the bonding interface.
Referring to FIG. 1, when an electronic component or the like is bonded using the liquid metal bonding material of the present invention, a
Usually, when joining using metal joining materials, such as solder, it is known that joining strength will improve by forming a metal compound in a joining interface.
Even when the liquid metal bonding material of the present invention is used, it has the same effect as the metal compound formed at the bonding interface at the time of solder bonding, and it is considered that the bonding reliability is improved.
The composition of the liquid metal bonding material of the present invention includes a gallium stun that is a eutectic alloy of gallium (Ga), indium (In), and tin (Sn), and in the range having the liquid composition, Ga, Examples of the alloy include an appropriate amount of one or more selected from In, Sn, Na, K, Rb, Cs, P, Cu, Ag, Au, Ni, Al, Bi, Ti, and Sb.
That is, in the range in which the liquid metal bonding material of the present invention has a galinstan and a liquid composition, the galinstan has Ga, In, Sn, Na, K, Rb, Cs, P, Cu, Ag, Au, Ni, Al, Bi. Cu, Ni, Au, etc., which is a general electronic substrate material Cu and a general electronic component joint surface, because it is an alloy composition in which an appropriate amount of one or more selected from Ti, Sb and Sb is added Forms an intermetallic compound layer, which is a metal compound, at the bonding interface, and the formed intermetallic compound layer is compatible with the liquid metal bonding material present in the bonding portion, and has high electrical conductivity and excellent bonding reliability. It is thought to occur.
In addition, an intermetallic compound, which is a metal compound formed when a component that forms a compound at the bonding interface with Sn, In, Cu, etc., which is the composition of the liquid metal bonding material of the present invention, is eroded by the bonding target. It is thought that it also has the effect which prevents that, and a higher joining characteristic can be anticipated as a joining material.
本発明の液状金属接合材の接合に於ける使用量は、本発明の効果を有する範囲に於いて特に制限はなく、使用する液状金属接合材自体も段落００１３に示す液状金属接合材組成のみでなくても本発明の効果を有する量を配合すればよく、１００％〜９０％が好ましい。
また、当該液状金属接合材以外に配合する物質に関しても、本発明の効果を有する範囲に於いて特に制限はない。
そして、本発明の液状金属接合材は、接合対象に対するヌレ性にも優れている。
The amount used in the joining of the liquid metal joining material of the present invention is not particularly limited within the range having the effect of the present invention, and the liquid metal joining material itself used is only the composition of the liquid metal joining material shown in paragraph 0013. Even if not, an amount having the effect of the present invention may be added, and 100% to 90% is preferable.
Moreover, there is no restriction | limiting in particular in the range which has the effect of this invention also regarding the substance mix | blended other than the said liquid metal joining material.
And the liquid metal joining material of this invention is excellent also in the wet property with respect to joining object.
次に、本発明の液状金属接合材を用いた接合方法について説明する。
本発明の液状金属化合物は、常温に於いて流動性を有する性状であるため、はんだ合金等の接合材のように、単独で接合対象を固定することは困難である。
そこで、接合時には液状金属接合材の移動を制限する封止材が必要となる。
図２に本発明の液状金属接合材を用いた接合のイメージを示す。
Next, a bonding method using the liquid metal bonding material of the present invention will be described.
Since the liquid metal compound of the present invention has fluidity at room temperature, it is difficult to fix the object to be joined alone like a joining material such as a solder alloy.
Therefore, a sealing material that restricts the movement of the liquid metal bonding material is required at the time of bonding.
FIG. 2 shows an image of bonding using the liquid metal bonding material of the present invention.
図２に示すように、基板１上に本発明の液状金属接合材３をディスペンサー等で塗布し、接合対象の電子部品４を接着させ、封止材２で、当該液状金属接合材３と基板１並びに電子部品４を接着させて、液状金属接合材が移動しないようにする。
また、接合方法に関して、基板１と電子部品４を封止材２で固着した後、液状金属接合材を接合部にディスペンサー等で注入した後、注入口を塞ぐ方法でも構わない。
As shown in FIG. 2, the liquid
Further, regarding the bonding method, after the
本発明の液状金属接合材を用いた接合方法に使用する封止材としては、常温にて固化して当該液状金属接合材３が接合部からの移動が防止でき、しかも、基板１や電子部品４、及び液状金属接合材３に腐食等の悪影響を与えない素材であれば、特に制限はなく、ＥＶＡ、ＰＥ及びナイロン等の高分子、エポキシ樹脂やシリコーン樹脂等が例示できる。
As a sealing material used in the joining method using the liquid metal joining material of the present invention, the liquid
そして、本発明の液状金属接合材を用いた接合方法に於いて、使用する封止材を固化する条件は、常温にて行う範囲に於いて、本発明の効果を有する条件であれば特に制限はない。 In the bonding method using the liquid metal bonding material of the present invention, the conditions for solidifying the sealing material to be used are not particularly limited as long as the conditions have the effects of the present invention within the range to be performed at room temperature. There is no.
本発明の液状金属接合材並びに液状金属接合材を用いた接合方法によれば、常温にて導電性を有する接合が可能となり、しかも、接合部に外力がかかり編傾倒した場合に於いても、液状である特性を有することで、接合部の形状が変化することで応力を緩和しながら接合特性を維持することが可能となり、接合対象の特性や形状や適応した高い信頼性を有する接合が可能となるため、広く産業に応用が期待できる。 According to the bonding method using the liquid metal bonding material and the liquid metal bonding material of the present invention, it becomes possible to bond with conductivity at room temperature, and even when the knitting is tilted due to external force applied to the bonded portion, Because it has liquid characteristics, it is possible to maintain the bonding characteristics while relaxing the stress by changing the shape of the joint, and it is possible to bond with the characteristics and shape of the object to be joined and the high reliability that is adapted Therefore, it can be widely applied to industries.
１ 基板
２ 封止材
３ 液状金属接合材
４ 電子部品
５ 接合界面
６ 金属化合物層
DESCRIPTION OF
Claims (3)
A joining method and a joined product using the liquid metal joining material according to claim 1.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2018160471A1 (en) * | 2017-03-03 | 2018-09-07 | Microsoft Technology Licensing, Llc | Flexible conductive bonding |
| CN111250891A (en) * | 2020-03-26 | 2020-06-09 | 郑州机械研究所有限公司 | Profiling foil-shaped sandwich brazing filler metal for brazing aluminum honeycomb panel and preparation method thereof |
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| JP2010098035A (en) * | 2008-10-15 | 2010-04-30 | Konica Minolta Holdings Inc | Thermoelectric conversion element |
| JP2011082041A (en) * | 2009-10-08 | 2011-04-21 | Autonetworks Technologies Ltd | Terminal pair and electric connection structure using this |
| JP2012130242A (en) * | 2010-12-15 | 2012-07-05 | Benteler Automobiltechnik Gmbh | Heat exchanger |
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| JPS5220783A (en) * | 1975-08-11 | 1977-02-16 | Nippon Telegr & Teleph Corp <Ntt> | Semi-conductor unit |
| JP2010098035A (en) * | 2008-10-15 | 2010-04-30 | Konica Minolta Holdings Inc | Thermoelectric conversion element |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2018160471A1 (en) * | 2017-03-03 | 2018-09-07 | Microsoft Technology Licensing, Llc | Flexible conductive bonding |
| US10355371B2 (en) | 2017-03-03 | 2019-07-16 | Microsoft Technology Licensing, Llc | Flexible conductive bonding |
| CN111250891A (en) * | 2020-03-26 | 2020-06-09 | 郑州机械研究所有限公司 | Profiling foil-shaped sandwich brazing filler metal for brazing aluminum honeycomb panel and preparation method thereof |
| CN111250891B (en) * | 2020-03-26 | 2021-12-03 | 郑州机械研究所有限公司 | Profiling foil-shaped sandwich brazing filler metal for brazing aluminum honeycomb panel and preparation method thereof |
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