CN102284810A - Soldering flux for diode - Google Patents
Soldering flux for diode Download PDFInfo
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- CN102284810A CN102284810A CN2011102141180A CN201110214118A CN102284810A CN 102284810 A CN102284810 A CN 102284810A CN 2011102141180 A CN2011102141180 A CN 2011102141180A CN 201110214118 A CN201110214118 A CN 201110214118A CN 102284810 A CN102284810 A CN 102284810A
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- scaling powder
- polyoxyethylene sorbitan
- fatty acid
- diode scaling
- sorbitan fatty
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Abstract
The invention relates to a soldering flux for a diode. The soldering flux has excellent properties. The soldering flux is prepared by mixing rosin and derivatives thereof, an organic acid activating agent, a surfactant, an additive and a solvent. The soldering flux has the characteristics of no color, transparency, no pungent smell, bright welding spots, high wettability, high activity, low corrosion, no halogen, low rosin and the like.
Description
Technical field
The present invention relates to electronics industry, specifically relate to a kind of diode scaling powder that is applied in the electronics industry.
Background technology
The scaling powder that uses in the electronics industry is not only wanted to provide the good weldering performance that helps, but also can not be corroded materials to be welded, also will satisfy a series of machinery and electric property requirement simultaneously.Therefore, the quality of scaling powder has directly influenced the whole process of production and the product quality of electronics industry.Traditional scaling powder, postwelding residual many, corrosivity is big, outward appearance is not good enough, must clean with the freon that atmospheric ozone layer is had destruction or chlorinated hydrocabon and print version.And because solder containing pb has been limited to use in electronic product, lead-free solder develops rapidly.Current many other alloys with tin replace the SnPb alloy, but their fusing point generally exceeds much than the fusing point of SnPb eutectic solder, have caused in the welding process serious problems such as the easy oxidation of high temperature.Simultaneously, lead-free solder is compared with plumber's solder, and its rate of spread and wettability are significantly less than plumber's solder, thereby influences its solderability.Commercially available lead-free solder is improved to form on the basis of plumber's solder with scaling powder with scaling powder at present, contain halogen mostly, the electronic applications corrosion that electric property is had relatively high expectations is comparatively outstanding, thus scaling powder to Halogen, exempt to clean, the low-solid content direction develops.
Description
At the deficiencies in the prior art, the invention provides a kind of diode scaling powder that helps the active high and low burn into Halogen of weldering, low rosin.
To achieve these goals, the present invention adopts following technical scheme:
The diode scaling powder, by as components by weight percent, mixed by following component:
Described rosin derivative is selected for use: a kind of in Foral or the ester gum.
Described organic acid for activating agent is selected for use: at least a in lactic acid, malic acid, tartaric acid, sorbic acid or the citric acid.
Described surfactant is selected for use: a kind of in polyoxyethylene sorbitan fatty acid ester, polyethyleneoxide diamine or the sorbitan fatty acid ester.
Described polyoxyethylene sorbitan fatty acid ester is selected for use: at least a in polyoxyethylene sorbitan laurate, polyoxyethylene sorbitan oleate, the polyoxyethylene sorbitan stearate.
Described sorbitan fatty acid ester is selected for use: anhydrous sorbitol laurate or sorbitan monooleate.
Described additive is selected for use: coloured glaze base benzothiazole and 2, and the mixture of three grades of butyl of 6--4-methylphenol, described coloured glaze base benzothiazole and 2, the mass ratio of three grades of butyl of 6--4-methylphenol is 1: 0.5-2.
Described solvent is selected for use: the mixture of isopropyl alcohol, ethylene glycol, glycerine and methyl ethyl ketone, the mass ratio of described isopropyl alcohol, ethylene glycol, glycerine and methyl ethyl ketone are 1: 0.2～1: 0.1～0.5: 0.1～0.3.
In the technique scheme, the present invention adopts rosin derivative as one of raw material, and it mainly acts on is heat and the covering effect of transmitting in welding process, and the scolder under can protecting is not oxidated.This class material has good electric property simultaneously; the following apparent activity of diaphragm effect that plays of normal temperature; under welding temperature, show active; have characteristics such as no burn into protection against the tide; the organic acid for activating agent of selecting for use mainly relies on the effect of carboxyl; form with metallic bond is removed oxide-film; ability with medium removal oxide-film; and act on slowlyer, postwelding has corrosivity, but is easy to clean; organic acid is more eager to excel in whatever one does than rosin activator; but a little less than inorganic activator, between flux activity and cleanablity, it provides a good balance.Simultaneously, in the prescription of scaling powder of the present invention, added surfactant with wetting action, can reduce the surface tension of molten solder, impel wetting and sprawl, to obtain good soldered fitting, and non-ionic surface active agent unionization in the aqueous solution, stability is high, be not subjected to the tired influence that exists of strong electrolyte inorganic salts, be not subject to the influence of soda acid yet, good with the compatibility of the surfactant of other classes, solubility property is preferably all arranged in water and organic solvent, therefore, the polyoxyethylene sorbitan fatty acid ester, corrosion inhibiter and wetting agent that the typical non-ionic surface active agent of conduct such as polyethyleneoxide diamine and sorbitan fatty acid ester is used for scaling powder have premium properties preferably.Isopropyl alcohol, ethylene glycol, glycerine and methyl ethyl ketone etc. are as the solvent of scaling powder, and main effect is the carrier that is used for other components of scaling powder, makes it to become uniform thick liquid, can strengthen infiltration and wettability simultaneously.
Beneficial effect of the present invention is: owing to adopted above-mentioned technical scheme, so the present invention has water white transparency, have no irritating odor, and the solder joint light, wetability is strong, and helps advantages such as the active high and low burn into Halogen of weldering, low rosin.
The specific embodiment
Below by specific embodiment, the present invention is done detailed description:
Embodiment 1
A kind of diode scaling powder, mark meter by weight, mixed by following component:
Embodiment 2
A kind of diode scaling powder, mark meter by weight, mixed by following component:
Embodiment 3
A kind of diode scaling powder, mark meter by weight, mixed by following component:
Claims (8)
1. diode scaling powder is characterized in that: by as components by weight percent, mixed by following component:
2. according to claims 1 described diode scaling powder, it is characterized in that: described rosin derivative is selected for use: a kind of in Foral or the ester gum.
3. according to claims 1 described diode scaling powder, it is characterized in that: described organic acid for activating agent is selected for use: at least a in lactic acid, malic acid, tartaric acid, sorbic acid or the citric acid.
4. according to claims 1 described diode scaling powder, it is characterized in that: described surfactant is selected for use: a kind of in polyoxyethylene sorbitan fatty acid ester, polyethyleneoxide diamine or the sorbitan fatty acid ester.
5. according to claims 4 described diode scaling powders, it is characterized in that: described polyoxyethylene sorbitan fatty acid ester is selected for use: at least a in polyoxyethylene sorbitan laurate, polyoxyethylene sorbitan oleate, the polyoxyethylene sorbitan stearate.
6. according to claims 4 described diode scaling powders, it is characterized in that: described sorbitan fatty acid ester is selected for use: anhydrous sorbitol laurate or sorbitan monooleate.
7. according to claims 1 described diode scaling powder, it is characterized in that: described additive is selected for use: coloured glaze base benzothiazole and 2, the mixture of three grades of butyl of 6--4-methylphenol, described coloured glaze base benzothiazole and 2, the mass ratio of three grades of butyl of 6--4-methylphenol is 1: 0.5-2.
8. according to claims 1 described diode scaling powder, it is characterized in that: described solvent is selected for use: the mixture of isopropyl alcohol, ethylene glycol, glycerine and methyl ethyl ketone, the mass ratio of described isopropyl alcohol, ethylene glycol, glycerine and methyl ethyl ketone are 1: 0.2～1: 0.1～0.5: 0.1～0.3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102141180A CN102284810A (en) | 2011-07-28 | 2011-07-28 | Soldering flux for diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102141180A CN102284810A (en) | 2011-07-28 | 2011-07-28 | Soldering flux for diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102284810A true CN102284810A (en) | 2011-12-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102141180A Pending CN102284810A (en) | 2011-07-28 | 2011-07-28 | Soldering flux for diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102284810A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102513737A (en) * | 2011-12-27 | 2012-06-27 | 四川长虹电器股份有限公司 | Soldering flux and preparation method thereof |
| CN102581522A (en) * | 2012-02-28 | 2012-07-18 | 河南科技大学 | Rosin-based flux for ZnSn-based lead free solder and preparation method thereof |
| CN103846575A (en) * | 2014-03-17 | 2014-06-11 | 苏州龙腾万里化工科技有限公司 | Novel rosin flux |
| CN104084714A (en) * | 2014-07-30 | 2014-10-08 | 广西众昌树脂有限公司 | Rosin scaling powder |
| CN108890173A (en) * | 2018-08-31 | 2018-11-27 | 安徽红桥金属制造有限公司 | A kind of high-performance environment-friendly scaling powder and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101073862A (en) * | 2007-06-08 | 2007-11-21 | 北京工业大学 | Low-rosin and cleaning-free welding accessory without halogen for lead-free welding grease |
| CN101785455A (en) * | 2010-02-05 | 2010-07-28 | 深圳诺普信农化股份有限公司 | Pesticide oil suspension agent and preparation method thereof |
| CN102059471A (en) * | 2010-12-29 | 2011-05-18 | 厦门大学 | Soldering paste of Sn-Bi-Cu self-packed composite powder and preparation method thereof |
-
2011
- 2011-07-28 CN CN2011102141180A patent/CN102284810A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101073862A (en) * | 2007-06-08 | 2007-11-21 | 北京工业大学 | Low-rosin and cleaning-free welding accessory without halogen for lead-free welding grease |
| CN101785455A (en) * | 2010-02-05 | 2010-07-28 | 深圳诺普信农化股份有限公司 | Pesticide oil suspension agent and preparation method thereof |
| CN102059471A (en) * | 2010-12-29 | 2011-05-18 | 厦门大学 | Soldering paste of Sn-Bi-Cu self-packed composite powder and preparation method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102513737A (en) * | 2011-12-27 | 2012-06-27 | 四川长虹电器股份有限公司 | Soldering flux and preparation method thereof |
| CN102581522A (en) * | 2012-02-28 | 2012-07-18 | 河南科技大学 | Rosin-based flux for ZnSn-based lead free solder and preparation method thereof |
| CN103846575A (en) * | 2014-03-17 | 2014-06-11 | 苏州龙腾万里化工科技有限公司 | Novel rosin flux |
| CN104084714A (en) * | 2014-07-30 | 2014-10-08 | 广西众昌树脂有限公司 | Rosin scaling powder |
| CN104084714B (en) * | 2014-07-30 | 2016-08-24 | 广西众昌树脂有限公司 | Rosin flux |
| CN108890173A (en) * | 2018-08-31 | 2018-11-27 | 安徽红桥金属制造有限公司 | A kind of high-performance environment-friendly scaling powder and preparation method thereof |
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Application publication date: 20111221 |