CN105101762A - Thin high-transmission electromagnetic interference shielding film, and manufacturing method and applications thereof - Google Patents
Thin high-transmission electromagnetic interference shielding film, and manufacturing method and applications thereof Download PDFInfo
- Publication number
- CN105101762A CN105101762A CN201410186768.2A CN201410186768A CN105101762A CN 105101762 A CN105101762 A CN 105101762A CN 201410186768 A CN201410186768 A CN 201410186768A CN 105101762 A CN105101762 A CN 105101762A
- Authority
- CN
- China
- Prior art keywords
- adhesive layer
- shielding film
- layer
- release film
- emi shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a thin high-transmission electromagnetic interference shielding film and a manufacturing method and applications thereof. A first release film, an ink layer, a conductive adhesive layer with conductive metal particles, an adhesive layer and a second release film are superposed on each other so as to form the shielding film; the total thickness of the ink layer, the conductive adhesive layer and the adhesive layer is in a range of 16 to 83 microns. The thin high-transmission electromagnetic interference shielding film has the advantages of small transmission loss, high transmission quality, excellent shielding performance, excellent flexibility, favorable electrical properties, excellent chemical resistance, high softness and the like. When the thin high-transmission electromagnetic interference shielding film is applied to a printed circuit board, the ink layer, the conductive adhesive layer with the conductive metal particles, and the adhesive layer eventually cover the surface of the printed circuit board; when the shielding film is fittingly pressed on the circuit board, the thickness of the adhesive layer becomes smaller because of hot pressing, and the conductive metal particles in the conductive adhesive layer pierce through the adhesive layer as the resin materials are subjected to hot pressing, and therefore, the conductive metal particles and a grounding wire on the circuit board can form a conduction circuit, and as a result, the grounding impedance value of the circuit board is decreased, so that electromagnetic wave interference can be reduced.
Description
Technical field
The present invention relates to a kind of slimming, high-transmission emi shielding film, particularly a kind of slim have excellent chemical resistance, electrical characteristic, for the slim high-transmission emi shielding film of the printed circuit board (PCB) of high flexible.
Background technology
Under electronics and the multi-functional complicated market demand of communication product trend, the structure dress of circuit substrate needs lighter, thin, short, little; And functionally, then need the transmission of powerful and high-speed signal.Therefore, line density certainly will improve, distance to each other between support plate circuit is more and more nearer, and operating frequency is broadband towards height, if add configuration, unreasonable lower electromagnetic interference (ElectromagneticInterference, the EMI) situation that connects up is more and more serious, therefore must effectively manage electromagnetic compatibility (ElectromagneticCompatibility, EMC), thus maintain electronic product normal signal transmission and improve reliability.Frivolous and the characteristic that can arbitrarily bend, makes soft board occupy very important status in the development moving towards demand portable information and communication electronic industry.
Because telecommunications product more attains little trend, order about soft board and must carry more strong large function, on the other hand because portable electronic product moves towards microminiature, also the high demand of high density soft board technology is and then driven, functionally then require powerful and under the situation of high frequency, high density, graph thinning, be proposed the screen for film-type flexible printed wiring board (FPC) in the market, be widely adopted in the small-sized electronic products such as mobile phone, numerical digit camera, digit camera.
In view of this, a kind of material of shield electromagnetic interference of novelty is urgently developed.
Summary of the invention
In order to solve the problem, the invention provides a kind of slimming high-transmission emi shielding film and manufacture method thereof and application, this slimming high-transmission emi shielding film has the advantages such as transmission loss is little, transmission quality is high, shielding is good, good flexibility, electrical characteristic are good, chemical resistance is good, flexibility is good.
The present invention in order to the technical scheme solving its technical problem and adopt is:
The invention provides a kind of slimming high-transmission emi shielding film, form by the first release film, ink layer, the conductive adhesive layer with metal conductive particles, adhesive layer and the second release film are superimposed successively, and the structure finally remaining in circuit board surface forms by described ink layer, conductive adhesive layer and adhesive layer are superimposed successively, the gross thickness of described ink layer, conductive adhesive layer and adhesive layer is 16 to 83 microns, wherein, the thickness of described conductive adhesive layer is 8 to 60 microns, the thickness of described adhesive layer is 5 to 15 microns, and the thickness of described ink layer is 3 to 8 microns.
Say further, wherein, described conductive adhesive layer can be the adhesion layer of independent one deck band metal conductive particles.Also can be by the adhesion layer of one deck not with metal conductive particles and the superimposed double-decker layer formed of adhesion layer of one deck band metal conductive particles, wherein, the adhesion layer gluing not with conducting particles is between described ink layer and the adhesion layer of described band metal conductive particles.
Say further, wherein, described adhesive layer contains fluorine additive.Described adhesive layer dielectric property Df value is 0.003.
Say further, wherein, described first release film and the second release film mould the one in release film, PET silicate-containing oil release film, the sub-light release film of PET and PE release film for PET fluorine separately, and thickness is 25 to 100 microns separately.
Say further, wherein, described ink layer is the resin bed containing coloured female additive, and the resin material of described ink layer is epoxy resin, acrylic resin, amido formate system resin, silicon rubber system resin, poly-at least one in ring diformazan benzene series resin, bismaleimides system resin and polyimide resin, the look female additive of described ink layer comprises at least one in material with carbon element, titanium dioxide, pigment, dyestuff and toner.
Present invention also offers the printed circuit board (PCB) with above-mentioned slimming high-transmission emi shielding film, described ink layer, the conductive adhesive layer with metal conductive particles and adhesive layer Landfill covering in described slimming high-transmission emi shielding film are in printed circuit board surface, adhesive layer adheres to printed circuit board (PCB), and the metal conductive particles in described conductive adhesive layer pierces through described adhesive layer and walks linear contact lay conducting with the ground connection on printed circuit board (PCB).
Present invention also offers the manufacture method of described slimming high-transmission emi shielding film:
Step one: be coated with described ink layer on described first release film, by selecting the first release film of different surface roughness to make the reflective degree of ink layer surface different, reaches different glossiness;
Step 2: be coated with described conductive adhesive layer on the another side of described ink layer;
Step 3: get described second release film, described second release film is coated with described adhesive layer;
Step 4: the semi-finished product that step 2 and step 3 obtain are pressed into described slimming high-transmission emi shielding film.
The invention has the beneficial effects as follows: slimming high-transmission emi shielding film of the present invention is dope layer of ink on the first release film, applying conductive glue-line on ink layer, second release film is coated with adhesive layer, again by conductive adhesive layer and adhesive layer to pressure, slimming high-transmission emi shielding film has ultrathin type, flexibility is good, color masking, chemical resistance is good, electrical characteristic is good, good flexibility, transmission quality height and speed advantages of higher, be better than traditional PI diaphragm (the thin PI of thin glue), photosensitive type PI (or acryl system) diaphragm, non-photo-sensing type PI diaphragm (photoresistance need be gone up) and general screened film, be applicable to mobile phone, panel computers etc. contain a lot of antenna (bluetooth, Wi-Fi, cellular communication and GPS etc.) the application of handheld device, interference-free between making it in very little space mutually, thus replace general barrier film material.
Accompanying drawing explanation
Fig. 1 is the structural representation of slimming high-transmission emi shielding film of the present invention;
Fig. 2 is that the metal conductive particles in conductive adhesive layer of the present invention pierces through adhesive layer because resin material is subject to hot pressing, and then forms turning circuit schematic diagram with the ground connection cabling on flexible printed wiring board;
Fig. 3 is the printed circuit board arrangement schematic diagram with screened film of the present invention.
Embodiment
Below by way of specific instantiation, the specific embodiment of the present invention is described, those skilled in the art can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can be implemented in further, different ways, that is, not departing under disclosed category, can give different modifications and change.
Embodiment: a kind of slimming high-transmission emi shielding film, as shown in Figure 1, by the first release film 1, ink layer 2, the conductive adhesive layer 3 with metal conductive particles, adhesive layer 4 with the second release film 5 is superimposed successively forms, and the structure finally remaining in circuit board surface forms by described ink layer 2, conductive adhesive layer 3 and adhesive layer 4 are superimposed successively, the gross thickness of described ink layer, conductive adhesive layer and adhesive layer is 16 to 83 microns.
Wherein, described first release film 1 and the second release film 5 mould the one in release film, PET silicate-containing oil release film, the sub-light release film of PET and PE release film for PET fluorine separately, and thickness is 25 to 100 microns separately.
Wherein, described ink layer 2 is the resin beds containing coloured female additive, and the resin material of described ink layer is epoxy resin, acrylic resin, amido formate system resin, silicon rubber system resin, poly-at least one in ring diformazan benzene series resin, bismaleimides system resin and polyimide resin, the look female additive of described ink layer comprises at least one in material with carbon element, titanium dioxide, pigment, dyestuff and toner.Pigment can comprise obtained by organic material and inorganic material.Ink layer glossiness (Gloss) is about 20.Ink layer can be black, redness, the shades of colour such as orange, yellow, blue.The thickness of ink layer is 3 to 8 microns.
Wherein, described conductive adhesive layer 3 can be the adhesion layer of independent one deck band metal conductive particles; Also can be the superimposed double-decker layer formed of adhesion layer by the adhesion layer of one deck not with metal conductive particles (increasing the adhesion between ink layer and band metal conductive particles adhesion layer) and one deck band metal conductive particles, wherein, the adhesion layer gluing not with conducting particles is between described ink layer and the adhesion layer of described band metal conductive particles.The resin material that conductive adhesive layer adopts is epoxy resin, acrylic resin, amido formate system resin, silicon rubber system resin, poly-at least one in ring diformazan benzene series resin, bismaleimides system resin and polyimide resin.The thickness of described conductive adhesive layer is 8 to 60 microns.
Wherein, described adhesive layer 4 is containing fluorine additive, and the thickness of adhesive layer is 5 to 15 microns.Adhesive layer dielectric property Df value is 0.003.
The manufacture method of above-mentioned slimming high-transmission emi shielding film is as follows:
Step one: be coated with described ink layer on described first release film, by selecting the first release film of different surface roughness to make the reflective degree of ink layer surface different, reaches different glossiness;
Step 2: be coated with described conductive adhesive layer on the another side of described ink layer;
Step 3: get described second release film, described second release film is coated with described adhesive layer, and the second release film, for keeping the stickiness of described adhesive layer, is beneficial to follow-uply be bonding on circuit board or use is made in other pressing;
Step 4: the semi-finished product that step 2 and step 3 obtain are pressed into described slimming high-transmission emi shielding film.
When above-mentioned slimming high-transmission emi shielding film is applied to printed circuit board (PCB), first the second release film is removed, carry out pressing again, adhesive layer 4 is because of hot pressing lower thickness, metal conductive particles 31 in conductive adhesive layer 3 pierces through adhesive layer 4 because resin material is subject to hot pressing, and then form turning circuit with the ground connection cabling 61 on flexible printed wiring board, as shown in Figure 2, complete crosslinking curing is reached to maintain electrically good and mechanical properties via making resin under a period of time, flexible printed wiring board impedance ground value is made to lower the object reaching and reduce Electromagnetic Interference, there is the advantage of high-speed and high-efficiency transmission simultaneously.Be coated with the printed circuit board arrangement of slimming high-transmission emi shielding film as shown in Figure 3, described ink layer 2 in described slimming high-transmission emi shielding film, the conductive adhesive layer 3 with metal conductive particles and adhesive layer 4 Landfill covering are in printed circuit board (PCB) 6 surface, and the metal conductive particles 31 in described conductive adhesive layer pierces through described adhesive layer and contacts conducting with the ground connection cabling 61 on printed circuit board (PCB).
Slimming high-transmission emi shielding film used in the present invention has the characteristics such as flexibility is high, electrical characteristic good, chemical resistance is good, transmission loss is few, transmission quality is high, ultra-flexible is had more compared to the polyimides coverlay that insulating barrier used in the past, there is the advantages such as manufacture method is simple, with low cost, compare general electromagnetic shielding film and there is higher transmission quality.And emi shielding film of the present invention has better extinction effect, to meet the various different demand of client.Use the black polyamide thin film being added with carbon dust traditionally; though the polyimides diaphragm of this manufacture has good extinction effect; but high cost; do not meet demand during actual volume production, and the polyimides diaphragm containing additive also has the anxiety worry that the character such as tensile strength, dimensional stability is deteriorated.Therefore, the present invention can better be applied to signal transmission quality You Yao enterprise, circuit is had to the printed circuit board (PCB) of mask requirement.
Claims (9)
1. a slimming high-transmission emi shielding film, it is characterized in that: form by the first release film, ink layer, the conductive adhesive layer with metal conductive particles, adhesive layer and the second release film are superimposed successively, and the structure finally remaining in circuit board surface forms by described ink layer, conductive adhesive layer and adhesive layer are superimposed successively, the gross thickness of described ink layer, conductive adhesive layer and adhesive layer is 16 to 83 microns, wherein, the thickness of described conductive adhesive layer is 8 to 60 microns, the thickness of described adhesive layer is 5 to 15 microns, and the thickness of described ink layer is 3 to 8 microns.
2. slimming high-transmission emi shielding film as claimed in claim 1, is characterized in that: described conductive adhesive layer is the adhesion layer of independent one deck band metal conductive particles.
3. slimming high-transmission emi shielding film as claimed in claim 1, it is characterized in that: described conductive adhesive layer is by the adhesion layer of one deck not with metal conductive particles and the superimposed double-decker layer formed of adhesion layer of one deck band metal conductive particles, wherein, the adhesion layer gluing not with conducting particles is between described ink layer and the adhesion layer of described band metal conductive particles.
4. slimming high-transmission emi shielding film as claimed in claim 1, is characterized in that: described adhesive layer contains fluorine additive.
5. slimming high-transmission emi shielding film as claimed in claim 1, is characterized in that: described adhesive layer dielectric property Df value is 0.003.
6. slimming high-transmission emi shielding film as claimed in claim 1, it is characterized in that: described first release film and the second release film mould the one in release film, PET silicate-containing oil release film, the sub-light release film of PET and PE release film for PET fluorine separately, and thickness is 25 to 100 microns separately.
7. slimming high-transmission emi shielding film as claimed in claim 1, it is characterized in that: described ink layer is the resin bed containing coloured female additive, and the resin material of described ink layer is epoxy resin, acrylic resin, amido formate system resin, silicon rubber system resin, poly-at least one in ring diformazan benzene series resin, bismaleimides system resin and polyimide resin, the look female additive of described ink layer comprises at least one in material with carbon element, titanium dioxide, pigment, dyestuff and toner.
8. one kind has the printed circuit board (PCB) of the slimming high-transmission emi shielding film according to any one of claim 1 to 7, it is characterized in that: described ink layer, the conductive adhesive layer with metal conductive particles and adhesive layer Landfill covering in described slimming high-transmission emi shielding film are in printed circuit board surface, adhesive layer adheres to printed circuit board (PCB), and the metal conductive particles in described conductive adhesive layer pierces through described adhesive layer and walks linear contact lay conducting with the ground connection on printed circuit board (PCB).
9. a manufacture method for the slimming high-transmission emi shielding film according to any one of claim 1 to 7, is characterized in that:
Step one: be coated with described ink layer on described first release film, by selecting the first release film of different surface roughness to make the reflective degree of ink layer surface different, reaches different glossiness;
Step 2: be coated with described conductive adhesive layer on the another side of described ink layer;
Step 3: get described second release film, described second release film is coated with described adhesive layer;
Step 4: the semi-finished product that step 2 and step 3 obtain are pressed into described slimming high-transmission emi shielding film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410186768.2A CN105101762B (en) | 2014-05-06 | 2014-05-06 | It is thinned high-transmission emi shielding film and its manufacturing method and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410186768.2A CN105101762B (en) | 2014-05-06 | 2014-05-06 | It is thinned high-transmission emi shielding film and its manufacturing method and application |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105101762A true CN105101762A (en) | 2015-11-25 |
| CN105101762B CN105101762B (en) | 2018-08-07 |
Family
ID=54580947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410186768.2A Active CN105101762B (en) | 2014-05-06 | 2014-05-06 | It is thinned high-transmission emi shielding film and its manufacturing method and application |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105101762B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107791641A (en) * | 2016-08-30 | 2018-03-13 | 昆山雅森电子材料科技有限公司 | High shielding emi shielding film with double-level-metal layer and preparation method thereof |
| CN110691497A (en) * | 2018-07-06 | 2020-01-14 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110769677A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110769664A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110783015A (en) * | 2018-11-26 | 2020-02-11 | 广州方邦电子股份有限公司 | Conductive adhesive film, circuit board and preparation method of conductive adhesive film |
| CN110769668B (en) * | 2018-07-27 | 2024-04-23 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102026529A (en) * | 2009-09-18 | 2011-04-20 | 大自达电线株式会社 | Shielding film, shielding distribution board having the same and grounding method thereof |
| CN102387656A (en) * | 2010-08-30 | 2012-03-21 | 富葵精密组件(深圳)有限公司 | Circuit board with grounding shield structure and manufacturing method thereof |
| CN102572025A (en) * | 2010-12-31 | 2012-07-11 | 沈阳晨讯希姆通科技有限公司 | Electromagnetic shielding structure in mobile phone |
| CN203194086U (en) * | 2013-04-02 | 2013-09-11 | 昆山雅森电子材料科技有限公司 | Thin-type colorful electromagnetic interference shielding film |
| CN103687459A (en) * | 2012-09-14 | 2014-03-26 | 昆山雅森电子材料科技有限公司 | Electromagnetic wave shielding structure and flexible printed circuit board with same |
| CN103763893A (en) * | 2014-01-14 | 2014-04-30 | 广州方邦电子有限公司 | Electromagnetic wave shielding film and method for manufacturing circuit board with same |
| CN203859981U (en) * | 2014-05-06 | 2014-10-01 | 昆山雅森电子材料科技有限公司 | Thin high-transmission electromagnetic interference shielding film and printed circuit board having same |
-
2014
- 2014-05-06 CN CN201410186768.2A patent/CN105101762B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102026529A (en) * | 2009-09-18 | 2011-04-20 | 大自达电线株式会社 | Shielding film, shielding distribution board having the same and grounding method thereof |
| CN102387656A (en) * | 2010-08-30 | 2012-03-21 | 富葵精密组件(深圳)有限公司 | Circuit board with grounding shield structure and manufacturing method thereof |
| CN102572025A (en) * | 2010-12-31 | 2012-07-11 | 沈阳晨讯希姆通科技有限公司 | Electromagnetic shielding structure in mobile phone |
| CN103687459A (en) * | 2012-09-14 | 2014-03-26 | 昆山雅森电子材料科技有限公司 | Electromagnetic wave shielding structure and flexible printed circuit board with same |
| CN203194086U (en) * | 2013-04-02 | 2013-09-11 | 昆山雅森电子材料科技有限公司 | Thin-type colorful electromagnetic interference shielding film |
| CN103763893A (en) * | 2014-01-14 | 2014-04-30 | 广州方邦电子有限公司 | Electromagnetic wave shielding film and method for manufacturing circuit board with same |
| CN203859981U (en) * | 2014-05-06 | 2014-10-01 | 昆山雅森电子材料科技有限公司 | Thin high-transmission electromagnetic interference shielding film and printed circuit board having same |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107791641A (en) * | 2016-08-30 | 2018-03-13 | 昆山雅森电子材料科技有限公司 | High shielding emi shielding film with double-level-metal layer and preparation method thereof |
| CN107791641B (en) * | 2016-08-30 | 2020-01-14 | 昆山雅森电子材料科技有限公司 | High-shielding electromagnetic interference shielding film with double metal layers and preparation method thereof |
| CN110691497A (en) * | 2018-07-06 | 2020-01-14 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110691497B (en) * | 2018-07-06 | 2024-04-23 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110769677A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110769664A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110769664B (en) * | 2018-07-27 | 2024-02-06 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110769668B (en) * | 2018-07-27 | 2024-04-23 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110783015A (en) * | 2018-11-26 | 2020-02-11 | 广州方邦电子股份有限公司 | Conductive adhesive film, circuit board and preparation method of conductive adhesive film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105101762B (en) | 2018-08-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105101761A (en) | High-transmission thin electromagnetic interference shielding film, and manufacturing method and applications thereof | |
| CN105101762A (en) | Thin high-transmission electromagnetic interference shielding film, and manufacturing method and applications thereof | |
| CN204104291U (en) | Slimming high-transmission electromagnetic absorption screened film | |
| CN206650912U (en) | High shielding EMI screened films | |
| CN206067098U (en) | High shielding emi shielding film with double-level-metal layer | |
| CN205864954U (en) | The emi shielding film of high-transmission height shield effectiveness | |
| CN102480837B (en) | Flexible circuit board | |
| CN203859982U (en) | High-transmission thin electromagnetic interference shielding film and printed circuit board having same | |
| CN107660113A (en) | Emi shielding film of the high shield effectiveness of high-transmission and preparation method thereof | |
| CN203859981U (en) | Thin high-transmission electromagnetic interference shielding film and printed circuit board having same | |
| CN105578851A (en) | Thin-type high-transmission electromagnetic-absorbing screened film and manufacturing method thereof | |
| US20100326720A1 (en) | Housing and portable electronic device using the same | |
| CN105808000A (en) | OLED (Organic Light Emitting Diode) display apparatus and fabrication method | |
| US20120019475A1 (en) | Low-cost mass-produced touch sensors | |
| CN203194086U (en) | Thin-type colorful electromagnetic interference shielding film | |
| CN204596965U (en) | A kind of multi-functional NFC antenna | |
| KR101498570B1 (en) | Multi-Layer Structured High Functional Magnetic Film and Manufacturing Method thereof | |
| CN107791641B (en) | High-shielding electromagnetic interference shielding film with double metal layers and preparation method thereof | |
| WO2018006440A1 (en) | Electromagnetic shielding protection film and fpc | |
| CN105824359A (en) | Display device with NFC function | |
| CN104105386A (en) | Thin-type colorful electromagnetic interference shielding film and manufacturing method thereof | |
| CN103717050A (en) | Thin-type flexible thermally-cured electromagnetic shielding glue film | |
| CN208095043U (en) | Electromagnetic shielding film and wiring board | |
| CN204939377U (en) | Conductive shield adhesive tape | |
| CN207458013U (en) | Touch-control film, touch control component, touch-screen and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |