CN105072870A - Electronic device and support device - Google Patents
Electronic device and support device Download PDFInfo
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- CN105072870A CN105072870A CN201510423770.1A CN201510423770A CN105072870A CN 105072870 A CN105072870 A CN 105072870A CN 201510423770 A CN201510423770 A CN 201510423770A CN 105072870 A CN105072870 A CN 105072870A
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Abstract
The invention discloses an electronic device and a support device. The electronic device comprises a body, a processing unit arranged in the accommodating space of the body, and a first heat dissipation module arranged on the first surface of the body. When the electronic device is stabilized relative to the support device, the first heat dissipation module and the second heat dissipation module which is arranged in the support device form a thermocouple loop; the thermocouple loop is used for allowing the first heat dissipation module to absorb the heat energy generated by the processing unit, and conducting the absorbed heat energy to the second heat dissipation module so as to perform heat dissipation on the electronic device. According to the invention, the electronic device can be light and thin, and meanwhile possess better heat dissipation performance.
Description
Technical field
The present invention relates to heat treatment technology, particularly relate to a kind of electronic equipment and support unit.
Background technology
Electronic equipment ultrathin as day by day miniaturized in smart mobile phone, panel computer etc. in recent years, lighteningly in appearance cause internal heat dissipating limited space, at present, the relatively little processor of power consumption can only be adopted with the potential safety hazard avoiding apparatus overheat to bring and the problem affecting experience;
For realize electronic equipment lightening while guarantee the heat dispersion that electronic equipment internal is good, the processor of high-performance high power consumption can be arranged in the electronic device, promote the performance of electronic equipment, there is no effective solution.
Summary of the invention
The embodiment of the present invention provides a kind of electronic equipment and support unit, can realize electronic equipment lightening while, guarantee that electronic equipment has good heat dispersion.
The technical scheme of the embodiment of the present invention is achieved in that
The embodiment of the present invention provides a kind of electronic equipment, and described electronic equipment comprises body, be arranged at the processing unit of the accommodation space of described body and be arranged at the first heat radiation module of first surface of described body;
When described electronic equipment is firm relative to support unit, described first heat radiation module be arranged at the module that dispels the heat of second in described support unit and form For Thermocouple Circuit;
Wherein, the heat energy that described For Thermocouple Circuit produces for making described first heat radiation module absorb described processing unit, and by absorbed thermal energy conduction to described second heat radiation module, to dispel the heat to described electronic equipment.
The embodiment of the present invention provides a kind of support unit, and described support unit comprises:
Rack body, the second heat radiation module be arranged in described rack body;
Described rack body is used for support electronic equipment, to make electronic equipment firm relative to described rack body;
Described second heat radiation module, for when described electronic equipment is firm relative to described rack body, forms For Thermocouple Circuit with the module that dispels the heat of first in described electronic equipment;
Wherein, the heat energy that described For Thermocouple Circuit produces for making described first heat radiation module absorb the processing unit in described electronic equipment, and by absorbed thermal energy conduction to described second heat radiation module, to dispel the heat to described electronic equipment.
The embodiment of the present invention provides a kind of electronic equipment, and described electronic equipment comprises body and is arranged at first connector of first surface of described body;
Described first connector, for connecting described body and support unit, to make described body firm relative to described support unit;
Wherein, when described body is connected with described support unit, described electronic equipment has the first radiating efficiency, and when described body is not connected with described support unit, described electronic equipment has the second radiating efficiency, and described first radiating efficiency is greater than described second radiating efficiency.
The embodiment of the present invention provides a kind of support unit, and described support unit comprises:
Rack body, the second connector be arranged on described rack body;
Described second connector, for being connected with the first connector of electronic equipment, to make described electronic equipment firm relative to described rack body; Wherein,
When described second connector is connected with the first connector of described electronic equipment, described electronic equipment has the first radiating efficiency, when described second connector is not connected with the first connector of electronic equipment, described first electronic equipment has the second radiating efficiency, and described first radiating efficiency is greater than described second radiating efficiency.
In the embodiment of the present invention, electronic equipment is when forming firm relative position relation with support unit, utilize and form radiator structure (as For Thermocouple Circuit) with the annexation of support unit, thus promote the efficiency that the processing unit of electronic equipment is dispelled the heat.
Accompanying drawing explanation
Fig. 1 is the structural representation one of electronic equipment in the embodiment of the present invention;
Fig. 2 is the structural representation two of electronic equipment in the embodiment of the present invention;
Fig. 3 is the schematic diagram one that in the embodiment of the present invention, electronic equipment is placed into support unit;
Fig. 4 is the structural representation of For Thermocouple Circuit in the embodiment of the present invention;
Fig. 5 be in the embodiment of the present invention For Thermocouple Circuit schematic diagram one is set;
Fig. 6 is the schematic diagram two that in the embodiment of the present invention, electronic equipment is placed into support unit;
Fig. 7 is the schematic diagram three that in the embodiment of the present invention, electronic equipment is placed into support unit;
Fig. 8 be in the embodiment of the present invention processing unit and first heat radiation module schematic diagram is set;
Fig. 9 be in the embodiment of the present invention For Thermocouple Circuit schematic diagram two is set;
Figure 10 is the structural representation one of embodiment of the present invention medium-height trestle equipment;
Figure 11 is the schematic diagram four that in the embodiment of the present invention, electronic equipment is placed into support unit;
Figure 12 is the schematic diagram five that in the embodiment of the present invention, electronic equipment is placed into support unit;
Figure 13 is the schematic diagram six that in the embodiment of the present invention, electronic equipment is placed into support unit;
Figure 14 is the structural representation two of embodiment of the present invention medium-height trestle equipment;
Figure 15 is the schematic diagram seven that in the embodiment of the present invention, electronic equipment is placed into support unit.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
Embodiment one weighs 1/5
The present embodiment records a kind of electronic equipment 100, can smart mobile phone or panel computer from product form electronic equipment 100; As shown in Figure 1, described electronic equipment 100 comprises body 110, is arranged at processing unit 120 (not shown) of the accommodation space of described body 110, and as shown in Figure 2, the first surface 130 of electronic equipment 100 is also provided with the first heat radiation module 140; Wherein, processing unit 120 can be at least one in application processor and baseband processor, as shown in Figure 1, the second surface 150 of electronic equipment 100 is provided with display unit 160 as Touch Screen, in order to dodge display unit 160, second surface 150 and first surface 130 are two surfaces opposing on the body 110 of electronic equipment 100.
Electronic equipment 100 can by user's handling (as being hold by one hand or hands grasping use), now, the heat that the processing unit 120 in electronic equipment 100 produces can utilize the body 110 of heat sink material (as graphite flake) and the electronic equipment 100 arranged in the accommodation space of electronic equipment 100 to conduct;
As shown in Figure 3, electronic equipment 100 can be placed on support unit 200 and firm relative to support unit 200 time, the first heat radiation module 140 that the first surface 130 of electronic equipment 100 is arranged be arranged at the module 210 that dispels the heat of second in described support unit 200 and form For Thermocouple Circuit, For Thermocouple Circuit can make described first heat radiation module 140 absorb the heat energy of processing unit 120 generation in the accommodation space of electronic equipment 100, and by absorbed thermal energy conduction to the second heat radiation module 210 in support unit 200, to dispel the heat to electronic equipment 100, the efficiency of when efficiency of now dispelling the heat to the processing unit 120 in electronic equipment 100 is not placed on support unit 200 apparently higher than electronic equipment 100, the processing unit 120 in the accommodation space of electronic equipment 100 being dispelled the heat.
Be described with the scene in practical application below, user's handling electronic equipment runs big game application, processing unit in the accommodation space of now electronic equipment is often with heavy-duty service, when the heat produced significantly is applied more than electronic equipment off-duty big game, when electronic equipment utilizes the body temperature of self to rise to the temperature (as exceeding 40 degree) of another user's significant discomfort, electronic equipment can be placed on support unit 200 by user, second module 210 that dispels the heat in first of the first surface of electronic equipment the heat radiation module and support unit 200 is made to form For Thermocouple Circuit, thus promote the efficiency that the processing unit in the accommodation space of electronic equipment is dispelled the heat, reduce the temperature of the body of electronic equipment as early as possible, be convenient to user and proceed holding operation.
Embodiment two weighs 1/2/5
The present embodiment is described the For Thermocouple Circuit that embodiment one is recorded.
As shown in Figure 4, For Thermocouple Circuit comprises the first thermoelectric components 1401 (can P type semiconductor) and the second thermoelectric components 1402 (can be N type semiconductor) that adopt conductor (as copper coin 1403, copper coin 2102) to connect thus the complete circuit of formation one, and the outside of circuit is also provided with insulating heat-conduction material (as potsherd 2101 and potsherd 1402);
As an example, the first heat radiation module 140 can adopt the first thermoelectric components 1401 (P type semiconductor), the second thermoelectric components (N type semiconductor), potsherd 1404 and copper coin 1403 in Fig. 4; Second heat radiation module 210 can adopt potsherd 2101 in Fig. 4 and copper coin 2102;
First heat radiation module 140 schematic diagram is set as shown in Figure 5, the accommodation space that potsherd 1403, copper coin 1404 are arranged on electronic equipment 100 is inner, and the first thermoelectric components 1401 and the second thermoelectric components 1402 appear in second surface 150 part of the body 110 of electronic equipment 100;
Copper coin 1404 in first heat radiation module 140 and potsherd 1403 are near the mainboard 160 of electronic equipment 100, under the effect of DC power supply shown in Figure 4, have in first thermoelectric components 1401 and the second thermoelectric components 1402 electric current of the output of the DC power supply in Fig. 4 by time, will transfer of heat be produced between two ends in the first thermoelectric components 1401 and the second thermoelectric components 1402; Heat will transfer to the other end from one end of thermoelectric components, thus generation temperature difference formation cold junction and hot junction are (when the first thermoelectric components 1401 and the second thermoelectric components 1402 form galvanic couple pair, just can produce the transfer of heat, electric current absorbs heat by N type semiconductor flow of material to the joint of P type semiconductor material becomes cold junction, becomes hot junction by P type semiconductor flow of material to the joint release heat of N type semiconductor material); Reverse heat trnasfer is carried out from by air and semi-conducting material (first thermoelectric components 1401 and the second thermoelectric components 1402) between cold junction and hot junction, thus the heat that the processing unit 120 arranged in mainboard 160 can be produced conducts to the second heat radiation module 210 (being also copper coin 2102 and potsherd 2101) in support unit 200 by For Thermocouple Circuit, effectively dispel the heat to processing unit 120.
It is pointed out that in practical application, the DC power supply shown in Fig. 4 can be arranged in the accommodation space of electronic equipment 100, also can be arranged in support unit 200; Electronic equipment 100 be placed into support unit 200 formed be stable in the schematic diagram of the relative position relation of support unit 200 can also be as shown in Figure 6 and Figure 7, that is, the form of relative position relation when electronic equipment 100 is firm relative to support unit 200 is not unique.
Embodiment three weighs 1/2/3/5
As shown in Figure 8, processing unit 120 in electronic equipment 100 is arranged at the accommodation space corresponding with first area (region shown in dotted lines in Figure 2), described first area 170 be described body 110 first surface 130 on arrange described first heat radiation module 140 region; A side structure schematic diagram of the first heat radiation module 140 is set in electronic equipment 100 as shown in Figure 9, processing unit 120 is arranged between mainboard 160 and the first heat radiation module 140 (comprising potsherd 1403 and copper coin 1404), because processing unit 120 and first dispels the heat the corresponding accommodation space in the Ye Ji first area, setting area 170 of module 140, thus processing unit 120 and the first delivered heat shortest path dispelled the heat between module 140 can be made, promote the speed of delivered heat, and then the efficiency that lifting second heat radiation module 210 pairs of processing units 120 dispel the heat.
Embodiment four weighs 1/4/5
The first running status can be in when electronic equipment 100 not being placed in the present embodiment the position relationship that support unit 200 forms with support unit 200 relative securement, in a first operational state, the power consumption of electronic equipment 100 is less than the maximum power dissipation that can reach, such as processing unit 120 in a first operational state with frequency reducing mode operation to reduce power consumption, electronic equipment 100 ensures good radiating effect in the mode of sacrificing performance, can not produce obvious hotness thus affect experience when guaranteeing user's handling electronic equipment 100, when electronic equipment 100 is placed on support unit 200, as previously mentioned, because the first heat radiation module 140 in electronic equipment 100 and second in support unit 200 module 210 that dispels the heat forms For Thermocouple Circuit, the heat that the processing unit 120 of electronic equipment 100 produces is conducted to rapidly the second heat radiation module 210 in support unit 200, thus improve the efficiency that processing unit 120 is dispelled the heat, now electronic equipment 100 can be in the second running status, such as, under processing unit 120 may operate in farsighted frequency pattern, running frequency (as running frequency promoted when running big game) is promoted according to the computation requirement of electronic equipment 100, meet the performance requirement of electronic equipment 100, give the great heat radiation effect ensureing electronic equipment 100 simultaneously.
Certainly, electronic equipment 100 is not placed into support unit 200 formation also can be in the second running status with the position relationship of support unit 200 relative securement, such as, under processing unit 120 may operate in farsighted frequency pattern, running frequency (as running frequency promoted when running big game) is promoted according to the computation requirement of electronic equipment 100, meet the performance requirement of electronic equipment 100, but because the radiating effect relying on the heat sink material of electronic equipment 100 self (body 110 as graphite flake and electronic equipment 100) to dispel the heat to processing unit 120 is limited, therefore, when body 110 temperature of electronic equipment 100 obviously rises, electronic equipment 100 can be placed on support unit 200 by user, thus form the position relationship with support unit 200 relative securement, user does not need the body gripping electronic equipment 100, and the in electronic equipment 100 first heat radiation module 140 and second in support unit 200 can be utilized to dispel the heat, and For Thermocouple Circuit that module 210 formed dispels the heat to processing unit 120, the performance requirement of electronic equipment 100 can either be ensured, high efficiency heat radiation can be carried out again to the processing unit 120 of electronic equipment 100.
Embodiment five
The present embodiment is based on embodiment four, in order to promote the efficiency of dispelling the heat to the processing unit 120 of electronic equipment 100 further, as shown in figure 11, the heat sink 230 that the module 210 that to dispel the heat with second can be had to be connected also is set in the rack body 220 of support unit 200, such as heat sink 230 can adopt fan, described heat sink 230 is for when being in running status, described second heat radiation module and medium (air) is made to carry out heat exchange with the first rate of heat exchange, described first rate of heat exchange is greater than the second rate of heat exchange, described second rate of heat exchange is that described heat sink 230 is when being in closed condition, rate of heat exchange between described second heat radiation module 210 and medium.
Above-mentioned DC power supply can be arranged in electronic equipment 100, also can as shown in figure 12, DC power supply is set in support unit 200, to power to For Thermocouple Circuit and heat sink 230.
Embodiment six weighs 6/7/8
Corresponding with the record of embodiment one to embodiment four, the present embodiment records a kind of support unit 200, and as shown in Figure 10, support unit 200 comprises:
Rack body 220, the second heat radiation module 210 be arranged in described rack body 220;
Described rack body 220 for support electronic equipment 100, to make electronic equipment 100 firm relative to described rack body 220;
Described second heat radiation module 210, for when described electronic equipment 100 is firm relative to described rack body 220, forms For Thermocouple Circuit with the module 140 that dispels the heat of first in described electronic equipment 100;
Wherein, the heat energy that described For Thermocouple Circuit produces for making described first heat radiation module 140 absorb the processing unit in described electronic equipment 100, and by absorbed thermal energy conduction to described second heat radiation module 210, to dispel the heat to described electronic equipment 100.
As shown in Figure 3, electronic equipment 100 can be placed on support unit 200 and firm relative to support unit 200 time, the first heat radiation module 140 that the first surface 130 of electronic equipment 100 is arranged be arranged at the module 210 that dispels the heat of second in described support unit 200 and form For Thermocouple Circuit, For Thermocouple Circuit can make described first heat radiation module 140 absorb the heat energy of processing unit 120 generation in the accommodation space of electronic equipment 100, and by absorbed thermal energy conduction to the second heat radiation module in support unit 200, to dispel the heat to electronic equipment 100, the efficiency of when efficiency of now dispelling the heat to the processing unit 120 in electronic equipment 100 is not placed on support unit 200 apparently higher than electronic equipment 100, the processing unit 120 in the accommodation space of electronic equipment 100 being dispelled the heat.
As shown in Figure 4, For Thermocouple Circuit comprises the first thermoelectric components 1401 (can P type semiconductor) and the second thermoelectric components 1402 (can be N type semiconductor) that adopt conductor (as copper coin 1403, copper coin 2102) to connect thus the complete circuit of formation one, and the outside of circuit is also provided with insulating heat-conduction material (as potsherd 2101 and potsherd 1402);
As an example, the first heat radiation module 140 can adopt the first thermoelectric components 1401 (P type semiconductor), the second thermoelectric components (N type semiconductor), potsherd 1404 and copper coin 1403 in Fig. 4; Second heat radiation module 210 can adopt potsherd 2101 in Fig. 4 and copper coin 2102; Second heat radiation module 210 can adopt copper coin 2102 in Fig. 4 and potsherd 2101;
Copper coin 1404 in first heat radiation module 140 and potsherd 1403 are near the mainboard 160 of electronic equipment 100, under the effect of DC power supply shown in Figure 4, have in first thermoelectric components 1401 and the second thermoelectric components 1402 electric current of the output of the DC power supply in Fig. 4 by time, will transfer of heat be produced between two ends in the first thermoelectric components 1401 and the second thermoelectric components 1402; Heat will transfer to the other end from one end of thermoelectric components, thus generation temperature difference formation cold junction and hot junction are (when the first thermoelectric components 1401 and the second thermoelectric components 1402 form galvanic couple pair, just can produce the transfer of heat, electric current absorbs heat by N type semiconductor flow of material to the joint of P type semiconductor material becomes cold junction, becomes hot junction by P type semiconductor flow of material to the joint release heat of N type semiconductor material); Reverse heat trnasfer is carried out from by air and semi-conducting material (first thermoelectric components 1401 and the second thermoelectric components 1402) between cold junction and hot junction, thus the heat that the processing unit 120 arranged in mainboard 160 can be produced conducts to the second heat radiation module 210 (being also copper coin 2102 and potsherd 2101) in support unit 200 by For Thermocouple Circuit, effectively dispel the heat to processing unit 120.
Embodiment seven weighs 9/11/12
As shown in figure 13, the present embodiment records a kind of electronic equipment 100, and described electronic equipment 100 comprises body 110 and is arranged at first connector 140 of first surface 130 of described body 110;
Described first connector 140, for connecting described body 110 and support unit 200, to make described body 110 firm relative to described support unit 200;
Wherein, when described body 110 is connected with described support unit 200, described electronic equipment 100 carries out dispelling the heat with the first radiating efficiency, such as, utilize the heat sink material (as graphite flake and body 110 self) arranged in body 110 to dispel the heat to processing unit in the accommodation space being arranged on body 110;
As an example, when electronic equipment 100 is connected with the second connector 210 of support unit 200 by the first connector 140, first connector 140 and the second connector 210 can form heat transfer pathway, such as the first connector 140 and the second connector 210 can adopt heat-conducting medium (as copper), except playing for electronic equipment 100 is stable in except the effect on support unit 200, the heat conduction that the processing unit 120 of electronic equipment 100 can also be produced conducts to the second connector 210 from the first connector 140, and by the second connector 210, the heat absorbed is conducted in support unit 200, thus promote the efficiency that processing unit 120 is dispelled the heat.
As another example, when electronic equipment 100 is connected with the second connector 210 of support unit 200 by the first connector 140, first connector 140 and the second connector 210 can form For Thermocouple Circuit, the heat energy that For Thermocouple Circuit produces for absorbing electronic equipment 100 body 110 (comprising the processing unit of the accommodation space of body 110), and conduct to described rack body 110, to dispel the heat to described electronic equipment 100, thus make the second radiating efficiency higher than the first radiating efficiency; That is, support unit 200, except for firm electronic equipment 100, can also play the effect of the radiating efficiency promoting electronic equipment 100.
As shown in Figure 4, For Thermocouple Circuit comprises the first thermoelectric components 1401 (can P type semiconductor) and the second thermoelectric components 1402 (can be N type semiconductor) that adopt conductor (as copper coin 1403, copper coin 2102) to connect thus the complete circuit of formation one, and the outside of circuit is also provided with insulating heat-conduction material (as potsherd 2101 and potsherd 1402);
As an example, the first connector 140 can adopt the first thermoelectric components 1401 (P type semiconductor), the second thermoelectric components (N type semiconductor), potsherd 1404 and copper coin 1403 in Fig. 4; Second heat radiation module 210 can adopt potsherd 2101 in Fig. 4 and copper coin 2102;
First connector 140 schematic diagram is set as shown in Figure 5, the accommodation space that potsherd 1403, copper coin 1404 are arranged on electronic equipment 100 is inner, and the first thermoelectric components 1401 and the second thermoelectric components 1402 appear in second surface 150 part of the body 110 of electronic equipment 100;
Copper coin 1404 in first connector 140 and potsherd 1403 are near the mainboard 160 of electronic equipment 100, under the effect of DC power supply shown in Figure 4, have in first thermoelectric components 1401 and the second thermoelectric components 1402 electric current of the output of the DC power supply in Fig. 4 by time, will transfer of heat be produced between two ends in the first thermoelectric components 1401 and the second thermoelectric components 1402; Heat will transfer to the other end from one end of thermoelectric components, thus generation temperature difference formation cold junction and hot junction are (when the first thermoelectric components 1401 and the second thermoelectric components 1402 form galvanic couple pair, just can produce the transfer of heat, electric current absorbs heat by N type semiconductor flow of material to the joint of P type semiconductor material becomes cold junction, becomes hot junction by P type semiconductor flow of material to the joint release heat of N type semiconductor material); Reverse heat trnasfer is carried out from by air and semi-conducting material (first thermoelectric components 1401 and the second thermoelectric components 1402) between cold junction and hot junction, thus the heat that the processing unit 120 arranged in mainboard 160 can be produced conducts to the second heat radiation module 210 (being also copper coin 2102 and potsherd 2101) in support unit 200 by For Thermocouple Circuit, effectively dispel the heat to processing unit 120.
It is pointed out that in practical application, the DC power supply shown in Fig. 4 can be arranged in the accommodation space of electronic equipment 100, also can be arranged in support unit 200.
Embodiment eight weighs 9/10
The first running status can be in when electronic equipment 100 not being placed in the present embodiment the position relationship that support unit 200 forms with support unit 200 relative securement, in a first operational state, the power consumption of electronic equipment 100 is less than the maximum power dissipation that can reach, such as processing unit 120 in a first operational state with frequency reducing mode operation to reduce power consumption, electronic equipment 100 ensures good radiating effect in the mode of sacrificing performance, can not produce obvious hotness thus affect experience when guaranteeing user's handling electronic equipment 100, when electronic equipment 100 is placed on support unit 200, as previously mentioned, because the first connector 140 in electronic equipment 100 forms For Thermocouple Circuit with the second connector 210 in support unit 200, the heat that the processing unit 120 of electronic equipment 100 produces is conducted to rapidly the second connector 210 in support unit 200, thus improve the efficiency that processing unit 120 is dispelled the heat, now electronic equipment 100 can be in the second running status, such as, under processing unit 120 may operate in farsighted frequency pattern, running frequency (as running frequency promoted when running big game) is promoted according to the computation requirement of electronic equipment 100, meet the performance requirement of electronic equipment 100, give the great heat radiation effect ensureing electronic equipment 100 simultaneously.
Certainly, electronic equipment 100 is not placed into support unit 200 formation also can be in the second running status with the position relationship of support unit 200 relative securement, such as, under processing unit 120 may operate in farsighted frequency pattern, running frequency (as running frequency promoted when running big game) is promoted according to the computation requirement of electronic equipment 100, meet the performance requirement of electronic equipment 100, but because the radiating effect relying on the heat sink material of electronic equipment 100 self (body 110 as graphite flake and electronic equipment 100) to dispel the heat to processing unit 120 is limited, therefore, when body 110 temperature of electronic equipment 100 obviously rises, electronic equipment 100 can be placed on support unit 200 by user, thus form the position relationship with support unit 200 relative securement, user does not need the body gripping electronic equipment 100, and the For Thermocouple Circuit that the first connector 140 in electronic equipment 100 and the second connector 210 in support unit 200 can be utilized to be formed dispels the heat to processing unit 120, the performance requirement of electronic equipment 100 can either be ensured, high efficiency heat radiation can be carried out again to the processing unit 120 of electronic equipment 100.
Embodiment nine weighs 9/13
As shown in Figure 1, the second surface 150 of electronic equipment 100 is provided with display unit 160 as Touch Screen, and in order to dodge display unit 160, second surface 150 and first surface 130 are two surfaces opposing on the body 110 of electronic equipment 100.
Embodiment ten weighs 14/15
The present embodiment records a kind of support unit 200, corresponding with the support unit 200 that embodiment six to embodiment ten is recorded, and as shown in figure 14, support unit 200 comprises:
Rack body 220, the second connector 210 be arranged in described rack body 220;
Described rack body 220 for support electronic equipment 100, to make electronic equipment 100 firm relative to described rack body 220;
Described second connector 210, for when described electronic equipment 100 is firm relative to described rack body 220, forms For Thermocouple Circuit with the module 140 that dispels the heat of first in described electronic equipment 100;
Wherein, the heat energy that described For Thermocouple Circuit produces for making described first heat radiation module 140 absorb the processing unit in described electronic equipment 100, and by absorbed thermal energy conduction to described second connector 210, to dispel the heat to described electronic equipment 100.
As shown in Figure 3, electronic equipment 100 can be placed on support unit 200 and firm relative to support unit 200 time, the first heat radiation module 140 that the first surface 130 of electronic equipment 100 is arranged forms For Thermocouple Circuit with the second connector 210 be arranged in described support unit 200, For Thermocouple Circuit can make described first heat radiation module 140 absorb the heat energy of processing unit 120 generation in the accommodation space of electronic equipment 100, and by absorbed thermal energy conduction to the second heat radiation module in support unit 200, to dispel the heat to electronic equipment 100, the efficiency of when efficiency of now dispelling the heat to the processing unit 120 in electronic equipment 100 is not placed on support unit 200 apparently higher than electronic equipment 100, the processing unit 120 in the accommodation space of electronic equipment 100 being dispelled the heat.
As shown in Figure 4, For Thermocouple Circuit comprises the first thermoelectric components 1401 (can P type semiconductor) and the second thermoelectric components 1402 (can be N type semiconductor) that adopt conductor (as copper coin 1403, copper coin 2102) to connect thus the complete circuit of formation one, and the outside of circuit is also provided with insulating heat-conduction material (as potsherd 2101 and potsherd 1402);
As an example, the first heat radiation module 140 can adopt the first thermoelectric components 1401 (P type semiconductor), the second thermoelectric components (N type semiconductor), potsherd 1404 and copper coin 1403 in Fig. 4; Second connector 210 can adopt potsherd 2101 in Fig. 4 and copper coin 2102; Second connector 210 can adopt copper coin 2102 in Fig. 4 and potsherd 2101;
Copper coin 1404 in first heat radiation module 140 and potsherd 1403 are near the mainboard 160 of electronic equipment 100, under the effect of DC power supply shown in Figure 4, have in first thermoelectric components 1401 and the second thermoelectric components 1402 electric current of the output of the DC power supply in Fig. 4 by time, will transfer of heat be produced between two ends in the first thermoelectric components 1401 and the second thermoelectric components 1402; Heat will transfer to the other end from one end of thermoelectric components, thus generation temperature difference formation cold junction and hot junction are (when the first thermoelectric components 1401 and the second thermoelectric components 1402 form galvanic couple pair, just can produce the transfer of heat, electric current absorbs heat by N type semiconductor flow of material to the joint of P type semiconductor material becomes cold junction, becomes hot junction by P type semiconductor flow of material to the joint release heat of N type semiconductor material); Reverse heat trnasfer is carried out from by air and semi-conducting material (first thermoelectric components 1401 and the second thermoelectric components 1402) between cold junction and hot junction, thus the heat that the processing unit 120 arranged in mainboard 160 can be produced conducts to the second connector 210 (being also copper coin 2102 and potsherd 2101) in support unit 200 by For Thermocouple Circuit, effectively dispel the heat to processing unit 120.
Embodiment 11 weighs 14/16
In order to promote the efficiency of dispelling the heat to the processing unit 120 of electronic equipment 100 further, as shown in figure 15, the heat sink 230 that can have and be connected with the second connector 210 is also set in the rack body 220 of support unit 200, such as heat sink 230 can adopt fan, described heat sink 230 is for when being in running status, described second heat radiation module and medium (air) is made to carry out heat exchange with the first rate of heat exchange, described first rate of heat exchange is greater than the second rate of heat exchange, described second rate of heat exchange is that described heat sink 230 is when being in closed condition, rate of heat exchange between described second connector 210 and medium.
Above-mentioned DC power supply can be arranged in electronic equipment 100, also DC power supply can be set in support unit 200, to power to For Thermocouple Circuit and heat sink 230.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; change can be expected easily or replace, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of described claim.
Claims (16)
1. an electronic equipment, is characterized in that, described electronic equipment comprises body, be arranged at the processing unit of the accommodation space of described body and be arranged at the first heat radiation module of first surface of described body;
When described electronic equipment is firm relative to support unit, described first heat radiation module be arranged at the module that dispels the heat of second in described support unit and form For Thermocouple Circuit;
Wherein, the heat energy that described For Thermocouple Circuit produces for making described first heat radiation module absorb described processing unit, and by absorbed thermal energy conduction to described second heat radiation module, to dispel the heat to described electronic equipment.
2. electronic equipment according to claim 1, is characterized in that,
Described first heat radiation module comprises interconnective first thermoelectric components and the second thermoelectric components;
When described electronic equipment is firm relative to described support unit, the heat energy that described first thermoelectric components and described second thermoelectric components produce for absorbing described processing unit, and by absorbed thermal energy conduction to described second heat radiation module.
3. electronic equipment according to claim 1, is characterized in that,
Described processing unit is arranged at the accommodation space corresponding with first area, described first area be described body first surface on arrange described first heat radiation module region.
4. electronic equipment according to claim 1, is characterized in that,
Described processing unit, also for when described electronic equipment is in relative securement state relative to support unit, switches to the second running status from the first running status, and the power consumption of described first running status is less than the power consumption of described second running status.
5. the electronic equipment according to any one of Claims 1-4, is characterized in that,
The second surface of described body is provided with display unit, and described first surface and described second surface are two opposing surfaces of described body.
6. a support unit, is characterized in that, described support unit comprises:
Rack body, the second heat radiation module be arranged in described rack body;
Described rack body is used for support electronic equipment, to make electronic equipment firm relative to described rack body;
Described second heat radiation module, for when described electronic equipment is firm relative to described rack body, forms For Thermocouple Circuit with the module that dispels the heat of first in described electronic equipment;
Wherein, the heat energy that described For Thermocouple Circuit produces for making described first heat radiation module absorb the processing unit in described electronic equipment, and by absorbed thermal energy conduction to described second heat radiation module, to dispel the heat to described electronic equipment.
7. support unit according to claim 6, is characterized in that,
Also heat sink is provided with in described rack body, described heat sink and described second module that dispels the heat is connected, described heat sink is used for when being in running status, described second heat radiation module and medium is made to carry out heat exchange with the first rate of heat exchange, described first rate of heat exchange is greater than the second rate of heat exchange, described second rate of heat exchange is described heat sink when being in closed condition, the rate of heat exchange between described second heat radiation module and medium.
8. the support unit according to claim 6 or 7, is characterized in that,
Also DC power supply is provided with in described rack body, for providing electric current to described For Thermocouple Circuit, the heat energy of the processing unit generation in described electronic equipment is absorbed to make described first heat radiation module, and by absorbed thermal energy conduction to described second heat radiation module, to dispel the heat to described electronic equipment.
9. an electronic equipment, is characterized in that, described electronic equipment comprises body and is arranged at first connector of first surface of described body;
Described first connector, for connecting described body and support unit, to make described body firm relative to described support unit;
Wherein, when described body is connected with described support unit, described electronic equipment has the first radiating efficiency, and when described body is not connected with described support unit, described electronic equipment has the second radiating efficiency, and described first radiating efficiency is greater than described second radiating efficiency.
10. electronic equipment according to claim 9, is characterized in that,
Described body, for when described first connector connects described body and described support unit, switches from the first running status and enters the second running status;
Wherein, the power consumption of described second running status is higher than the power consumption of described first running status.
11. electronic equipments according to claim 9, is characterized in that,
Described first connector, time also for being connected with described support unit, forms For Thermocouple Circuit with described support unit, the heat energy that described For Thermocouple Circuit produces for absorbing described body, and passes to described support unit, to dispel the heat to described body.
12. electronic equipments according to claim 9, is characterized in that,
Described first connector comprises interconnective first thermoelectric components and the second thermoelectric components;
When described first connector connects described body and described support unit, the heat energy that described first thermoelectric components and described second thermoelectric components produce for absorbing described body, and by absorbed thermal energy conduction to described support unit.
13. electronic equipments according to any one of claim 9 to 12, is characterized in that,
The second surface of described body is provided with display unit, and described first surface and described second surface are two opposing surfaces of described body.
14. 1 kinds of support units, is characterized in that, described support unit comprises:
Rack body, the second connector be arranged on described rack body;
Described second connector, for being connected with the first connector of electronic equipment, to make described electronic equipment firm relative to described rack body; Wherein,
When described second connector is connected with the first connector of described electronic equipment, described electronic equipment has the first radiating efficiency, when described second connector is not connected with the first connector of electronic equipment, described first electronic equipment has the second radiating efficiency, and described first radiating efficiency is greater than described second radiating efficiency.
15. support units according to claim 14, is characterized in that,
Described second connector, time also for being connected with the first connector of described electronic equipment, For Thermocouple Circuit is formed with the first connector of described electronic equipment, the heat energy that described For Thermocouple Circuit produces for absorbing described electronic equipment body, and conduct to described rack body, with to described electronic equipment dissipating heat.
16. support units according to claims 14 or 15, is characterized in that,
Also heat sink is provided with in described rack body, described heat sink is connected with described second connector, described heat sink is used for when being in running status, described second connector and medium is made to carry out heat exchange with the first rate of heat exchange, described first rate of heat exchange is greater than the second rate of heat exchange, described second rate of heat exchange is described heat sink when being in closed condition, the rate of heat exchange between described second connector and medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510423770.1A CN105072870A (en) | 2015-07-17 | 2015-07-17 | Electronic device and support device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510423770.1A CN105072870A (en) | 2015-07-17 | 2015-07-17 | Electronic device and support device |
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| CN106895531A (en) * | 2017-04-26 | 2017-06-27 | 重庆大学 | A kind of semiconductor air conditioner support |
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Application publication date: 20151118 |