CN209914399U - Auxiliary heat dissipation device, electronic equipment host and electronic equipment heat dissipation system - Google Patents
Auxiliary heat dissipation device, electronic equipment host and electronic equipment heat dissipation system Download PDFInfo
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- CN209914399U CN209914399U CN201921964291.0U CN201921964291U CN209914399U CN 209914399 U CN209914399 U CN 209914399U CN 201921964291 U CN201921964291 U CN 201921964291U CN 209914399 U CN209914399 U CN 209914399U
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Abstract
The utility model discloses an auxiliary heat abstractor, electronic equipment host computer and electronic equipment cooling system relates to electronic equipment technical field. An auxiliary heat dissipation device comprises a shell, wherein a refrigeration module and a heat conduction part are arranged in the shell, one end of the heat conduction part penetrates out of the shell and is used for conducting heat conduction with external equipment, and the other end of the heat conduction part is used for conducting heat exchange with the refrigeration module. The utility model discloses supplementary heat abstractor, electronic equipment host computer and electronic equipment cooling system have solved the problem that the equipment heat dissipation function is not good, have improved the heat dissipation function of equipment.
Description
Technical Field
The utility model relates to an electronic equipment technical field, concretely relates to supplementary heat abstractor, electronic equipment host computer and electronic equipment cooling system.
Background
In recent years, electronic devices have been developed rapidly, for example, game hosts have overtaken PC platforms and have entered the field of vision of a wide range of players. Although large 3D games can be realized on a host platform and a PC platform, the game host is limited by the size and the weight, the appearance cannot be large, and therefore the heat dissipation function cannot be optimized well. When a large 3D game is operated, the CPU and the display card generate heat seriously, the rotating speed of the cooling fan is increased, the noise is loud, the game experience in use and the service life of the game host are seriously influenced, and the cooling efficiency and the noise become the problems of the game host which need to be solved emphatically.
At present, the heat dissipation means of the game host machine on the market only adds fans at the air inlet and the air outlet of the game host machine, improves the heat dissipation efficiency by accelerating the air flow speed, and the purchaser selling the heat sink generally evaluates the effect generally and the inner and outer fan rotating speed is not matched and the heat dissipation efficiency is possibly reduced.
SUMMERY OF THE UTILITY MODEL
To the above defect that prior art exists, the utility model discloses a first purpose provides an auxiliary heat abstractor, and this auxiliary heat abstractor has solved the problem that equipment heat dissipation function is not good.
In order to solve the technical problem, the utility model discloses a technical scheme is:
an auxiliary heat dissipation device comprises a shell, wherein a refrigeration module and a heat conduction part are arranged in the shell, one end of the heat conduction part penetrates out of the shell and is used for conducting heat conduction with external equipment, and the other end of the heat conduction part is used for conducting heat exchange with the refrigeration module.
Wherein, the refrigeration module is a semiconductor refrigeration module.
Wherein the heat conducting component is a heat conducting metal.
And a heat conducting agent is arranged between the semiconductor refrigeration module and the heat conducting metal.
Wherein the heat conducting agent is heat conducting silica gel.
Wherein the thermally conductive metal is copper.
Wherein, the shell is provided with a heat radiation port corresponding to the position of the refrigeration module
By adopting the technical scheme, the beneficial effects of the utility model are that:
the utility model provides an auxiliary heat dissipation device, because be provided with refrigeration module and heat-conducting part in the casing, the one end of heat-conducting part is worn out the casing and is used for carrying out heat-conduction with external equipment, the other end of heat-conducting part is used for carrying out the heat exchange with the refrigeration module, therefore, under the condition that equipment needs, can be with external this auxiliary heat dissipation device of equipment, heat conduction in the messenger equipment is to the heat-conducting part on, and through the quick dissipation of the heat on the refrigeration module with the heat-conducting part, and then reduce the temperature of equipment, improve equipment's heat dissipation function, the life of extension equipment.
A second object of the present invention is to provide an electronic device host, which solves the problem of poor heat dissipation capability of the electronic device host.
In order to solve the technical problem, the utility model discloses a technical scheme is:
an electronic equipment host comprises a shell, wherein a heat dissipation assembly is arranged in the shell, a socket used for being connected with the heat conduction component of the auxiliary heat dissipation device in the first technical scheme in an inserting mode is arranged on the shell, and the heat conduction component is inserted into the shell through the socket and conducts heat conduction with the heat dissipation assembly.
Wherein the heat dissipation assembly includes a heat dissipation metal that conducts heat with the heat conductive member.
By adopting the technical scheme, the beneficial effects of the utility model are that:
the utility model provides an electronic equipment host computer, owing to be provided with be arranged in with first technical scheme auxiliary heat abstractor's heat-conducting component carry out the socket of pegging graft, under the condition that electronic equipment host computer needs, can be with the external auxiliary heat abstractor of electronic equipment host computer, make the heat conduction in the electronic equipment host computer to the heat-conducting component on, and through the quick elimination of the heat on the refrigeration module with the heat-conducting component, and then reduce the temperature of electronic equipment host computer, improve the heat dissipation function of electronic equipment host computer, prolong the life of electronic equipment host computer.
A third object of the present invention is to provide a heat dissipation system for electronic equipment, which solves the problem of poor heat dissipation capability of the host computer of the electronic equipment.
In order to solve the technical problem, the utility model discloses a technical scheme is:
an electronic device heat dissipation system includes an electronic device host described in the second technical aspect and an auxiliary heat dissipation device described in the first technical aspect, wherein the heat conduction member of the auxiliary heat dissipation device conducts heat with the heat dissipation component of the electronic device host.
By adopting the technical scheme, the beneficial effects of the utility model are that:
the utility model provides an electronic equipment cooling system, because electronic equipment host computer in the second technical scheme, this electronic equipment host computer is external to have the supplementary heat abstractor in the first technical scheme, therefore, the heat on the radiator unit of electronic equipment host computer can conduct to supplementary heat abstractor's heat-conducting component on, and the quick heat dissipation on with the heat-conducting component of refrigeration module through supplementary heat abstractor, and then reduce the temperature of electronic equipment host computer, improve the heat dissipation function of electronic equipment host computer, prolong the life of electronic equipment host computer.
Drawings
Fig. 1 is a schematic structural view of an auxiliary heat dissipation device of the present invention;
fig. 2 is a schematic structural diagram of the electronic device host of the present invention;
in the figure: 1-shell, 11-heat dissipation port, 2-refrigeration module, 3-heat conduction part, 4-plug, 5-shell, 51-socket and 52-heat dissipation air port.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The first embodiment is as follows:
as shown in fig. 1, an auxiliary heat dissipation device includes a housing 1, a refrigeration module 2 and a heat conduction member 3 are disposed in the housing 1, one end of the heat conduction member 3 penetrates out of the housing 1 for heat conduction with an external device, and the other end of the heat conduction member 3 is used for heat exchange with the refrigeration module 2.
The semiconductor refrigeration technology is widely applied to military, medical, laboratory equipment and the like, the technology is mature, and the semiconductor refrigeration technology has the characteristics of short refrigeration time, no noise, long service life, controllable temperature and the like, so the refrigeration module 2 in the embodiment is preferably a semiconductor refrigeration module.
The heat conducting member 3 may be made of a metal material such as silver and copper, or a non-metal material such as graphene, graphite, carbon fiber, and a C/C composite material. The heat-conducting member 3 in this embodiment is a heat-conducting metal, preferably a copper material.
As shown in fig. 1, a heat conducting agent (not shown) is disposed between the semiconductor refrigeration module and the heat conducting metal.
Because the heat-conducting silica gel has excellent cold and hot alternation resistance, aging resistance and electrical insulation performance, and has excellent moisture resistance, shock resistance, corona resistance, electric leakage resistance and chemical medium resistance, can be continuously used at-60-280 ℃, and has good adhesion to most of metal and non-metal materials, therefore, the heat-conducting agent in the embodiment is preferably the heat-conducting silica gel, the heat-conducting silica gel can well fill the gap between the contact surfaces of the refrigeration module 2 and the heat-conducting part 3, the air is extruded out of the contact surfaces, the air is a poor heat conductor and can seriously obstruct the transfer of heat between the contact surfaces, the heat-conducting silica gel is supplemented, the contact surfaces can be better and fully contacted, the face-to-face contact is really realized, and the reaction on the temperature can reach the temperature difference as small as possible.
As shown in fig. 1, the housing 1 is provided with a heat dissipation port 11 at a position corresponding to the refrigeration module 2. Through setting up thermovent 11, can in time spill the heat that refrigeration module 2 produced, guarantee the stability of refrigeration module 2 work.
When the heat-conducting module is used, the heat-conducting component 3 positioned outside the shell 1 is inserted into external equipment needing heat dissipation, the auxiliary heat dissipation device is electrically connected with a power supply device (not shown in the figure) through the plug 4, and the refrigeration module 2 starts refrigeration; meanwhile, the heat conducting part 3 conducts heat of the external equipment to the heat conducting part 3, and the heat of the heat conducting part 3 is rapidly and quietly dissipated through the refrigeration module 2, so that the temperature of the external equipment is reduced, the heat dissipation function of the external equipment is improved, and the service life of the external equipment is prolonged.
Example two:
as shown in fig. 2, an electronic device host includes a housing 5, a heat dissipation assembly is disposed in the housing 5, a socket 51 for inserting the heat conduction member 3 of the auxiliary heat dissipation device in the first embodiment is disposed on the housing 5, and the heat conduction member 3 is inserted into the housing 5 through the socket 51 to conduct heat with the heat dissipation assembly.
The heat dissipation assembly includes a heat dissipation metal (not shown), and the heat dissipation metal conducts heat with the heat conduction member 3.
The heat dissipation assembly in this embodiment further includes a heat dissipation fan (not shown) disposed in the housing 5, wherein the housing 5 is provided with a heat dissipation air opening 52, and the heat dissipation fan is disposed at the heat dissipation air opening 52.
When the electronic device host needs, the auxiliary heat dissipation device in the first embodiment can be plugged into the electronic device host, so that heat in the electronic device host is conducted to the heat conducting part 3, and the heat on the heat conducting part 3 is quickly and quietly dissipated through the refrigeration module 2, thereby reducing the temperature of the electronic device host, improving the heat dissipation function of the electronic device host and prolonging the service life of the electronic device host.
The electronic equipment host in the embodiment is a game host, if the load of the electronic equipment host is small and the heat productivity is low, the auxiliary heat dissipation device can be removed, and a heat dissipation fan carried by the electronic equipment host is used for dissipating heat through the heat dissipation air opening 52, so that the system is simplified, and the power consumption is reduced.
Example three:
as shown in fig. 1 and fig. 2, a heat dissipation system for electronic equipment includes a host computer for electronic equipment described in the second embodiment and an auxiliary heat dissipation device described in the first embodiment, wherein a heat conduction member 3 of the auxiliary heat dissipation device conducts heat with a heat dissipation component of the host computer for electronic equipment.
During the use, insert the socket 51 of electronic equipment host computer with auxiliary heat abstractor's heat-conducting component 3, make heat-conducting component 3 and the inside heat dissipation metal that is used for the heat dissipation of electronic equipment host computer link to each other, then with electronic equipment host computer and auxiliary heat abstractor circular telegram start, the heat dissipation metal conducts the heat fast to heat-conducting component 3 on to cool down rapidly through refrigeration module 2, realize that the electronic equipment host computer is quiet, dispel the heat fast.
If the load of the main body of the electronic equipment is small, the heat productivity is low, the auxiliary heat dissipation device can be removed, and the heat dissipation fan of the electronic equipment main body is used for dissipating heat through the heat dissipation air opening 52, so that the system is simplified, and the power consumption is reduced.
The present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes without the labor of creation from the above conception, which falls within the protection scope of the present invention.
Claims (10)
1. An auxiliary heat dissipation device is characterized by comprising a shell, wherein a refrigeration module and a heat conduction component are arranged in the shell, one end of the heat conduction component penetrates out of the shell and is used for conducting heat conduction with external equipment, and the other end of the heat conduction component is used for conducting heat exchange with the refrigeration module.
2. The auxiliary heat sink as recited in claim 1 wherein said refrigeration module is a semiconductor refrigeration module.
3. The auxiliary heat sink as claimed in claim 2, wherein the heat conductive member is a heat conductive metal.
4. The auxiliary heat sink as claimed in claim 3, wherein a heat conducting agent is disposed between the semiconductor refrigeration module and the heat conducting metal.
5. The auxiliary heat sink as claimed in claim 4, wherein the heat conducting agent is a heat conducting silica gel.
6. The auxiliary heat sink as recited in claim 4 wherein said thermally conductive metal is copper.
7. The auxiliary heat sink as claimed in claim 1, wherein the housing is provided with a heat dissipating port at a position corresponding to the refrigeration module.
8. An electronic device host, comprising a housing, wherein a heat dissipation assembly is disposed in the housing, and characterized in that a socket for plugging with the heat conduction component of the auxiliary heat dissipation device of any one of claims 1 to 7 is disposed on the housing, and the heat conduction component is inserted into the housing through the socket to conduct heat with the heat dissipation assembly.
9. The electronic device host of claim 8, wherein the heat dissipation assembly comprises a heat dissipation metal that is in thermal conduction with the thermal conductive member.
10. A heat dissipating system for an electronic device, comprising the electronic device host of claim 8 or 9 and the auxiliary heat dissipating apparatus of any one of claims 1 to 7, wherein the heat conducting member of the auxiliary heat dissipating apparatus conducts heat with the heat dissipating component of the electronic device host.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921964291.0U CN209914399U (en) | 2019-11-14 | 2019-11-14 | Auxiliary heat dissipation device, electronic equipment host and electronic equipment heat dissipation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921964291.0U CN209914399U (en) | 2019-11-14 | 2019-11-14 | Auxiliary heat dissipation device, electronic equipment host and electronic equipment heat dissipation system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209914399U true CN209914399U (en) | 2020-01-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921964291.0U Active CN209914399U (en) | 2019-11-14 | 2019-11-14 | Auxiliary heat dissipation device, electronic equipment host and electronic equipment heat dissipation system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209914399U (en) |
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2019
- 2019-11-14 CN CN201921964291.0U patent/CN209914399U/en active Active
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