CN203722977U - Mobile device heat radiation structure - Google Patents
Mobile device heat radiation structure Download PDFInfo
- Publication number
- CN203722977U CN203722977U CN201320783915.5U CN201320783915U CN203722977U CN 203722977 U CN203722977 U CN 203722977U CN 201320783915 U CN201320783915 U CN 201320783915U CN 203722977 U CN203722977 U CN 203722977U
- Authority
- CN
- China
- Prior art keywords
- running gear
- cooling chip
- circuit unit
- radiator structure
- lower cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005855 radiation Effects 0.000 title abstract description 9
- 238000001816 cooling Methods 0.000 claims abstract description 31
- 230000004308 accommodation Effects 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 abstract 4
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000009434 installation Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000005679 Peltier effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a mobile device heat radiation structure. The mobile device heat radiation structure comprises a housing and a heating element. The housing comprises an upper cover and a lower cover. The upper cover and the lower cover define a holding space. The heating element is arranged in the holding space. A cooling chip is attached onto one side of the heating element. The other side of the cooling chip is attached onto the lower cover. The cooling chip absorbs the heat energy of the heating element, and the heat energy is led out from the housing. The problem of heat radiation of the mobile device is solved and the energy saving function is achieved.
Description
Technical field
The present invention relates to a kind of radiator structure, espespecially a kind of running gear radiator structure that is applied to running gear and can promotes running gear heat dissipation.
Background technology
In electronic installation development, more and more high operation efficiency has been trend now with the process chip with high computing clock pulse, but has also produced the problem in more heat radiations; More and the development of electronic installation more need to take compact be designer trends, but must reach under high operation efficiency and compact designer trends simultaneously, the radiating efficiency of its relative electronic installation is relative difficulty also.
The electronic installation of prior art is when running, and its inner chip or processor are when carrying out computing or processing, the temperature of chip or processor itself can raise, thereby produce unnecessary heat, if for frivolous running gear, such as ultra-thin mobile computer, flat computer, intelligent mobile phone etc. hand held device, be mainly previously to utilize the modes such as simple perforate, heat conduction, thermal convection to set about, but those radiating modes are with the heat energy that high-effect chip or processor produced now of cannot loading.
But, along with existing hand held device usefulness is more and more higher, its central interior processing unit march toward double-core or the even higher usefulness of four cores, and the faster heat that it produces of the treatment efficiency processing speed of central processing unit also certainly will be more and more higher, therefore how can reach quick conductive and dispel the heat under identical volume thinness, also become a very important problem simultaneously.
Summary of the invention
Therefore,, for effectively addressing the above problem, main purpose of the present invention is to provide a kind of running gear radiator structure that promotes running gear heat dissipation.
Another object of the present invention is providing a kind of running gear radiator structure that can promote its heat dissipation in the limited running gear in inner space.
Another object of the present invention can provide the structure of heat conduction providing a kind of in limited space, effectively promotes the heat dissipation of its running gear not increasing in addition under the thickness of running gear or overall volume.
Another object of the present invention provide a kind of can be via the transformation of cooling chip produce power, except can the heat energy of heater element is loose, also can send the running gear radiator structure of the electric power that power conversion produces.
For reaching above-mentioned purpose, the invention provides a kind of running gear radiator structure, comprising: a shell, there is a upper cover and a lower cover, between this upper cover and lower cover, define an accommodation space; One heater element, is arranged on a circuit unit and is relatively arranged in described accommodation space, and this heater element one side is pasted with a cooling chip, and this cooling chip opposite side is attached at described lower cover.
Preferably, described cooling chip has at least one connecting line and is electrically connected described circuit unit.
Preferably, described cooling chip is electrically connected and supplies power to described circuit unit.
Preferably, in described accommodation space, be more provided with at least one support body.
Preferably, described support body has one first storage tank for described circuit unit setting.
Preferably, described support body has one second storage tank for described cooling chip setting.
Preferably, be more provided with at least one power elements in described accommodation space, this power elements is to be arranged on described support body and via an adapter unit to be electrically connected described circuit unit and described cooling chip.
Whereby, can receive its heater element heat energy via described cooling chip one side draught, opposite side is derived heat energy by lower cover, and then solves the problem of running gear heat radiation and reach energy-conservation effect, and structure effective heat dissipation that promotes its running gear of heat conduction more can be provided in limited space.
Accompanying drawing explanation
Figure 1A is the three-dimensional exploded view of first embodiment of the invention;
Figure 1B is another angle three-dimensional exploded view of first embodiment of the invention;
Fig. 1 C is the three-dimensional combination figure of first embodiment of the invention;
Fig. 1 D is the assembled sectional view of first embodiment of the invention;
Fig. 2 A is the three-dimensional exploded view of second embodiment of the invention;
Fig. 2 B is another angle three-dimensional exploded view of second embodiment of the invention;
Fig. 2 C is the three-dimensional combination figure of second embodiment of the invention;
Fig. 2 D is the assembled sectional view of second embodiment of the invention.
Symbol description
Shell 1
Upper cover 11
Lower cover 12
Accommodation space 13
Heater element 2
Circuit unit 21
Cooling chip 22
Connecting line 23
Support body 3
The first storage tank 31
The second storage tank 32
Adapter unit 33
Power elements 34
Embodiment
Characteristic in above-mentioned purpose of the present invention and structure thereof and function, is explained the preferred embodiment according to institute's accompanying drawing.
Refer to shown in Figure 1A to 1D, stereo decomposing and another angle stereo decomposing and three-dimensional combination and assembled sectional view for running gear radiator structure the first preferred embodiment of the present invention, as shown in the figure, running gear radiator structure of the present invention comprises a shell 1 and a heater element 2;
Described shell 1 has a upper cover 11 and a lower cover 12, and this upper cover 11 covers and defines an accommodation space 13 mutually with lower cover 12, and in this accommodation space 13, be provided with described heater element 2, this heater element 2 is arranged at a side of a circuit unit 21, this circuit unit 21 is relatively arranged in described accommodation space 13 and a side is corresponding described upper cover 11, and opposite side is provided with described heater element 2, and these heater element 2 one sides attachings are incorporated into described circuit unit 21, and opposite side is provided with a cooling chip 22, this cooling chip 22 is also relatively arranged in described accommodation space 13 simultaneously, and this cooling chip 22 is attached at described lower cover 12 with respect to heater element 2 opposite sides, with when this heater element 2 produces heat energy, this cooling chip 22 uses Peltier effect (Peltier Effect) can make the heat of heater element 2 be conducted to and be attached at lower cover 12 1 sides by one of described cooling chip 22 side, whereby, can receive its heater element 2 heat energy by described cooling chip 22 1 side draughts, opposite side is derived heat energy by lower cover 12, and then the problem of solution running gear heat radiation, structure effective heat dissipation that promotes its running gear of heat conduction more can be provided in limited space.
This cooling chip 22 has the described circuit unit 21 of at least one connecting line 23 electric connection again, to receive its heater element 2 heat energy when these cooling chip 22 1 side draughts, opposite side is derived produce power simultaneously by heat energy by lower cover 12 and is changed, by its thermal power transfer, be electric energy and provide electrical power to described circuit unit 21, so as to effectively reaching the effect of saving the energy.
Separately refer to shown in Fig. 2 A to 2D, stereo decomposing and another angle stereo decomposing and combination and assembled sectional view for running gear radiator structure the second preferred embodiment of the present invention, as shown in the figure, the present embodiment part-structure is identical with aforementioned the first embodiment, therefore will repeat no more at this, only the present embodiment and aforementioned the first embodiment's does not exist together for being more provided with at least one support body 3 in described accommodation space 13, this support body 3 has respectively one first storage tank 31 and one second storage tank 32 with respect to circuit unit 21 and cooling chip 22 positions, and on this support body 3, being separately provided with an adapter unit 33 connects for the mutual group of a power elements 34, wherein this support body 3 is arranged in described accommodation space 13, and this circuit unit 21 is to be arranged in described the first storage tank 31, the cooling chip 22 that the heater element 2 of its relative circuit unit 21 1 side settings and heater element 2 attach is to be arranged in described the second storage tank 32, whereby, can receive its heater element 2 heat energy by described cooling chip 22 1 side draughts, opposite side is derived heat energy by lower cover 12, and then the problem of solution running gear heat radiation, structure effective heat dissipation that promotes its running gear of heat conduction more can be provided in limited space, and be not increase in addition under the thickness of running gear or overall volume effectively heat radiation usefulness.
Again, the adapter unit 33 arranging on this support body 3 is to be electrically connected described circuit unit 21, and its power elements 34 is for being connected to described adapter unit 33 and being electrically connected described circuit unit 21, and this cooling chip 22 has the described circuit unit 21 of described connecting line 23 electric connection, cause its cooling chip 22 1 side draughts to receive its heater element 2 heat energy, opposite side is derived produce power simultaneously by heat energy by lower cover 12 and is changed, by its thermal power transfer, be electric energy and provide electrical power to described circuit unit 21 and power elements 34, so as to effectively reaching the effect of saving the energy.
In sum; running gear radiator structure of the present invention is when being used; for really reaching its effect and object; therefore the present invention is the invention of a practicality excellence, although the present invention discloses as above with execution mode, so it is not in order to limit the present invention; any person skilled in the art person; without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations, so protection scope of the present invention is worked as with standard that claims are decided to be.
Claims (7)
1. a running gear radiator structure, is characterized in that, comprising:
One shell, has a upper cover and a lower cover, defines an accommodation space between this upper cover and lower cover; One heater element, is arranged on a circuit unit and is relatively arranged in described accommodation space, and this heater element one side is pasted with a cooling chip, and this cooling chip opposite side is attached at described lower cover.
2. running gear radiator structure as claimed in claim 1, is characterized in that, described cooling chip has at least one connecting line and is electrically connected described circuit unit.
3. running gear radiator structure as claimed in claim 2, is characterized in that, described cooling chip is electrically connected and supplies power to described circuit unit.
4. running gear radiator structure as claimed in claim 1, is characterized in that, is more provided with at least one support body in described accommodation space.
5. running gear radiator structure as claimed in claim 4, is characterized in that, described support body has one first storage tank for described circuit unit setting.
6. running gear radiator structure as claimed in claim 4, is characterized in that, described support body has one second storage tank for described cooling chip setting.
7. running gear radiator structure as claimed in claim 4, is characterized in that, is more provided with at least one power elements in described accommodation space, and this power elements is arranged on described support body and via an adapter unit and is electrically connected described circuit unit and described cooling chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320783915.5U CN203722977U (en) | 2013-12-02 | 2013-12-02 | Mobile device heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320783915.5U CN203722977U (en) | 2013-12-02 | 2013-12-02 | Mobile device heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203722977U true CN203722977U (en) | 2014-07-16 |
Family
ID=51162092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320783915.5U Expired - Lifetime CN203722977U (en) | 2013-12-02 | 2013-12-02 | Mobile device heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203722977U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104684349A (en) * | 2013-12-02 | 2015-06-03 | 奇鋐科技股份有限公司 | Heat dissipation structure of mobile device |
| CN105376988A (en) * | 2014-08-26 | 2016-03-02 | 奇鋐科技股份有限公司 | Mobile equipment cooling structure |
| CN107565377A (en) * | 2017-09-28 | 2018-01-09 | 中国科学院长春光学精密机械与物理研究所 | A kind of semiconductor chip structure |
| US10114430B2 (en) | 2014-10-20 | 2018-10-30 | Asia Vital Components Co., Ltd. | Heat dissipation structure for mobile device |
-
2013
- 2013-12-02 CN CN201320783915.5U patent/CN203722977U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104684349A (en) * | 2013-12-02 | 2015-06-03 | 奇鋐科技股份有限公司 | Heat dissipation structure of mobile device |
| CN105376988A (en) * | 2014-08-26 | 2016-03-02 | 奇鋐科技股份有限公司 | Mobile equipment cooling structure |
| CN105376988B (en) * | 2014-08-26 | 2020-04-10 | 奇鋐科技股份有限公司 | Mobile device heat radiation structure |
| US10114430B2 (en) | 2014-10-20 | 2018-10-30 | Asia Vital Components Co., Ltd. | Heat dissipation structure for mobile device |
| CN107565377A (en) * | 2017-09-28 | 2018-01-09 | 中国科学院长春光学精密机械与物理研究所 | A kind of semiconductor chip structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140716 |
|
| CX01 | Expiry of patent term |