CN105039776A - Dispersion strengthening copper-based composite material for spot-welding electrode and preparation method of dispersion strengthening copper-based composite material - Google Patents
Dispersion strengthening copper-based composite material for spot-welding electrode and preparation method of dispersion strengthening copper-based composite material Download PDFInfo
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- CN105039776A CN105039776A CN201510458914.7A CN201510458914A CN105039776A CN 105039776 A CN105039776 A CN 105039776A CN 201510458914 A CN201510458914 A CN 201510458914A CN 105039776 A CN105039776 A CN 105039776A
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Abstract
The invention discloses a dispersion strengthening copper-based composite material for a spot-welding electrode and a preparation method of the dispersion strengthening copper-based composite material, and belongs to the technical field of metal-based composite materials. The dispersion strengthening copper-based composite material for the spot-welding electrode is composed of, by mass, 5%-10% of TiC, 0.5%-1% of Ce, 0.5%-1% of La2O3, 0.1%-1% of Al2O3 and the balance Cu. The TiC has the characteristics of being high in hardness, high in melting point and good in heat stability. The TiC and the Cu are not subjected to solid solution with each other. The prepared composite material not only has the TiC characteristics of being high in strength, high in hardness and high in melting point but also has the Cu characteristics of being high in electrical conductivity, high in thermal conductivity and the like. Furthermore, the strength, abrasion resistance and high-temperature resistance of copper can be improved through the TiC. The light rare earth element Ce and the light rare earth oxide La2O3 have the effects of strengthening the grain boundary and refining crystal grains, and thus the strength and machinability of the composite material can be improved.
Description
Technical field
The present invention relates to a kind of spot-wedling electrode dispersed and strengthened copper-based composite material, and the preparation method of this matrix material, belong to metal-base composites technical field.
Background technology
High-intensity high-conductivity copper based composites is the new function material that a class has excellent comprehensive performance, has both had excellent electroconductibility, has again high intensity and superior high-temperature behavior.Along with the development of electronic industry, especially the end of the seventies in last century, SCM Corporation of the U.S. developed Glidcop series A l
2o
3after dispersion-strengthened Cu matrix material, high-intensity high-conductivity copper based composites in the developed country such as the U.S., Japan development research Showed Very Brisk, and enters practical stage.And the research of China to this kind of material is started late, carry out the research of this kind of material to the beginning of the nineties at the end of the eighties in last century, but not yet entered practical stage.The wear resistance of the Cu alloy material of fine copper and the existing trade mark, electroconductibility, intensity and high-temperature behavior are often difficult to take into account, the hi-tech such as Aeronautics and Astronautics, microelectronics can not be met comprehensively and develop requirement to its over-all properties rapidly, as the material requirements of microelectronic device spot-wedling electrode: hardness >=110HBS, specific conductivity >=85%IACS, high temperature resistance softening temperature >=923K.
Dispersion copper is a kind of excellent electron structure function material with high abrasion, high connductivity, high strength, high resistance softening temperature, be widely used in the fields such as large power, electrically valve tube, microelectronic device pin, circuit lead frame, micro-wave communication, power transmission, in national defense industry and electronics and information industry, there is widespread use.
Manufacturing technology many employings powder metallurgic method of tradition dispersion copper, be wherein most widely used with powder internal oxidition powder metallurgic method, its common technology flow process is: alloy melting → powder process → internal oxidition → reduction → compacting → sintering → hot-work → cold working.Because this manufacturing technology process flow process is complicated, cause Material quality control difficulty, cost is very high, significantly limit it and applies.Dispersion copper in China market is mostly the U.S., Japanese firm's product, and domestic scale is very little, is difficult to meet national defence and social development demand.
Dispersion-strengthened Al
2o
3-Cu matrix material, not only intensity is high, and electroconductibility is close with fine copper, but also has good anti-electric-arc ablation, anti-electrical wear ability and higher normal temperature strength and hot strength, is a kind of novel texture and functional materials with broad prospect of application.Along with the development of electronic industry, increasing to the demand of this kind of high abrasion, high purity, high connductivity compound, material.
The development of the development of dispersion-strengthened Cu mainly technology of preparing.The key of dispersion-strengthened Cu technology of preparing how to obtain ultra-fine strengthening particulate homogenous to be distributed on the fine copper matrix of high connductivity, to obtain the combarloy based composites of high diffusive strengthening effect.Its technology of preparing main development experienced by traditional powder metallurgic method, the powder metallurgic method of improvement and other new preparation technology.
The intensity of dispersion strengthened material not only depend on matrix and disperse phase person's character and also be decided by the content of disperse phase, granularity and distribution, form and disperse phase and matrix in conjunction with situation, simultaneously also relevant with preparation technology's (such as processing mode, processing conditions).Dispersion strengthened material, because there being low ductility, needs to be paid attention to and improve, but the superiority of dispersion strengthened material in performance still accounts for main.
Chinese patent (application number: the preparation method 201210361535.2) disclosing a kind of high-wear-resistancehigh-strength high-strength high connductivity spot-wedling electrode, comprises the following steps: (1) takes Cu respectively
2o, Cu-Al, TiC powder, after mixing under rotating speed 30rpm ball milling 12 ~ 16h; Cu
2the granularity of O powder is 200 orders, and consumption is 2.5 ~ 5% of Cu-Al alloy mass; The granularity of Cu-Al powder is 200 orders, and in Cu-Al, aluminium content is not more than 0.5wt%; The granularity of TiC powder is 20 ~ 60mm, accounts for 12.14 ~ 26.56% of mixed powder total mass; (2) mixed powder after ball milling is loaded graphite jig, precompressed 5min under 30MPa condition; (3) in step (2), mixed powder will be housed and mold integral through precompressed is placed in vacuum sintering funace, in sintering temperature 900 ~ 1000 DEG C, vacuum tightness 1.5 × 10
-2hot pressed sintering 1 ~ 2h under MPa, compacting pressure 20 ~ 40MPa condition, then removes pressure sintering 1 ~ 4h, obtains the dispersion copper of complete internal oxidition; (4) get dispersion copper in step (3) and be processed as the product of desired size.Dispersion copper spot-wedling electrode prepared by the method has the feature of high-wearing feature, high strength & high electric-conduction, high resistance softening temperature, wherein dispersion copper-TiC (30%) electric conductivity 82.6%IACS, microhardness 175HV, density 99.15%, thermal conductivity 90.14Wm
-1k
-1, the spot-wedling electrode life-span (solder joint) is 6.8 ~ 7.2 ten thousand times, and softening temperature is higher than 650 DEG C.But the specific conductivity of this spot-wedling electrode material is lower than the standard of microelectronic device spot-wedling electrode material electric conductivity >=85%IACS, and softening temperature, electroconductibility and softening resistant performance still have much room for improvement.
Summary of the invention
The object of this invention is to provide a kind of spot-wedling electrode dispersed and strengthened copper-based composite material.
Meanwhile, the present invention also provides a kind of preparation method of above-mentioned dispersed and strengthened copper-based composite material.
In order to realize above object, the technical solution adopted in the present invention is:
A kind of spot-wedling electrode dispersed and strengthened copper-based composite material, is made up of the component of following mass percent: TiC5 ~ 10%, Ce0.5 ~ 1%, La
2o
30.5 ~ 1%, Al
2o
30.1 ~ 1%, surplus is Cu.This matrix material can adopt method preparation as described in the background art, and difference is only to the addition of Ce powder and La in step (1) more
2o
3powder.
A kind of spot-wedling electrode dispersed and strengthened copper-based composite material, is made up of the raw material of following mass percent: TiC powder 5 ~ 10%, Ce powder 0.5 ~ 1%, La
2o
3the Cu of powder 0.5 ~ 1%, reacting weight
2o powder, surplus is Cu-Al powdered alloy, and in Cu-Al powdered alloy, Al content is not more than 0.5wt%.
The granularity of described TiC powder is 5 ~ 15 μm, and median particle size is 10 μm.
The granularity of described Ce (being used as short interface cohesion agent) powder is 0.5 ~ 3 μm.
Described La
2o
3the granularity of (as activator) powder is 0.2 ~ 1 μm.
In described Cu-Al powdered alloy, Al content is preferably 0.1 ~ 0.5wt%, accordingly, and Cu in raw material
2the mass percent of O powder is 0.5 ~ 4%.
Described Cu
2the granularity of O powder is 20 ~ 60 μm, and median particle size is 30 μm, is mainly internal oxidition and provides oxygen source.
The granularity of described Cu-Al alloy (low solid solubility alloy) powder is lower than 200 orders.Cu-Al powdered alloy can adopt conventional water fog method preparation.
A preparation method for spot-wedling electrode dispersed and strengthened copper-based composite material, comprises the following steps:
(1) each raw material is got according to mass percent, by five kinds of powder mixing and ball milling to granularity lower than 200 orders but only 400 orders;
(2) loaded in mould by the mixed powder after ball milling, carry out vacuum heating-press sintering, sintering temperature is 980 ~ 1030 DEG C, and the internal oxidition time is 1 ~ 3h, and compacting pressure is 35 ~ 55MPa, and total clamping time is 0.5 ~ 1h, obtains dispersed copper matrix material.
Described in step (1), ball milling can adopt QM-3SP20 planetary ball mill, ball milling 1.5 ~ 3 hours under 35 ~ 45rpm rotating speed.
After mixed powder loads mould in step (2), first carry out precompressed, then carry out vacuum heating-press sintering.The pressure of precompressed is 50 ~ 100MPa, and the time is 10 ~ 20min.The object of precompressed ensures mixed powder completely densified.
Vacuum heating-press sintering adopts VPF-350 vacuum hotpressing stove in step (2), mixed powder will be housed and be placed in vacuum hotpressing stove through the mold integral of precompressed to carry out vacuum heating-press sintering internal oxidition.
In step (2), the vacuum tightness of vacuum heating-press sintering is 1.0 × 10
-2~ 1.0 × 10
-4pa.
In step (2) vacuum heating-press sintering process in have pressurization-unload press operation, the summation of total clamping time and several periods of press times, it does not comprise the time of precompressed.
After obtaining dispersed copper matrix material in step (2), namely machining deformation obtains spot-wedling electrode.Described machining deformation is cold-pressing deformation, hot extrusion deformation or rolling deformation.For complex-shaped microelectronic device or spot-wedling electrode component, while meeting dimensional requirement, the intensity of dispersion copper can be improved further by cold deformation, and due to the Dispersed precipitate of nano alumina particles and particulate titanium carbide, this working hardening effect can be remained into comparatively high temps.Cold (heat) crimp can adopt an extrusion molding or multi-pass rolling to be shaped.
Beneficial effect of the present invention:
In the present invention, dispersed copper matrix material adopts TiC, light rare earths Ce and light rare earths oxide compound La
2o
3powder, wherein TiC has that hardness is high, fusing point is high, the characteristic of Heat stability is good, TiC particle (or fiber) is added in metallic copper, TiC and Cu not solid solution mutually, the prepared existing TiC high strength of matrix material, high rigidity, high-melting-point characteristic, have again the characteristics such as Cu high connductivity, high heat conduction, TiC can also improve the intensity of copper, wear resistance and resistance to elevated temperatures in addition.Light rare earths Ce and light rare earths oxide compound La
2o
3there is the effect of strengthening crystal boundary and crystal grain thinning, intensity and the processing characteristics of matrix material can be improved.
The spot-wedling electrode adopting dispersed copper matrix material of the present invention to prepare has the characteristics such as high strength, high-wearing feature, high conductivity, high resistance softening temperature, high anti electric arc corrosion, specific conductivity is at more than 85%IACS, density is higher than 98%, work-ing life improves 9 ~ 10 times than conventional copper alloy spot-wedling electrode, softening temperature reaches more than 690 DEG C, can be used for the fields such as large power, electrically valve tube, microelectronic device pin, circuit lead frame, micro-wave communication, power transmission, also there is widespread use in national defense industry and electronics and information industry.
In the present invention, the preparation method of dispersed copper matrix material has the advantage that the internal oxidition time is short, cost is low, efficiency is high, is suitable for large-scale industrial production.
Embodiment
Following embodiment is only described in further detail the present invention, but does not form any limitation of the invention.
Embodiment 1
Spot-wedling electrode dispersed and strengthened copper-based composite material in the present embodiment, is made up of the component of following mass percent: TiC8%, Ce0.7%, La
2o
30.8%, Al
2o
30.1%, surplus is Cu.This matrix material is with reference to the preparation of method described in background technology, and difference is only to the addition of Ce powder and La in step (1) more
2o
3powder.
Embodiment 2
Spot-wedling electrode dispersed and strengthened copper-based composite material in the present embodiment, is made up of the component of following mass percent: TiC5%, Ce0.5%, La
2o
30.5%, Al
2o
30.5%, surplus is Cu.Preparation method is with embodiment 1.
Embodiment 3
Spot-wedling electrode dispersed and strengthened copper-based composite material in the present embodiment, is made up of the component of following mass percent: TiC10%, Ce1%, La
2o
31%, Al
2o
31%, surplus is Cu.Preparation method is with embodiment 1.
Embodiment 4
Spot-wedling electrode dispersed and strengthened copper-based composite material in the present embodiment, is made up of the raw material of following mass percent: TiC powder (granularity 10 μm) 8%, Ce powder (granularity 1 μm) 0.7%, La
2o
3powder (granularity 0.5 μm) 0.8%, Cu
2o powder (granularity 30 μm) 0.8%, surplus is Cu-Al powdered alloy (granularity 200 order), and in Cu-Al powdered alloy, Al content is 0.09%.
The preparation method of spot-wedling electrode dispersed and strengthened copper-based composite material, comprises the following steps:
(1) get each raw material according to above-mentioned mass percent, be placed on QM-3SP20 planetary ball mill by five kinds of powder mixing, ball milling 2h under 30rpm rotating speed, obtaining granularity is 300 object mixed powders;
(2) powder after ball milling is loaded in graphite jig (cavity dimension is φ 50mm × 30mm), precompressed 20min under 50MPa pressure, be placed in VPF-350 vacuum hotpressing stove together with mold integral again and carry out vacuum heating-press sintering, vacuum tightness is 1.5 × 10
-3pa, sintering temperature is 1000 DEG C, and the internal oxidition time is 2h, pressurize after internal oxidition 30min 20min, and compacting pressure is 45MPa, then release 30min, and then the 40min that pressurizes, total clamping time is 1h, obtains the overall TiC/Ce/La that internal oxidition is complete, density is 99.3%
2o
3/ Cu-Al
2o
3block.
The dispersed and strengthened copper-based composite material of above-mentioned preparation comprises Cu, Al, Ti, C, Ce, La and O element, and wherein Al and O exists with the form of aluminum oxide second-phase, Al
2o
3content to be 0.17wt%, Ti and C exist (content 8wt%) with the form of TiC wild phase, Ce is short interface cohesion agent (content 0.7wt%), La and O is with La
2o
3exist as activator and interface cohesion toughener (content 0.8wt%), surplus is Cu.
By overall TiC/Ce/La
2o
3/ Cu-Al
2o
3block sawing machine cuts into the segment of diameter 7mm, long 30mm, in SXL-1200 type chamber type electric resistance furnace, be heated to 900 DEG C, insulation 30min, then on YT32-400 type four-column hydraulic press, be hot extruded into the microelectronic device spot-wedling electrode of diameter 4mm.The electric conductivity that obtained welding electrode material has is 86.8%, and hardness is 185HV, and the welding electrode life-span is 7.2 ~ 7.5 ten thousand times, and softening temperature is higher than 698 DEG C.
Embodiment 5
Spot-wedling electrode dispersed and strengthened copper-based composite material in the present embodiment, is made up of the raw material of following mass percent: TiC powder (granularity 10 μm) 5%, Ce powder (granularity 0.5 μm) 0.5%, La
2o
3powder (granularity 0.2 μm) 0.5%, Cu
2o powder (granularity 30 μm) 2.5%, surplus is Cu-Al powdered alloy (granularity 200 order), and in Cu-Al powdered alloy, Al content is 0.3%.
The preparation method of spot-wedling electrode dispersed and strengthened copper-based composite material, comprises the following steps:
(1) get each raw material according to above-mentioned mass percent, be placed on QM-3SP20 planetary ball mill by five kinds of powder mixing, ball milling 2h under 30rpm rotating speed, obtaining granularity is 300 object mixed powders;
(2) powder after ball milling is loaded in graphite jig (cavity dimension is φ 50mm × 30mm), precompressed 20min under 50MPa pressure, be placed in VPF-350 vacuum hotpressing stove together with mold integral again and carry out vacuum heating-press sintering, vacuum tightness is 1.5 × 10
-3pa, sintering temperature is 980 DEG C, and the internal oxidition time is 2h, pressurize after internal oxidition 30min 20min, and compacting pressure is 35MPa, then release 30min, and then the 40min that pressurizes, total clamping time is 1h, obtains the overall TiC/Ce/La that internal oxidition is complete, density is 99.0%
2o
3/ Cu-Al
2o
3block.
The dispersed and strengthened copper-based composite material of above-mentioned preparation comprises Cu, Al, Ti, C, Ce, La and O element, and wherein Al and O exists with the form of aluminum oxide second-phase, Al
2o
3content to be 0.52wt%, Ti and C exist (content 5wt%) with the form of TiC wild phase, Ce is short interface cohesion agent (content 0.5wt%), La and O is with La
2o
3exist as activator and interface cohesion toughener (content 0.5wt%), surplus is Cu.
By overall TiC/Ce/La
2o
3/ Cu-Al
2o
3block sawing machine cuts into the segment of diameter 7mm, long 30mm, in SXL-1200 type chamber type electric resistance furnace, be heated to 900 DEG C, insulation 30min, then on YT32-400 type four-column hydraulic press, be hot extruded into the microelectronic device spot-wedling electrode of diameter 4mm.The electric conductivity that obtained welding electrode material has is 86.5%, and hardness is 182HV, and the welding electrode life-span is 6.9 ~ 7.3 ten thousand times, and softening temperature is higher than 694 DEG C.
Embodiment 6
Spot-wedling electrode dispersed and strengthened copper-based composite material in the present embodiment, is made up of the raw material of following mass percent: TiC powder (granularity 10 μm) 10%, Ce powder (granularity 3 μm) 1.0%, La
2o
3powder (granularity 1 μm) 1.0%, Cu
2o powder (granularity 30 μm) 3.7%, surplus is Cu-Al powdered alloy (granularity 200 order), and in Cu-Al powdered alloy, Al content is 0.42%.
The preparation method of spot-wedling electrode dispersed and strengthened copper-based composite material, comprises the following steps:
(1) get each raw material according to above-mentioned mass percent, be placed on QM-3SP20 planetary ball mill by five kinds of powder mixing, ball milling 2h under 30rpm rotating speed, obtaining granularity is 300 object mixed powders;
(2) powder after ball milling is loaded in graphite jig (cavity dimension is φ 50mm × 30mm), precompressed 20min under 50MPa pressure, be placed in VPF-350 vacuum hotpressing stove together with mold integral again and carry out vacuum heating-press sintering, vacuum tightness is 1.5 × 10
-3pa, sintering temperature is 1030 DEG C, and the internal oxidition time is 2h, pressurize after internal oxidition 30min 20min, and compacting pressure is 55MPa, then release 30min, and then the 40min that pressurizes, total clamping time is 1h, obtains the overall TiC/Ce/La that internal oxidition is complete, density is 98.7%
2o
3/ Cu-Al
2o
3block.
The dispersed and strengthened copper-based composite material of above-mentioned preparation comprises Cu, Al, Ti, C, Ce, La and O element, and wherein Al and O exists with the form of aluminum oxide second-phase, Al
2o
3content to be 0.8wt%, Ti and C exist (content 10wt%) with the form of TiC wild phase, Ce is short interface cohesion agent (content 1.0wt%), La and O is with La
2o
3exist as activator and interface cohesion toughener (content 1.0wt%), surplus is Cu.
By overall TiC/Ce/La
2o
3/ Cu-Al
2o
3block sawing machine cuts into the segment of diameter 7mm, long 30mm, in SXL-1200 type chamber type electric resistance furnace, be heated to 900 DEG C, insulation 30min, then on YT32-400 type four-column hydraulic press, be hot extruded into the microelectronic device spot-wedling electrode of diameter 4mm.The electric conductivity that obtained welding electrode material has is 85.7%, and hardness is 178HV, and the welding electrode life-span is 6.5 ~ 7.1 ten thousand times, and softening temperature is higher than 692 DEG C.
In above-mentioned example, QM-3SP20 planetary ball mill is purchased from Henan brother plant and instrument company limited; VPF-350 vacuum sintering funace is purchased from Yixing City longitude and latitude electric furnace company limited; SXL-1200 chamber type electric resistance furnace is purchased from the loud and clear plant and instrument company limited in Zhengzhou; Four-column hydraulic press YT32-400 is purchased from Tengzhou City Fang Teng machine works.
Claims (10)
1. a spot-wedling electrode dispersed and strengthened copper-based composite material, is characterized in that: be made up of the component of following mass percent: TiC5 ~ 10%, Ce0.5 ~ 1%, La
2o
30.5 ~ 1%, Al
2o
30.1 ~ 1%, surplus is Cu.
2. a spot-wedling electrode dispersed and strengthened copper-based composite material, is characterized in that: be made up of the raw material of following mass percent: TiC powder 5 ~ 10%, Ce powder 0.5 ~ 1%, La
2o
3powder 0.5 ~ 1%, Cu
2o powder 0.5 ~ 4%, surplus is Cu-Al powdered alloy, and in Cu-Al powdered alloy, Al content is 0.1 ~ 0.5wt%.
3. dispersed and strengthened copper-based composite material according to claim 2, is characterized in that: the granularity of described TiC powder is 5 ~ 15 μm.
4. dispersed and strengthened copper-based composite material according to claim 2, is characterized in that: the granularity of described Ce powder is 0.5 ~ 3 μm.
5. dispersed and strengthened copper-based composite material according to claim 2, is characterized in that: described La
2o
3the granularity of powder is 0.2 ~ 1 μm.
6. dispersed and strengthened copper-based composite material according to claim 2, is characterized in that: described Cu
2the granularity of O powder is 20 ~ 60 μm.
7. dispersed and strengthened copper-based composite material according to claim 2, is characterized in that: the granularity of described Cu-Al powdered alloy is lower than 200 orders.
8. the preparation method of the spot-wedling electrode dispersed and strengthened copper-based composite material according to any one of claim 2 ~ 7, is characterized in that: comprise the following steps:
(1) each raw material is got according to mass percent, by five kinds of powder mixing and ball milling to granularity lower than 200 orders but only 400 orders;
(2) loaded in mould by the mixed powder after ball milling, carry out vacuum heating-press sintering, sintering temperature is 980 ~ 1030 DEG C, and the internal oxidition time is 1 ~ 3h, and compacting pressure is 35 ~ 55MPa, and total clamping time is 0.5 ~ 1h, obtains dispersed copper matrix material.
9. preparation method according to claim 8, is characterized in that: after in step (2), mixed powder loads mould, first carry out precompressed, then carry out vacuum heating-press sintering, the pressure of precompressed is 50 ~ 100MPa, and the time is 10 ~ 20min.
10. preparation method according to claim 8, is characterized in that: in step (2), the vacuum tightness of vacuum heating-press sintering is 1.0 × 10
-2~ 1.0 × 10
-4pa.
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| CN106282649A (en) * | 2016-08-31 | 2017-01-04 | 宁波新睦新材料有限公司 | A kind of high-strength conductive Cu-base composites and preparation method thereof |
| CN110093530A (en) * | 2019-06-10 | 2019-08-06 | 河南科技大学 | It is a kind of high to lead wear-resistant copper based composites and preparation method thereof |
| CN110184489A (en) * | 2019-06-11 | 2019-08-30 | 中山麓科睿材科技有限公司 | A kind of preparation process of alumina dispersion-strenghtened copper alloy |
| AU2019284109B1 (en) * | 2019-01-29 | 2020-02-27 | Hunan Hi-Tech Cuway Materials Co., Ltd. | Nano dispersion copper alloy with high air-tightness and low free oxygen content and brief manufacturing process thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106282649A (en) * | 2016-08-31 | 2017-01-04 | 宁波新睦新材料有限公司 | A kind of high-strength conductive Cu-base composites and preparation method thereof |
| AU2019284109B1 (en) * | 2019-01-29 | 2020-02-27 | Hunan Hi-Tech Cuway Materials Co., Ltd. | Nano dispersion copper alloy with high air-tightness and low free oxygen content and brief manufacturing process thereof |
| CN110093530A (en) * | 2019-06-10 | 2019-08-06 | 河南科技大学 | It is a kind of high to lead wear-resistant copper based composites and preparation method thereof |
| CN110184489A (en) * | 2019-06-11 | 2019-08-30 | 中山麓科睿材科技有限公司 | A kind of preparation process of alumina dispersion-strenghtened copper alloy |
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Application publication date: 20151111 |