CN105024018B - A kind of flexible display and preparation method thereof - Google Patents
A kind of flexible display and preparation method thereof Download PDFInfo
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- CN105024018B CN105024018B CN201410176745.3A CN201410176745A CN105024018B CN 105024018 B CN105024018 B CN 105024018B CN 201410176745 A CN201410176745 A CN 201410176745A CN 105024018 B CN105024018 B CN 105024018B
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Abstract
The present invention discloses a kind of flexible display and preparation method thereof, wherein, production method includes step：A, carrier substrate intermediate region is surface-treated so that carrier substrate intermediate region is in hydrophobicity；B, crosslinking curing is allowed to, forms thin polymer film in the uniform coated polymer solution of carrier substrate surface, then heating；C, thin polymer film surrounding is surface-treated, increases the cementability of thin polymer film and carrier substrate；D, barrier layer, tft array layer, oled layer and encapsulated layer are sequentially formed on the polymer film, then strip down from carrier substrate flexible display along line of cut.It ensure that there is preferable cementability when making flexible display by the present invention, it in turn ensure that after completing, easily display device is stripped down from carrier substrate, the present invention is without using to bonding agent at the same time, simplify device preparation technology, flexible base board heat resistance is improved, is suitable for making high-resolution flexible display.
Description
Technical field
The present invention relates to flexible display apparatus field, more particularly to a kind of flexible display and preparation method thereof.
Background technology
Flexible display is the research hotspot of each colleges and universities of recent domestic and research structure, and all big enterprises fall over each other cloth
The emphasis of office.Various advanced manufacture crafts and technology are constantly progressive so that and not only screen size constantly increases flexible display, and
And display quality is also continuously improved, Samsung, LG Deng great factories release flexible AMOLED one after another（Active matrix organic light-emitting diode face
Plate）Show model machine.Compared with regular display, flexible display has many advantages, such as：Light-weight, small, slimming, carries
It is convenient；High-low temperature resistant, impact resistance, shock resistance are stronger, and adaptable working environment is wider；Rollable, shape is with more art
The aesthetic feeling of design；It is cheaper using the coil type production technology of typography, cost；It is low in energy consumption, it is more energy efficient；Organic material is more
Add environmentally protective.Flexible display is by the use of flexible substrate material as device bearing substrate, and requires electrode layer, TFT matrixes, aobvious
Show that device and encapsulated layer have certain bending radius to realize flexibility.
At present, the production technology of Flexible Displays product is broadly divided into two classes：The first kind is to use R2R（roll to roll）
Production technology, i.e., directly prepare display device on flexible substrates by way of printing, but due to be subject to printing technology and
Show the limitation of ink material, the display device prepared does not reach the requirement shown in high precision, and yields is low, reliability
Difference；Second class is to use S2S（sheet to sheet）Production technology, the method peeled off afterwards is first attached with reference to flexible base board, first
Flexible base board is attached on hard carrier substrate and prepares display device, display device has been prepared and has peeled off hard substrate again afterwards,
Flexible display device is taken out, this technique does not influence the making precision of display device, and making apparatus and technique are with making tradition
TFT-LCD it is similar, it is not necessary to do too big adjustment, therefore in a short time closer to volume production application.
It is way commonplace at present that the method for attaching and peeling off is combined using S2S production technologies and makes flexible display,
But this method needs additionally to use bonding agent, and harshness is required to adhesive performance, attaching and stripping technology, it is whole to make
During bonding agent substrate and carrier must be bonded firm, uniform ground attaches bubble-free, stripping means to device performance without
Bonding agent noresidue after influencing and peeling off.More importantly flexible substrate substrate must acid and alkali-resistance, organic solvent（All TFT works
The solvent that journey is used）, it is seen that light transmission rate is high, and is resistant to TFT high-temperature technologies, other mechanicalnesses and stability have higher
It is required that.
But existing S2S production technologies, which are difficult to, is ensureing there is preferable glue between carrier substrate and thin polymer film
In the case of connecing property, moreover it is possible to easily thin polymer film is stripped down, and bonding agent noresidue.
Therefore, the prior art has yet to be improved and developed.
The content of the invention
In view of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide a kind of flexible display and its making side
Method, it is intended to solve existing process for manufacturing flexible display be difficult to ensure that between carrier substrate and thin polymer film can have compared with
The problem of good cementability is conveniently peeled off again.
Technical scheme is as follows：
A kind of production method of flexible display, wherein, including step：
A, carrier substrate intermediate region is surface-treated so that carrier substrate intermediate region is in hydrophobicity；
B, crosslinking curing is allowed to, forms polymer thin in the uniform coated polymer solution of carrier substrate surface, then heating
Film；
C, thin polymer film surrounding is surface-treated, increases the cementability of thin polymer film surrounding and carrier substrate；
D, barrier layer, tft array layer, oled layer and encapsulated layer are sequentially formed on the polymer film, then along line of cut
Flexible display is cut and stripped down from carrier substrate.
The production method of the flexible display, wherein, in the step A, to the surface of carrier substrate intermediate region
The step of processing, specifically includes：
Mask process first is carried out to the surrounding of carrier substrate, carrier base is then bombarded using fluoro-gas low temperature plasma
The intermediate region of plate.
The production method of the flexible display, wherein, in the step A, to the surface of carrier substrate intermediate region
The step of processing, specifically includes：
Mask process first is carried out to the surrounding of carrier substrate, then using atmosphere low-temperature plasma bombardment carrier substrate
Intermediate region, then add hydrophober in the intermediate region of carrier substrate.
The production method of the flexible display, wherein, the hydrophober is dimethicone.
The production method of the flexible display, wherein, in the step C, surface is carried out to thin polymer film surrounding
The step of processing, specifically includes：
Mask process first is carried out to the intermediate region of thin polymer film, then thin polymer film surrounding is carried out at uv-exposure
Reason, makes the cross-linking reaction of thin polymer film surrounding complete.
The production method of the flexible display, wherein, in the step C, surface is carried out to thin polymer film surrounding
The step of processing, specifically includes：
Mask process first is carried out to the intermediate region of thin polymer film, then pulse microwave is carried out to thin polymer film surrounding and is added
Heat treatment, makes thin polymer film surrounding high-temperature oxydation, improves the cementability of thin polymer film and carrier substrate.
The production method of the flexible display, wherein, in the step C, barrier layer is organic material/inorganic material
The alternating structure of formation, or the alternating structure that inorganic material/inorganic material is formed.
The production method of the flexible display, wherein, the organic material/inorganic material alternating structure is
parylene/SiNx/parylene/SiNx。
The production method of the flexible display, wherein, the inorganic material/inorganic material alternating structure is SiNx/
SiO2/SiNx。
A kind of flexible display, wherein, it is made of production method as described above.
Beneficial effect：Mode of the invention by using mask, with reference to the surface treatment to carrier substrate, so that carrier
The intermediate region of substrate is in hydrophobicity, and the thin polymer film surrounding of formation is surface-treated, and makes thin polymer film four
Week is Nian Jie with carrier substrate firmly, and then cementability is poor for thin polymer film intermediate region, that is, ensure that and making flexible display
When there is preferable cementability, in turn ensure that after completing, easily strip down display device from carrier substrate, together
When the present invention without using to bonding agent, simplifying device preparation technology, improving flexible base board heat resistance, be suitable for making
High-resolution flexible display.
Brief description of the drawings
Fig. 1 is a kind of flow chart of the production method preferred embodiment of flexible display of the present invention.
Fig. 2 is the flow diagram being surface-treated in the production method of the present invention to carrier substrate.
Fig. 3 is the flow diagram for making thin polymer film in the production method of the present invention on carrier substrate.
Fig. 4 is the flow diagram being surface-treated in the production method of the present invention to thin polymer film.
Fig. 5 is structural representation when forming barrier layer and encapsulated layer in the production method of the present invention on the polymer film
Figure.
Fig. 6 is the structure diagram of the barrier layer in Fig. 5.
Fig. 7 is structure diagram when display device being cut and peeled off in the production method of the present invention.
Fig. 8 is the structure diagram of the last flexible display of obtained top light emitting of production method of the present invention.
Fig. 9 is the structure diagram of the last flexible display of obtained bottom-emission of production method of the present invention.
Embodiment
The present invention provides a kind of flexible display and preparation method thereof, to make the purpose of the present invention, technical solution and effect
Clearer, clear and definite, the present invention is described in more detail below.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
Referring to Fig. 1, Fig. 1 is a kind of flow chart of the production method preferred embodiment of flexible display of the present invention, such as scheme
Shown, it includes step：
S1, be surface-treated carrier substrate intermediate region so that carrier substrate intermediate region is in hydrophobicity；
S2, in the uniform coated polymer solution of carrier substrate surface, then heating is allowed to crosslinking curing, forms polymer thin
Film；
S3, be surface-treated thin polymer film surrounding, increases the cementability of thin polymer film surrounding and carrier substrate；
S4, sequentially form barrier layer, tft array layer, oled layer and encapsulated layer on the polymer film, then along line of cut
Flexible display is cut and stripped down from carrier substrate.
In embodiments of the present invention, by being surface-treated to carrier substrate intermediate region so that among carrier substrate
Region is in hydrophobicity, and then conveniently peels off thin polymer film and carrier substrate, in addition carries out table to thin polymer film surrounding again
Surface treatment, increases the cementability of thin polymer film surrounding and carrier substrate, so in turn ensure that in manufacturing process, display device is equal
Even smooth bubble-free, so the manufacture craft of the embodiment of the present invention has taken into account cementability and release performance, while again without using
To traditional bonding agent, so simplifying manufacture craft, flexible base board heat resistance is improved.
Polymer in the embodiment of the present invention is preferably easily PI solution, and PI materials turn itself with higher vitrifying
Temperature（Tg）, higher material decomposition temperature（Td）, coordinate TFT high temperature engineerings, the tft array that manufacturability can be excellent is real
Existing high-resolution flexibility AMOLED is shown.
As the preferred embodiment of the present invention, in the step S1, the surface treatment to carrier substrate intermediate region
Step specifically includes：
As shown in Fig. 2, mask process first is carried out to the surrounding of carrier substrate 100（MASK1）, it is then low using fluoro-gas
Isothermal plasma bombards the intermediate region of carrier substrate 100, and bombardment time is controlled in 15 ~ 45min, such as 30min, so as to carry
The intermediate region on 100 surface of structure base board forms hydrophobic surface 110.Mask process therein refers to cover selected region
Processing, so that follow-up processing procedure can only influence the region beyond selected region, refers to carrier substrate in the present embodiment
Intermediate region on 100 outside mask process region.
In the present embodiment, carrier substrate 100 is preferably display level electronic glass, on electronic glass surface, its hydrophilicity
The hydrolysis tendency and minute crack of alkali metal ion, hydroxyl, silica from surface, and fluoro-gas low temperature plasma
In contain substantial amounts of active particle, when bombarding glass surface, the chemical bond of the various groups of glass surface can be opened, so that shape
Acted on into sputtering, remove the hydrophilic radicals such as the alkali metal ion, hydroxyl and silica of glass surface, make carrier base so as to reach
The intermediate region of plate 100 is in hydrophobic purpose, and the cementability of such thin polymer film and hydrophobic surface is poor, is conducive to device
Stripped down from carrier substrate 100.
As the preferred embodiment of the present invention, in the step S1, the surface treatment to carrier substrate intermediate region
Step includes：
Mask process first is carried out to the surrounding of carrier substrate 100（MASK1）, then bombarded using atmosphere low-temperature plasma
The intermediate region of carrier substrate 100, bombardment time are controlled in 15 ~ 45min, such as 30min, then in the centre of carrier substrate 100
Hydrophober is added in region, so as to form hydrophobic surface 110 in the intermediate region on 100 surface of carrier substrate.The hydrophober is two
Methyl-silicone oil.
In the present embodiment, after using 100 surface of atmosphere low-temperature plasma bombardment carrier substrate, hydrophober is also added,
So that glass surface reacts, hydrophobic film is generated, to form hydrophobic surface.Hydrophober therein is preferably dimethyl-silicon
Oil, under the action of plasma, dimethicone chemical bond rupture generation methyl and another macromolecular radical, the two can
Reacted with the surface with electronic glass on the premise of hydroxyl is replaced, generate one layer of fine and close hydrophobic film, strengthen electronics glass
The hydrophobicity of glass intermediate region.
After being surface-treated to the intermediate region of carrier substrate 100, as shown in figure 3, then in whole face carrier base
The uniform coated polymer solution in 100 surface of plate, such as PI solution, are then fed into high temperature oven, carry out high-temperature heating treatment,
Polymer solution is set to crosslink curing, it is flexible substrate to form thin polymer film 200, and the coating method of polymer solution can be with
It is spin-coating method (Spin), knife coating（slit）Or ink jet printing（inkjet printing）The methods of, and control polymer molten
The characterisitic parameters such as thickness, uniformity and the surface roughness of liquid coating.In addition, nitrogen can be passed through in high temperature oven, avoid
With carrier substrate 100 interfacial reaction, which occurs, for polymer solution under high temperature influences the performance of thin polymer film 200.
Above-mentioned two embodiment is the surface treatment for carrier substrate 100 so that thin polymer film 200 and carrier substrate
The cementability of 100 intermediate regions is poor, and thin polymer film 200 and 100 surrounding of carrier substrate are Nian Jie insecure in order to prevent, below
Embodiment to polymeric film surface processing is provided, to strengthen the cementability of thin polymer film surrounding and carrier substrate, is prevented
During subsequent technique phenomena such as thin polymer film curling, peeling.
As the preferred embodiment of the present invention, in the step S3, thin polymer film surrounding is surface-treated
Step specifically includes：
As shown in figure 4, mask process first is carried out to the intermediate region of thin polymer film 200（MASK2）, then to polymer thin
200 surrounding of film carries out uv-exposure processing, makes the cross-linking reaction of 200 surrounding of thin polymer film complete.The present embodiment is to polymerization
200 surrounding of thing film carries out uv-exposure processing, and time for exposure control is in 10 ~ 30min, such as 20min, so that polymer thin
The cross-linking reaction of 200 surrounding of film is complete, and organic polymer rearranges, and thin polymer film is formed polymer latex 210, further
Lift the curing degree of thin polymer film 200, the cementability of enhancing thin polymer film 200 and carrier substrate 100 so that bonding is more
Uniform ground, bubble-free.
As the preferred embodiment of the present invention, in the step S3, thin polymer film surrounding is surface-treated
Step specifically includes：
Mask process first is carried out to the intermediate region of thin polymer film 200（MASK2）, then to 200 surrounding of thin polymer film
Pulse microwave heating is carried out, makes 200 surrounding high-temperature oxydation of thin polymer film, temperature conditionss are controlled at 250 ~ 450 DEG C, processing
Time control when 1 ~ 3 is small, such as under 300 DEG C of temperature conditionss processing 2 it is small when, to improve thin polymer film 200 and carrier substrate
100 cementability.The present embodiment is using the form of pulse microwave heating, and 200 surrounding of thin polymer film is carried out high-temperature oxydation
Processing, so that 200 surrounding of thin polymer film reacts with 100 interface of carrier substrate, strengthens bonded energy, improves polymer thin
The cementability of film 200 and carrier substrate 100.
Since the water oxygen transmitance of thin polymer film 200 is high, stability and service life to OLED device have sternly
Ghost image is rung, so need to form barrier layer 300 on thin polymer film 200, as shown in figure 5, to prevent water oxygen from passing through, to device into
Row protection, as the preferred embodiment of the present invention, the alternating knot that the barrier layer 300 is formed for organic material/inorganic material
Structure, or the alternating structure that inorganic material/inorganic material is formed.Preferably, the organic material/inorganic material alternating structure is
parylene/SiNx/parylene/SiNx；Further, as shown in fig. 6, the inorganic material/inorganic material alternating structure is
SiNx（310）/SiO2（320）/SiNx（310）.Then the TFT battle arrays for being used for driving flexible display device are made on barrier layer 300
Row, such as Oxide-TFT, according to the difference of TFT technological temperatures, it is necessary to select the different flexible substrate material of heat resistance.So
After be deposited each layer organic material and electrode material, make OLED display device, AMOLED layers formed by tft array layer and oled layer
400, encapsulated layer 500 is finally made, plays and protects flexible display from the influence of steam, oxygen, dust and stress.
After the completion of above-mentioned element manufacturing, as shown in fig. 7, flexible display can be cut and be stripped down along line of cut,
Wherein, preferably, line of cut corresponds to the intermediate region of carrier substrate water repellent region and point of peripheral regions for thin polymer film
Boundary line.Since carrier substrate 100 and the cementability of the intermediate region of thin polymer film 200 are poor, so can using mechanical system
Easily device and carrier are separated, simultaneously because without using to bonding agent, manufacture craft being simplified, without in view of viscous
The residue problem of agent is connect, also improves flexible base board heat resistance.
In addition, the PI solution that selection light transmittance is different, can also be fabricated to top emitting as shown in Figure 8（Top light emitting）It is soft
Property display or bottom emitting as shown in Figure 9（Bottom-emission）Flexible display, can specifically select to make as needed different
The flexible display of type.
Based on the above method, the present invention also provides a kind of flexible display, it uses the production method to be made.
In conclusion mode of the present invention by using mask, with reference to the surface treatment to carrier substrate, so that carrier
The intermediate region of substrate is in hydrophobicity, and the thin polymer film surrounding of formation is surface-treated, and makes thin polymer film four
Week is Nian Jie with carrier substrate firmly, and then cementability is poor for thin polymer film intermediate region, that is, ensure that and making flexible display
When there is preferable cementability, in turn ensure that after completing, easily strip down display device from carrier substrate, together
When the present invention without using to bonding agent, simplifying device preparation technology, improving flexible base board heat resistance, be suitable for making
High-resolution flexible display.
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can
To be improved or converted according to the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect scope.
Claims (6)
1. a kind of production method of flexible display, it is characterised in that including step：
A, carrier substrate intermediate region is surface-treated so that carrier substrate intermediate region is in hydrophobicity；To carrier substrate
The step of surface treatment of intermediate region, specifically includes：Mask process first is carried out to the surrounding of carrier substrate, then using air
Low temperature plasma bombards the intermediate region of carrier substrate, then adds hydrophober in the intermediate region of carrier substrate；
B, crosslinking curing is allowed to, forms thin polymer film in the uniform coated polymer solution of carrier substrate surface, then heating；
C, thin polymer film surrounding is surface-treated, increases the cementability of thin polymer film surrounding and carrier substrate；
D, barrier layer, tft array layer, oled layer and encapsulated layer are sequentially formed on the polymer film, then will be soft along line of cut
Property display cuts and strips down from carrier substrate；The alternating knot that the barrier layer is formed for organic material/inorganic material
Structure, or the alternating structure that inorganic material/inorganic material is formed；
In the step C, the step of being surface-treated to thin polymer film surrounding, specifically includes：
Mask process is first carried out to the intermediate region of thin polymer film, then thin polymer film surrounding is carried out uv-exposure processing or
Pulse microwave heats, and makes the cross-linking reaction of thin polymer film surrounding complete；
Line of cut corresponds to the intermediate region of carrier substrate water repellent region and the line of demarcation of peripheral regions for thin polymer film.
2. the production method of flexible display according to claim 1, it is characterised in that in the step A, to carrier base
The step of surface treatment of plate intermediate region, specifically includes：
Mask process first is carried out to the surrounding of carrier substrate, then using fluoro-gas low temperature plasma bombardment carrier substrate
Intermediate region.
3. the production method of flexible display according to claim 1, it is characterised in that the hydrophober is dimethyl-silicon
Oil.
4. the production method of flexible display according to claim 1, it is characterised in that the organic material/inorganic material
Material alternating structure is parylene/SiNx/parylene/SiNx。
5. the production method of flexible display according to claim 1, it is characterised in that the inorganic material/inorganic material
Material alternating structure is SiNx/SiO2/SiNx。
6. a kind of flexible display, it is characterised in that be made of such as claim 1 to 5 any one of them production method.
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| CN106920813A (en) * | 2015-12-28 | 2017-07-04 | 昆山工研院新型平板显示技术中心有限公司 | The preparation method of flexible display |
| CN106935593B (en) * | 2015-12-31 | 2019-10-11 | 昆山工研院新型平板显示技术中心有限公司 | Flexible display apparatus and preparation method thereof |
| CN106654055B (en) * | 2016-09-14 | 2018-08-24 | 昆山国显光电有限公司 | Flexible display and preparation method thereof |
| CN106158740A (en) * | 2016-09-26 | 2016-11-23 | 昆山工研院新型平板显示技术中心有限公司 | Flexible substrate substrate and the preparation method of flexible OLED display |
| CN106448473B (en) * | 2016-12-16 | 2017-11-10 | 京东方科技集团股份有限公司 | Display panel motherboard and display panel preparation method |
| CN108305938B (en) * | 2017-01-12 | 2020-03-31 | 京东方科技集团股份有限公司 | Thin film transistor, manufacturing method thereof, array substrate and display device |
| CN107516666B (en) * | 2017-08-18 | 2020-01-10 | 武汉华星光电技术有限公司 | Flexible OLED display device stripping method and flexible OLED display device |
| CN107610597A (en) * | 2017-10-27 | 2018-01-19 | 武汉华星光电半导体显示技术有限公司 | The cutting method of display panel motherboard and display panel motherboard |
| CN107768414B (en) * | 2017-10-27 | 2020-07-17 | 京东方科技集团股份有限公司 | Flexible substrate and manufacturing method thereof, flexible display substrate and manufacturing method thereof |
| CN108962937B (en) * | 2017-12-21 | 2021-07-30 | 广东聚华印刷显示技术有限公司 | Flexible display device and preparation method thereof |
| CN108963090A (en) * | 2017-12-26 | 2018-12-07 | 广东聚华印刷显示技术有限公司 | Flexible display device and preparation method thereof |
| JP6778829B2 (en) * | 2018-03-16 | 2020-11-04 | 株式会社東芝 | Electrode manufacturing method and manufacturing equipment |
| CN109273511A (en) * | 2018-10-17 | 2019-01-25 | 武汉华星光电半导体显示技术有限公司 | A kind of OLED display panel and preparation method thereof |
| CN110649183A (en) * | 2019-09-02 | 2020-01-03 | 武汉华星光电半导体显示技术有限公司 | Manufacturing method of display panel |
| CN114824035B (en) * | 2021-01-19 | 2023-09-15 | 东莞市中麒光电技术有限公司 | LED display module and manufacturing method thereof |
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