CN104979320A - 用于与半导体器件的连接的引线 - Google Patents
用于与半导体器件的连接的引线 Download PDFInfo
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- CN104979320A CN104979320A CN201510108593.8A CN201510108593A CN104979320A CN 104979320 A CN104979320 A CN 104979320A CN 201510108593 A CN201510108593 A CN 201510108593A CN 104979320 A CN104979320 A CN 104979320A
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- lead
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/35—Manufacturing methods
- H01L2224/352—Mechanical processes
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/3701—Shape
- H01L2224/37011—Shape comprising apertures or cavities
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- H01L2224/37013—Cross-sectional shape being non uniform along the connector
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- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
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- H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/376—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/37601—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
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- H01L2224/3754—Coating
- H01L2224/37599—Material
- H01L2224/376—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/37638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H01L2224/4009—Loop shape
- H01L2224/40095—Kinked
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/40247—Connecting the strap to a bond pad of the item
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/8434—Bonding interfaces of the connector
- H01L2224/84345—Shape, e.g. interlocking features
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/848—Bonding techniques
- H01L2224/84801—Soldering or alloying
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14163714.0A EP2930747A1 (en) | 2014-04-07 | 2014-04-07 | Lead for connection to a semiconductor device |
EP14163714.0 | 2014-04-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104979320A true CN104979320A (zh) | 2015-10-14 |
Family
ID=50439260
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510108593.8A Pending CN104979320A (zh) | 2014-04-07 | 2015-03-12 | 用于与半导体器件的连接的引线 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9418918B2 (zh) |
EP (1) | EP2930747A1 (zh) |
CN (1) | CN104979320A (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107910308A (zh) * | 2016-09-30 | 2018-04-13 | 英飞凌科技美国公司 | 用于半导体装置封装体的导电夹 |
CN108206163A (zh) * | 2016-12-19 | 2018-06-26 | 安世有限公司 | Ic封装件中夹布置的半导体器件和方法 |
CN110211942A (zh) * | 2019-07-10 | 2019-09-06 | 广东气派科技有限公司 | 一种芯片封装用的铜夹和芯片封装结构 |
CN111326493A (zh) * | 2018-12-17 | 2020-06-23 | 安世有限公司 | 用于半导体装置的引线框架组件 |
CN113594125A (zh) * | 2020-05-01 | 2021-11-02 | 安世有限公司 | 半导体装置及其制造方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9640465B2 (en) | 2015-06-03 | 2017-05-02 | Infineon Technologies Ag | Semiconductor device including a clip |
KR102565034B1 (ko) * | 2016-11-09 | 2023-08-09 | 주식회사 아모텍 | 기능성 컨택터 |
WO2018150553A1 (ja) * | 2017-02-20 | 2018-08-23 | 新電元工業株式会社 | 電子装置 |
WO2019082345A1 (ja) * | 2017-10-26 | 2019-05-02 | 新電元工業株式会社 | 半導体装置、及び、半導体装置の製造方法 |
US11211353B2 (en) * | 2019-07-09 | 2021-12-28 | Infineon Technologies Ag | Clips for semiconductor packages |
US11177197B2 (en) * | 2019-09-25 | 2021-11-16 | Texas Instruments Incorporated | Semiconductor package with solder standoff |
JP7414073B2 (ja) * | 2019-10-15 | 2024-01-16 | 富士電機株式会社 | 半導体モジュール |
US11545459B2 (en) | 2021-01-22 | 2023-01-03 | Infineon Technologies Ag | Metal clip with solder volume balancing reservoir |
KR20230168513A (ko) * | 2022-06-07 | 2023-12-14 | 현대모비스 주식회사 | 파워모듈에 적용되는 메탈 클립 |
CN117542820A (zh) * | 2022-08-02 | 2024-02-09 | 力特半导体(无锡)有限公司 | 用于电视装置的封装结构组件 |
CN117673053A (zh) * | 2022-08-24 | 2024-03-08 | 力特半导体(无锡)有限公司 | 二合一引线框架封装件 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070114352A1 (en) * | 2005-11-18 | 2007-05-24 | Victor R Cruz Erwin | Semiconductor die package using leadframe and clip and method of manufacturing |
US20080093736A1 (en) * | 2006-10-23 | 2008-04-24 | Nec Electronics Corporation | Semiconductor device |
CN101593740A (zh) * | 2008-05-30 | 2009-12-02 | 万国半导体股份有限公司 | 用于半导体器件封装的导电夹片 |
US20090321900A1 (en) * | 2008-06-26 | 2009-12-31 | Mitsubishi Electric Corporation | Semiconductor device |
CN101752329A (zh) * | 2008-12-01 | 2010-06-23 | 万国半导体有限公司 | 带有堆积式互联承载板顶端散热的半导体封装及其方法 |
US20110076807A1 (en) * | 2007-08-28 | 2011-03-31 | Gomez Jocel P | Self locking and aligning clip structure for semiconductor die package |
US20110108968A1 (en) * | 2006-05-04 | 2011-05-12 | International Rectifier Corporation | Semiconductor package with metal straps |
CN102194788A (zh) * | 2010-03-18 | 2011-09-21 | 万国半导体股份有限公司 | 多层引线框封装及其制备方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4085768B2 (ja) * | 2002-10-08 | 2008-05-14 | トヨタ自動車株式会社 | 上部電極、パワーモジュール、および上部電極のはんだ付け方法 |
CN101819955B (zh) * | 2004-12-20 | 2011-09-28 | 半导体元件工业有限责任公司 | 具有增强散热性的半导体封装结构 |
JP2006190728A (ja) * | 2005-01-04 | 2006-07-20 | Mitsubishi Electric Corp | 電力用半導体装置 |
US7683464B2 (en) * | 2005-09-13 | 2010-03-23 | Alpha And Omega Semiconductor Incorporated | Semiconductor package having dimpled plate interconnections |
US8581376B2 (en) * | 2010-03-18 | 2013-11-12 | Alpha & Omega Semiconductor Incorporated | Stacked dual chip package and method of fabrication |
JP5270614B2 (ja) * | 2010-05-24 | 2013-08-21 | 三菱電機株式会社 | 半導体装置 |
TW201251140A (en) * | 2011-01-31 | 2012-12-16 | Cree Inc | High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion |
US8354733B2 (en) * | 2011-03-04 | 2013-01-15 | International Rectifier Corporation | IGBT power semiconductor package having a conductive clip |
JP2013161941A (ja) * | 2012-02-06 | 2013-08-19 | Renesas Electronics Corp | 半導体装置 |
-
2014
- 2014-04-07 EP EP14163714.0A patent/EP2930747A1/en not_active Withdrawn
-
2015
- 2015-03-12 CN CN201510108593.8A patent/CN104979320A/zh active Pending
- 2015-03-25 US US14/667,979 patent/US9418918B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070114352A1 (en) * | 2005-11-18 | 2007-05-24 | Victor R Cruz Erwin | Semiconductor die package using leadframe and clip and method of manufacturing |
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CN113594125B (zh) * | 2020-05-01 | 2023-03-03 | 安世有限公司 | 半导体装置及其制造方法 |
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EP2930747A1 (en) | 2015-10-14 |
US20150287666A1 (en) | 2015-10-08 |
US9418918B2 (en) | 2016-08-16 |
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