CN104953011B - 一种具有金属层的基板及其制造方法 - Google Patents
一种具有金属层的基板及其制造方法 Download PDFInfo
- Publication number
- CN104953011B CN104953011B CN201510366929.0A CN201510366929A CN104953011B CN 104953011 B CN104953011 B CN 104953011B CN 201510366929 A CN201510366929 A CN 201510366929A CN 104953011 B CN104953011 B CN 104953011B
- Authority
- CN
- China
- Prior art keywords
- metallic circuit
- metallic
- substrate
- circuit unit
- cut zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 82
- 239000002184 metal Substances 0.000 title claims abstract description 42
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000009413 insulation Methods 0.000 claims abstract description 57
- 230000001464 adherent effect Effects 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 238000005530 etching Methods 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 241000784732 Lycaena phlaeas Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510366929.0A CN104953011B (zh) | 2015-06-26 | 2015-06-26 | 一种具有金属层的基板及其制造方法 |
HK15111490.5A HK1210873A1 (zh) | 2015-06-26 | 2015-11-20 | 種具有金屬層的基板及其製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510366929.0A CN104953011B (zh) | 2015-06-26 | 2015-06-26 | 一种具有金属层的基板及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104953011A CN104953011A (zh) | 2015-09-30 |
CN104953011B true CN104953011B (zh) | 2016-05-11 |
Family
ID=54167536
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510366929.0A Active CN104953011B (zh) | 2015-06-26 | 2015-06-26 | 一种具有金属层的基板及其制造方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN104953011B (zh) |
HK (1) | HK1210873A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107072044B (zh) * | 2017-06-05 | 2024-04-12 | 广东顺德施瑞科技有限公司 | 一种双面柔性线路板 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109538999A (zh) * | 2018-11-29 | 2019-03-29 | 深圳市利和腾鑫科技有限公司 | 灯条柔性导电连接件的生产工艺 |
CN110402013A (zh) * | 2019-07-17 | 2019-11-01 | 佛山市新鹿电子科技有限公司 | 一种led灯带线路板 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101208751B1 (ko) * | 2004-03-31 | 2012-12-05 | 미츠비시 덴센 고교 가부시키가이샤 | 회로기판의 제조방법 |
CN201797655U (zh) * | 2010-08-24 | 2011-04-13 | 张�林 | 用并置扁平导线制作的双面线路板 |
CN103167744B (zh) * | 2011-12-08 | 2016-03-02 | 王定锋 | 带元件的led灯带线路板及其制作方法 |
CN102711368A (zh) * | 2012-05-21 | 2012-10-03 | 王定锋 | 具有单面混合电路的led模组及其制造方法 |
CN204005452U (zh) * | 2014-07-28 | 2014-12-10 | 深圳市零奔洋科技有限公司 | 柔性灯带 |
CN204377247U (zh) * | 2014-11-02 | 2015-06-03 | 王定锋 | 一种用模切金属箔制作的led灯条线路板 |
-
2015
- 2015-06-26 CN CN201510366929.0A patent/CN104953011B/zh active Active
- 2015-11-20 HK HK15111490.5A patent/HK1210873A1/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107072044B (zh) * | 2017-06-05 | 2024-04-12 | 广东顺德施瑞科技有限公司 | 一种双面柔性线路板 |
Also Published As
Publication number | Publication date |
---|---|
CN104953011A (zh) | 2015-09-30 |
HK1210873A1 (zh) | 2016-05-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104953011B (zh) | 一种具有金属层的基板及其制造方法 | |
CN202535642U (zh) | 用多条导线制作的led单面线路板 | |
CN103957671A (zh) | 一种采用覆盖绝缘液体并固化的方式制作的led条形灯板及其方法 | |
KR20030061353A (ko) | 저저항 중합체 매트릭스 퓨즈장치 및 그 제조방법 | |
CN103597915A (zh) | 金属箔图案层叠体、金属箔层叠体、金属箔层叠基板、太阳能电池模块和金属箔图案层叠体的制造方法 | |
CN207334345U (zh) | 一种高压led灯带 | |
CN207599407U (zh) | 一种防水led灯带 | |
CN104427789A (zh) | 多层电路板及其制作方法 | |
CN204732434U (zh) | 一种具有金属层的基板 | |
CN204026585U (zh) | 一种led灯电路板 | |
CN201797655U (zh) | 用并置扁平导线制作的双面线路板 | |
CN203880482U (zh) | 一种具有绝缘液体固化簿膜层的led条形灯 | |
WO2008141500A1 (en) | A circuit board for heat dispersion | |
CN106031307B (zh) | 用于生产功率印制电路的工艺和通过此工艺获得的功率印制电路 | |
CN105576061A (zh) | 高导通高电压太阳能光电玻璃板 | |
CN104733590B (zh) | 一种具有金属层的基板及其制造方法 | |
CN109757032A (zh) | 一种金属箔电路和导线电路复合制作电路板的方法 | |
CN108533985A (zh) | 一种led灯带的制造方法 | |
CN204335153U (zh) | 焊盘结构及电路板 | |
CN210958935U (zh) | 一种用于led灯带的柔性电路板 | |
CN207599406U (zh) | 一种多层电路板led灯带 | |
CN206963171U (zh) | 一种直通散热铜基板 | |
CN207514651U (zh) | 一种使用多层电路板的防水led灯带 | |
CN204651343U (zh) | 一种具有金属层的基板 | |
CN207831051U (zh) | 一种led灯带 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1210873 Country of ref document: HK |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160531 Address after: 364000, room 4, block 6, 604, upper well street, Midtown, Xinluo, Fujian, Longyan Patentee after: Chen Weihua Patentee after: Zhang Xin Address before: 518000, Guangdong Province, Shenzhen province Baoan District manhole Street New Village second sink building E1002 room Patentee before: SHENZHEN JUNZE TECHNOLOGY CO.,LTD. |
|
REG | Reference to a national code |
Ref country code: HK Ref legal event code: GR Ref document number: 1210873 Country of ref document: HK |
|
TR01 | Transfer of patent right |
Effective date of registration: 20170612 Address after: 529000, No. 50 Zhongxing Road, lotus pond town, Pengjiang District, Guangdong, Jiangmen Patentee after: Jiangmen Ying Ying Electronic Technology Co.,Ltd. Address before: 364000, room 4, block 6, 604, upper well street, Midtown, Xinluo, Fujian, Longyan Co-patentee before: Zhang Xin Patentee before: Chen Weihua |
|
TR01 | Transfer of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A substrate with a metal layer and its manufacturing method Effective date of registration: 20230719 Granted publication date: 20160511 Pledgee: Bank of China Limited Jiangmen High-tech Sub-branch Pledgor: Jiangmen Ying Ying Electronic Technology Co.,Ltd. Registration number: Y2023980048921 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |