CN104942430B - Laser processing device and laser processing - Google Patents
Laser processing device and laser processing Download PDFInfo
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- CN104942430B CN104942430B CN201510141679.0A CN201510141679A CN104942430B CN 104942430 B CN104942430 B CN 104942430B CN 201510141679 A CN201510141679 A CN 201510141679A CN 104942430 B CN104942430 B CN 104942430B
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- 238000012545 processing Methods 0.000 title claims abstract description 81
- 230000003287 optical effect Effects 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000001514 detection method Methods 0.000 claims abstract description 16
- 230000008569 process Effects 0.000 claims abstract description 15
- 230000000644 propagated effect Effects 0.000 claims abstract description 11
- 230000000630 rising effect Effects 0.000 claims description 14
- 238000012360 testing method Methods 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 5
- 230000033228 biological regulation Effects 0.000 claims description 4
- 238000003754 machining Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 210000001367 artery Anatomy 0.000 description 5
- 210000003462 vein Anatomy 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 230000006641 stabilisation Effects 0.000 description 4
- 238000011105 stabilization Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
Even if the present invention provides a kind of frequency and changes, it is also possible to judge the good and bad laser processing device and laser processing of laser pulse exactly.Optical beam scanner makes pulse laser beam incide workpiece, and moves the incoming position on surface.Photodetector detects the physical quantity for depending on pulse energy of each laser pulse.Path switch switches over the path of pulse laser beam between the 2nd path incided the 1st path of workpiece and be not incident on workpiece.Control device controls optical beam scanner, so that pulse laser beam incides the position for being processed point according to processing sequence, while detection depends on the physical quantity of pulse energy, the permissible range of physical quantity is determined according to the distribution of physical quantity.In process, control device makes at least a portion of laser pulse of the physical quantity detected by photodetector in permissible range along the 1st propagated, makes the laser pulse beyond permissible range along the 2nd propagated.
Description
The application advocates the priority based on Japanese patent application filed in 27 days March in 2014 the 2014-064974th.
The full content of the Japanese publication is by reference to being applied in this specification.
Technical field
Pulse laser beam is set to incide the multiple quilts delimited on workpiece surface in sequence the present invention relates to a kind of
Processing stand and the laser processing device and laser processing that are laser machined.
Background technology
Have disclosed in following patent documents 1 carries out the technology of perforate processing using pulse laser beam on wiring substrate.
In method disclosed in patent document 1, wiring substrate is incided in the laser pulse with the pulse energy less than feasible value
In the case of, by the incident extra laser pulse in the position, can compensate for the in shortage of pulse energy.
In the method disclosed in following patent documents 2, the energy of the rising part of laser pulse is detected.If testing result
In permissible range, then the further part of the laser pulse is set to incide workpiece and be processed.If testing result surpasses
Go out permissible range, then the laser pulse is incided workpiece.Thereby, it is possible to prevent the energy not enough or energy surplus
Bad laser pulse incides workpiece.
Patent document 1：No. 2858236 publications of Japanese Patent No.
Patent document 2：Japanese Unexamined Patent Publication 2009-148812 publications
In order to accurately determine the energy of the permissible range of the pulse energy of laser pulse or the rising part of laser pulse
Permissible range, it is necessary to carry out various evaluation tests with different pulse energies.Can also according to LASER Light Source normal work when
The deviation of pulse energy determine the permissible range of pulse energy.Permissible range can easily be determined by the method.
Pulse energy depends on the repetition rate (hereinafter referred to as " frequency ") of pulse.Therefore, if Laser Processing when frequency
Rate produces deviation, then the deviation of pulse energy can become big.If the deviation of pulse energy becomes big, even if the normal work of LASER Light Source
Make, pulse energy is also possible to beyond the permissible range for initially determining that.If being judged on the basis of the permissible range for initially determining that
Laser pulse it is good and bad, then sometimes in normal work export laser pulse can be judged as it is bad.
The content of the invention
Even if being changed it is an object of the invention to provide a kind of frequency also can exactly judge the good of laser pulse
Good and bad laser processing device and laser processing.
A kind of a kind of viewpoint of the invention, there is provided laser processing device, it has：
LASER Light Source, exports pulse laser beam；
Objective table, keeps workpiece；
Optical beam scanner, makes the pulse laser beam from LASER Light Source output incide the workpiece,
And move the incoming position on the workpiece surface；
Photodetector, detection depends on arteries and veins from each laser pulse of the pulse laser beam of LASER Light Source output
Rush the physical quantity of energy；
Path switch, the processing is being incided by the path of the pulse laser beam exported from the LASER Light Source
Switched between 1st path of object and the 2nd path for being not incident on the workpiece；And
Control device, the multiple for storing the workpiece surface is processed position and processing sequence a little, and according to
The testing result of the position, the processing sequence and the photodetector of the processed point come control the optical beam scanner and
The path switch,
The control device performs preparatory process before processing, and the smooth beam scanning is controlled in preparatory process before the processing
Device, so that the pulse laser beam incides the position of the processed point according to the processing sequence, while passing through the light
Detector detects the physical quantity for depending on pulse energy of each laser pulse, and according to the distribution of the physical quantity come really
The permissible range of the fixed physical quantity,
After preparatory process before the processing, the control device makes to lead in the process of the workpiece
At least a portion of the laser pulse of the physical quantity that the photodetector detects in the permissible range is crossed along institute
The 1st propagated is stated, makes the laser pulse beyond the permissible range along the 2nd propagated.
A kind of another viewpoint of the invention, there is provided laser processing, it has following operation：
Control optical beam scanner, so that pulse laser beam incides the processed point of regulation according to the processing sequence of regulation
Position, while measuring the physical quantity for depending on pulse energy of each laser pulse；
The permissible range of the physical quantity is determined according to the distribution of the physical quantity measured；And
Pulse laser beam is set to incide the position of the described processed point on workpiece according to the processing sequence, from
And laser machined,
In the operation for being laser machined, the physics of each laser pulse of the pulse laser beam is measured
Amount, makes at least a portion of the laser pulse incide the workpiece when measurement result is in the permissible range,
The laser pulse is not set to incide the workpiece when measurement result exceeds the permissible range.
Due to actually exporting pulse laser beam while optical beam scanner is controlled, and measurement depends on pulse energy
Physical quantity, therefore, the deviation of the pulse energy of the deviation of the frequency of pulse laser beam during based on processing is embodied in permissible range
Determination in.Therefore, it is possible to judge the good and bad of laser pulse exactly.
Brief description of the drawings
Fig. 1 is the schematic diagram of the laser processing device of embodiment.
Fig. 2 is laser pulse Lp1, the propagation in machining path for representing trigger signal trg, inciding path switch
Laser pulse Lp2, in collector path propagate laser pulse Lp3, the control signal con of control path switch and from
The timing diagram of the detection signal det that photodetector sends to control device and the chart of of waveform.
Fig. 3 A be from LASER Light Source with constant frequency output laser pulse when timing diagram, Fig. 3 B be with constant frequency export
The histogram of judgement energy during laser pulse.
Fig. 4 A are the diagrammatic top views of workpiece, and Fig. 4 B are the timing diagram of the laser pulse in process, Fig. 4 C
It is the histogram for judging energy of the laser pulse in process.
Fig. 5 is the flow chart of the laser processing of embodiment.
Fig. 6 A be in step sl from LASER Light Source output laser pulse timing diagram, Fig. 6 B be shown in Fig. 6 A when
Carve the histogram of the judgement energy of the laser pulse of output.
Fig. 7 is to represent the chart with the corresponding relation between placing graphic pattern and permissible range for being processed point.
In figure：10- LASER Light Sources, 11- illuminating optical systems, 13- apertures, 15- paths switch, 16- machining paths,
17- collectors path, 18- retroreflectors, 20- optical beam scanners, 21- object lens, 23- objective tables, 24- travel mechanisms, 30- portions
Speculum, 31- beam dumps, 32- photodetectors, 40- workpieces, 41- is divided to be processed point, 50- control devices, 51-
Storage device, Lp1, Lp2, Lp3- laser pulse, con- control signals, det- detection signals, trg- trigger signals, R0- is normal
Scope, R1- permissible ranges.
Specific embodiment
The schematic diagram of the laser processing device of embodiment is shown in Fig. 1.The laser processing device of embodiment is, for example, to matching somebody with somebody
Line substrate carries out the laser drill of perforate processing.LASER Light Source 10 receives trigger signal trg from control device 50, so as to export
Pulse laser beam.LASER Light Source 10 for example uses carbon dioxide laser.
Illuminating optical system 11 is incided from the pulse laser beam of the output of LASER Light Source 10.Illuminating optical system 11 changes arteries and veins
At least one in the beam divergence angle and beam diameter of laser beam.Pulse laser beam through illuminating optical system 11 incides aperture 13.
Illuminating optical system 11 has the function of homogenizing the beam distribution on the position of aperture 13.Aperture 13 is carried out to beam cross section
Shaping.
Pulse laser beam through aperture 13 incides path switch 15.Path switch 15 is by from control device 50
Receive control signal con and between machining path 16 and collector path 17 switch pulse laser beam path.Path switches
Device 15 for example uses acousto-optic element (AOD).The path of the laser pulse Lp1 straight aheads being transfused to is equivalent to collector path
17, the path of laser pulse diffraction is equivalent to machining path 16.
The laser pulse Lp2 propagated along machining path 16 is partial to by retroreflector 18, is swept so as to incide light beam
Retouch device 20.The controlled device 50 of optical beam scanner 20 is controlled, and the direct of travel of pulse laser beam is changed in the two-dimensional direction.Light beam
Scanner 20 for example uses a pair of galvanometer scanning galvanometers.
Workpiece 40 is incided through object lens 21 by the pulse laser beam of optical beam scanner 20.21, object lens
Such as use f θ lens.Workpiece 40 should for example, carry out the wiring substrate of perforate processing.Workpiece 40 is held in load
Thing platform 23.Objective table 23 is by travel mechanism 24 along the moving in two dimensional directions parallel with the surface of workpiece 40.By control
Device processed 50 controls travel mechanism 24.
By object lens 21, the opening portion reduced projection of aperture 13 to the surface of workpiece 40.By optical beam scanner 20
Change the direct of travel of pulse laser beam, thus enable that the incoming position of pulse laser beam is moved on the surface of workpiece 40
It is dynamic.
The laser pulse Lp3 propagated along collector path 17 incides partially reflecting mirror 30.Permeation parts speculum 30
Laser pulse incide beam dump 31.The laser pulse for passing through partially reflective the reflection of mirror 30 incides photodetector 32.
Photodetector 32 for example has the energy meter of sensitivity using the wavelength region of the pulse laser beam to being exported from LASER Light Source 10.
Detection signal det based on photodetector 32 is input to control device 50.
Control device 50 includes storage device 51.Be stored with storage device 51 workpiece 40 multiple be processed point
Positional information, processing sequence and control needed for various information.
Laser pulse Lp1, the biography in machining path 16 for trigger signal trg is shown in Fig. 2, inciding path switch 15
The laser pulse Lp2 for broadcasting, laser pulse Lp3, the control signal of control path switch 15 propagated in collector path 17
One of the timing diagram and waveform of con and the detection signal det sent from photodetector 32 to control device 50.
In moment t1, if trigger signal trg rises, laser pulse Lp1 rises in moment t2 a little later.At the moment,
The outgoing route of path switch 15 switches to collector path 17.Therefore, the laser pulse propagated in collector path 17
Lp3 rises.
Photodetector 32 detects laser pulse Lp3, and detection signal det is sent into control device 50.Detection signal
The size of det is substantially proportional to the power of laser pulse Lp3.Control device 50 from rising time t2 by certain hour
Untill moment t3 afterwards, detection signal det is integrated.And by integral result storage in storage device 51.
In moment t4, control device 50 sends the control signal con for switching to machining path 16 to path switch 15.Road
The outgoing route of footpath switch 15 switches to machining path 16 by collector path 17, and thus laser pulse Lp3 declines and laser
Pulse Lp2 rises.Because laser pulse Lp3 declines, thus the detection signal det of photodetector 32 also turns into 0.
In moment t5, control device 50 sends the control signal con for switching to collector path 17 to path switch 15.
The outgoing route of path switch 15 switches to collector path 17 by machining path 16, and thus laser pulse Lp3 rises and swashs
Light pulse Lp2 declines.Because laser pulse Lp3 risings, thus the detection signal det of photodetector 32 also rise.
In moment t6, trigger signal trg declines.Thus, laser pulse Lp1 and laser pulse Lp3 declines.Due to laser arteries and veins
Lp3 declines are rushed, thus the detection signal det of photodetector 32 also declines.
Value (the face with dash area in Fig. 2 that the detection signal det of photodetector 32 is integrated from moment t2 to t3
Product) rising part equivalent to laser pulse Lp1 energy.If the laser arteries and veins used as processing and cut from laser pulse Lp1
The pulse width for rushing Lp2 is constant, then the pulse energy of laser pulse Lp2 has with the energy of the rising part of laser pulse Lp1
Dependency relation.Therefore, it is possible to judge the pulse energy of laser pulse Lp2 by the energy of the rising part of laser pulse Lp1
It is whether normal.The energy of the rising part of laser pulse Lp1 is referred to as " judgement energy ".Energy is judged as pulse energy is depended on
Physical quantity.
Determined according to the average rise time of laser pulse Lp1 from times of the moment t2 to moment t3.As from
Times of the moment t2 to moment t3, the average time untill stable state can be reached using the power of laser pulse Lp1,
The average time untill the 90% of steady state power can also be reached using the power of laser pulse Lp2.
As the physical quantity for depending on pulse energy, it would however also be possible to employ the power of the rising part of laser pulse Lp1 carrys out generation
For the energy of rising part.If using the power of only 1 point on the time shaft in rising part as the thing for depending on pulse energy
Reason amount and use, then the reduction of the reliability of the pulse energy for being deduced by power.By by the time shaft in rising part
The power at multiple positions is used as the physical quantity for depending on pulse energy, it is possible to increase the pulse energy deduced by power
Reliability.
Shown in Fig. 3 A from LASER Light Source 10 with constant frequency output laser pulse Lp1 when timing diagram.
The histogram of judgement energy during with constant frequency output laser pulse Lp1 is shown in Fig. 3 B.Transverse axis represents judgement
Energy, the longitudinal axis represents the number of degrees.When 10 normal work of LASER Light Source, judge the distribution of energy substantially according to normal distribution.If using m
The average value for judging energy is represented, standard deviation is represented with σ, then the judgement energy of most laser pulse Lp1 is in m ± 3 σ
In the range of (hereinafter referred to as normal range (NR) R0).
The diagrammatic top view of workpiece 40 is shown in Fig. 4 A.Being delimited on the surface of workpiece 40 has multiple being processed
Point 41.41 (Fig. 1) of point are processed by inciding laser pulse Lp2, perforate processing is carried out.It is processed the processing sequence of point 41
It is pre-determined.In Figure 4 A, of processing sequence indicated by an arrow.As shown in Figure 4 A, from being processed for being processed
Distances of the point 41 to next processed point 41 that should be processed are simultaneously non-constant, but there is deviation.If pulse laser beam
The displacement of incoming position is elongated, then the stabilization time of optical beam scanner 20 is also elongated.Therefore, adding in workpiece 40
During work, the frequency of pulse laser beam is simultaneously non-constant, but is become according to the displacement of the incoming position of pulse laser beam
It is dynamic.
One of timing diagram of the pulse laser beam in during processing from the output of LASER Light Source 10 is shown in Fig. 4 B.As schemed
Shown in 4B, there is deviation in the frequency of pulse laser beam.
The histogram of judgement energy when showing that the frequency of pulse laser beam has a deviation in Fig. 4 C.Compare for convenience,
The histogram of the judgement energy when frequency of pulse laser beam is constant is represented by dashed line.Generally, from the output of LASER Light Source 10
The pulse energy of pulse laser beam depends on frequency.For example, in carbon dioxide laser, if frequency is uprised, pulse energy tool
There is decline.
In the deviation of the judgement energy when frequency has deviation, the deviation of judgement energy when overlapping with frequency-invariant and
There is the deviation of judgement energy caused by deviation because of frequency.Therefore, if frequency has deviation, judge that the deviation of energy increases
Greatly.When frequency and it is non-constant when, even if the normal work of LASER Light Source 10, can also occur judge energy beyond normal range (NR) R0 feelings
Condition.
When carrying out only judging that laser pulse of the energy in normal range (NR) R0 is used for the control for laser machining, even if swashing
Radiant 10 is operating normally, and the laser pulse with the judgement energy beyond normal range (NR) R0 is also not used to processing.Therefore, swash
The utilization ratio of light energy can be reduced.In embodiment explained below, the condition in the normal work of LASER Light Source 10 can be suppressed
The reduction of the utilization ratio of laser energy caused by the lower deviation because judging energy.
The flow chart of the laser processing of embodiment is shown in Fig. 5.In step sl, according to the quilt of workpiece 40
The position of processing stand 41 (Fig. 4 A) and processing sequence control LASER Light Source 10 and optical beam scanner 20, thus from LASER Light Source 10
Output pulse laser.Now, path switch 15 maintains outgoing route to switch to the state in collector path 17.Therefore, loading
Will not incident pulse laser beam on platform 23.But, due to controlling optical beam scanner 20, therefore body in the frequency of pulse laser beam
The deviation of the stabilization time of optical beam scanner 20 is showed.
Shown in Fig. 6 A in step sl from LASER Light Source 10 output laser pulse Lp1 timing diagram.With shown in Fig. 4 B
Processing during in pulse laser beam frequency it is identical, the frequency of the pulse laser beam in step S1 there is also deviation.Light beam
Scanner 20 is controlled according to the actual position for being processed point 41 and processing sequence, therefore pulse laser beam in step S1
The extent of deviation of the frequency of the pulse laser beam when extent of deviation of frequency is with processing is identical.
The testing result of photodetector 32 is input to control device 50.Control device 50 obtains sentencing for each laser pulse Lp1
Surely measure, and the judgement energy stores that will be obtained are in storage device 51.
In step s 2, the permissible range R1 of judgement energy is determined according to the distribution for judging energy.
Illustrated to judging the determination method of the permissible range R1 of energy with reference to Fig. 6 B.Show to judge energy in Fig. 6 B
Histogram.Compare for convenience, the distribution for judging energy during the frequency-invariant of pulse laser beam is represented by dashed line.Represented with m1
The average value of the distribution of the judgement energy obtained in step sl, standard deviation is represented with σ 1.As one, scope R1 is will allow for
Higher limit be set to m1+3 σ 1, lower limit is set to m1-3 σ 1.Due to judging the deviation of energy, normal range (NR) during with frequency-invariant
R0 is compared, and permissible range R1 when frequency has deviation becomes wider.
In step S3 (Fig. 5), workpiece 40 is placed in objective table 23 (Fig. 1).In step s 4, sweep light beam
Retouch device 20 to act, and wait until the stabilization of optical beam scanner 20 of pulse laser beam.After the stabilization of optical beam scanner 20, in step
In S5,1 laser pulse Lp1 is exported from LASER Light Source 10.In the output start time of laser pulse Lp1, path switch 15
Outgoing route switch to collector path 17.Therefore, the detection signal det of the luminous intensity based on photodetector 32 is input to control
Device processed 50.Control device 50 calculates judgement energy according to the detection signal det being input into from photodetector 32.
In step s 6, judge energy whether in permissible range R1.If it is determined that energy exceeds permissible range R1, then
After laser pulse Lp1 declines, step S5 is returned to, export lower 1 laser pulse Lp1.If it is determined that energy is in permissible range R1,
Then enter step S7, by control path switch 15, laser pulse Lp2 (Fig. 2) is cut from laser pulse Lp1, make laser arteries and veins
LP2 is rushed to be propagated along machining path 16.Laser pulse Lp2 incides workpiece 40 and carries out perforate processing.
In step s 8, judge whether the processing of all of processed point 41 is over.If also leaving unprocessed quilt
Processing stand 41, then return to step S4, carries out the processing of next processed point 41.Point 41 is processed to every 1 incident multiple
Laser pulse and when being processed, can be using circulation pattern processing or pulse mode processing.
In circulation pattern processing, after incident 1 laser pulse of point 41 is processed to 1, incoming position is set to move to down 1
Individual processed point 41.1 circulation will be set to the order of incident 1 laser pulse of all of processed point 41, it is many by repeating
The secondary circulation, can incide the laser pulse of desired emitting times and be processed point 41.It is being circulated pattern processing
When, in step s 8, if the circulation of desired number of times is repeated, it is judged to process finishing.
In burst mode processing, the laser pulse of the emitting times being processed to 1 desired by the continuous incidence of point 41 it
Afterwards, the processing of next processed point 41 that should be processed is carried out.When carrying out burst mode and processing, the once laser pulse on making
And next time laser pulse incide identical be processed point 41 in the case of, without make in step s 4 optical beam scanner 20 move
Make.
When the process finishing of all of processed point 41, in step s 9, determine whether to leave matching somebody with somebody for processed point 41
The unprocessed workpiece 40 of placing graphic pattern identical.If leaving unprocessed workpiece 40, step S3 is returned to, will
Next workpiece 40 that should be processed is placed in objective table 23.If without unprocessed workpiece 40, terminating to add
Work operation.
There is the configuration different with placing graphic pattern from the processed point 41 of the upper workpiece 40 once processed in processing
During the workpiece 40 of pattern, preparatory process before the processing of step S1~step S2 is performed, redefine permissible range R1.
In above-described embodiment, even the laser pulse with the judgement energy beyond the normal range (NR) R0 shown in Fig. 6 B
Lp1, judges that laser pulse of the energy in permissible range R1 can also be used for processing.Therefore, it is possible to suppress the utilization of laser energy
The reduction of efficiency.Also, when the job insecurity of LASER Light Source 10 causes to judge that energy exceeds permissible range R1, the laser pulse
Lp1 is not used in processing.Therefore, it is possible to prevent because adding caused by the not enough or excessive laser pulse Lp2 of incident pulse energy
The decline of work quality.
In above-described embodiment, start be processed point 41 with placing graphic pattern identical multiple workpieces 40 processing it
Before, operation before the processing of implementation steps S1~step S2 (Fig. 5) determines permissible range R1.To can also allow identified
Scope R1 is stored in storage device 51 with the corresponding relation associated with placing graphic pattern foundation of processed point 41.
One of the corresponding relation is shown in Fig. 7.According to every 1 processed 41 with placing graphic pattern, it is stored with and allows model
Enclose the lower limit and higher limit of R1.When being stored with placing graphic pattern for processed point 41 of next workpiece 40 that should be processed exists
When in the corresponding table of Fig. 7, it is convenient to omit step S1~step S2 (Fig. 2).In step s 6, if judge judge energy whether
It is stored within the permissible range R1 in storage device 51.
More than, according to embodiment, the present invention is described, but the present invention is not limited to this.For example, can carry out
Various changes, improvement and combination etc., this is apparent to those skilled in the art.
Claims (7)
1. a kind of laser processing device, it has：
LASER Light Source, exports pulse laser beam；
Objective table, keeps workpiece；
Optical beam scanner, makes the pulse laser beam from LASER Light Source output incide the workpiece, and
Move the incoming position on the workpiece surface；
Photodetector, detection depends on pulse energy from each laser pulse of the pulse laser beam of LASER Light Source output
The physical quantity of amount；
Path switch, the processing object is being incided by the path of the pulse laser beam exported from the LASER Light Source
Switched between 1st path of thing and the 2nd path for being not incident on the workpiece；And
Control device, the multiple on the storage workpiece surface is processed position and processing sequence a little, and according to described
The testing result for being processed the position, the processing sequence and the photodetector of point controls the optical beam scanner and described
Path switch,
The control device performs preparatory process before processing, and the optical beam scanner is controlled in preparatory process before the processing,
So that the pulse laser beam incides the position of the processed point according to the processing sequence, while being detected by the light
Device detects the physical quantity for depending on pulse energy of each laser pulse, and according to the distribution of the physical quantity to determine
The permissible range of physical quantity is stated,
After preparatory process before the processing, the control device makes by institute in the process of the workpiece
At least a portion of the laser pulse of the physical quantity that photodetector detects in the permissible range is stated along the described 1st
Propagated, makes the laser pulse beyond the permissible range along the 2nd propagated.
2. laser processing device according to claim 1, wherein,
The control device determines the higher limit and lower limit of the permissible range according to the standard deviation of the physical quantity.
3. laser processing device according to claim 1 and 2, wherein,
The control device is once processed with placing graphic pattern in the processed point of next workpiece that should be processed with upper
The processed point of workpiece with placing graphic pattern it is different when, carry out next workpiece that should be processed processing it
Before, preparatory process before the processing is performed, redefine the permissible range.
4. laser processing device according to claim 1 and 2, wherein,
The physical quantity is the energy of the rising part of the laser pulse.
5. a kind of laser processing, it has following operation：
Control optical beam scanner, so that pulse laser beam incides the position of the processed point of regulation according to the processing sequence of regulation
Put, while measuring the physical quantity for depending on pulse energy of each laser pulse；
The permissible range of the physical quantity is determined according to the distribution of the physical quantity measured；And
Pulse laser beam is set to incide the position of the described processed point on workpiece according to the processing sequence, so as to enter
Row Laser Processing,
In the operation for being laser machined, the physical quantity of each laser pulse of the pulse laser beam is measured, when
At least a portion of the laser pulse is incided the workpiece when measurement result is in the permissible range, work as measurement
Result does not make the laser pulse incide the workpiece when exceeding the permissible range.
6. laser processing according to claim 5, wherein,
Standard deviation according to the physical quantity determines the higher limit and lower limit of the permissible range.
7. the laser processing according to claim 5 or 6, wherein,
The physical quantity is the energy of the rising part of the laser pulse.
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| JP2014064974A JP6234296B2 (en) | 2014-03-27 | 2014-03-27 | Laser processing apparatus and laser processing method |
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| KR (1) | KR102002200B1 (en) |
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| JP6732613B2 (en) | 2016-09-07 | 2020-07-29 | 住友重機械工業株式会社 | Laser light source and laser processing apparatus using the same |
| JP6682146B2 (en) * | 2016-12-12 | 2020-04-15 | 住友重機械工業株式会社 | Laser pulse cutting device and laser processing method |
| JP7066368B2 (en) * | 2017-10-24 | 2022-05-13 | 住友重機械工業株式会社 | Laser machining machine control device, laser machining method, and laser machining machine |
| JP7190808B2 (en) * | 2017-11-08 | 2022-12-16 | 住友重機械工業株式会社 | LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD |
| CN109323761B (en) * | 2018-10-31 | 2020-12-25 | 中国科学院西安光学精密机械研究所 | Laser power online monitoring method and device |
| JP7262410B2 (en) * | 2020-03-11 | 2023-04-21 | 住友重機械工業株式会社 | Processing sequence determination device, laser processing device, and laser processing method |
| CN111707359A (en) * | 2020-05-12 | 2020-09-25 | 固高科技(深圳)有限公司 | Laser processing detection system and method |
| CN112108775A (en) * | 2020-09-09 | 2020-12-22 | 湖南鼎一致远科技发展有限公司 | Device and method for controlling lasers in parallel and laser marking machine |
| JP2022063595A (en) * | 2020-10-12 | 2022-04-22 | 住友重機械工業株式会社 | Control device of laser processing machine, laser processing machine, and laser processing method |
| TWI755109B (en) * | 2020-10-23 | 2022-02-11 | 新代科技股份有限公司 | Laser processing system and laser processing method thereof |
| CN114799572A (en) * | 2022-06-14 | 2022-07-29 | 广东宏石激光技术股份有限公司 | Laser cutting machining method based on scanning path control energy distribution |
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| JP2015186818A (en) | 2015-10-29 |
| CN104942430A (en) | 2015-09-30 |
| KR102002200B1 (en) | 2019-07-19 |
| TW201540406A (en) | 2015-11-01 |
| JP6234296B2 (en) | 2017-11-22 |
| TWI577482B (en) | 2017-04-11 |
| KR20150112814A (en) | 2015-10-07 |
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