TW201350241A - Laser processing apparatus and laser processing method - Google Patents
Laser processing apparatus and laser processing method Download PDFInfo
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- TW201350241A TW201350241A TW102104195A TW102104195A TW201350241A TW 201350241 A TW201350241 A TW 201350241A TW 102104195 A TW102104195 A TW 102104195A TW 102104195 A TW102104195 A TW 102104195A TW 201350241 A TW201350241 A TW 201350241A
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- 238000003672 processing method Methods 0.000 title claims description 14
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 16
- 239000010949 copper Substances 0.000 description 16
- 238000005553 drilling Methods 0.000 description 5
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
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Abstract
Description
本發明係有關一種使多次發射雷射脈衝向加工對象物加工點的入射來進行雷射加工之雷射加工裝置及雷射加工方法。 The present invention relates to a laser processing apparatus and a laser processing method for performing laser processing by causing a plurality of emission laser pulses to be incident on a processing object.
已知將脈衝雷射光束照射於印製基板等來進行鑽孔加工之技術。因雷射振盪器的不穩定性，有時一部份雷射脈衝的脈衝能量變得小於平均值。有時無法在脈衝能量較小的雷射脈衝入射之位置上形成所希望的形狀及深度的孔。為了防止鑽孔加工不良，提出有各種技術。 A technique of performing drilling processing by irradiating a pulsed laser beam onto a printed substrate or the like is known. Due to the instability of the laser oscillator, sometimes the pulse energy of a portion of the laser pulse becomes less than the average value. It is sometimes impossible to form a hole of a desired shape and depth at a position where a laser pulse having a small pulse energy is incident. In order to prevent poor drilling processing, various techniques have been proposed.
專利文獻1中所記載之方法中，在雷射脈衝向加工對象物入射之前，檢測雷射脈衝的上升部份的能量。若檢測出之能量正常，則使用比上升部份更靠後方的部份的雷射脈衝來進行加工。若檢測出之能量異常，則該雷射脈衝不用於加工。如此，可藉由排除異常的雷射脈衝來防止加工不良。 In the method described in Patent Document 1, the energy of the rising portion of the laser pulse is detected before the laser pulse is incident on the object to be processed. If the detected energy is normal, the laser pulse is processed using a portion of the laser beam that is further behind the rising portion. If the detected energy is abnormal, the laser pulse is not used for processing. In this way, processing defects can be prevented by eliminating abnormal laser pulses.
專利文獻2、專利文獻3中所記載之方法中，按每一雷射脈衝對脈衝能量進行監控。當脈衝能量小於閾值時， 直接使追加的雷射脈衝入射。藉此，能夠防止加工不良。 In the methods described in Patent Document 2 and Patent Document 3, the pulse energy is monitored for each laser pulse. When the pulse energy is less than the threshold, The additional laser pulse is directly incident. Thereby, processing defects can be prevented.
(先前技術文獻) (previous technical literature)
(專利文獻) (Patent Literature)
專利文獻1：日本特開2004-25292號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2004-25292
專利文獻2：日本特開平9-253878號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. Hei 9-253878
專利文獻3：日本特開2009-148812號公報 Patent Document 3: Japanese Laid-Open Patent Publication No. 2009-148812
在雷射脈衝的上升部份判定雷射脈衝的好壞之方法中，雷射脈衝的上升部份不使用於加工。當在上升部份使用如光強度顯示峰值之脈衝波形的雷射光束進行加工時，無法將峰值部份的能量利用於加工。因此，導致能量利用效率降低。 In the method of determining the quality of the laser pulse in the rising portion of the laser pulse, the rising portion of the laser pulse is not used for processing. When a laser beam such as a pulse waveform of a peak of light intensity is used for processing in the rising portion, the energy of the peak portion cannot be utilized for processing. Therefore, the energy utilization efficiency is lowered.
本發明的目的在於，提供一種雷射加工裝置及雷射加工方法，其可防止產生由雷射脈衝的不穩定性引起之加工不良，且能夠抑制能量利用效率的降低。 An object of the present invention is to provide a laser processing apparatus and a laser processing method capable of preventing a processing failure caused by instability of a laser pulse and suppressing a decrease in energy use efficiency.
依本發明的一觀點，提供如下雷射加工裝置：雷射光源，射出脈衝雷射光束；掃描光學系統，將從前述雷射光源射出之脈衝雷射光束引導至加工對象物，並且在前述加工對象物上使雷射光束的入射點移動；檢測儀，使從前述雷射光源射出之脈衝雷射光束的能量的一部份分叉，並檢 測分叉之脈衝雷射光束的特徵性物理量；控制裝置，控制前述雷射光源及前述掃描光學系統；及記憶裝置，記憶待使脈衝雷射光束向前述加工對象物入射之複數個加工點的位置、每一向加工點入射之發射號的照射條件、及每一發射號的照射條件的容許範圍，並確保照射錯誤資訊表；前述控制裝置按每一向前述加工對象物入射之脈衝雷射光束的發射將來自前述檢測儀的檢測結果與記憶在前述記憶裝置之對應發射號的照射條件的容許範圍進行比較，當判定為前述檢測結果在前述照射條件的容許範圍外時，對該發射所入射之加工點的位置資訊、發射號、及前述檢測儀的檢測結果建立關聯並記錄到前述照射錯誤資訊表。 According to an aspect of the present invention, a laser processing apparatus is provided: a laser light source that emits a pulsed laser beam; and a scanning optical system that guides a pulsed laser beam emitted from the laser light source to a processing object, and processes the foregoing Moving the incident point of the laser beam on the object; the detector splits a portion of the energy of the pulsed laser beam emitted from the laser source and detects a characteristic physical quantity of a pulsed laser beam of a measuring fork; a control device for controlling the laser light source and the scanning optical system; and a memory device for storing a plurality of processing points to be incident on the processing object by the pulsed laser beam a position, an irradiation condition of an emission number incident on each processing point, and an allowable range of an irradiation condition of each transmission number, and an illumination error information table; and the control device applies a pulsed laser beam incident on each of the processing objects The emission compares the detection result from the detector with an allowable range of the irradiation condition of the corresponding transmission number stored in the memory device, and when it is determined that the detection result is outside the allowable range of the irradiation condition, the emission is incident The position information of the processing point, the transmission number, and the detection result of the aforementioned detector are associated and recorded in the aforementioned illumination error information table.
依本發明的另一觀點，提供如下雷射加工方法：在對應於發射號決定之照射條件下，至少使1次發射的雷射脈衝向樹脂膜上形成金屬膜之加工對象物的前述金屬膜的加工點入射來在前述金屬膜上形成孔，並且按每一發射檢測向前述加工點入射之雷射脈衝，並將檢測結果與對應於該發射號之照射條件的容許範圍進行比較，當在容許範圍外時，對檢測結果、前述加工點的位置、及該發射號建立關聯並記錄到照射錯誤資訊表上之製程；在前述金屬膜的前述加工點上形成孔之後，在對應於發射號決定之照射條件下，使至少1次發射的雷射脈衝向前述加工點入射來在前述樹脂膜上形成孔，並且檢測向前述加工點入射之雷射脈衝，將檢測結果與對應於該發射號之前述照射條件的容許範圍進行比較，當在容許範圍外時，對檢測結果、前述加 工點的位置、及該發射號建立關聯並記錄到前述照射錯誤資訊表之製程；及在前述樹脂膜的前述加工點上形成孔之後，在對應於該發射號之照射條件下，使與已記錄之發射號以後的發射號對應之雷射脈衝向記錄到前述照射錯誤資訊表之加工點的位置入射之矯正製程。 According to another aspect of the present invention, there is provided a laser processing method of forming a metal film of a processing object of a metal film by causing at least one laser pulse to be emitted to the resin film under irradiation conditions determined by a transmission number. The processing point is incident to form a hole in the foregoing metal film, and a laser pulse incident to the processing point is detected for each emission, and the detection result is compared with an allowable range of the irradiation condition corresponding to the emission number, when When the outside of the allowable range, the detection result, the position of the processing point, and the emission number are associated and recorded on the irradiation error information table; after the hole is formed in the aforementioned processing point of the metal film, corresponding to the transmission number Under the determined irradiation condition, at least one shot laser pulse is incident on the processing point to form a hole in the resin film, and a laser pulse incident on the processing point is detected, and the detection result corresponds to the emission number The allowable range of the aforementioned irradiation conditions is compared, and when it is outside the allowable range, the detection result, the aforementioned addition a position of the work point, a process associated with the emission number and recorded in the irradiation error information table; and after forming a hole in the aforementioned processing point of the resin film, under the irradiation condition corresponding to the emission number, The correction process of the laser pulse corresponding to the transmission number after the transmission number is recorded to the position of the processing point of the illumination error information table.
使多次發射的雷射脈衝向1個加工點入射來進行雷射加工時，在產生雷射照射錯誤之加工點上照射追加的雷射脈衝。因此，能夠抑制加工不良的產生。 When a laser pulse that is repeatedly emitted is incident on one processing point and subjected to laser processing, an additional laser pulse is irradiated at a processing point where a laser irradiation error occurs. Therefore, it is possible to suppress the occurrence of processing failure.
20‧‧‧雷射光源 20‧‧‧Laser light source
21‧‧‧控制裝置 21‧‧‧Control device
22‧‧‧記憶裝置 22‧‧‧ memory device
25‧‧‧射束整形器 25‧‧‧beam shaper
26‧‧‧部份反射鏡 26‧‧‧Partial mirror
27‧‧‧檢測儀 27‧‧‧Detector
28‧‧‧顯示裝置 28‧‧‧Display device
29‧‧‧輸入裝置 29‧‧‧ Input device
30‧‧‧射束偏轉器 30‧‧‧beam deflector
31‧‧‧射束阻尼器 31‧‧‧Ball damper
33‧‧‧部份反射鏡 33‧‧‧Partial mirror
34‧‧‧反射鏡 34‧‧‧Mirror
35A、35B‧‧‧掃描光學系統 35A, 35B‧‧‧ scanning optical system
36A、36B‧‧‧fθ透鏡 36A, 36B‧‧‧fθ lens
37A、37B‧‧‧XY載物台 37A, 37B‧‧‧XY stage
38A、38B‧‧‧拍攝裝置 38A, 38B‧‧‧ camera
40A、40B‧‧‧加工對象物 40A, 40B‧‧‧Processing objects
41‧‧‧掃描區 41‧‧‧Scanning area
50‧‧‧基板 50‧‧‧Substrate
51‧‧‧內層的銅圖案 51‧‧‧ inner layer of copper pattern
52‧‧‧樹脂膜 52‧‧‧ resin film
53‧‧‧表層的銅膜 53‧‧‧ surface copper film
第1圖係表示實施例1之雷射加工裝置的概要圖。 Fig. 1 is a schematic view showing a laser processing apparatus of the first embodiment.
第2圖A係以實施例1之雷射加工裝置加工之加工對象物的俯視圖，第2圖B係表示位置記憶區域的資料結構之圖表。 Fig. 2A is a plan view of an object to be processed by the laser processing apparatus of the first embodiment, and Fig. 2B is a diagram showing a data structure of the position memory area.
第3圖A~第3圖C係以實施例1之雷射加工裝置加工之加工對象物的截面圖。 3A to 3C are cross-sectional views of the object to be processed processed by the laser processing apparatus of the first embodiment.
第4圖A係表示照射條件記憶區域的資料結構之圖表。第4圖B係表示銅加工用及樹脂加工用雷射脈衝的波形之曲線圖。 Fig. 4A is a graph showing the data structure of the irradiation condition memory area. Fig. 4B is a graph showing the waveform of a laser pulse for copper processing and resin processing.
第5圖係表示照射錯誤資訊表的資料結構之圖表。 Fig. 5 is a diagram showing the structure of the data of the irradiation error information table.
第6圖係實施例1之雷射加工方法的流程圖。 Fig. 6 is a flow chart showing the laser processing method of the first embodiment.
第7圖係第6圖的步驟S1的詳細的流程圖。 Fig. 7 is a detailed flowchart of step S1 of Fig. 6.
第8圖係第6圖的步驟S3的詳細的流程圖。 Fig. 8 is a detailed flowchart of step S3 of Fig. 6.
第9圖係實施例2之雷射加工方法的局部流程圖。 Figure 9 is a partial flow chart of the laser processing method of Embodiment 2.
第10圖係表示實施例2中使用之照射條件記憶區域的資料結構之圖表。 Fig. 10 is a graph showing the data structure of the irradiation condition memory area used in the second embodiment.
第11圖係實施例3之雷射加工方法的流程圖。 Figure 11 is a flow chart showing the laser processing method of Embodiment 3.
第1圖中示出實施例1之雷射加工裝置的概要圖。控制裝置21向雷射光源20送出控制信號。雷射光源20若接收控制信號，則射出脈衝雷射光束。從雷射光源20射出之脈衝雷射光束向射束整形器25入射。射束整形器25對脈衝雷射光束的光束截面進行整形，並且對脈衝雷射光束進行校準。 Fig. 1 is a schematic view showing a laser processing apparatus of the first embodiment. The control device 21 sends a control signal to the laser light source 20. Upon receiving the control signal, the laser source 20 emits a pulsed laser beam. The pulsed laser beam emitted from the laser light source 20 is incident on the beam shaper 25. The beam shaper 25 shapes the beam section of the pulsed laser beam and calibrates the pulsed laser beam.
被校準之脈衝雷射光束向射束偏轉器30入射。射束偏轉器30受到來自控制裝置21的控制，使脈衝雷射光束轉向加工用路徑及朝向射速阻尼器31之路徑的任一路徑。 The calibrated pulsed laser beam is incident on the beam deflector 30. The beam deflector 30 is controlled by the control device 21 to direct the pulsed laser beam to any path of the machining path and the path toward the rate damper 31.
在加工用路徑中傳輸之脈衝雷射光束的一部份被部份反射鏡26反射而向檢測儀27入射。被部份反射鏡26反射之脈衝雷射光束的功率為反射前的脈衝雷射光束的功率的1%以下。檢測儀27檢測脈衝能量，將檢測結果輸入到控制裝置21。檢測儀27例如能夠使用能量計。 A portion of the pulsed laser beam transmitted in the processing path is reflected by the partial mirror 26 and incident on the detector 27. The power of the pulsed laser beam reflected by the partial mirror 26 is less than 1% of the power of the pulsed laser beam before reflection. The detector 27 detects the pulse energy and inputs the detection result to the control device 21. The detector 27 can use, for example, an energy meter.
作為以檢測儀27檢測出之脈衝雷射光束的特徵性物 理量，除了脈衝能量以外，亦可採用峰值功率等。當測定脈衝雷射光束的峰值功率時，在檢測儀27上使用光電二極管等。 As a characteristic of the pulsed laser beam detected by the detector 27 In addition to pulse energy, peak power can also be used. When the peak power of the pulsed laser beam is measured, a photodiode or the like is used on the detector 27.
透過部份反射鏡26之脈衝雷射光束被後段的部份反射鏡33分叉成2條路徑。由部份反射鏡33所產生之雷射功率的分叉比為1：1。 The pulsed laser beam transmitted through the partial mirror 26 is branched into two paths by the partial mirror 33 of the rear stage. The laser power generated by the partial mirror 33 has a bifurcation ratio of 1:1.
以部份反射鏡33分叉之其中一方的脈衝雷射光束經由掃描光學系統35A及fθ透鏡36A向加工對象物40A入射。掃描光學系統35A例如使用電流掃描儀。加工對象物40A保持在XY載物台37A上。fθ透鏡36A使射束整形器25內的遮罩位置的光束截面形狀在加工對象物40A的表面成像。掃描光學系統35A受到來自控制裝置21的控制，使脈衝雷射光束的入射點在加工對象物40A的表面上沿2維方向移動。並且，fθ透鏡36A使以掃描光學系統35A沿2維方向擺動之脈衝雷射光束向加工對象物40A的表面垂直入射。 The pulsed laser beam which is branched by one of the partial mirrors 33 is incident on the object 40A via the scanning optical system 35A and the fθ lens 36A. The scanning optical system 35A uses, for example, a current scanner. The object 40A is held on the XY stage 37A. The fθ lens 36A images the beam cross-sectional shape of the mask position in the beam shaper 25 on the surface of the object 40A. The scanning optical system 35A is controlled by the control device 21 so that the incident point of the pulsed laser beam moves in the two-dimensional direction on the surface of the object 40A. Further, the fθ lens 36A vertically injects a pulsed laser beam that is swung in the two-dimensional direction by the scanning optical system 35A toward the surface of the object 40A.
在XY載物台37A的上方配置有拍攝裝置38A。拍攝裝置38A對加工對象物的表面進行拍攝。藉由拍攝裝置38A獲取之圖像資料被輸入到控制裝置21。拍攝裝置38A例如使用CCD照相機。 An imaging device 38A is disposed above the XY stage 37A. The imaging device 38A images the surface of the object to be processed. The image data acquired by the photographing device 38A is input to the control device 21. The imaging device 38A uses, for example, a CCD camera.
以部份反射鏡33分叉之另一方的脈衝雷射光束經由反射鏡34、掃描光學系統35B、及fθ透鏡36B向加工對象物40B入射。加工對象物40B保持在XY載物台37B上。在XY載物台37B的上方配置有拍攝裝置38B。掃描 光學系統35B、fθ透鏡36B、XY載物台37B、及拍攝裝置38B的結構與掃描光學系統35A、fθ透鏡36A、XY載物台37A、及拍攝裝置38A的結構相同。 The other pulsed laser beam branched by the partial mirror 33 is incident on the object 40B via the mirror 34, the scanning optical system 35B, and the fθ lens 36B. The object 40B is held on the XY stage 37B. An imaging device 38B is disposed above the XY stage 37B. scanning The configurations of the optical system 35B, the fθ lens 36B, the XY stage 37B, and the imaging device 38B are the same as those of the scanning optical system 35A, the fθ lens 36A, the XY stage 37A, and the imaging device 38A.
顯示裝置28顯示加工點的圖像等。操作員從輸入裝置29輸入對控制裝置21之指令(命令)。記憶裝置22確保有控制裝置21在雷射加工時所參閱之各種資料的記憶區域。參閱第2圖A、第2圖B~第5圖對各種記憶區域的結構進行說明。 The display device 28 displays an image of the processing point and the like. The operator inputs an instruction (command) to the control device 21 from the input device 29. The memory device 22 ensures a memory area of various materials that the control device 21 refers to during laser processing. The structure of various memory areas will be described with reference to Fig. 2A and Fig. 2B to Fig. 5.
在第2圖A中示出在加工對象物40A的表面定義之待進行鑽孔加工之加工點P的一部份。在加工對象物40B的表面亦定義有複數個加工點。加工對象無40A的加工點的分佈與加工對象物40B的加工點的分佈不限於相同。加工對象物40A的表面上的任意位置以x、y座標定義。 In Fig. 2A, a part of the processing point P to be subjected to drilling processing defined on the surface of the object 40A is shown. A plurality of processing points are also defined on the surface of the object 40B. The distribution of the machining points having no machining target 40A and the distribution of the machining points of the machining target 40B are not limited to the same. Any position on the surface of the object 40A is defined by x and y coordinates.
加工對象物40A的表面區分成複數個掃描區41。1個掃描區41具有能夠不移動XY載物台37A(第1圖)，而藉由使掃描光學系統35A動作來使脈衝雷射光束入射之大小。作為一例，在1個掃描區41內定義有1000~5000個加工點P。 The surface of the object 40A is divided into a plurality of scanning areas 41. One scanning area 41 has the ability to move the scanning laser system 35A without moving the XY stage 37A (Fig. 1). The size. As an example, 1000 to 5000 processing points P are defined in one scanning area 41.
在第2圖B中示出記憶裝置22中確保之位置記憶區域的資料結構的一例。按每一加工點Pi定義有其xy座標(xi，yi)。其中，i為正整數。在鑽孔加工時，使脈衝雷射光束依次向複數個加工點Pi入射。 An example of the data structure of the position memory area secured in the memory device 22 is shown in FIG. The xy coordinate (xi, yi) is defined for each processing point Pi. Where i is a positive integer. During the drilling process, the pulsed laser beam is sequentially incident on a plurality of processing points Pi.
第3圖A中示出加工對象物40A的1個加工點附近的截面圖。在玻璃環氧基等的基板50上形成有內層的銅 圖案51。在銅圖案51及基板50上形成有樹脂膜52。在樹脂膜52上形成有表層的銅膜53。在銅膜53的表面施加黑化處理或茶化處理。 FIG. 3A is a cross-sectional view showing the vicinity of one processing point of the object 40A. An inner layer of copper is formed on the substrate 50 such as a glass epoxy group Pattern 51. A resin film 52 is formed on the copper pattern 51 and the substrate 50. A copper film 53 having a surface layer is formed on the resin film 52. A blackening treatment or a tea treatment is applied to the surface of the copper film 53.
第3圖B中示出使銅加工用的1次發射的雷射脈衝入射之後的加工對象物40A的截面圖。藉由1次發射的雷射脈衝貫穿銅膜53，形成到達至樹脂膜52的表層部之凹部S1。 FIG. 3B is a cross-sectional view of the object 40A after the laser pulse of the primary emission for copper processing is incident. The laser light emitted from the first time passes through the copper film 53 to form a concave portion S1 reaching the surface layer portion of the resin film 52.
第3圖C中示出使樹脂加工用的3次發射的雷射脈衝入射之後的加工對象物40A的截面圖。如虛線S2及S3所示，凹部的底部藉由從第3圖B所示之銅加工用的第1次發射的雷射脈衝的入射計數之第2次發射及第3次發射的雷射脈衝的入射而變深。藉由第4次發射的雷射脈衝的入射，內層的銅圖案51露出。 FIG. 3C is a cross-sectional view of the object 40A after the laser pulse of the third-order emission for resin processing is incident. As shown by broken lines S2 and S3, the bottom of the concave portion is subjected to the second emission and the third emitted laser pulse by the incident count of the first-shot laser pulse for copper processing shown in FIG. The incidence becomes darker. The copper pattern 51 of the inner layer is exposed by the incidence of the laser pulse emitted for the fourth time.
第4圖A中示出記憶裝置22(第1圖)中確保之照射條件記憶區域的資料結構的一例。如第3圖A~第3圖C所示，藉由使多次發射的雷射脈衝向1個加工點入射來進行鑽孔加工。照射條件記憶區域中記憶有向1個加工點入射之雷射脈衝發射數。從第1次發射起依次對雷射脈衝附加發射號#1、#2、#3、……。按每一發射號決定雷射脈衝的照射條件。作為規定照射條件之物理量例如採用脈衝能量。例如，第1次發射的銅加工用雷射脈衝在脈衝能量Em(mJ)的條件下，照射到加工對象物40A(第3圖B)。從第2次發射至第4次發射的樹脂加工用雷射脈衝在脈衝能量Er(mJ)的條件下，照射到加工對象物40A (第3圖C)。 An example of the data structure of the irradiation condition memory area secured in the memory device 22 (Fig. 1) is shown in Fig. 4A. As shown in FIGS. 3A to 3C, the drilling process is performed by causing a plurality of laser pulses to be incident on one processing point. In the illumination condition memory area, the number of laser pulse shots incident on one processing point is stored. The transmission numbers #1, #2, #3, ... are added to the laser pulses in order from the first transmission. The irradiation conditions of the laser pulse are determined for each transmission number. As the physical quantity that defines the irradiation conditions, for example, pulse energy is used. For example, the laser pulse for copper processing which is first emitted is irradiated onto the object 40A under the condition of pulse energy Em (mJ) (Fig. 3B). The laser pulse for resin processing from the second emission to the fourth emission is irradiated onto the object 40A under the condition of pulse energy Er (mJ) (Fig. 3C).
另外，按每一發射號記憶有照射條件的容許範圍的下限值。若實際照射之雷射脈衝的脈衝能量小於該下限值，則判斷為照射錯誤。 Further, the lower limit value of the allowable range of the irradiation conditions is stored for each transmission number. If the pulse energy of the actually irradiated laser pulse is less than the lower limit value, it is determined that the irradiation error is caused.
第4圖B中示出銅加工用雷射脈衝Em和樹脂加工用雷射脈衝Er的脈衝波形。橫軸表示經過時間，縱軸表示功率。筒加工用雷射脈衝Em與從雷射光源20射出之雷射脈衝的波形相等。樹脂加工用雷射脈衝Er在雷射脈衝上升之後且完全下降之前截斷雷射光束。雷射光束的截斷藉由以射束偏轉器30(第1圖)雷射光束的路徑朝向射束阻尼器31來進行。樹脂加工用雷射脈衝Er的脈衝能量變得小於銅加工用雷射脈衝Em的脈衝能量。 The pulse waveform of the copper processing laser pulse Em and the resin processing laser pulse Er is shown in Fig. 4B. The horizontal axis represents elapsed time and the vertical axis represents power. The laser pulse Em for barrel processing is equal to the waveform of the laser pulse emitted from the laser light source 20. The laser pulse for resin processing intercepts the laser beam after the laser pulse rises and completely falls. The truncation of the laser beam is performed by the path of the laser beam of the beam deflector 30 (Fig. 1) toward the beam damper 31. The pulse energy of the laser pulse for resin processing Er becomes smaller than the pulse energy of the laser pulse for copper processing Em.
第4圖A中示出了使4次發射的雷射脈衝向1個加工點入射之例子，但是發射數不限於4次發射。例如，可將銅加工用雷射脈衝設為2次發射，將樹脂加工用雷射脈衝設為4次發射。並且，第4圖A中，作為照射條件定義了銅加工用及樹脂加工用2種，但是亦可定義3種以上的照射條件。並且，第4圖A中，以脈衝能量定義了照射條件，但是亦可用其他物理量定義。例如，可用脈衝寬度、峰值功率等定義。 An example in which the four-shot laser pulses are incident on one processing point is shown in Fig. 4, but the number of shots is not limited to four shots. For example, the laser pulse for copper processing can be set to 2 shots, and the laser pulse for resin processing can be set to 4 shots. In addition, in FIG. 4A, two types of copper processing and resin processing are defined as the irradiation conditions, but three or more types of irradiation conditions may be defined. Further, in Fig. 4A, the irradiation conditions are defined by the pulse energy, but they may be defined by other physical quantities. For example, it can be defined by pulse width, peak power, and the like.
第5圖中示出記憶裝置22(第1圖)中確保之照射錯誤資訊表的資料結構的一例。當以檢測儀27檢測出之脈衝能量小於記憶在照射條件記憶區域(第4圖A)之容許範圍下限值時，對以檢測儀27檢測出之檢測結果、加 工點的座標、及發射號建立關聯並記錄到照射錯誤資訊表。例如，第5圖的第1行資料意味著向座標(xe1，ye1)的加工點入射之發射號#1的雷射脈衝的脈衝能量脫離容許值，其檢測結果為E1(mJ)。檢測結果E1小於第4圖A所示之發射號#1的容許範圍下限值EmL。 Fig. 5 shows an example of a data structure of an illumination error information table secured in the memory device 22 (Fig. 1). When the pulse energy detected by the detector 27 is less than the lower limit of the allowable range stored in the illumination condition memory area (Fig. 4A), the detection result detected by the detector 27 is added. The coordinates of the work site and the transmission number are linked and recorded in the illumination error information table. For example, the first row of data in Fig. 5 means that the pulse energy of the laser pulse of the emission number #1 incident on the processing point of the coordinate (xe1, ye1) is out of the allowable value, and the detection result is E1 (mJ). The detection result E1 is smaller than the allowable range lower limit value EmL of the emission number #1 shown in FIG. 4A.
第1圖所示之以檢測儀27檢測出之脈衝能量與以部份反射鏡26反射之成份的脈衝能量相等，而與實際向加工對象物40A入射之雷射脈衝的脈衝能量不同。但是，已知部份反射鏡26的反射率，因此能夠由以檢測儀27檢測出之脈衝能量準確地計算實際向加工對象物40A入射之雷射脈衝的脈衝能量。本說明書中，並未特別限定，以檢測儀27檢測出之脈衝能量的“檢測結果”意味著以實際向加工對象物40A入射之脈衝能量換算之值。 The pulse energy detected by the detector 27 shown in Fig. 1 is equal to the pulse energy of the component reflected by the partial mirror 26, and is different from the pulse energy of the laser pulse actually incident on the object 40A. However, since the reflectance of the partial mirror 26 is known, the pulse energy of the laser pulse actually incident on the object 40A can be accurately calculated from the pulse energy detected by the detector 27. In the present specification, the "detection result" of the pulse energy detected by the detector 27 means a value converted from the pulse energy actually incident on the object 40A.
第6圖中示出實施例1之雷射加工方法的流程圖。該步驟藉由控制裝置21執行計算機程序來實現。在以下說明中，對使用第1圖所示之掃描光學系統35A及fθ透鏡36A進行加工對象物40A的加工之步驟進行說明。使用掃描光學系統35B及fθ透鏡36B之加工對象物40B的加工亦同時進行。 Fig. 6 is a flow chart showing the laser processing method of the first embodiment. This step is implemented by the control device 21 executing a computer program. In the following description, the procedure of processing the object 40A using the scanning optical system 35A and the fθ lens 36A shown in FIG. 1 will be described. The processing of the object 40B using the scanning optical system 35B and the fθ lens 36B is also performed simultaneously.
步驟S1中，進行1個掃描區41(第2圖A)內的加工點的加工。 In step S1, processing of the machining points in one scanning zone 41 (Fig. 2A) is performed.
第7圖示出步驟S1的詳細的流程圖。步驟SA1中，在掃描區41(第2圖A)內的最初待加工之加工點對脈衝雷射光束的入射點進行定位。該定位依據記憶在位置記憶 區域(第2圖B)之座標，藉由控制裝置21控制掃描光學系統35A來進行。另外，步驟S1中，初期設定發射號。具體而言，作為發射號設定第1次發射的號碼#1。 Fig. 7 shows a detailed flowchart of the step S1. In step SA1, the incident point of the pulsed laser beam is positioned at the first processing point to be processed in the scanning area 41 (Fig. 2A). The positioning is based on memory in position memory The coordinates of the area (Fig. 2B) are controlled by the control device 21 controlling the scanning optical system 35A. Further, in step S1, the transmission number is initially set. Specifically, the number #1 of the first transmission is set as the transmission number.
步驟SA2中，在與發射號對應之照射條件下，使雷射脈衝向脈衝雷射光束的入射點被定位之加工點入射。照射條件能夠依據記憶在照射條件記憶區域(第4圖A)之資訊決定。使雷射脈衝向加工對象物40A入射之同時，以檢測儀27(第1圖)檢測雷射脈衝的脈衝能量。檢測結果輸入到控制裝置21。 In step SA2, the laser pulse is incident on the processing point at which the incident point of the pulsed laser beam is positioned under the irradiation condition corresponding to the transmission number. The irradiation conditions can be determined based on the information of the memory in the irradiation condition memory area (Fig. 4A). While the laser pulse is incident on the object 40A, the pulse energy of the laser pulse is detected by the detector 27 (Fig. 1). The detection result is input to the control device 21.
步驟SA3中，控制裝置21對檢測結果進行判定。具體而言，判定檢測出之脈衝能量是否小於記憶在照射條件記憶區域(第4圖A)之容許範圍的下限值。當檢測結果小於容許範圍的下限值時，判定為該檢測結果在容許範圍外。當脈衝能量的檢測結果為容許範圍外時，步驟SA4中將檢測結果記錄到照射錯誤資訊表(第5圖)上。此時，脈衝能量的檢測結果與雷射脈衝所入射之加工點的座標、及發射號建立關聯並進行記錄。 In step SA3, the control device 21 determines the detection result. Specifically, it is determined whether or not the detected pulse energy is smaller than the lower limit value of the allowable range stored in the irradiation condition memory region (Fig. 4A). When the detection result is less than the lower limit of the allowable range, it is determined that the detection result is outside the allowable range. When the detection result of the pulse energy is outside the allowable range, the detection result is recorded in the irradiation error information table (Fig. 5) in step SA4. At this time, the detection result of the pulse energy is associated with the coordinates of the processing point at which the laser pulse is incident, and the transmission number, and is recorded.
若步驟SA4的處理結束，則步驟SA5中，判定對掃描區41內的所有加工點的雷射脈衝的入射是否結束。步驟SA3中，當判定為脈衝能量的檢測結果在容許範圍內時，無需進行步驟SA4的處理而進行步驟SA5的處理。 When the process of step SA4 is completed, in step SA5, it is determined whether or not the incidence of the laser pulse for all the machining points in the scanning zone 41 is completed. When it is determined in step SA3 that the detection result of the pulse energy is within the allowable range, the processing of step SA5 is performed without performing the processing of step SA4.
步驟SA5中，當判定為在掃描區41(第2圖A)內殘留未照射的加工點時，步驟SA6中，使脈衝雷射光束的入射點移動到下一個待照射之加工點。之後，執行來自 步驟SA2的處理。 In step SA5, when it is determined that the unirradiated machining point remains in the scanning area 41 (Fig. 2A), in step SA6, the incident point of the pulsed laser beam is moved to the next processing point to be irradiated. After that, the execution comes from Processing of step SA2.
步驟SA5中，當判定為對掃描區41(第2圖A)內的所有加工點的脈衝雷射光束的照射已結束時，步驟SA7中，判定與所有發射號對應之雷射脈衝的照射是否結束。當殘留有未照射的發射號時，步驟SA8中更新發射號。具體而言，當發射號#j的雷射脈衝的照射完成時，將發射號更新為#(j+1)。之後，執行來自步驟SA2的處理。 In step SA5, when it is determined that the irradiation of the pulsed laser beam for all the processing points in the scanning area 41 (Fig. 2A) has ended, in step SA7, it is determined whether or not the irradiation of the laser pulse corresponding to all the transmission numbers is End. When the unirradiated transmission number remains, the transmission number is updated in step SA8. Specifically, when the irradiation of the laser pulse of the transmission number #j is completed, the transmission number is updated to #(j+1). Thereafter, the processing from step SA2 is performed.
步驟SA7中，當判定為所有發射號的照射已結束時，結束步驟S1的處理。接著，第6圖所示之流程圖的步驟S2中，判定有無照射錯誤。具體而言，判定在照射錯誤資訊表(第5圖)中是否記錄有錯誤資訊。當未記錄錯誤資訊時，步驟S4中判定所有掃描區41(第2圖A)的加工是否結束。步驟S2中，當判定為存在照射錯誤時，步驟S3中執行矯正處理之後，執行步驟S4。 In step SA7, when it is determined that the irradiation of all the transmission numbers has ended, the processing of step S1 is ended. Next, in step S2 of the flowchart shown in Fig. 6, it is determined whether or not there is an irradiation error. Specifically, it is determined whether or not error information is recorded in the irradiation error information table (Fig. 5). When the error information is not recorded, it is determined in step S4 whether or not the processing of all the scanning areas 41 (Fig. 2A) is completed. In step S2, when it is determined that there is an irradiation error, after the correction processing is executed in step S3, step S4 is performed.
步驟S4中，當判定為殘留有未加工的掃描區41時，步驟S5中使未加工的掃描區移動至由掃描光學系統35A及fθ透鏡36A(第1圖)所進行之可掃描範圍內。該移動藉由控制裝置21控制XY載物台37A來進行。之後，執行來自步驟S1的處理。 In step S4, when it is determined that the unprocessed scanning area 41 remains, the unprocessed scanning area is moved to the scannable range by the scanning optical system 35A and the fθ lens 36A (Fig. 1) in step S5. This movement is performed by the control device 21 controlling the XY stage 37A. Thereafter, the processing from step S1 is performed.
步驟S4中，當判定為所有掃描區41的加工已結束時，結束加工處理。 In step S4, when it is determined that the processing of all the scanning areas 41 has ended, the processing is ended.
在第7圖中，示出了若在步驟SA2中檢測雷射脈衝，則在進行下一個加工點的加工之前，判定雷射脈衝的檢測結果是否在容許範圍內之例子。亦可對檢測結果進行 記憶，來代替每次檢測雷射脈衝時，均判定檢測結果是否在容許範圍。在步驟SA5中，當判定為對所有加工點的照射已結束時，亦可依據所記憶之雷射脈衝的檢測結果，按每一發進行檢測結果是否在容許範圍的判定。或者，在步驟SA7中，當判定為所有發射號的照射已結束時，亦可依據所記憶之雷射脈衝的檢測結果，按每一發進行檢測結果是否在容許範圍的判定。 In Fig. 7, when the laser pulse is detected in step SA2, it is determined whether or not the detection result of the laser pulse is within the allowable range before the processing of the next machining point is performed. Can also test results Memory, instead of detecting the laser pulse each time, determines whether the detection result is within the allowable range. In step SA5, when it is determined that the irradiation of all the processing points has ended, it is also possible to determine whether or not the detection result is within the allowable range for each transmission based on the detection result of the stored laser pulse. Alternatively, in step SA7, when it is determined that the irradiation of all the transmission numbers has ended, it is also possible to determine whether or not the detection result is within the allowable range for each transmission based on the detection result of the stored laser pulse.
第8圖示出步驟S3(第6圖)的矯正處理的流程圖。步驟SB1中，從照射錯誤資訊表(第5圖)中抽出1個產生錯誤之加工點。步驟SB2中獲取抽出之加工點的圖像資料。具體而言，控制裝置21(第1圖)控制XY載物台38A使抽出之加工點移動至拍攝裝置38A的視野內。之後，以拍攝裝置38A對加工點進行拍攝來獲取圖像資料。控制裝置21將獲取之圖像資料作為圖像顯示在顯示裝置28。 Fig. 8 is a flow chart showing the correction processing of step S3 (Fig. 6). In step SB1, one processing point that causes an error is extracted from the irradiation error information table (Fig. 5). The image data of the extracted processing point is obtained in step SB2. Specifically, the control device 21 (first drawing) controls the XY stage 38A to move the extracted machining point into the field of view of the imaging device 38A. Thereafter, the processing point is captured by the imaging device 38A to acquire image data. The control device 21 displays the acquired image data as an image on the display device 28.
步驟SB3中，操作員依據顯示在顯示裝置28之圖像判斷是否需要對顯示之加工點進行矯正處理。操作員將判斷結果輸入到輸入裝置29(第1圖)。被輸入之資訊發送到控制裝置21。 In step SB3, the operator judges whether or not the correction processing of the displayed machining point is necessary based on the image displayed on the display device 28. The operator inputs the judgment result to the input device 29 (Fig. 1). The input information is sent to the control device 21.
當判斷為需要矯正處理時，步驟SB4中，對判定為需要矯正處理之加工點照射追加的雷射脈衝。以下，對照射追加的雷射脈衝之步驟進行說明。 When it is determined that the correction processing is required, in step SB4, the additional laser pulse is irradiated to the processing point determined to require the correction processing. Hereinafter, the procedure of irradiating an additional laser pulse will be described.
追加的雷射脈衝追加照射雷射脈衝，該雷射脈衝與記錄到照射錯誤資訊表(第5圖)之產生錯誤之發射號以後 的發射號對應。對於比產生錯誤之發射號更靠前的發射號正常照射雷射脈衝，因此無需進行追加照射。追加的雷射脈衝的照射條件與記憶在照射條件記憶區域(第4圖A)之該發射號對應之照射條件相同。 The additional laser pulse additionally illuminates the laser pulse, and the laser pulse is recorded after the transmission error number is generated in the illumination error information table (Fig. 5). The corresponding transmission number corresponds. The laser beam is normally irradiated with a higher transmission number than the transmission number that generated the error, so no additional illumination is required. The irradiation condition of the additional laser pulse is the same as the irradiation condition corresponding to the emission number stored in the irradiation condition memory area (Fig. 4A).
步驟SB3中，當判斷為無需進行矯正處理時，或者若步驟SB4中追加的雷射脈衝的照射已結束，則步驟SB5中對所有產生錯誤之加工點判定矯正處理是否結束。當矯正處理未結束時，對產生錯誤之下一個加工點執行來自步驟SB1的處理。當對所有產生錯誤之加工點結束了矯正處理時，結束步驟S3的處理。 In step SB3, when it is determined that the correction processing is not necessary, or if the irradiation of the laser pulse added in step SB4 has been completed, it is determined in step SB5 whether or not the correction processing is completed for all the processing points where the error has occurred. When the correction processing is not ended, the processing from step SB1 is performed on a processing point that generates an error. When the correction processing is completed for all the machining points that have caused the error, the processing of step S3 is ended.
上述實施例1中，如第4圖B所示，能夠將脈衝波形中功率的峰值部份利用於加工。因此，能夠抑制能量利用率的降低。另外，在實施例1中，步驟SB4(第8圖)中關於與比產生錯誤之發射號更靠前的發射號對應之雷射脈衝不進行追加照射。因此，能夠防止雷射脈衝的過度照射。 In the first embodiment described above, as shown in Fig. 4B, the peak portion of the power in the pulse waveform can be used for processing. Therefore, it is possible to suppress a decrease in energy utilization rate. Further, in the first embodiment, in step SB4 (Fig. 8), no additional irradiation is performed with respect to the laser pulse corresponding to the transmission number higher than the emission number at which the error occurred. Therefore, excessive irradiation of the laser pulse can be prevented.
實施例1中，步驟SB3(第8圖)中藉由操作員介入來判定是否需要進行矯正處理。亦可省略步驟SB2及SB3，對於產生錯誤之所有加工點，亦可進行步驟SB4的追加照射。 In the first embodiment, in step SB3 (Fig. 8), it is judged by the operator intervention whether or not correction processing is required. Steps SB2 and SB3 may be omitted, and additional processing of step SB4 may be performed for all processing points where an error occurs.
並且，在實施例1中，如第1圖所示，示出了使脈衝雷射光束分叉成2條路徑而用2個軸進行雷射加工之例子，但是無需一定以2個軸進行雷射加工。可以用1個軸進行雷射加工，亦可以用3個軸以上的多軸進行雷射加 工。 Further, in the first embodiment, as shown in Fig. 1, an example in which the pulsed laser beam is branched into two paths and laser processing is performed by two axes is shown, but it is not necessary to perform the Ray with two axes. Shot processing. Laser machining can be performed with one axis, or laser can be performed with multiple axes of three or more axes. work.
對實施例2之雷射加工方法進行說明。在實施例2之雷射加工方法中，亦可適用與實施例1的第6圖所示之流程圖相同的步驟。第9圖中示出第6圖的步驟S3(執行矯正處理)的詳細之流程圖。以下，對與第8圖所示之實施例1的流程圖的不同點進行說明，對於相同的製程省略說明。 The laser processing method of the second embodiment will be described. In the laser processing method of the second embodiment, the same steps as those of the flowchart shown in Fig. 6 of the first embodiment can be applied. Fig. 9 is a flowchart showing the details of step S3 (execution correction processing) of Fig. 6. Hereinafter, differences from the flowchart of the first embodiment shown in FIG. 8 will be described, and descriptions of the same processes will be omitted.
實施例2中，在步驟SB1與步驟SB2之間執行步驟SC1。在步驟SC1中判定記錄到照射錯誤資訊表(第5圖)之錯誤的檢測結果是否在必須矯正的範圍內。當判定為檢測結果在必須矯正的範圍內時，無需執行伴隨步驟SB2的圖像獲取、步驟SB3的操作員的介入之處理而在步驟SB4中進行用於矯正的追加的雷射脈衝的照射。在步驟SC1中，當判定為檢測結果在必須矯正的範圍外時，與實施例1同樣地，執行步驟SB2。 In the second embodiment, step SC1 is executed between step SB1 and step SB2. It is determined in step SC1 whether or not the detection result of the error recorded in the irradiation error information table (Fig. 5) is within the range that must be corrected. When it is determined that the detection result is within the range that must be corrected, it is not necessary to perform the image acquisition with the step SB2 and the intervention of the operator of the step SB3, and the irradiation of the additional laser pulse for correction is performed in step SB4. In step SC1, when it is determined that the detection result is outside the range that must be corrected, step SB2 is executed in the same manner as in the first embodiment.
第10圖中示出在實施例2之方法中所參閱之照射條件記憶區域的資料結構的一例。按每一發射號，記憶有必須矯正的範圍的下限值。該下限值小於容許範圍下限值。當實際向該加工點入射之雷射脈衝的脈衝能量小於必須矯正下限值時，無需操作員確認該加工點的圖像，就能夠判斷該加工點為加工不良。此時，省略圖像獲取及操作員介在之步驟，因此能夠縮短矯正處理的所需時間。 Fig. 10 shows an example of the data structure of the irradiation condition memory area referred to in the method of the second embodiment. According to each transmission number, the lower limit of the range that must be corrected is memorized. The lower limit value is less than the allowable range lower limit value. When the pulse energy of the laser pulse actually incident on the processing point is smaller than the lower limit of the necessary correction, the operator can be judged to be defective in processing without checking the image of the machining point. At this time, the image acquisition and the steps interposed by the operator are omitted, so that the time required for the correction processing can be shortened.
第11圖中示出實施例3之雷射加工方法的流程圖。以下，對與第6圖所示之實施例1的流程圖的不同點進行說明，對相同的製程省略說明。 Fig. 11 is a flow chart showing the laser processing method of the third embodiment. Hereinafter, differences from the flowchart of the first embodiment shown in FIG. 6 will be described, and the description of the same processes will be omitted.
在實施例1中，每結束1個掃描區41(第2圖A)的加工時，均進行有無照射錯誤的判定(步驟S2)及矯正處理(步驟S3)。在實施例3中，步驟S1、S4、S5中首先進行所有掃描區41的加工。在所有掃描區41的加工結束之後，進行有無照射錯誤的判定(步驟S2)。當判定為存在照射錯誤時，步驟S3中執行矯正處理。實施例3中，亦得到與實施例1相同的效果。 In the first embodiment, the determination of the presence or absence of the irradiation error (step S2) and the correction processing (step S3) are performed every time the processing of one scanning area 41 (second drawing A) is completed. In the third embodiment, the processing of all the scanning areas 41 is first performed in steps S1, S4, and S5. After the processing of all the scanning areas 41 is completed, the determination of the presence or absence of the irradiation error is performed (step S2). When it is determined that there is an irradiation error, the correction processing is performed in step S3. In Example 3, the same effects as in Example 1 were also obtained.
沿著以上實施例對本發明進行了說明，但是本發明不限制於這些。例如，本領域技術人員可知能夠進行各種變更、改良、組合等。 The invention has been described along the above examples, but the invention is not limited thereto. For example, those skilled in the art will recognize that various modifications, improvements, combinations, and the like can be made.
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