CN104919591A - Processing of flexible glass substrates and substrate stacks including flexible glass substrates and carrier substrates - Google Patents
Processing of flexible glass substrates and substrate stacks including flexible glass substrates and carrier substrates Download PDFInfo
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- CN104919591A CN104919591A CN201380044389.3A CN201380044389A CN104919591A CN 104919591 A CN104919591 A CN 104919591A CN 201380044389 A CN201380044389 A CN 201380044389A CN 104919591 A CN104919591 A CN 104919591A
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- tack coat
- flexible glass
- glass substrate
- carbon
- carrier substrate
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
- H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Joining Of Glass To Other Materials (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
A method of processing a flexible glass substrate includes providing a substrate stack comprising the flexible glass substrate bonded to a carrier substrate using a carbon bonding layer. The flexible glass substrate is then separated from the carrier substrate.
Description
The application according to 35U.S.C. § 119, the priority of No. 61/691899th, the U.S. Provisional Application Ser requiring on August 22nd, 2012 to submit to, based on this application that it is incorporated herein by reference in full herein.
Technical field
The present invention relates to equipment and method that the flexible glass substrate on carrier substrate is processed.
Background technology
By the processing of the device architecture on glass substrate surface, manufacture the conventional flex electronic device relevant with patterned glass transistor (TFT) to PV, OLED, LCD.The thickness of these base materials can be, such as, between 0.3-0.7mm.In order at thickness range be 0.3-0.7mm glass baseplate on produce these device architectures, LCD device manufacturer has dropped into huge capital investment on equipment.
Glass baseplate in flexible electrical application is just becoming thinner and lighter.The glass baseplate that thickness is less than 0.5mm (being such as less than 0.3mm, such as 0.1mm or even thinner) may be wish for some display application, particularly mobile electronic device, such as notebook computer and hand-held device etc.Usually form the glass baseplate of this type of low thickness in the following way: on thicker glass baseplate, manufacture device architecture, then (such as by chemistry and/or machinery etching) processes glass baseplate, further to make glass baseplate thinning.Although this thinning process is effective, it is desirable to directly on thinner glass baseplate, to manufacture device architecture, thus eliminate the arbitrary glass thinning step after defining device architecture on the glass substrate.
It is desirable that a kind of carrier method, it utilizes the existing Capital infrastructure of manufacturer, and realizes processing thin, flexible glass substrate (that is, thickness is no more than the thick glass of about 0.3mm).
Summary of the invention
Concept of the present invention relates to employing carbon tack coat and thin slice (such as flexible glass substrate) and carrier substrate is bondd, described carbon tack coat change structure and/or described carbon tack coat after its received energy input (such as heat energy) are fragility, this can contribute to Crack Extension by carbon tack coat, makes flexible glass substrate from carrier substrate layering.
A commercial advantage of method of the present invention is, manufacturer can use their existing fund inputs to process equipment, obtain the benefit being used for the such as thin glass plate of photovoltaic (PV), Organic Light Emitting Diode (OLED), liquid crystal display (LCDs), touch sensor and patterned film transistor (TFT) electronics simultaneously.
According to first aspect, a kind of the method that flexible glass substrate is processed to be comprised:
There is provided base material stack, described base material stack comprises the flexible glass substrate adopting carbon tack coat and carrier substrate to bond; And
Flexible glass substrate is separated from carrier substrate.
According to second aspect, provide the method as first aspect, wherein carbon tack coat is fragility, and described method is also included in carbon tack coat and causes crackle.
According to the third aspect, provide the method as first aspect or second aspect, described method also comprises provides energy to input to carbon tack coat, thus introduces the structural change of carbon tack coat.
According to fourth aspect, provide the method as the third aspect, wherein energy input is heat energy, and described method comprises the temperature be heated to by carbon tack coat at least about 250 DEG C.
According to the 5th aspect, provide the method as the third aspect or fourth aspect, wherein energy input is luminous energy, and carbon tack coat is heated to the temperature at least about 250 DEG C by it.
According to the 6th aspect, provide the method any one of the 3rd to the 5th aspect, wherein structural change comprises the porosity increasing carbon tack coat.
According to the 7th aspect, provide the method any one of the first to the 6th aspect, wherein carbon tack coat is positioned at the circumference along flexible glass substrate.
According to eighth aspect, provide the method any one of the first to the 7th aspect, wherein use laser localized heating carbon tack coat.
According to the 9th aspect, provide the method any one of the first to eighth aspect, wherein use LED or flash light source heating carbon tack coat.
According to the tenth aspect, provide the method any one of the first to the 9th aspect, described method also comprises electric component is applied to flexible glass substrate.
According to the 11 aspect, provide the method any one of the first to the tenth aspect, wherein the thickness of flexible glass substrate is not more than about 0.3mm.
According to the 12 aspect, provide the method any one of the first to the 11 aspect, wherein carrier substrate comprises glass.
According to the 13 aspect, provide the method any one of the first to the 12 aspect, wherein the thickness of carrier substrate is greater than the thickness of flexible glass substrate.
According to fourteenth aspect, a kind of the method that flexible glass substrate is processed to be comprised:
The carrier substrate with glass support surface is provided;
There is provided flexible glass substrate, it has the first and second wide surfaces;
Use carbon tack coat, first of flexible glass substrate the wide surface is bonded to the glass support surface of carrier substrate; And
Cause the crackle in carbon tack coat, to remove flexible glass substrate from carrier substrate.
According to the 15 aspect, provide the method as fourteenth aspect, described method also comprises provides energy to input to carbon tack coat, for changing the structure of carbon tack coat and the adhesion strength reduced between flexible glass substrate and carrier substrate.
According to the 16 aspect, provide the method as the 15 aspect, wherein energy input is heat energy, and described method comprises the temperature be heated to by carbon tack coat at least about 250 DEG C.
According to the 17 aspect, provide the method as the 15 aspect or the 16 aspect, wherein energy input is luminous energy, and it causes the temperature be heated to by carbon tack coat at least about 250 DEG C.
According to the 18 aspect, provide the method any one of the 14 to the 17 aspect, wherein carbon tack coat is positioned at the circumference along flexible glass substrate.
According to the 19 aspect, provide the method any one of the 14 to the 18 aspect, wherein use laser localized heating carbon tack coat.
According to the 20 aspect, provide the method any one of the 14 to the 20 aspect, wherein use LED or flash light source heating carbon tack coat.
According to the 21 aspect, provide the method any one of the 14 to the 20 aspect, wherein the thickness of flexible glass substrate is not more than about 0.3mm.
According to the 22 aspect, a kind of base material stack comprises:
There is the carrier substrate of glass support surface;
Flexible glass substrate, it is supported by the glass support surface of carrier substrate; And
Carbon tack coat, it makes flexible glass substrate and carrier substrate bond, and described carbon tack coat is fragility, to contribute to Crack Extension by carbon tack coat.
According to the 23 aspect, provide the base material stack as the 22 aspect, wherein the thickness of flexible glass substrate is not more than about 0.3mm.
According to twenty-fourth aspect, provide the base material stack as described in the 22 aspect or the 23 aspect, wherein the thickness of carbon tack coat is not more than about 0.1mm.
Supplementary features of the present invention and advantage is proposed in the following detailed description, Partial Feature wherein and advantage be the easy understand by described content to those skilled in the art, or defines by the citing enforcement in text description and accompanying drawing and claims and be familiar with the present invention.Should be understood that foregoing general description and the following detailed description are all to example of the present invention, be used to provide the overview or framework of understanding claimed character of the present invention and characteristic.
The further understanding accompanying drawings provided the principle of the invention comprised, accompanying drawing is incorporated in the present specification and forms a part for specification.Accompanying drawing illustrates one or more execution mode of the present invention, and is used for illustrative examples as principle of the present invention and operation together with specification.Should be understood that the of the present invention various feature disclosed in the present description and drawings can combinationally use with any and all.
Accompanying drawing explanation
Fig. 1 is the end view of an execution mode of base material stack, and described base material stack comprises the flexible glass substrate with carrier substrate delivery;
Fig. 2 is the decomposition diagram of the base material stack of Fig. 1;
Fig. 3 shows an execution mode to the method that the flexible glass substrate shown in Fig. 1 and base material stack are processed;
Fig. 4 is the vertical view of an execution mode of base material stack, and described base material stack comprises the flexible glass substrate and carrier substrate with different size;
Fig. 5 is the vertical view of another execution mode of base material stack, and described base material stack comprises and has difform flexible glass substrate and carrier substrate;
Fig. 6 is the vertical view of an execution mode of base material stack, and described base material stack has the tack coat on the glass support surface of paint carrier substrate;
Fig. 7 is the vertical view of another execution mode of base material stack, and described base material stack has the tack coat on the glass support surface of paint carrier substrate;
Fig. 8 is the vertical view of another execution mode of base material stack, and described base material stack has the tack coat on the glass support surface of paint carrier substrate;
Fig. 9 shows the absorption of carbon back tack coat;
Figure 10 is the vertical view of an execution mode of base material stack, and described base material stack has the tack coat on the glass support surface of paint carrier substrate;
Figure 11 is the vertical view of an execution mode of base material stack for the formation of multiple required parts; And
Figure 12 shows an execution mode of the method from carrier substrate release flexible glass substrate.
Detailed Description Of The Invention
Execution mode relate generally to as herein described is processed flexible glass substrate (in this article sometimes also referred to as device substrate).Flexible glass substrate can be the part of base material stack, and described base material stack generally includes carrier substrate and the flexible glass substrate by inorganic bond layer and its bonding.Term used herein " inorganic material " refers to it is not the compound of hydro carbons or derivatives thereof.As detailed below, tack coat comprises inorganic cementitious material, it provides fragility or other modes can be easier to the tack coat be separated, it is compatible that described tack coat and device (such as TFT) are processed, and provide peel strength, described peel strength realizes being separated of flexible glass substrate and carrier substrate.
With reference to Fig. 1 and 2, base material stack 10 comprises carrier substrate 12 and flexible glass substrate 20.Carrier substrate 12 has glass support surface 14, opposed support surface 16 and circumference 18.Flexible glass substrate 20 has first wide surperficial 22, relative second wide surperficial 24 and circumference 26.Flexible glass substrate 20 can be " ultra-thin ", and thickness 28 is less than or equal to about 0.3mm, includes but not limited to following thickness, such as, and about 0.01-0.05mm, about 0.05-0.1mm, about 0.1-0.15mm and about 0.15-0.3mm.
Use tack coat 30, flexible glass substrate 20 is bondd at the glass support surface 14 of its first wide surperficial 22 places and carrier substrate 12.Tack coat can be the inorganic bond layer comprising inorganic bonding material.When being made carrier substrate 12 and flexible glass substrate 20 mutually bond by tack coat 30, the combination thickness 25 of base material stack 10 can be equal to and independent glass baseplate, the thickness that described independent glass baseplate compares single flexible glass substrate 20 has the thickness of increase, and it can be suitable for using existing device fabrication infrastructure.Such as, if the process equipment of device fabrication infrastructure is designed for 0.7mm plate, and the thickness 28 of flexible glass substrate 20 is 0.3mm, so the thickness 32 of carrier substrate 12 can be chosen to be certain thickness being not more than 0.4mm, this depends on the thickness of such as tack coat 30.
Carrier substrate 12 can be the material of any appropriate, comprises such as glass, glass ceramics or pottery, and can be transparent or opaque.If be made up of glass, then carrier substrate 12 can be the composition of any appropriate, comprises aluminosilicate, borosilicate, aluminoborosilicate, sodium-calcium-silicate, and depends on that its final application can be alkalescence or non-alkaline.The thickness 32 of carrier substrate 12 can be about 0.2-3mm, and such as 0.2,0.3,0.4,0.5,0.6,0.65,0.7,1.0,2.0 or 3mm, and can be depending on the thickness 28 of flexible glass substrate 20, as mentioned above.In addition, carrier substrate 12 can be made up (as shown) of one deck, or can be made up of the multilayer (comprising multiple thin plate) being bonded together the part forming base material stack 10.
Flexible glass substrate 20 can be formed by the material of any appropriate, comprises such as glass, glass ceramics or pottery, and can be transparent or opaque.If be made up of glass, then flexible glass substrate 20 can be the composition of any appropriate, comprises aluminosilicate, borosilicate, aluminoborosilicate, sodium-calcium-silicate, and depends on that its final application can be alkalescence or non-alkaline.The thickness 28 of flexible glass substrate 20 can be less than or equal to about 0.3mm, such as, be less than or equal to about 0.2mm, such as about 0.1mm, as mentioned above.As described herein, flexible glass substrate 20 can have the size identical with carrier substrate 12 and/or shape, or is of different sizes and/or shape.
See Fig. 3, the one shown as a part of processing flexible glass substrate 20 can discharge adhesive method 40.In step 42, based on such as their size, thickness, material and/or terminal use, select carrier substrate 12 and flexible glass substrate 20.Once have selected carrier substrate 12 and flexible glass substrate 20, can in step 44 by one or two in first wide surperficial 22 of tack coat 30 paint glass support surface 14 and flexible glass substrate 20.Any suitable method can be used to apply tack coat 30, such as one or more of pressurized application, such as by nozzle, sprawl, melt, spin coating casting, spraying, dip-coating, vacuum or aerial sediment etc.
In step 46, use tack coat 30, make flexible glass substrate 20 and carrier substrate 12 adhere to or otherwise bond.In order to obtain adhesion strength required between flexible glass substrate 20 and carrier substrate 12, can the binding material forming tack coat 30 be heated, cool, drying mixes with other material, induced reaction, applying pressure etc.Herein by terms " adhesion strength " refers to following any one or multiple: dynamic shear strength, dynamic peel strength, Static Shear Strength, static peel strength and combination thereof.Such as, in separation mode, peel strength is that the stress by being applied to flexible glass substrate and/or carrier substrate causes inefficacy (static state) and/or maintains the power of specific failure rate (dynamically) necessary per unit width.In shear mode, shear strength is that the stress by being applied to flexible glass substrate and/or carrier substrate causes inefficacy (static state) and/or maintains the power of specific failure rate (dynamically) necessary per unit width.The method of any appropriate can be used for determining adhesion strength, comprises stripping and/or the shear strength test of any appropriate.
Step 48 and 50 relates to flexible glass substrate 20 is discharged or unsticking knot from carrier substrate 12, thus can remove flexible glass substrate 20 from carrier substrate 12.Before or after discharging flexible glass substrate 20 from carrier substrate 12, can such as form processing flexible glass substrate 20 in display device (such as LCD, OLED or TFT electronics).Such as, electronic building brick or filter can be applied to the second wide by surperficial 24 of flexible glass substrate 20.In addition, can, before discharging flexible glass substrate 20 from carrier substrate 20, final electronic building brick and flexible glass substrate 20 be carried out assembling or combining.Such as, extra film or glass baseplate can be laminated to the surface of flexible glass substrate 12, or can bond electronic building brick such as flexible circuit or IC.Once process flexible glass substrate, energy can be inputted 47 and be applied to tack coat 30, this changes the structure of tack coat 30 in step 48.As described below, this structural change reduces the adhesion strength of tack coat 30, and before the energy input compared to step 46, this contributes to being separated flexible glass substrate 20 from carrier substrate 12.Or also as mentioned below, tack coat 30 can comprise the inorganic material without undergoing structural change, but this inorganic material forms tack coat 30, and described tack coat 30 is vulnerable to such as break, to promote that the unsticking of flexible glass substrate 20 is tied.In step 50, remove flexible glass substrate 20 from carrier substrate 12.By such as peeling off flexible glass substrate 20 or its part from carrier substrate 12, realize this taking-up.By with angled with the plane P extending through tack coat 30, come to apply directed force F to one or two base material, be peeling power.
the selection of carrier substrate and flexible glass plate
Carrier substrate 12 can be formed by identical, similar or different materials with flexible glass substrate 20.In some embodiments, carrier base ability 12 and flexible glass substrate 20 are formed by glass, glass ceramics or ceramic material.Carrier substrate 12 can be formed by identical, similar or different manufacturing process with flexible glass substrate 14.Such as, fusion process (such as glass tube down-drawing) forms high-quality thin glass plate, and it can be used for various device, such as flat-panel monitor.When using different materials, matched coefficients of thermal expansion value may be needed.Compared to the glass plate produced by other method, the surface of the glass plate prepared in fusion process has excellent flatness and smoothness.Fusion process see S Patent Application Serial the 3rd, 338, No. 696 and 3,682, No. 609.Other suitable glass plate formation method comprises float glass process, again drawing and slot draw.Flexible glass substrate 20 (and/or carrier substrate 12) also can comprise temporary transient or permanent protective finish or other types of coatings on its one or two in first and second wide surperficial 22 and 24.
One or more in the size of carrier substrate 12 and flexible glass substrate 20 and/or shape can be about identical and/or different.Such as, briefly see Fig. 4, display carrier substrate 12 has the shape substantially identical with flexible glass substrate 20, but one or more size is greater than flexible glass substrate 20.This layout allows the perimeter region 52 of carrier substrate 12 to extend outwardly beyond flexible glass substrate 20 around circumference 26 that is whole or flexible glass substrate 20 at least partially.Again such as, Fig. 5 shows so a kind of execution mode, and wherein the shape of flexible glass substrate 20, size are different from carrier substrate 12.This layout can only allow the part 54 of the circumference 18 of carrier substrate 12 to extend outwardly beyond the circumference 26 of flexible glass substrate 20.Although show rectangle and round-shaped, depend on required stack structure, any suitable shape can be used, comprise irregularly shaped.In addition, the edge of carrier substrate 12 can carry out corners, fine grinding (finished) and/or grinding to tolerate impact and to contribute to process.Also can provide surface characteristics such as groove and/or hole on carrier substrate 12.Groove, hole and/or other surface characteristics can promote and/or suppress localization and/or the adhesion of binding material.
the selection of tack coat and applying
Tack coat 30 can comprise one or more binding materials, and its warp after received energy input is subject to structural change.Such as, tack coat 30 can comprise inorganic material, and can comprise following material, such as glass, glass ceramics, pottery and carbonaceous material.In some embodiments, tack coat 30 can be made up of the carbon forming carbon tack coat.Various exemplary binder material is as described below.Any suitable method can be used to apply tack coat 30, such as one or more of pressurized application, such as by nozzle, sprawl, melt, spin coating casting, spraying, dip-coating, vacuum or aerial sediment etc.
The pattern of any appropriate and/or shape can apply tack coat 30.See Fig. 6, by the region A of tack coat 30 paint glass support surface 14
1on, it is at least about the area A covered by flexible glass substrate 20 of 50%
2, such as substantially all region A
2.In some embodiments, A
1can be the A being less than about 50%
2, such as, be not more than the A of about 25%
2.Tack coat 30 can extend over the circumference of flexible glass substrate 20, or tack coat 30 can be contained within the circumference of flexible glass substrate 20.See Fig. 7, tack coat 30 can along predefined paths (such as region A
3) apply continuously, described region A
3around A
2circumference extend (that is, continuous print surrounding bonding), leave the non-bonded areas R connected with tack coat 30.See Fig. 8, tack coat 30 can be formed by discrete bonding fragment 60 spaced apart from each other.In the execution mode of Fig. 8, discrete bonding fragment is the form of single lines.Other suitable shape any can be used, such as the combination of circle, point, irregular shape and various shape.
There is provided energy to input to tack coat 30, this changes or is used for changing the structure of tack coat 30.Compared with before inputting with energy, this structural change reduces the adhesion strength of tack coat 30, contributes to being separated flexible glass substrate 20 from carrier substrate 12.The kind of energy input, depends on binding material used in tack coat 30 at least in part.Be provided for below providing the binding material of tack coat 30 and the non-limitative example of input energy, but have no intention to limit.
Embodiment
The tack coat of carbon containing is formed by phenolic resin solution.This process employs P-F copolymer, and creates sample with spin coating casting and curing process.Procedure of processing comprises:
A. be cast on carrier substrate by the phenolic resin solution spin coating of the dilution of 70 % by weight resins and 30 % by weight DI water, 3krpm continues 30 seconds, obtains the tack coat being not more than 10 μm of thickness.
B. at room temperature, the carrier substrate with tack coat and device substrate placed on it is placed in thermal station.Apply counterweight, it produces the maximum bonded pressure being greater than 100kPa.
C. thermal station is heated to 150 DEG C, and keeps about 10 minutes, then room temperature is got back in cooling.
D. the stack that circulates in stove and in air is high to 400 DEG C, keeps 1 hour, then cools.
Use this process, device substrate is bonded to and is shearing the carrier substrate of surviving in tractive test, and can be separated when applying peeling force, this is the porosity because of the increase formed in tack coat in the carbon tack coat stayed after heating and heating process at least in part.Device substrate and carrier substrate all by
(purchased from NY, USA city, the trade name of the alkali free aluminium borosilicate glass of Corning Inc (Corning Incorporated, Corning, NY)) (8cmx12cm) base material is formed, and thickness is 0.7mm.
Extra filler test is carried out to the stack formed according to embodiment.Circulated 1 hour in the stove of 500 DEG C and in air by stack, this causes the severe oxidation of tack coat.This oxidation of carbon tack coat can be used to device substrate is tied from carrier substrate unsticking.Because the evaporation of the carbon of oxidation, can easily remove carbon tack coat, be used for reusing with clean carrier substrate.
By being oxidized the adhesion strength reduced between flexible glass substrate 20 and carrier substrate 12 to carbon back tack coat.Such as in an embodiment, in the presence of oxygen, temperature tack coat 30 being heated to about 500 DEG C can cause the oxidation of carbon.Under the existence of ozone, the oxidation of carbon tack coat can occur being less than at the temperature of 500 DEG C.Although the device substrate of assembling completely being heated to high may be unacceptable to 500 DEG C, in some embodiments, laser can be used tack coat to be locally heated to the temperature of accelerating oxidation.
See Fig. 9, show the absorption of carbon back tack coat 30.Laser can be used to localized heating and oxidation carbon back tack coat 30 (or as herein described any one or multiple binding material).Carbon back tack coat 30 can apply as circumference bonding (Fig. 7 and 8), by laser, localized heating is carried out to carbon back tack coat 30 to help, for carbon back tack coat 30 provides larger accessibility (access), because it is near the circumference of flexible glass substrate 20.Fig. 9 shows the absorption spectrum of the carbon back tack coat 30 formed from the phenolic resin described in embodiment above.Known, be absorbed in visible ray and the increase of UV spectral regions, make heating binding material can be used for thermal oxidation.Can dopant be added to tack coat, increase the amount of radiation of absorption.
It should be noted, for concrete device manufacturing processes used, the optimization of binding material should be carried out.Such as, for a-Si or p-Si TFT process, manufacture temperature and be more than or equal to about 250 DEG C, such as be more than or equal to about 350 DEG C, such as about 250-450 DEG C, can be chosen to be the debinding beat exposure of jointing material and be more than or equal to 250 DEG C, such as, be more than or equal to 350 DEG C, such as be more than or equal to 450 DEG C, to reduce the possibility of any non-purpose debinding.But beat exposure should be selected lower than causing that of damage to device electronic part or other assemblies.In some embodiments, when height is to target debinding beat exposure, the adhesion strength of tack coat 30 can substantially not exist or exist and a small amount of (is such as less than about 50%, such as be less than about 25%, such as be less than about 10%, such as, be less than about 5%, such as, be less than about 1%) reduce.Therefore, can manufacture according to different devices the unsticking knot that situation optimizes material.In addition, can by the applying of the energy 47 to tack coat 30 localization to tack coat 30 self.Such as, can be optimized energy source, thus make tack coat 30 absorb most energy 47, this causes any device layer on flexible glass substrate 20, carrier substrate 12 or flexible glass substrate 20 to have lower thermal effect.
Tack coat 30 can comprise and cause adhesion strength reduction (such as without undergoing structural change, about 250-450 DEG C) inorganic material, but this inorganic material forms tack coat 30, and described tack coat 30 is vulnerable to such as break, to promote that the unsticking of flexible glass substrate 20 is tied.Without wishing to be bound by theory, breaking of two types comprises toughness and breaks and non-plastic fracture.Strong, long lasting bond between base material are in important application, and toughness is broken normally preferred, and obtain the plastic deformation along with using toughness material, this has usually delayed Crack Extension and has passed through toughness material.On the other hand, non-plastic fracture causes rapid crack by fragile material or along the interface between tack coat 30 and flexible glass substrate 20 and/or carrier substrate 12 usually, is usually approximately perpendicular to the direction of stress application.Therefore, discharge in application as herein described, the non-plastic fracture with relevant Rapid Crack may be preferred.As used herein, coherent-brittle layer can be such one, and the size of plastic zone wherein formed around crack tip in tack coat is little (such as, being not more than about 25% or less), compared to tack coat 30 thickness (such as, about 100 μm at most, such as, at most about 50 μm, such as maximum about 25 μm, such as maximum about 10 μm, such as maximum about 5 μm, such as about 5-50 μm).Some materials, such as glass, can not have or the plastic zone of near-zero, thus form coherent-brittle layer.Another kind of exemplary coherent-brittle layer can be carbon tack coat, and such as, the mode of formation is similar to employing phenolic-formaldehyde copolymer mentioned above and the embodiment of thermal curing methods.
release flexible glass substrate
The method of any appropriate can be used to discharge flexible glass substrate 20 from carrier substrate 12.As an example, because the skew of overall tensile-center of compression axle in the forming process of resulting devices adopting flexible glass substrate 20, the stress for delamination may be there is.Such as, flexible glass substrate 20 and carrier substrate 12 are bonded together, can first make bonding plane be placed in close to center of stress axle.When boning near central shaft, mechanical stretching stress can minimize.After device is assembled completely and flexible glass substrate 20 bond with carrier substrate 12 (with possible cover-plate glass), center of stress axle can offset, and this can increase stretching along the plane that bonds and bending stress significantly, causes at least some delamination.Also can use the device of any amount, such as skid plate, laser, cutter, cutting wheel, corrosive agent cause and/or complete delamination, and/or manually can remove flexible glass substrate.
Now see Figure 10, show a kind of exemplary binder layer 30 and apply pattern, wherein flexible glass substrate 20 be divided into or cut into multiple fragment, being sometimes referred to as device cell.The vertical view of Figure 10 display stack overlapping piece 100, it comprises the flexible glass substrate 20 being bonded to carrier substrate 12 as above.Tack coat (can be used region A
1represent) be applied on the footprint of the flexible glass substrate 20 of whole (or being less than whole), described flexible glass substrate 20 is positioned on the glass support surface 14 of carrier substrate 12.In the embodiment shown, flexible glass substrate 20 is subdivided into device cell 102 and (also uses A
2represent), for further processing, it has circumference 104.By applying tack coat A below device cell 102
1, can minimize or prevent process fluid from leaking and enter the region limited by device cell 102, this leakage may contaminate subsequent processing or flexible glass substrate 20 (or it at least partially) may be made to be separated from carrier substrate 12 prematurely.
Although be shown as one piece of flexible glass substrate 20 to bond with carrier substrate 12, polylith flexible glass substrate 20 and one piece of carrier substrate 12 or polylith carrier substrate 12 can be bondd.In these cases, can side by side or in the mode of suitable order, carrier substrate 12 be separated from polylith flexible glass substrate 20.
By cutting along circumference 104, the device cell 102 of arbitrary number can be separated with other device cell 102 of arbitrary number.Exhaust can be provided to reduce any expansion on flexible glass substrate 20 or other adverse influence.Laser or other cutter sweep can be used to cut individual devices unit 102 from flexible glass plate 20.In addition, can be carried out as follows cutting, make only cutting or scribing flexible glass substrate 20, and do not cut or scribing carrier substrate 12, to realize reusing of carrier substrate 12.Etching and/or other clean method any can be used to remove any residue that tack coat 30 stays.Etching also can be used for helping to remove flexible glass substrate 20 from carrier substrate 12.
With reference to Figure 11, show device cell 140 for removing flexible glass substrate 20 from carrier substrate 12 (such as, this unit have electronic device 145 or formed thereon other needed for structure) an execution mode of method.Can be manufactured the device cell 140 of arbitrary number by the flexible glass substrate 20 being bonded to carrier substrate, this depends on the size of flexible glass substrate 20 and the size of device cell 140.Such as, flexible glass substrate can be 2 generations (Gen 2) sizes or larger, such as, and 3 generations, 4 generations, 5 generations, 8 generations or larger (such as, chip size is 100mmx100mm to 3 meter of x3 rice or larger).In order to allow the layout of user's determining device unit 140, such as, with regard to the size of device cell 140, quantity and shape, wishing that one piece of flexible glass substrate 20 from being bonded to carrier substrate 12 is produced, flexible glass substrate 20 can be provided as shown in figure 11.More specifically, a kind of base material stack 10 with flexible glass substrate 20 and carrier substrate 12 is provided.Flexible glass substrate 20 bonds at bonded areas 142 and carrier substrate 12, and described bonded areas 142 is around non-bonded areas 144.
Bonded areas 142 is arranged on the periphery of flexible glass substrate 20, and Perfect Ring is around non-bonded areas 144.This continuous print bonded areas 142 can be used to any gap between the flexible glass substrate 20 at the circumference place being sealed in flexible glass substrate 20 and carrier substrate 12, thus do not capture process fluid, otherwise the process fluid be captured may pollute the following process transmitting base material stack 10 processes.But, in other embodiments, discrete bonded areas can be used.
CO can be used
2laser beam cuts the circumference 146 of required parts 140.CO
2laser makes it possible to integral cutting (100% thickness) flexible glass substrate 20.For CO
2laser cutting, is gathered into the circular beam shape of the minor diameter on the surface 24 of flexible glass substrate 20, and moves along required track by laser beam, and below can with there being coolant jet.Such as coolant jet can be air nozzle, and compressed air stream is delivered on the surface of thin slice by small diameter bore by it.Also can use water or air-liquid mist.Once cut the circumference 146 of device cell 140, the flexible glass substrate 20 of device cell 140 from remainder can be removed.Then, can apply energy input to tack coat 30, this changes the structure of tack coat 30.This structural change reduces the adhesion strength of tack coat 30, to promote to be separated remaining flexible glass substrate 20 from carrier substrate 12.
See Figure 12, show the execution mode discharging the method for flexible glass substrate 20 from carrier substrate 12.Required device 150 is comprised (such as once be processed into by flexible glass substrate 20, LCD, OLED or TFT soft copy) and such as eliminate device cell 140, discharge remaining flexible glass substrate 20 (or whole flexible glass substrate 20) from carrier substrate 12.In this embodiment, tack coat 30 can be formed as circumference bonding 152, forms bonded areas 154 and adhesive free region 156.(such as, wavelength is about 400-750nm's) laser beam 160 leads between flexible glass substrate 162 and carrier substrate 12 by laser 158, to carry out localized heating to the tack coat 30 of part.Also can use LED and photoflash lamp source, they are adjusted to tack coat 30 and absorb.Such as, laser 158 can be used to localized heating and oxidation carbon back tack coat 30.Circumference bonding 152 can promote the localized heating by laser 158 pairs of carbon back tack coats 30, the accessibility of larger carbon back tack coat 30 is provided, because it is near the circumference of flexible glass substrate 20, and there is less sectional area (such as, comparing with the Binder Phase of the whole width through flexible glass substrate 12).
Tack coat mentioned above can provide inorganic adhesion method, and it makes it possible to use thin flexible glass substrate under existing equipment and manufacturing condition.Carrier substrate can reuse from different flexible glass substrate.The stack comprising carrier substrate, flexible glass substrate and tack coat can be assembled and transport subsequently for further processing.Or, before transportation, can be assembled some or do not assemble stack.In order to be used as carrier substrate, carrier substrate is without the need to being original.Such as, carrier substrate can stand excessively to bundle or apply excessive striped, makes them be unsuitable for being used as display device.Use carrier substrate can avoid the problem directly using thin base material, such as, around the problem of the scrobicula of vacuum hole and the electrostatic of increase.The height of tack coat can be thin (such as, about 10 μm or less, or about 1-100 μm), this can make flatness problem (such as sagging) minimize, and the continuous film contributed to as applying through whole carrier substrate, or Topical application, such as, around periphery.
In detailed description above, unrestricted in order to explain, give the illustrative embodiments that detail is described, to provide fully understanding various principle of the present invention.But, it will be obvious to those skilled in the art that after benefiting from this specification, the present invention can be implemented according to other execution modes being different from detail described herein.In addition, the description to well-known device, method and material may be saved herein, in order to avoid the description of interference to various principle of the present invention.Finally, when any applicable, identical Reference numeral represents identical element.
Direction used herein term, such as up, down, left, right, before and after, top, the end are only the accompanying drawings with reference to drawing, and are not used for representing absolute orientation.
Should emphasize, the above-mentioned execution mode of the present invention, particularly any " preferably " execution mode, be only embodiment in the cards, only state in order to clear understanding various principle of the present invention.When substantially not departing from spirit of the present invention and various principle, many changes and adjustment can be carried out to above-mentioned execution mode of the present invention.All such changes and modifications are intended to be included in the scope of this specification and claims protection.
Claims (10)
1., to the method that flexible glass substrate is processed, described method comprises:
There is provided base material stack, described base material stack comprises the flexible glass substrate adopting carbon tack coat and carrier substrate to bond; And
Flexible glass substrate is separated from carrier substrate.
2. the method for claim 1, is characterized in that, described carbon tack coat is fragility, and described method is also included in described carbon tack coat and causes crackle.
3. the method for claim 1, described method also comprises provides energy to input to carbon tack coat, thus introduces the structural change in carbon tack coat.
4. method as claimed in claim 3, is characterized in that, described energy input is luminous energy, and carbon tack coat is heated to the temperature of at least 250 DEG C by it.
5. method as claimed in claim 3, is characterized in that, described structural change comprises the porosity increasing carbon tack coat.
6. method as claimed in claim 3, is characterized in that, uses laser, LED or flash light source heating carbon tack coat.
7. the method according to any one of claim 1-6, described method also comprises executes power-up component to flexible glass substrate.
8. a base material stack, it comprises:
There is the carrier substrate of glass support surface;
Flexible glass substrate, it is supported by the glass support surface of carrier substrate; And
Carbon tack coat, it makes flexible glass substrate and carrier substrate bond, and described carbon tack coat is fragility, to contribute to Crack Extension by carbon tack coat.
9. base material stack as claimed in claim 8, it is characterized in that, the thickness of described flexible glass substrate is not more than about 0.3mm.
10. base material stack as claimed in claim 8 or 9, it is characterized in that, the thickness of described carbon tack coat is not more than about 0.1mm.
Applications Claiming Priority (3)
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| US201261691899P | 2012-08-22 | 2012-08-22 | |
| US61/691,899 | 2012-08-22 | ||
| PCT/US2013/054479 WO2014031374A1 (en) | 2012-08-22 | 2013-08-12 | Processing of flexible glass substrates and substrate stacks including flexible glass substrates and carrier substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104919591A true CN104919591A (en) | 2015-09-16 |
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|---|---|---|---|
| CN201380044389.3A Pending CN104919591A (en) | 2012-08-22 | 2013-08-12 | Processing of flexible glass substrates and substrate stacks including flexible glass substrates and carrier substrates |
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| JP (1) | JP6329540B2 (en) |
| KR (1) | KR20150046219A (en) |
| CN (1) | CN104919591A (en) |
| TW (1) | TW201412554A (en) |
| WO (1) | WO2014031374A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019178746A1 (en) * | 2018-03-20 | 2019-09-26 | 深圳市柔宇科技有限公司 | Flexible component, electronic device, and separation method for flexible cover plate |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016112082A1 (en) * | 2015-01-06 | 2016-07-14 | Corning Incorporated | A glass-carrier assembly and methods for processing a flexible glass sheet |
| WO2016112975A1 (en) * | 2015-01-14 | 2016-07-21 | Ev Group E. Thallner Gmbh | Method and device for detaching a substrate from a substrate stack |
| US20180154493A1 (en) * | 2015-04-22 | 2018-06-07 | Corning Incorporated | Methods of edge finishing laminated glass structures |
| KR101673417B1 (en) | 2015-07-14 | 2016-11-07 | 에스피텍 주식회사 | Manufacturing Method for Reducing Thickness Deflection of Ultra-Thin Type Glass Plate |
| KR101661278B1 (en) | 2015-07-14 | 2016-09-29 | 에스피텍 주식회사 | Manufacturing Method of Ultra-Thin Type Glass Plate |
| TWI767948B (en) | 2016-10-31 | 2022-06-21 | 美商康寧公司 | Layered bendable puncture resistant glass article and method of making |
| JP2020506817A (en) * | 2016-11-28 | 2020-03-05 | アレス マテリアルズ インコーポレイテッド | Temporary adhesive layers for flexible electronics processing |
| KR20220052123A (en) | 2020-10-20 | 2022-04-27 | 동우 화인켐 주식회사 | Treating apparatus for ultra thin glass and manufaturing method of ultra thin glass using the same |
| JP2023005724A (en) * | 2021-06-29 | 2023-01-18 | 日本電気硝子株式会社 | Manufacturing method of assembly, and manufacturing apparatus of assembly |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1816768A (en) * | 2003-07-03 | 2006-08-09 | 康宁股份有限公司 | Glass product for use in ultra-thin glass display applications |
| US20110192525A1 (en) * | 2008-10-23 | 2011-08-11 | Asahi Glass Company, Limited | Glass substrate laminated device and method for producing laminate glass substrate |
| WO2012056867A1 (en) * | 2010-10-29 | 2012-05-03 | 東京応化工業株式会社 | Stacked body and method for detaching stacked body |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4405246B2 (en) * | 2003-11-27 | 2010-01-27 | スリーエム イノベイティブ プロパティズ カンパニー | Manufacturing method of semiconductor chip |
| JP4930161B2 (en) * | 2006-05-08 | 2012-05-16 | 旭硝子株式会社 | Thin glass laminated body, display device manufacturing method using thin glass laminated body, and supporting glass substrate |
| KR100820170B1 (en) * | 2006-08-30 | 2008-04-10 | 한국전자통신연구원 | A Flexible Substrate Adhesion Method |
| JP4866210B2 (en) * | 2006-11-08 | 2012-02-01 | 信越化学工業株式会社 | Method for producing single crystal silicon solar cell |
| JPWO2009128359A1 (en) * | 2008-04-17 | 2011-08-04 | 旭硝子株式会社 | GLASS LAMINATE, PANEL FOR DISPLAY DEVICE WITH SUPPORT AND METHOD FOR PRODUCING THEM |
| KR101458901B1 (en) * | 2008-04-29 | 2014-11-10 | 삼성디스플레이 주식회사 | Method of manufacturing flexible display device |
| US9063605B2 (en) * | 2009-01-09 | 2015-06-23 | Apple Inc. | Thin glass processing using a carrier |
| TW201033000A (en) * | 2009-01-09 | 2010-09-16 | Asahi Glass Co Ltd | Glass laminate and manufacturing method therefor |
| JPWO2011024690A1 (en) * | 2009-08-27 | 2013-01-31 | 旭硝子株式会社 | Laminated structure of flexible substrate-support, panel for electronic device with support, and method for manufacturing panel for electronic device |
| JP5562597B2 (en) * | 2009-08-28 | 2014-07-30 | 荒川化学工業株式会社 | SUPPORT, GLASS SUBSTRATE LAMINATE, DISPLAY DEVICE PANEL WITH SUPPORT AND METHOD FOR PRODUCING DISPLAY DEVICE PANEL |
| JP5637140B2 (en) * | 2009-10-20 | 2014-12-10 | 旭硝子株式会社 | GLASS LAMINATE, PANEL FOR DISPLAY DEVICE WITH SUPPORT, PANEL FOR DISPLAY DEVICE, DISPLAY DEVICE, AND MANUFACTURING METHOD THEREOF |
| MY161592A (en) * | 2010-01-21 | 2017-04-28 | Denka Company Ltd | Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus |
| WO2012060199A1 (en) * | 2010-11-05 | 2012-05-10 | 旭硝子株式会社 | Laminate body, panel for use in display device with support board, panel for use in display device, and display device |
| JP6006569B2 (en) * | 2012-07-23 | 2016-10-12 | 東京応化工業株式会社 | Laminate and method for producing laminate |
-
2013
- 2013-08-12 JP JP2015528516A patent/JP6329540B2/en not_active Expired - Fee Related
- 2013-08-12 KR KR20157007086A patent/KR20150046219A/en not_active Application Discontinuation
- 2013-08-12 WO PCT/US2013/054479 patent/WO2014031374A1/en active Application Filing
- 2013-08-12 CN CN201380044389.3A patent/CN104919591A/en active Pending
- 2013-08-20 TW TW102129846A patent/TW201412554A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1816768A (en) * | 2003-07-03 | 2006-08-09 | 康宁股份有限公司 | Glass product for use in ultra-thin glass display applications |
| US20110192525A1 (en) * | 2008-10-23 | 2011-08-11 | Asahi Glass Company, Limited | Glass substrate laminated device and method for producing laminate glass substrate |
| WO2012056867A1 (en) * | 2010-10-29 | 2012-05-03 | 東京応化工業株式会社 | Stacked body and method for detaching stacked body |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019178746A1 (en) * | 2018-03-20 | 2019-09-26 | 深圳市柔宇科技有限公司 | Flexible component, electronic device, and separation method for flexible cover plate |
| CN112313790A (en) * | 2018-03-20 | 2021-02-02 | 深圳市柔宇科技股份有限公司 | Flexible member, electronic device, and method for peeling flexible cover |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015534528A (en) | 2015-12-03 |
| TW201412554A (en) | 2014-04-01 |
| WO2014031374A1 (en) | 2014-02-27 |
| JP6329540B2 (en) | 2018-05-23 |
| KR20150046219A (en) | 2015-04-29 |
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