CN104918417A - Method for producing organic solderability preservative on surface of circuit board - Google Patents
Method for producing organic solderability preservative on surface of circuit board Download PDFInfo
- Publication number
- CN104918417A CN104918417A CN201510249643.4A CN201510249643A CN104918417A CN 104918417 A CN104918417 A CN 104918417A CN 201510249643 A CN201510249643 A CN 201510249643A CN 104918417 A CN104918417 A CN 104918417A
- Authority
- CN
- China
- Prior art keywords
- cylinder
- wiring board
- oxidant
- organic
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
Abstract
The invention belongs to the circuit board production technical field and relates to a method for producing an organic solderability preservative on the surface of a circuit board. According to the method of the invention, sand blasting and board grinding procedures are omitted in a pretreatment process, and technological parameters of pickling and micro-etching are adjusted, and therefore, the problem of the smash of fine sands onto a board surface and the problem of high roughness and unevenness of a copper surface when a grinding brush is adopted to perform board grinding can be solved, and the roughness of the copper surface of the circuit board can be moderate and uniform, and the thickness of a formed organic film can be basically consistent with the thickness of etched copper; the circuit board is arranged in an antioxidant cylinder before the production of the organic film, a cylinder dragging plate is adopted to perform cylinder dragging processing at first, so that impurities in an antioxidant solution can be removed, and production parameters can be stabilized, and the concentration of Cu<2+> in the solution is controlled below 15ppm, and therefore, the organic film can be effectively prevented from blackening or color difference of the organic film can be effectively prevented, and yield can be improved; technological methods and parameters in various links are modified, and optimal parameter combinations can be explored, and therefore, the color of the organic film formed on the copper surface can be uniform.
Description
Technical field
The present invention relates to circuit board making technical field, particularly relate to and a kind ofly make in PCB surface the method that organic guarantor welds film.
Background technology
Wiring board is also known as circuit board or printed circuit board (PCB), and be called for short PCB (Printed Circuit Board), being one of vitals of electronics industry, is the carrier of the supporter of electronic devices and components, electrical connection.When producing wiring board, after plate face makes outer-layer circuit and solder mask, also need to carry out surface treatment to wiring board, for the protection of the copper face of wiring board, prevent copper face oxidized, ensure the excellent solderability of wiring board.Surface-treated type mainly contains heavy nickel gold, heavy silver, heavy tin, electronickelling gold, has plumbous spray tin, lead-free tin spray and organic guarantor to weld film (Organic Solder-ability Preservatives is called for short OSP) etc.It is that one meets " about being limited in electronic and electrical equipment the instruction using some harmful components " (Restriction of Hazardous Substances that organic guarantor welds film surface treatment, be called for short RoHS) process of surface treatment that requires, there is relative environmental protection and cheap advantage.It is exactly grow one deck organic film with the method for chemical reaction on the copper face of wiring board that organic guarantor welds film surface treatment, this organic film has anti-oxidation, heat shock resistance and moisture-proof, copper face can not be continued get rusty (oxidation or sulfuration etc.) in normal environment, and in follow-up welding high temperature, this organic film can be removed rapidly by scaling powder again, clean copper face is exposed and is combined with melting scolding tin within the extremely short time to form firmly solder joint.
At present, it is generally first by sandblasting nog plate that organic guarantor welds film surface-treated flow process, by clean for the copper face polishing on wiring board, then with sour clean plate face to remove the greasy dirt on wiring board, then made the copper face alligatoring on wiring board again by microetch process (microetch amount 2 μm); Then wiring board is placed in anti-oxidant cylinder again, the copper face on wiring board and the active component in Glicoat-SMD F2 is reacted, copper face is formed one deck organic film; Finally with water, wiring board is cleaned up and drying, complete organic guarantor and weld film surface treatment, the copper face of wiring board is formed the organic film that one deck can prevent copper oxidized.In prior art, pre-treatment adopts sandblasting nog plate, be equivalent to fine sand be pounded the plate face to wiring board, subsequently with polish-brush polishing plate face, if manipulate improper, be easy to damage copper face, larger on the roughness impact of copper face, and follow-uply not only can etch excessive copper again through overpickling and microetch, also be difficult to make copper face reach the effect of " even roughness "; Control the microetch amount of 2 μm, based on sandblasting nog plate above, microetch is too much, the inhomogeneities of roughness can be caused to increase, and the thickness that organic guarantor welds film is generally only about 1 μm, and being not enough to make up microetch, to fall the copper of 2 μm thick; It is more fragile that organic guarantor that prior art is formed welds film, compatible poor, and very easily occur face blackout or Jafani effect, organic guarantor welds film and occurs obvious aberration.
Summary of the invention
The present invention is directed to existing organic guarantor and weld the problem that face aberration, blackout very easily appear in film process for treating surface, provide a kind of and ensure that organic guarantor welds film surface color and makes the method that organic guarantor welds film uniformly.
For achieving the above object, the present invention by the following technical solutions.
Make in PCB surface the method that organic guarantor welds film, comprise the following steps:
S1 pickling: wiring board is moved in pickling cylinder, wash wiring board with acid solution.
Preferably, described acid solution is the H of 4-6wt%
2sO
4solution
S2 microetch: moved into by wiring board in microetch cylinder, carry out microetch process to wiring board, controlling microetch amount is 0.8-1.6 μm.
Preferably, the micro-corrosion liquid of microetch process contains the H of 1-2wt%
2o
2with the Cu of 3-25g/L
2+.
S3 prepares organic film: wiring board is placed in anti-oxidant cylinder, and the anti-oxidant liquid medicine in anti-oxidant cylinder and the copper face on wiring board react, and forms organic film.
Active component in described anti-oxidant liquid medicine is Glicoat-SMD F2.
Preferably, anti-oxidant cylinder, for the preparation of before organic film, first will drag cylinder plate to be placed in anti-oxidant cylinder and carry out dragging cylinder process, remove the impurity in anti-oxidant liquid medicine.Preferred, by dragging cylinder process, control Cu in anti-oxidant liquid medicine
2+concentration be less than or equal to 15ppm.
S4 washes wiring board clearly with water, then dry wiring board.
Compared with prior art, the invention has the beneficial effects as follows: the present invention by reducing sandblasting nog plate operation in pre-treatment link, adjust the technological parameter of pickling and microetch simultaneously, not only can exempt from fine sand and pound problem to causing copper face roughness excessive and uneven when plate face and polish-brush nog plate, the copper face roughness of wiring board also can be made moderate, even, and the thickness making the organic film of formation is basically identical with the thickness of the copper etched away; Wiring board is placed in before anti-oxidant cylinder makes organic film, first with dragging cylinder plate to carry out dragging cylinder process, removes the impurity in anti-oxidant liquid medicine, steady production parameter, controlling Cu in liquid medicine
2+concentration at below 15ppm, thus prevent organic film turn black or there is aberration, improve yields.The present invention is by improving process and the parameter of each link, and explore best parameter combinations, the color of the organic film that copper face is formed is even.
Accompanying drawing explanation
The schematic diagram of the front washing section that Fig. 1 is production line described in embodiment, preimpregnation section, anti-oxidant section and after washing section.
Embodiment
In order to more fully understand technology contents of the present invention, below in conjunction with specific embodiment, technical scheme of the present invention being described further and being illustrated.
Embodiment
The present embodiment provides a kind of and makes in PCB surface the method that organic guarantor welds film.Wherein, production line is disposed with pickling cylinder, No. 1 water washing cylinder, microetch cylinder, No. 2 water washing cylinders, No. 3 DI water (deionized water) water washing cylinders, high wind hair dryer, anti-oxidant cylinder, No. 4 water washing cylinders, No. 5 DI water water washing cylinders, automatical hot flue dryers, wiring board by connecting gear with the speed of 0.8-1.2m/min (preferred 1.0m/min) through above-mentioned each cylinder body, high wind hair dryer and automatical hot flue dryer.
Make in PCB surface the method that organic guarantor welds film, comprise the following steps:
(1) pickling
Wiring board is moved in pickling cylinder, under the condition of 25-35 DEG C, with acid solution with 1.5Kg/cm
2pressure wash wiring board, acid solution is the H of 5wt%
2sO
4solution.Wiring board, can the dirt in clear board face through the cleaning of overpickling cylinder, ensures that plate face is cleaned.
Wiring board enters in No. 1 water washing cylinder after overpickling cylinder, with water with 3.0Kg/cm
2pressure wash wiring board, wash away the H on wiring board
2sO
4.
In other embodiments, acid solution can also be the H of 4-6wt%
2sO
4solution, pressure when washing plate with acid solution can also be 1.0-2.0Kg/cm
2, washing pressure in No. 1 water washing cylinder can also be 2.0-4.0Kg/cm
2.
(2) microetch
Wiring board is moved in microetch cylinder, under the condition of 25-35 DEG C, with micro-corrosion liquid (containing the H of 1.5wt% in micro-corrosion liquid
2o
2with the Cu of 3-25g/L
2+) with 1.5kg/cm
2pressure microetch wiring board, and microetch amount to be controlled at 1.3 μm.
Wiring board, after microetch cylinder, enters in No. 2 water washing cylinders, with water with 3.0kg/cm
2pressure wash wiring board, wash away the micro-corrosion liquid on wiring board; And then enter in No. 3 DI water water washing cylinders, clean wiring board further with DI water, ensure that the micro-corrosion liquid on wiring board is totally capable of washing.
Moisture on wiring board after No. 3 DI water water washing cylinders, then through high wind hair dryer, is dried up by high wind hair dryer by wiring board.
In other embodiments, contained in micro-corrosion liquid H
2o
2can also be 1-2wt%, microetch amount can be controlled in 0.8-1.6 μm, can also be 0.7-2.7kg/cm with pressure during micro-corrosion liquid microetch wiring board
2, washing pressure in No. 2 water washing cylinders can also be 2.0-4.0Kg/cm
2.
(3) organic film is prepared
Anti-oxidant cylinder, for the preparation of before organic film, first will drag cylinder plate to be placed in anti-oxidant cylinder and carry out dragging cylinder process, and remove the impurity in anti-oxidant liquid medicine, and control Cu in anti-oxidant liquid medicine
2+concentration be less than or equal to 15ppm.(drag cylinder plate also known as false plate, itself and wiring board to be processed measure-alike, usually using light copper coin or the wiring board scrapped as dragging cylinder plate.Drag cylinder process to be exactly one or more dragged before cylinder plate is placed on wiring board to be processed, make to drag cylinder plate to be introduced into production line, play the effect removing impurity, steady production parameter and state in cylinder in advance.)
Wiring board is moved in anti-oxidant cylinder, under 36-42 DEG C and pH are the condition of 3.95, anti-oxidant liquid medicine (active component is Glicoat-SMD F2) in anti-oxidant cylinder reacts with the copper face on wiring board, forms organic film, and controlling leather film thickness is 0.25 μm.
In other embodiments, in anti-oxidant cylinder, the pH of liquid medicine also can be controlled between 3.8-4.1, and leather film thickness also can be controlled between 0.2-0.3 μm.
(4) cleaning, drying
Wiring board is after anti-oxidant cylinder process, and enter overflow washing in No. 4 water washing cylinders, washing pressure is 1.5Kg/cm
2, wash away the anti-oxidant liquid medicine on wiring board; And then enter in No. 5 DI water water washing cylinders, clean wiring board further with DI water, ensure that the anti-oxidant liquid medicine on wiring board is totally capable of washing.
Moisture on wiring board after No. 5 DI water water washing cylinders, then through automatical hot flue dryer, dries up with the hot blast of 75-85 DEG C by wiring board, completes and makes the surface treatment that organic guarantor welds film in the circuit board.The organic film color that copper face on wiring board is formed is even, occurs without blackout phenomenon.
In other embodiments, washing pressure in No. 4 water washing cylinders can also be 1.0-2.0Kg/cm
2.
Production line is made up of front washing section (comprising pickling cylinder and No. 1 water washing cylinder), preimpregnation section (comprising microetch cylinder, No. 2 water washing cylinders and No. 3 DI water water washing cylinders), high wind hair dryer, anti-oxidant section (comprising anti-oxidant cylinder) and after washing section (No. 4 water washing cylinders and No. 5 DI water water washing cylinders), automatical hot flue dryer, be equipped with in the cylinder body of each section and transmit row rumble and spray head, water suction row rumble (the capable rumble of water-absorbing sponge) and the capable rumble of setting-out are set outside each cylinder body.During work, the capable rumble of water-absorbing sponge is for absorbing the moisture in multi-layer sheet plate face, and the capable rumble of setting-out is used for pressure further and falls the moisture in multi-layer sheet plate face, and transmit row rumble for transmitting multi-layer sheet, spray head is used for shower water or liquid medicine, and cylinder body is used for the circulation of liquid medicine or water.Front washing section is mainly used in cleaning cleaner plate face, removes foreign material and spot; Preimpregnation section is mainly used in anti-oxidant front preliminary treatment, plays the effect of activation, alligatoring; Anti-oxidant section for completing the making of the anti-oxidant surface treatment of wiring board (organic guarantor welds film); After washing section is for completing the clean and protection in multi-layer sheet plate face after anti-oxidant surface treatment.As shown in Figure 1, in figure, 1a is front washing section to the schematic diagram of front washing section, preimpregnation section, anti-oxidant section and after washing section, and 1b is preimpregnation section, 1c is anti-oxidant section, and 1d is after washing section, and 2a is spray head, 2b is the capable rumble of setting-out, and 2c is the capable rumble of water-absorbing sponge, and 2d is for transmitting row rumble.
If production line is shut down more than 24 hours, when start is produced again, need first to maintain production line, maintenance project comprises following a-i item:
A, the capable rumble of absorbent sponge cleaned in anti-oxidant section of front and back and anti-oxidant cylinder, change with sponge for subsequent use;
B, capable for the setting-out before and after anti-oxidant cylinder rumble to be cleaned up;
Before transmitting the open cycle of row rumble in c, anti-oxidant cylinder, with 500mL glacial acetic acid spray, dissolving crystallized;
D, use 40-60 block thickness of slab for 1.8-2.5mm and light copper coin with holes carries out dragging cylinder process;
E, measure Cu in anti-oxidant cylinder
2+concentration and control Cu
2+concentration at below 15ppm;
F, carry out organic guarantor and weld the analysis of film thickness, controlling the thickness that organic guarantor welds film is 0.12-0.25 μm;
G, microetch amount control at 1.0-2.0 μm;
H, add anti-oxidant liquid medicine to anti-oxidant cylinder after, ON cycle more than 1 hour just can be done experiment plate;
I, shut down and need opening device in more than 4 hours, empty machine circulates more than 1 hour plate of just can doing experiment.
Production line stop more than 24 hours, if do not maintain before producing, production line impurity is more, fails to be transitioned into plateau, directly produce after setting parameter, very easily occurs producing abnormal problem, affects product quality.
The present embodiment by reducing sandblasting nog plate operation in pre-treatment link, adjust the technological parameter of pickling and microetch simultaneously, fine sand not only can be avoided to pound problem to causing copper face roughness excessive and uneven when plate face and polish-brush nog plate, the copper face roughness of wiring board also can be made moderate, even, and the thickness making the organic film of formation is basically identical with the thickness of the copper etched away; Wiring board is placed in before anti-oxidant cylinder makes organic film, first with dragging cylinder plate to carry out dragging cylinder process, removes the impurity in anti-oxidant liquid medicine, steady production parameter, controlling Cu in liquid medicine
2+concentration at below 15ppm, thus prevent organic film turn black or there is aberration, improve yields.
The present invention is by improving process and the parameter of each link, and explore best parameter combinations, the color of the organic film that copper face is formed is even.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by protection of the present invention.
Claims (6)
1. make in PCB surface the method that organic guarantor welds film, it is characterized in that, comprise the following steps:
S1 pickling: wiring board is moved in pickling cylinder, wash wiring board with acid solution;
S2 microetch: wiring board is moved in microetch cylinder, microetch process is carried out to wiring board, controlling microetch amount is 0.8-1.6 μm;
S3 prepares organic film: wiring board is placed in anti-oxidant cylinder, and the anti-oxidant liquid medicine in anti-oxidant cylinder and the copper face on wiring board react, and forms organic film;
S4 washes wiring board clearly with water, then dry wiring board.
2. a kind ofly according to claim 1 make in PCB surface the method that organic guarantor welds film, it is characterized in that, in step S1, described acid solution is the H of 4-6wt%
2sO
4solution.
3. a kind ofly according to claim 1 make in PCB surface the method that organic guarantor welds film, it is characterized in that, in step S2, the micro-corrosion liquid of microetch process is containing the H of 1-2wt%
2o
2with the Cu of 3-25g/L
2+.
4. a kind ofly according to claim 1 make in PCB surface the method that organic guarantor welds film, it is characterized in that, in step S3, the active component in described anti-oxidant liquid medicine is Glicoat-SMD F2.
5. a kind ofly according to claim 4 make in PCB surface the method that organic guarantor welds film, it is characterized in that, in step S3, anti-oxidant cylinder is for the preparation of before organic film, cylinder plate first will be dragged to be placed in anti-oxidant cylinder carry out dragging cylinder process, remove the impurity in anti-oxidant liquid medicine.
6. a kind ofly according to claim 5 make in PCB surface the method that organic guarantor welds film, it is characterized in that, in step S3, Cu in anti-oxidant liquid medicine
2+concentration be less than or equal to 15ppm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510249643.4A CN104918417A (en) | 2015-05-15 | 2015-05-15 | Method for producing organic solderability preservative on surface of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510249643.4A CN104918417A (en) | 2015-05-15 | 2015-05-15 | Method for producing organic solderability preservative on surface of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104918417A true CN104918417A (en) | 2015-09-16 |
Family
ID=54086986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510249643.4A Pending CN104918417A (en) | 2015-05-15 | 2015-05-15 | Method for producing organic solderability preservative on surface of circuit board |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106929852A (en) * | 2015-12-31 | 2017-07-07 | 苏州市吴通电子有限公司 | A kind of pcb board surface automatic film coating technique |
| CN107138462A (en) * | 2017-06-20 | 2017-09-08 | 河南国玺超纯新材料股份有限公司 | A kind of high-purity copper plates composite cleaning line |
| CN107509317A (en) * | 2017-08-02 | 2017-12-22 | 深圳市景旺电子股份有限公司 | A kind of PCB anti-welding processing methods and pcb board |
| CN108882546A (en) * | 2018-07-13 | 2018-11-23 | 常州澳弘电子有限公司 | A kind of processing technology of the wiring board with extra-strong corrosion resistant |
| CN109287075A (en) * | 2018-11-23 | 2019-01-29 | 开平依利安达电子有限公司 | A kind of anti-oxidation technique of pcb board copper face |
| CN110267456A (en) * | 2019-06-11 | 2019-09-20 | 昆山大洋电路板有限公司 | A kind of chemical pre-processing method for wiring board production internal layer |
| CN110881249A (en) * | 2019-10-21 | 2020-03-13 | 信丰福昌发电子有限公司 | FQC back-pass surface treatment method for double-sided circuit board |
| CN110913599A (en) * | 2019-10-21 | 2020-03-24 | 信丰福昌发电子有限公司 | Processing technology of stepped circuit board with gold-surface copper-plating mixed surface technology |
| CN110987773A (en) * | 2019-11-18 | 2020-04-10 | 大连崇达电子有限公司 | Micro-etching testing method of circuit board |
| CN112930040A (en) * | 2021-01-25 | 2021-06-08 | 肇庆市武大环境技术研究院 | Method for improving copper wire gap on surface of circuit board |
| CN114158189A (en) * | 2021-10-27 | 2022-03-08 | 深圳崇达多层线路板有限公司 | Manufacturing method for improving oil dropping of PAD edge of tin plate |
| CN114798654A (en) * | 2021-01-29 | 2022-07-29 | 深南电路股份有限公司 | Cylinder dragging plate and cleaning method thereof |
| CN115334768A (en) * | 2022-08-29 | 2022-11-11 | 深圳和美精艺半导体科技股份有限公司 | Packaging substrate processing method for improving OSP appearance quality |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106929852A (en) * | 2015-12-31 | 2017-07-07 | 苏州市吴通电子有限公司 | A kind of pcb board surface automatic film coating technique |
| CN107138462A (en) * | 2017-06-20 | 2017-09-08 | 河南国玺超纯新材料股份有限公司 | A kind of high-purity copper plates composite cleaning line |
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| CN107509317A (en) * | 2017-08-02 | 2017-12-22 | 深圳市景旺电子股份有限公司 | A kind of PCB anti-welding processing methods and pcb board |
| CN107509317B (en) * | 2017-08-02 | 2020-01-17 | 深圳市景旺电子股份有限公司 | PCB solder mask processing method and PCB |
| CN108882546B (en) * | 2018-07-13 | 2020-12-01 | 常州澳弘电子股份有限公司 | Processing technology of circuit board with super-strong corrosion resistance |
| CN108882546A (en) * | 2018-07-13 | 2018-11-23 | 常州澳弘电子有限公司 | A kind of processing technology of the wiring board with extra-strong corrosion resistant |
| CN109287075A (en) * | 2018-11-23 | 2019-01-29 | 开平依利安达电子有限公司 | A kind of anti-oxidation technique of pcb board copper face |
| CN110267456A (en) * | 2019-06-11 | 2019-09-20 | 昆山大洋电路板有限公司 | A kind of chemical pre-processing method for wiring board production internal layer |
| CN110913599A (en) * | 2019-10-21 | 2020-03-24 | 信丰福昌发电子有限公司 | Processing technology of stepped circuit board with gold-surface copper-plating mixed surface technology |
| CN110881249A (en) * | 2019-10-21 | 2020-03-13 | 信丰福昌发电子有限公司 | FQC back-pass surface treatment method for double-sided circuit board |
| CN110987773A (en) * | 2019-11-18 | 2020-04-10 | 大连崇达电子有限公司 | Micro-etching testing method of circuit board |
| CN112930040A (en) * | 2021-01-25 | 2021-06-08 | 肇庆市武大环境技术研究院 | Method for improving copper wire gap on surface of circuit board |
| CN112930040B (en) * | 2021-01-25 | 2022-07-29 | 肇庆市武大环境技术研究院 | Method for improving copper wire gap on surface of circuit board |
| CN114798654A (en) * | 2021-01-29 | 2022-07-29 | 深南电路股份有限公司 | Cylinder dragging plate and cleaning method thereof |
| CN114798654B (en) * | 2021-01-29 | 2023-09-22 | 深南电路股份有限公司 | Cylinder dragging plate and cleaning method thereof |
| CN114158189A (en) * | 2021-10-27 | 2022-03-08 | 深圳崇达多层线路板有限公司 | Manufacturing method for improving oil dropping of PAD edge of tin plate |
| CN115334768A (en) * | 2022-08-29 | 2022-11-11 | 深圳和美精艺半导体科技股份有限公司 | Packaging substrate processing method for improving OSP appearance quality |
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Application publication date: 20150916 |
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