CN104896983A - Manufacturing method of soaking plate with ultrathin foam silver as liquid absorbing core - Google Patents
Manufacturing method of soaking plate with ultrathin foam silver as liquid absorbing core Download PDFInfo
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- CN104896983A CN104896983A CN201410081954.XA CN201410081954A CN104896983A CN 104896983 A CN104896983 A CN 104896983A CN 201410081954 A CN201410081954 A CN 201410081954A CN 104896983 A CN104896983 A CN 104896983A
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Abstract
The invention discloses a manufacturing method of a soaking plate with ultrathin foam silver as a liquid absorbing core. Foam silver with different thicknesses and porosities and constructed in a classification manner is sintered on an upper cover plate and a lower baseplate made of corresponding pure copper plates (copper foils) with different thicknesses to manufacture the soaking plate by such processes as welding, vacuumizing, liquid injection and packaging. A middle steam cavity adopts cylindrical or block-shaped classified foam silver or copper with the thickness not smaller than 0.8 mm as a support column to guarantee quick flowing of a medium (working medium) after the gasification and quick reflowing after the phase change of accelerating the conversion from gas to liquid so as to accelerate the working medium phase change circulation. The ultrathin foam silver has excellent capillary suction, uniform hole structure distribution, high porosity and higher heat conductivity. The soaking plate with the ultrathin foam silver as the liquid absorbing core has the characteristics of high cooling efficiency, light weight and good reliability, is suitable for manufacturing an ultrathin structure, can satisfy the requirements of high heat conductivity and miniaturization needed by high-heat-flux electronic equipment, and is suitable for the heat management application of high-end equipment due to the price factor.
Description
Technical field
The present invention relates to the device of two dimension (plane) structure quick heat radiating in a kind of Electron Heat management equipment, i.e. soaking plate and method for making thereof, particularly a kind ofly adopt ultra-thin Foam silver to be the manufacture method of the soaking plate of liquid-sucking core.
Background technology
Along with the fast development of information technology, dissipation from electronic devices requires to improve constantly, and promotes the research and development of Electron Heat management device.Especially apply as the Hi-Tech equipments such as radar, laser, satellite, manned spacecraft are had higher requirement to heat radiation in national defence and Aero-Space Grand Equipments, traditional radiating mode utilizes fan forced convection to cool metal heat sink, and this mode can not meet the requirement of current control system as the high heat flux of chip and electronic equipment microminaturization far away.The application of hot pipe technique solves and utilizes one-dimentional structure feature to be derived fast by high heat flux and a difficult problem of dispelling the heat.And the operation principle of soaking plate (vapor chamber) is similar to heat pipe, difference is that adopting heat pipes for heat transfer is one dimension, and soaking plate heat transfer is two dimension, for heat pipe, concentrated heat from heat source can be delivered to larger area by soaking plate, and therefore the heat-transfer character of soaking plate is better.Soaking plate is as the heat pipe (so also claiming plane heat pipe) of two-dimension plane structure, and inside is in vacuum state and injects a certain amount of liquid working media.Inwall has wick structure, when soaking plate is heated, the working media rapid evaporation of its evaporating surface becomes steam, steam passes to cryosurface heat release fast by vapor chamber and condenses into liquid by gaseous state, liquid under capillary action by wick structure again quick backflow to the evaporating surface be heated, form phase to flow fast and the circulation of phase transformation, realize heat to spread out of fast and the effect of dispelling the heat from heating surface.
Its preparation process and heat pipe also basic simlarity, difference is only on soaking plate production and normally first vacuumizes the liquid phase medium that reinjects, to make liquid phase medium can fill up all micro-structurals of liquid-sucking core.The working medium of filling is except methyl alcohol, alcohol, acetone etc., and maximum under normal serviceability temperature utilize deionized water, because specific heat of water holds large, and environmental protection, and usefulness and the service life of soaking plate can be promoted further.The micro-structural of liquid-sucking core conventional in current soaking plate mainly contains two profiles state: copper powder sintering structure and braiding copper mesh structure.
The development trend of soaking plate needs heat radiation power higher, and size is thinner, no matter is copper powder sintering or braiding copper mesh sintering structure at present, still needs to improve constantly in constant product quality and heat radiation power two.Wish obtain higher heat radiation power Qmax and reduce thermal resistance further, this finds a kind of material be more suitable for meet products application and market demands with regard to needing.The ultra-thin Foam silver material of Jiangsu Ge Ye new material Science and Technology Ltd. exploitation is the metal that thermal conductivity is the highest due to silver, by being prepared into ultra-thin Foam silver, being a kind of liquid-sucking core material of superior, can meeting the requirement of above-mentioned performance and preparation.
Summary of the invention
According to the soaking plate structure feature of current copper liquid-sucking core material, adopt Foam silver can expand soaking plate liquid-sucking core material and kind, and improve soaking plate heat transfer efficiency and performance further.The present invention proposes a kind of preparation method of the soaking plate utilizing ultra-thin Foam silver to be liquid-sucking core, this ultra-thin Foam silver itself has excellent heat conductivility, it has excellent capillarity and structure as liquid-sucking core, can realize liquid medium rapid phase transition and circulation, and heat radiation power is high relative with product preparation temperature low and consistency of performance good.The ultra-thin Foam silver that the present invention proposes is the manufacture of liquid-sucking core soaking plate, this ultra-thin Foam silver is the hierarchy construction Foam silver that Jiangsu Ge Ye new material Science and Technology Ltd. produces, pore size scope is between 300 nanometers are to 1 millimeter, porosity can be selected within the scope of 40%-95% according to designing requirement, and material thickness can be chosen according to soaking plate designing requirement between 0.1-2 millimeter.
A kind of ultra-thin Foam silver of the present invention is the manufacture of liquid-sucking core soaking plate, and as shown in Figure 1, its aperture is hierarchy construction to the micro-structural of its ultra-thin Foam silver, and aperture varies, from nanometer more than 300 to hundreds of micron even 1 millimeter; Ultra-thin Foam silver be the structural representation of the soaking plate of liquid-sucking core as shown in Figure 2, the middle support column formwork structure of its vapor chamber as shown in Figure 3, support column can adopt Foam silver or the foam copper of desired thickness, and the key step that concrete ultra-thin Foam silver soaking plate manufactures is as follows:
(1) template processing and cleaning: according to designing requirement, employing material is copper coin or the Copper Foil of red copper (fine copper) desired thickness, is processed into upper cover plate and lower shoe according to designing requirement, and to its surface after processing through cleaning and drying and processing;
(2) processing of ultra-thin Foam silver and Foam silver or copper support column: by ultra-thin Foam silver according to upper cover plate and lower shoe inner-cavity structure Punching Technology, and the Foam silver of Punching Technology desired thickness or foam copper cylinder or block structure are as middle support column (thickness requires at least to be more than or equal to 0.8 millimeter according to usual vapor chamber), the quantity of this Foam silver or foam copper support column is according to soaking plate inner-cavity structure layout, and the diameter of support column may be selected to be Foam silver or the copper that 2-8 millimeter or block structure length and width are 2-8 millimeter;
(3) assembling between ultra-thin Foam silver and template: ultra-thin Foam silver is inserted in corresponding upper cover plate and lower shoe; Support column is placed in above base plate and ultra-thin Foam silver according to the Stainless Molding Board of location layout, Foam silver or foam copper support column are inserted the corresponding position of template; The ultra-thin Foam silver of Stainless Molding Board to lower shoe also plays certain pressure effect, ensures sinter bonded effect;
(4) high temperature reduction sintering processes: the maximum temperature that high temperature reduction is arranged is chosen between 700 DEG C-900 DEG C, the sintered heat insulating time was chosen in 2 hours at 30 minutes, and object realizes ultra-thin Foam silver and sintering diffusion bond between upper cover plate and lower shoe and between ultra-thin Foam silver and Foam silver or copper support column.The selection principle of actual temp and time can be determined according to ultra-thin Foam silver and bond strength required between cover plate and base plate, if need bond strength large, then and the relatively high length relative to temperature retention time of selective temperature;
(5) welding assembly: surrounding jointing edge, according to designing requirement, is carried out the welding of the copper silver solder under vacuum or protective atmosphere by upper cover plate and lower shoe except vacuum pumping liquid injection mouth;
(6) encapsulate: according to vacuum level requirements, carry out vacuumizing, fluid injection and encapsulation;
(7) performance test and inspection: the test and check carrying out the hot propertys such as heat radiation power Qmax and thermal resistance after encapsulation, guarantees that the Performance and quality of soaking plate meets the demands;
Soaking plate primary structure composition of the present invention comprises three parts, as shown in Figure 2:
1. hollow shell: it comprises upper cover plate and lower shoe that copper coin or Copper Foil that material is purple (pure) copper be processed into, the sealed chamber formed by copper silver brazing solder bond;
2. liquid-sucking core part: the structure with good capillary properties be made up of the ultra-thin Foam silver of levels and support column Foam silver or copper, its ultra-thin Foam silver and pillar Foam silver and copper are hierarchy construction, by sintering diffusion bond under high temperature reducing atmospheres together, wherein ultra-thin Foam silver liquid-sucking core and combine good between upper cover plate and lower shoe;
3. liquid medium: usually adopt deionized water, ether, ethanol (alcohol) and ammoniacal liquor etc., its addition is to be filled in the amount of the hole in capillary structure and support column arrangement for theoretical recommendation.
Therefore soaking plate inside of the present invention is by the combination between the Foam silver of three layers of hierarchy construction or copper, and upper cover plate and the combination between lower shoe inner surface and Foam silver are good diffusion bond.Because support column also uses Foam silver or the copper of capillary structure, after the conversion of medium vapour-liquid, the reflowing result of liquid phase is obvious, improves radiating effect.
Support column employing diameter is the cylinder of 2-8 millimeter, also can adopt and be of a size of 2-8 millimeter block structure, and according to suitable interval 8-15 millimeter, object plays the resultant effect supporting and reflux.
Accompanying drawing explanation
The micro-structural stereoscan photograph of the ultra-thin Foam silver of Fig. 1 hierarchy construction
The ultra-thin Foam silver of Fig. 2 is the soaking plate internal structure schematic diagram of liquid-sucking core
The formwork structure schematic diagram of the middle support column of Fig. 3 soaking plate
Fig. 4 column Foam silver support column, support column thickness 0.8 millimeter, soaking plate thickness is the structural representation of 2.4mm
Fig. 5 block structure Foam silver is support column, and soaking plate thickness is the structural representation of 3.6 mm
The Foam silver middle support column formwork structure schematic diagram of Fig. 6 example 2
detailed description of the invention:
example 1, thickness is the manufacture of the soaking plate of 2.4mm: upper cover plate and lower shoe all adopt thickness to be the copper plate of 0.6mm, be as shown in Figure 4 through compression molding, the chamber height formed is 1.2mm, and the upper red copper fluid injection capillary of welding, the thickness selecting Jiangsu Ge Ye new material Science and Technology Ltd. to produce is that the ultra-thin Foam silver of 0.2mm is after Punching Technology, diffusion way sinter bonded is passed through on surface respectively at upper cover plate and lower shoe, the thickness selecting Jiangsu Ge Ye new material Science and Technology Ltd. to produce again is the silver-colored cylinder (as shown in Figure 4) being made Φ 4mm by punching press of hierarchy construction porous of 0.8mm, be placed between upper cover plate and lower shoe by mode as shown in Figure 4, in the mode of vacuum copper silver brazing, heat resisting steel mould is adopted to compress upper cover plate and lower shoe, edge juncture is made to divide good face contact, in vacuum brazing furnace, upper cover plate and lower shoe are combined, and form the steam inner chamber that a height is 0.8mm.The thermal creep stress that soldering combines is 750 DEG C, and pressure is 5MPa, and keeps this temperature and pressure lower 1.5 hours.
example 2, thickness is the manufacture of the soaking plate of 3.6 mm: employing lower shoe thickness is the copper plate of 1 mm, upper cover plate thickness is the copper plate of 0.6mm is as shown in Figure 5 through compression molding, the steam chambers height formed is 2.0 mm, and the upper red copper liquid injection pipe of welding, the thickness selecting Jiangsu Ge Ye new material Science and Technology Ltd. to produce is that the Foam silver of 0.4 mm is respectively at upper, lower cover inner surface is sintered by diffusion way, the thickness selecting Jiangsu Ge Ye new material Science and Technology Ltd. to produce again is that the porous silver of 1.2 mm is rectangular by shearing 3 x 5 making 3x8mm, as shown in Figure 6, be placed in by mode as shown in Figure 6, between lower cover, in the mode of vacuum copper silver brazing, adopt graphite to make mould and compress upper and lower cover plates, by on this in vacuum brazing furnace, lower cover combines, and to form a height be 1.2 mm chambers.The thermal creep stress that soldering combines is 800 DEG C, and pressure is 5MPa, and keeps this temperature and pressure lower 1 hour.
After above-mentioned two examples complete, all carry out resistance to pressure and air tightness test by liquid injection pipe, all reach the Eligibility requirements of complete welded seal, then carry out that next step vacuumizes, fluid injection encapsulation, the inner evacuated vacuum (10 of soaking plate
-4to 10
-5torr).According to calculating and passing through to weigh by the appropriate deionized water of liquid injection pipe filling in soaking plate inner chamber, then involution, complete whole encapsulation preparation process, and carry out the quality testing of corresponding soaking plate hot property.
Claims (5)
1. a ultra-thin Foam silver is as the soaking plate manufacture method of liquid-sucking core, on the upper cover plate adopting the support column of the ultra-thin Foam silver of hierarchy construction different-thickness and porosity and Foam silver or foam copper sintering to make at purple (pure) copper copper coin or the Copper Foil of the different-thickness through design processing and lower shoe, then assembly welding, through vacuumizing, fluid injection, makes soaking plate after encapsulation.
2. a kind of ultra-thin Foam silver as claimed in claim 1 is the soaking plate manufacture method of liquid-sucking core, and its preparation process comprises:
(1) template processing and cleaning: according to designing requirement, needs through cleaning and dry process after the upper cover plate of fine copper and lower shoe processing;
(2) the support column processing of ultra-thin Foam silver and Foam silver or copper: by hierarchy construction Foam silver according to upper cover plate and lower shoe inner-cavity structure Punching Technology, and the hierarchy construction Foam silver of Punching Technology desired thickness or foam copper cylinder or block structure are as middle support column (thickness requires at least to be more than or equal to 0.8 millimeter according to usual vapor chamber), the quantity of this Foam silver or copper support column is according to soaking plate inner-cavity structure layout, the diameter of support column may be selected to be Foam silver or the copper of 2-8 millimeter, also the block structure being of a size of 2-8 millimeter can be selected as middle support column,
(3) assembling between ultra-thin Foam silver and template: ultra-thin Foam silver is placed in corresponding upper cover plate and lower shoe; And support column is placed in above base plate and Foam silver according to the Stainless Molding Board of its topology layout simultaneously, the support column of Foam silver or copper is inserted the corresponding position of template, wherein the ultra-thin Foam silver of Stainless Molding Board to lower shoe also plays certain pressure effect, ensures sinter bonded effect;
(4) high temperature reduction sintering processes: the maximum temperature that high temperature reduction is arranged is chosen between 700 DEG C-900 DEG C, the sintered heat insulating time was chosen in 2 hours at 30 minutes, object realizes ultra-thin Foam silver and combination between upper cover plate and lower shoe and between ultra-thin Foam silver and Foam silver or copper support column, the selection principle of actual temp and time can be determined according to required bond strength, required bond strength is large, then can the high length relative to the time of selective temperature;
(5) welding assembly: surrounding bound fraction, according to designing requirement, is carried out the welding of the copper silver solder under vacuum or protective atmosphere by upper cover plate and lower shoe except vacuum pumping liquid injection mouth;
(6) encapsulate: according to vacuum level requirements, carry out vacuumizing, fluid injection and encapsulation;
(7) performance test and inspection: the test and check carrying out the hot propertys such as heat radiation power Qmax and thermal resistance after encapsulation, guarantees reliability prepared by soaking plate and quality requirement.
3. the manufacture method of the soaking plate as liquid-sucking core of a kind of ultra-thin Foam silver as claimed in claim 1, this liquid-sucking core ultra-thin Foam silver used is the ultra-thin Foam silver of hierarchy construction, its support column adopts Foam silver or copper, and pore size scope is from 300 nanometers to 1000 microns (namely 1 millimeters); Porosity can be selected between 40-95% according to the designing requirement of soaking plate; Foam silver liquid-sucking core material thickness can need to select between 0.1 millimeter to 2 millimeters according to soaking plate design.
4. a kind of ultra-thin Foam silver as claimed in claim 1 is as the manufacture method of the soaking plate of liquid-sucking core, it is characterized in that the vapor chamber between the upper cover plate after ultra-thin Foam silver sintering and lower shoe generally adopts the columned of thickness >=0.8 millimeter or square hierarchy construction Foam silver or copper as support column, quantity and the size dimension of support column depend on size, and the interval between usual support column is roughly: 8-15 mm.
5. as the high temperature reduction sintering processes in claim 2 as described in (4), its reduction adopts hydrogen-nitrogen mixture gas, hydrogen: nitrogen ratio is (75%-10%): (25%-90%) (hydrogen: nitrogen is than the ratio for during 75%:25% being constituents), it is utilize nitrogen to adjust that the ratio of hydrogen reduces, and all meets the quality requirement of reduction sintering within the scope of above-mentioned hydrogen-nitrogen mixture gas.
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| CN201410081954.XA CN104896983B (en) | 2014-03-07 | 2014-03-07 | Manufacturing method of soaking plate with ultrathin foam silver as liquid absorbing core |
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| CN201410081954.XA CN104896983B (en) | 2014-03-07 | 2014-03-07 | Manufacturing method of soaking plate with ultrathin foam silver as liquid absorbing core |
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| CN104896983A true CN104896983A (en) | 2015-09-09 |
| CN104896983B CN104896983B (en) | 2017-04-26 |
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| CN107052612A (en) * | 2017-04-25 | 2017-08-18 | 哈尔滨工业大学深圳研究生院 | High-temp solder based on metallic tin filled and process silver and preparation method thereof |
| CN107068846A (en) * | 2017-03-29 | 2017-08-18 | 华南理工大学 | A kind of LED phase-change heats substrate and preparation method thereof |
| CN110267493A (en) * | 2019-06-12 | 2019-09-20 | 华南理工大学 | A kind of flexible ultra-thin liquid-sucking core and its manufacturing method with graded porous structure |
| CN110763061A (en) * | 2019-10-31 | 2020-02-07 | 东莞市合众导热科技有限公司 | Vapor chamber and processing method thereof |
| CN111174616A (en) * | 2020-03-12 | 2020-05-19 | 深圳威铂驰热技术有限公司 | Ultrathin uniform temperature plate structure and manufacturing process thereof |
| CN111683501A (en) * | 2020-06-10 | 2020-09-18 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
| CN112105219A (en) * | 2019-06-18 | 2020-12-18 | 讯凯国际股份有限公司 | Temperature equalizing plate and manufacturing method thereof |
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| WO2022025257A1 (en) * | 2020-07-31 | 2022-02-03 | 日本電産株式会社 | Heat conducting member |
| WO2022025256A1 (en) * | 2020-07-31 | 2022-02-03 | 日本電産株式会社 | Heat conduction member |
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| CN107068846A (en) * | 2017-03-29 | 2017-08-18 | 华南理工大学 | A kind of LED phase-change heats substrate and preparation method thereof |
| CN107052612A (en) * | 2017-04-25 | 2017-08-18 | 哈尔滨工业大学深圳研究生院 | High-temp solder based on metallic tin filled and process silver and preparation method thereof |
| CN110267493A (en) * | 2019-06-12 | 2019-09-20 | 华南理工大学 | A kind of flexible ultra-thin liquid-sucking core and its manufacturing method with graded porous structure |
| CN110267493B (en) * | 2019-06-12 | 2023-12-01 | 华南理工大学 | Flexible ultrathin liquid absorption core with hierarchical porous structure and manufacturing method thereof |
| CN112105219A (en) * | 2019-06-18 | 2020-12-18 | 讯凯国际股份有限公司 | Temperature equalizing plate and manufacturing method thereof |
| CN112105219B (en) * | 2019-06-18 | 2023-06-09 | 讯凯国际股份有限公司 | Temperature equalizing plate and manufacturing method thereof |
| CN110763061A (en) * | 2019-10-31 | 2020-02-07 | 东莞市合众导热科技有限公司 | Vapor chamber and processing method thereof |
| CN111174616A (en) * | 2020-03-12 | 2020-05-19 | 深圳威铂驰热技术有限公司 | Ultrathin uniform temperature plate structure and manufacturing process thereof |
| CN111683501A (en) * | 2020-06-10 | 2020-09-18 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
| WO2022025257A1 (en) * | 2020-07-31 | 2022-02-03 | 日本電産株式会社 | Heat conducting member |
| WO2022025256A1 (en) * | 2020-07-31 | 2022-02-03 | 日本電産株式会社 | Heat conduction member |
| WO2022025255A1 (en) * | 2020-07-31 | 2022-02-03 | 日本電産株式会社 | Heat conduction member |
| CN114061347A (en) * | 2021-10-18 | 2022-02-18 | 中天超容科技有限公司 | Foam metal liquid absorption core, preparation method thereof and vapor chamber |
| CN113991215A (en) * | 2021-10-28 | 2022-01-28 | 深圳市顺熵科技有限公司 | Power battery module, power battery pack and thermal management method thereof |
| WO2023070905A1 (en) * | 2021-10-28 | 2023-05-04 | 深圳市顺熵科技有限公司 | Power battery module, power battery pack thereof, and thermal management method therefor |
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