CN105307452B - A kind of heat sink material is the manufacturing method of the ultra-thin soaking plate of bottom plate - Google Patents
A kind of heat sink material is the manufacturing method of the ultra-thin soaking plate of bottom plate Download PDFInfo
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- CN105307452B CN105307452B CN201410308535.5A CN201410308535A CN105307452B CN 105307452 B CN105307452 B CN 105307452B CN 201410308535 A CN201410308535 A CN 201410308535A CN 105307452 B CN105307452 B CN 105307452B
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Abstract
The invention discloses one kind using ultra-thin foam copper as liquid-sucking core, and heat sink material such as molybdenum copper or tungsten-copper alloy are the method that bottom plate and oxygen-free copper cover board were connect and encapsulated that the techniques such as fluid injection manufacture ultra-thin soaking plate by high temperature sintering, copper silver or silver soldering.The method achieve by high-thermal-conductivity low-expansibility heat sink material such as molybdenum copper or tungsten-copper alloy and conventional being made into one of soaking plate, it is 0.3 millimeter to 2.0 millimeters ultra-thin soaking plate that thickness, which is made, it is directly used in that thyristor, IGBT, IGCT etc. be high-power or chip cooling of power electronic devices, ensure the matched coefficients of thermal expansion of the electronic components and heat sink material base material such as chip, it realizes efficient, quick conductive and heat dissipation characteristics, reduce thermal resistance and improves the reliability of system.This method is easily manufactured, and equipment is simple, and production process is pollution-free, is suitble to bulk industrial production.Soaking plate structure obtained is as thin as 0.3 millimeter or so of flexible structure, meets that samming, thermal resistance be small, cooling requirements quickly and efficiently.
Description
Technical field
It is that its bottom plate uses heat sink material the present invention relates to a kind of manufacturing method of soaking plate, one of the characteristics of the soaking plate
It is integrated with soaking plate to realize heat sink material for such as molybdenum copper or tungsten-copper alloy；Feature second is that using ultra-thin foam copper, together
When the internal structure of the soaking plate layout such as position and structure of vapor chamber are resided in the same layer structure of liquid-sucking core, prepare ultra-thin knot
The soaking plate of structure.
Background technology
Heat management is directly related to the stability and reliability of semi-conductor electronic device and Grand Equipments work, combines at present
Device cooling requirements carry out the design of soaking plate, manufacture and application and are gradually paid attention to because soaking plate has extension thermal resistance it is low,
The advantages that uniform heat flux, heat quickly spread, are light-weight and noiseless, can realize to semi-conductor electronic device and equipment
The effective thermal control of running temperature.
Soaking plate (Vapor Chamber) is the high vacuum cavity that an inner wall has microstructure, structure such as Fig. 1 institutes
Show be by liquid-sucking core, copper post, upper and lower cover plates capillary structure material and upper and lower copper cover board through being sintered and welding（Diffusion Welding or
Copper silver soldering connects）Be combined into, then by vacuumizing, the processes such as fluid injection and encapsulation are made.In application, when heat is by the chip of semiconductor
Heat source to soaking plate evaporating area when, liquid phase can takes place in condition of high vacuum degree environment in the liquid phase medium inside cavity
Gasification absorbs thermal energy and rapid spatial expansion, and is gradually full of entire vapor chamber, the medium of gas phase quickly through vapor chamber,
Just condensation phenomenon occurs when being transmitted to a colder region, releases latent heat of phase change by solution-air transformation, the liquid phase after condensation
Medium can by micro-structure on inner wall capillary phenomenon again quick backflow to heat source evaporation ends, this process will in the cavity week and
Recycle progress with renewing, here it is the courses of work of soaking plate.Since the micro-structure of liquid-sucking core in soaking plate has very strong hair
Thin power, liquid medium are adsorbed on by capillary phenomenon in liquid-sucking core, are not influenced by gravity when soaking plate works, and also referred to as it is anti-
It is non-directional in gravity characteristic and application process.The efficient quick radiating efficiency and power of soaking plate, uniform heat flux,
The advantages that noiseless, is increasingly taken seriously and is constantly researched and developed.Further, since semi-conductor electronic device is especially
Portable electronic device constantly develops to small-sized, beautiful, efficient direction, and soaking plate is equally constantly ultra-thin, efficiently and high reliability
Direction develop.
It is the internal structure chart of conventional soaking plate shown in Fig. 1, soaking plate is usually made of five-layer structure and lower plate+hair
Thin core material+vapor chamber+capillary core material+upper cover plate, the thickness of wherein vapor chamber, which is commonly designed, to be needed to be not less than 0.8 mm, is added
The thickness of the thickness of upper a variety of materials, such soaking plate is generally higher than 3 millimeters for now.How soaking plate thickness is realized
The continuous reduction with weight is further decreased, the requirement new to designing and preparing all continuous proposition, the present invention is out of soaking plate
The method that portion's liquid-sucking core material and structure propose solution.
It is the heat sources such as chip and the regular connection process of soaking plate shown in Fig. 2, heat source such as chip usually passes through heat conduction first
Glue etc. and heat sink material realize MULTILAYER COMPOSITE using mount technology, then heat sink material again by heat-conducting glue or welding method with
Hot plate and its corresponding heat radiation module combine, and practical structures are formed by five layers：Heat source（Such as chip）The composite layers such as+heat-conducting glue（It adopts
Use mount technology）+ heat sink material+heat-conducting glue（Or welding layer）+ soaking plate and its module.It can be seen that reducing thermal resistance
It is a vital demand of the cooling heat sources such as chip.Because increasing articulamentum, structure change, dimensioning are also resulted in
The increase of very little and weight, the relative reduction reliability of device.Because as soon as more layers connect, what more once possible contacts were failed can
It can property.Therefore the method that the present invention also proposes solution in terms of the material of soaking plate and structure two.
Invention content
At present semiconductor chip be especially such as thyristor, IGBT, IGCT device for high-power power electronic chip because of
The thermal stress generated to temperature change is very sensitive, need to usually design, this heat sink material integrated in conjunction with mount technology and heat sink material
Material needs have good heat conductivility, and coefficient of thermal expansion and corresponding chip are close, when varying with temperature in this way, generation
Thermal stress is small, it is ensured that its trouble free service and reliability.As soon as if using heat sink material as the face of soaking plate, at least reduce
The thermal resistance that two layers of integrated technique generates, when the thermal resistance of heat sink material itself, second is that the welding that heat sink material is connect with soaking plate
The thermal resistance of layer or heat-conducting glue.Heat sink material can thus be reduced and soaking plate and its corresponding is connected to by welding or heat-conducting glue
Module on two processes, reach heat conduction rapidly and efficiently and heat dissipation purpose.In order to meet cooling requirements, reducing thermal resistance and carry
The reliability that high chip and heat radiation module combine, it is proposed that the present invention sets about in terms of the preparation material of soaking plate, i.e., will be heat sink
Material thus at least reduces two layers of thermal resistance as a face for making soaking plate, when the thermal resistance of heat sink material itself, two
It is the thermal resistance of welding layer or heat-conducting glue that heat sink material is connect with soaking plate.
I.e. according to design requirement, use upper cover plate for anaerobic fine copper the sheathing material of ultra-thin soaking plate, lower plate uses
Molybdenum-copper or tungsten-copper alloy replace conventionally used anaerobic fine copper.Because molybdenum-copper and tungsten-copper alloy have good physics
Performance, such as high thermal conductivity, heat resistance and low coefficient of thermal expansion requirement, it may have good mechanical property is for example high-elastic
Property modulus, can meet the heat sink application of powerful integrated circuit and microwave device.Use the heat sink ultra-thin sheet material as soaking plate
A face, so that it may realize heat sink material and the integration of conventional soaking plate, substantially reduce the thermal resistance of entire heat radiation module, raising can
By property.Another side then selects ultra-thin no-oxygen copper plate, convenient for the connection between cooling fin.
The second is setting about from the internal structure of soaking plate, usual soaking plate Inner Constitution is used by five-layer structure, the present invention
The ultra-thin foam copper of Jiangsu Ge Ye new materials Science and Technology Ltd. production is as liquid-sucking core.The liquid-sucking core porosity can be in 40-95%
Selection in range, aperture structure is hierarchy construction, and magnitude range is within the scope of hundreds of nanometers to hundreds of microns, thickness >=0.1
Millimeter, the material itself have good capillary properties.Internal structure can be adjusted, make three-decker into, i.e., upper cover plate and
Lower plate, in addition the intermediate ultra-thin foam copper of hierarchy construction.Wherein intermediate vapor chamber can reside in liquid-sucking core by design
In same layer structure.I.e. according to the heat source positions such as chip and design feature, to the ultra-thin foam copper progress for soaking plate liquid-sucking core
Structure design meets the space requirement of required vapor chamber.Ultra-thin foam copper is punched out by corresponding mold after design, it can
To be processed into variously-shaped or structure according to design requirement, petal and M shape as shown in Figure 3, i.e. its corresponding heat source steam
Hair area and vapor chamber are realized by the structure design of ultra-thin foam copper.
The soaking plate is a kind of by ultra-thin foam copper and ultra-thin molybdenum copper or tungsten-copper alloy pass through structure design, high temperature is burnt
The techniques such as knot, welding and encapsulation fluid injection are fabricated, and realize the ultra-thin soaking plate that heat sink material and soaking plate are integrated,
Heat dissipation is integrated needed for component thermal resistance can be substantially reduced, meet semiconductor electronic component heat conduction rapidly and efficiently and heat dissipation need
It asks.In addition the soaking plate also changes the topology layout inside conventional soaking plate, the size of the evaporating area in conjunction with residing for heat source, position
And quantity, ultra-thin foam steel structure is designed, and the position and structure of vapor chamber are resided in the same layer structure of liquid-sucking core,
Ensure the superthin structure of soaking plate.
Description of the drawings
The structural schematic diagram of Fig. 1 routine soaking plates, i.e. lower plate+capillary core material+vapor chamber+capillary core material+upper cover
Plate
The schematic diagram that the heat sources such as Fig. 2 chips are combined with conventional heat sink material and soaking plate
The formwork structure design diagram of ultra-thin foam copper in the ultra-thin soaking plates of Fig. 3
The structural schematic diagram that the ultra-thin foam coppers of Fig. 4 are liquid-sucking core, heat sink material is the ultra-thin soaking plate of lower plate
The ultra-thin foam copper that Fig. 5 sizes are 80*80*0.6 mm is the structural schematic diagram of the ultra-thin soaking plate of liquid-sucking core
Specific example
Example one, size are the manufacture of the ultra-thin soaking plate of square structure molybdenum copper of 80*80*0.6 mm
It is bottom to prepare the molybdenum copper that the square structure that size is 80*80*0.6 mm has both heat sink material and soaking plate is integrated
The ultra-thin soaking plate of plate, is as follows：
（1）The design of soaking plate and the preparation of component materials：Bottom plate molybdenum-copper plate size is 80*80mm, thickness 0.2
Mm, upper cover plate are fine copper, are 0.2 mm, for size after appropriate deformation, deformation depth is 0.2 mm, and size is 80*80 mm.It is super
The thickness of thin foam copper is 0.22 mm, porosity 82%.Because ultra-thin foam copper is easily deformed, through appropriate pressure, it will can be changed
Shape to 0.20 mm, at this time porosity be about 80.2%, it is therefore an objective to the lower plate of the upper cover plate and molybdenum copper that ensure copper can come into full contact with
And weld together；
（2）The preparation of soaking plate liquid-sucking core：It is 0.22 mm that liquid-sucking core, which uses ultra-thin foam copper, thickness, and porosity is
82%, the intermediate position of soaking plate is located at according to the position of chip, size is 20*20 mm, and the structure of liquid-sucking core is designed to
" M shape ", in detail as shown in Figure 5, stamped mold Punching Technology is at required formwork structure；
（3）Cleaning and combination：By after processing upper cover plate oxygen-free copper plank and lower plate molybdenum-copper plate it is cleaned, dry
Afterwards, with the ultra-thin foam copper form assembly after punching, in its edge surrounding（It is pure including the reserved capillary for vacuum pumping liquid injection
Copper pipe）Uniform coated copper silver solder, it is ensured that the effect and quality of welding；
（4）High temperature sintering and welding：Above-mentioned ready soaking plate sub-assembly is placed in graphite jig, the graphite jig
It is to use outer exacerbation in being sintered and weld under follow-up 800 DEG C of high-temperature hydrogen reduction atmosphere for ensuring that the soaking plate of preparation is smooth
Power, soaking time are 30 minutes, realize good sinter bonded and welding effect between soaking plate sub-assembly；
(5) leak detection test：It needs to carry out leak detection test to surrounding welding quality after welding, it is ensured that surrounding welding is good；
(6) vacuumize, fluid injection, encapsulation and secondary degasification and solder up：After leak detection, the capillary of soaking plate is fixed
It is vacuumizing, on the fixture of fluid injection and encapsulation, is being vacuumized, fluid injection and encapsulation；Vacuum degree is 10-30Pa, after encapsulation
Soaking plate is suitably heated, and achievees the purpose that secondary degasification, then carries out welding and sealing to encapsulation port, it is ensured that solder up
Quality；
（7）Aging and thermal performance test：Ultra-thin soaking plate aging test temperature is set to 200 DEG C, is protected at 200 DEG C through 6 hours
Temperature completes burn-in test；After burn-in test, the hot property for carrying out soaking plate measures, and mainly tests Qmax, the temperature difference and thermal resistance, surveys
The manufacture of entire soaking plate is completed after fixed；
（8）Preservative treatment：Ultra-thin soaking plate carries out the surface anticorrosion processing of electronickelling.
Specific implementation mode
It is a kind of by ultra-thin foam copper and ultra-thin molybdenum copper or tungsten-copper alloy pass through structure design, high temperature sintering, welding, encapsulation
The implementation and specific steps for the ultra-thin soaking plate that heat sink material made of the techniques such as fluid injection and conventional soaking plate are integrated
It is as follows, it is divided to two aspects：First, the selection and design of the upper cover plate and lower plate of soaking plate；Second is that soaking plate inside liquid-sucking core and its
The design of structure, as shown in Figure 4.
First, the selection and design of soaking plate upper cover plate and lower plate：
（1）Upper cover plate, generally use anaerobic fine copper, through a small amount of punching press deformation, deformation quantity is the thickness of added foam copper；
（2）Lower plate generally uses ultra-thin heat sink material plate using heat sink material such as molybdenum-copper or tungsten-copper alloy
Material.
Second is that liquid-sucking core and its structure design inside soaking plate：
Liquid-sucking core inside soaking plate will be designed according to the heat source positions such as chip, quantity and size, through punching
It is processed into the ultra-thin foam copper template of single layer, wherein intermediate vapor chamber can be resided in by design in the same layer structure of liquid-sucking core.
Using the ultra-thin foam copper of Jiangsu Ge Ye new materials Science and Technology Ltd. production as liquid-sucking core.The liquid-sucking core porosity can be
It is selected within the scope of 40-95%, aperture structure is hierarchy construction, and magnitude range is within the scope of hundreds of nanometers to hundreds of microns, thickness
>=0.1 millimeter, the material itself has good capillary properties.
Specific embodiment is as follows：
（1）The design of soaking plate：Usual soaking plate is designed according to the size specific requirement of the heat sources such as chip.Cause
This is required according to the quantity, size and heat radiation power of chip, provides the structure and size of soaking plate；
（2）The preparation of soaking plate component materials：According to the structure and size of soaking plate, prepare corresponding soaking plate manufacture
Each component：Ultra-thin foam copper, molybdenum copper or tungsten-copper alloy plank, oxygen-free copper（Fine copper）Plank；
（3）The preparation of soaking plate modular construction：By upper cover plate oxygen-free copper plank according to the structure of soaking plate, carry out a small amount of
Punch process, deformation quantity are equal to the thickness of slightly below ultra-thin foam copper；
（4）The preparation of soaking plate liquid-sucking core：Ultra-thin foam copper as liquid-sucking core will be according to soaking plate design requirement, through mould
Has Punching Technology into required formwork structure.
（5）Cleaning：By after processing upper cover plate oxygen-free copper plank and lower plate molybdenum copper or tungsten-copper alloy plate it is cleaned, dry
It is spare afterwards；
（6）Combination：According to the design requirement of soaking plate, by lower plate molybdenum copper or tungsten-copper alloy plate, ultra-thin foam copper template,
After the combination of oxygen-free copper upper cover plate, in its edge surrounding（Including the reserved capillary pure copper tube for vacuum pumping liquid injection）Uniformly apply
Cover copper silver or silver solder, it is ensured that the quality of subsequent high temperature welding；
（7）It is placed in graphite jig：Above-mentioned ready soaking plate sub-assembly is placed in graphite jig, which is
For ensuring that the soaking plate prepared is smooth, gravity or external force can be used in subsequent high temperature is sintered and is welded, realizes soaking plate
Good combination between sub-assembly and welding effect；
（8）High temperature sintering and welding：Carried out under high-temperature vacuum or hydrogen reduction atmosphere ultra-thin foam copper and upper cover plate and under
High temperature sintering between bottom plate and upper cover plate and the copper silver on lower plate periphery or the welding of silver solder, wherein heating temperature is 780-
810 DEG C, soaking time is 10 points to 60 minutes；
(9) leak detection test：It needs to carry out leak detection test after welding, it is ensured that surrounding welding quality；
(10) it vacuumizes, fluid injection encapsulation：After leak detection, the capillary of soaking plate is fixed on vacuumize, fluid injection and encapsulation
It on fixture, is vacuumized, fluid injection and encapsulation；
（11）Secondary degasification and solder up：Soaking plate after above-mentioned encapsulation is subjected to secondary degasification, is then welded
Sealing, it is ensured that the quality of solder up；
（12）Burn-in test：The case where according to soaking plate liquid-sucking core, determines that aging test temperature and time, typical temperature are set
It is set to 180 DEG C or 200 DEG C, the burn-in test through a few hours to 24 hours；
（13）Thermal performance test：After burn-in test, carry out soaking plate hot property measure, mainly Qmax, the temperature difference and
The measurement of thermal resistance completes the manufacture of entire soaking plate after measurement.
（14）Preservative treatment：Usual soaking plate also needs to carry out the surface anticorrosion processing of electronickelling or chromium etc..
Claims (6)
1. a kind of manufacturing method of ultra-thin soaking plate, which is characterized in that using ultra-thin foam copper as liquid-sucking core, heat sink material is bottom plate
It connects and encapsulates fluid injection by high temperature sintering, copper silver or silver soldering with anaerobic fine copper cover board and form ultra-thin soaking plate, the ultra-thin soaking
Plate is three-decker, and the three-decker includes：Upper cover plate, lower plate and the ultra-thin foam copper of the hierarchy construction of centre, described point
It is petal or M shape that grade, which constructs ultra-thin foam copper,.
2. a kind of manufacturing method of ultra-thin soaking plate as described in claim 1, which is characterized in that the method achieve lead height
The molybdenum-copper of hot low bulk or the heat sink material of tungsten-copper alloy plank and conventional being made into one of soaking plate, can be made ultra-thin
Structure soaking plate.
3. a kind of manufacturing method of ultra-thin soaking plate as described in claim 1, which is characterized in that the structure of its ultra-thin foam copper
For hierarchy construction, there are good capillary properties, porosity can be selected between 40-95%, pore size is in 300nm to 300-
In 500 micron ranges, thickness >=0.1 millimeter.
4. a kind of manufacturing method of ultra-thin soaking plate as described in claim 1, which is characterized in that ultra-thin foam copper is as imbibition
Core, and the combination of anaerobic fine copper upper cover plate and heat sink material lower plate use the sintering knot under high-temperature vacuum or hydrogen reduction atmosphere
It closes, temperature range may be selected at 700-1000 DEG C.
5. a kind of manufacturing method of ultra-thin soaking plate as described in claim 1, which is characterized in that its lower plate heat sink material and
Using copper silver or the welding temperature of silver-colored series solder between upper cover plate oxygen-free copper, may be selected at 700-1000 DEG C, soaking time exists
10 minutes to 60 minutes.
6. a kind of manufacturing method of ultra-thin soaking plate as described in claim 1, which is characterized in that the thickness of heat sink material can be adopted
>=0.1 millimeter, thickness >=0.15 millimeter of oxygen-free copper cover board can be used with the thickness of >=0.05 millimeter, ultra-thin foam copper, in conjunction with
Above-mentioned parameter can according to ultra-thin foam copper thickness, the upper cover plate thickness of copper and molybdenum-copper or the determination of tungsten-copper alloy plate thickness
Manufactured soaking plate most thin thickness is 0.3 millimeter, increases separately the thickness of heat sink material, foam copper and oxygen-free copper cover board, is made
Soaking plate, thickness can thickness to 2.0 millimeters.
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| CN107068846A (en) * | 2017-03-29 | 2017-08-18 | 华南理工大学 | A kind of LED phase-change heats substrate and preparation method thereof |
| CN106979712B (en) * | 2017-04-01 | 2023-05-23 | 华南理工大学 | Preparation method of flexible soft copper/aluminum strip heat pipe with ordered array distribution of multiple bundles of fibers |
| CN107401941B (en) * | 2017-08-28 | 2023-09-26 | 华南理工大学 | Ultrathin soaking plate structure |
| CN107543440B (en) * | 2017-09-09 | 2019-07-23 | 中微冷却技术（深圳）有限公司 | The manufacturing method and temperature-uniforming plate of temperature-uniforming plate |
| CN107809055A (en) * | 2017-12-14 | 2018-03-16 | 长春理工大学 | A kind of high-power semiconductor laser chip welding and assembling method |
| CN109297328A (en) * | 2018-07-20 | 2019-02-01 | 昆山长运电子工业有限公司 | The manufacturing method of irregular temperature-uniforming plate |
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| US20060196640A1 (en) * | 2004-12-01 | 2006-09-07 | Convergence Technologies Limited | Vapor chamber with boiling-enhanced multi-wick structure |
| CN200966197Y (en) * | 2006-05-12 | 2007-10-24 | 迈萪科技股份有限公司 | A soaking plate with the composite miniature structure |
| CN102051498A (en) * | 2009-11-04 | 2011-05-11 | 江苏鼎启科技有限公司 | Tungsten and molybdenum copper alloy heat sink material and preparation method |
| CN101848629B (en) * | 2010-03-31 | 2012-02-15 | 华南理工大学 | Soaking plate of foam metal and copper powder compounded capillary structure |
| US20130032312A1 (en) * | 2011-08-04 | 2013-02-07 | Ching-Chung Wang | Vapor chamber capillary formation method and structure thereof |
| CN102956583B (en) * | 2011-08-29 | 2015-08-19 | 奇鋐科技股份有限公司 | Equalizing plate structure and manufacture method thereof |
| CN103687455B (en) * | 2013-12-31 | 2016-06-01 | 上海交通大学 | A kind of vapor chamber |
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