CN104754918A - Electronic control unit and electric power steering apparatus having the same - Google Patents
Electronic control unit and electric power steering apparatus having the same Download PDFInfo
- Publication number
- CN104754918A CN104754918A CN201410820355.5A CN201410820355A CN104754918A CN 104754918 A CN104754918 A CN 104754918A CN 201410820355 A CN201410820355 A CN 201410820355A CN 104754918 A CN104754918 A CN 104754918A
- Authority
- CN
- China
- Prior art keywords
- control unit
- electronic control
- heater members
- plate
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62D—MOTOR VEHICLES; TRAILERS
- B62D5/00—Power-assisted or power-driven steering
- B62D5/04—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear
- B62D5/0403—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by constructional features, e.g. common housing for motor and gear box
- B62D5/0406—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by constructional features, e.g. common housing for motor and gear box including housing for electronic control unit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Transportation (AREA)
- Mechanical Engineering (AREA)
- Power Steering Mechanism (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Inverter Devices (AREA)
Abstract
Provided are an electronic control unit and an electric power steering apparatus having the same. In an electronic control unit, high-heat-generating devices (20,21,22,23,24,25,30,31,32,33,41,42,51,411,412,421,422) are mounted on a first surface (11) or a second surface (12) of a board (10), a heat-dissipating member (70) is located facing the first surface of the board, and a heat-conducting member (80,81,82) is located between the board and the heat-dissipating member. The heat-conducting member is in contact with the high-heat-generating devices to transfer heat of the high-heat-generating devices to the heat-dissipating member. A ratio of the number of the high-heat-generating devices mounted on the board to the number of the high-heat-generating devices arranged inside a first limited region (T1) of the first surface or a second limited region (T2) of the second surface is greater than a predetermined ratio. The second limited region is located at a position corresponding to the first limited region.
Description
Technical field
Present disclosure relates to the electronic control unit for controlling control objectives and has the electric power-assisted steering apparatus of this electronic control unit.
Background technology
The electronic control unit of---such as switching device, relay, coil and capacitor---is known circuit board to be provided with high heater members.High heater members operationally produces a large amount of heat.Such as, in the JP-A-2012-59759 corresponding to US 2012/0057318A1, switching device, relay, coil, capacitor and shunt resistor are installed in the one side relative with radiating component of circuit board.
In electronic control unit disclosed in JP-A-2012-59759, heat conduction member is positioned in radiating component and is provided with switching device, between shunt resistor and the subregion of capacitor.Therefore, the heat of switching device, shunt resistor and capacitor is not also sent to radiating component by circuit board by means of only heat conduction member.As a result, the heat of switching device, shunt resistor and capacitor may not operatively dissipate.
Relay and coil are installed on the region that separates with the region being provided with switching device, shunt resistor and capacitor, and relay and coil are oriented to away from radiating component.That is, JP-A-2012-59759 does not consider the dissipation of heat making relay and coil.Therefore, electronic control unit may because of relay and coil heating and heating.
Especially, disclosed in JP-A-2012-59759 electronic control unit is used to the motor of the electric power-assisted steering apparatus controlling vehicle.When drive the motor of electric power-assisted steering apparatus and produce help driver to make the assist torque of Vehicular turn time, big current flows through the high heater members of motor and electronic control unit.Therefore, when drive motor, high heater members produces a large amount of heat.For this reason, when using electronic control unit to control the motor of electric power-assisted steering apparatus, the heat of the high heater members of electronic control unit preferentially should be made effectively to dissipate.
Summary of the invention
In view of the foregoing, the object of present disclosure is to provide a kind of miniature electric control unit making the heat produced in high heater members dissipate efficiently wherein, and provides a kind of electric power-assisted steering apparatus with this electronic control unit.
According to an aspect of present disclosure, electronic control unit comprises plate, high heater members, controller, radiating component and heat conduction member.This plate has first surface and the second surface relative with this first surface.On the first surface that high heater members is installed in plate or second surface, and produce the heat being greater than predetermined calorific value when electronic control unit works.Controller is controlled control objectives by least one control in high heater members.Radiating component is oriented to the first surface in the face of plate.Heat conduction member is positioned between plate and radiating component, and with high heater members, heat conduction member contacts that the heat of high heater members is passed to radiating component.The ratio installing the number of the high heater members within the sum of high heater members onboard and the second restricted area of the first restricted area or second surface that are arranged in first surface is greater than estimated rate.Second restricted area is positioned in the position corresponding with the first restricted area.
Accompanying drawing explanation
According to the detailed description made referring to accompanying drawing, the above object of present disclosure, feature and advantage and other objects, feature and advantage will become obvious.In the accompanying drawings:
Fig. 1 is the figure of the top plan view of the electronic control unit of the first execution mode illustrated according to present disclosure;
Fig. 2 is the figure of the flat sheet of the bottom view of the electronic control unit of the first execution mode illustrated according to present disclosure;
Fig. 3 is the figure of the sectional view obtained along the line III-III in Fig. 1;
Fig. 4 illustrates the figure used according to the structure of the electric power-assisted steering apparatus of the electronic control unit of the first execution mode of present disclosure;
Fig. 5 is the figure of the circuit structure of the electronic control unit of the first execution mode illustrated according to present disclosure;
Fig. 6 is the figure of the top plan view of the electronic control unit of the second execution mode illustrated according to present disclosure;
Fig. 7 is the figure of the flat sheet of the bottom view of the electronic control unit of the second execution mode illustrated according to present disclosure; And
Fig. 8 is the figure that the sectional view obtained along the VIII-VIII in Fig. 6 is shown.
Embodiment
The execution mode of present disclosure is described referring to wherein similar reference numerals instruction accompanying drawing that is identical or equivalent elements.For simplicity, Reference numeral can be distributed to only in the identical or equivalent elements in accompanying drawing.
(the first execution mode)
The electronic control unit 1 of the first execution mode is according to the present embodiment described referring to Fig. 1 to Fig. 4.As shown in Figure 4, electronic control unit (ECU) 1 is used in the electric power-assisted steering apparatus 100 of vehicle.Electronic control unit 1 drives based on turning to dtc signal and vehicle velocity signal and controls motor 101, makes motor 101 can produce the assist torque helping driver to make Vehicular turn.Motor 101 is corresponding with the control objectives described in claim.
Electronic control unit 1 comprise circuit board 10, switching device 20, capacitor 30, relay 41 and 42, coil 51, shunt resistor 52, power Zener diode 53, controller 60, as the radiator 70 of radiating component and heat conduction member 80.
Circuit board 10 is printed circuit board (PCB), the FR4 be such as made up of glass fabric and epoxy resin (fire retardant type 4).Plate 10 is substantial rectangular.
Switching device 20 is semiconductor device, such as mos field effect transistor (MOSFET) and igbt (IGBT).Such as, as shown in Figures 2 and 3, switching device 20 is similar to rectangular flat, and the mode that switching device 20 is parallel to first surface 11 with its surface direction is arranged on the first surface 11 of plate 10.According to the first execution mode, plate 10 is provided with four switching devices 20.Hereinafter, four derailing switches 20 are collectively referred to as " switching device 20 " sometimes, and are sometimes also hereinafter referred to as " switching device 21,22,23 and 24 ".
Such as, as shown in figures 1 and 3, capacitor 30 is aluminium electrolytic capacitor and is similar to cylinder.Electric capacity 30 is arranged on the second surface 12 relative with first surface 11 of plate 10 in the mode of its axle perpendicular to second surface 12.According to the first execution mode, plate 10 is provided with three capacitors 30.Hereinafter, three capacitors 30 are collectively referred to as " capacitor 30 " sometimes, and are sometimes also called separately " capacitor 31,32 and 33 ".
Such as, as shown in figures 1 and 3, relay 41 and 42 is mechanical switch and is similar to rectangular column.Relay 41 and 42 is arranged on the second surface 12 of plate 10 in the mode of its short transverse perpendicular to second surface 12.
Such as, as shown in figures 1 and 3, coil 51 is choke and has the external shape as rectangular column.Coil 51 is arranged on the second surface 12 of plate 10 in the mode of its short transverse perpendicular to second surface 12.
Such as, as shown in Figure 2, shunt resistor 52 is similar to rectangular flat, and the mode that shunt resistor 52 is parallel to first surface 11 with its surface direction is arranged on the first surface 11 of plate 10.
Such as, as shown in Figure 2, power Zener diode 53 is similar to rectangular flat and has the volume being greater than predetermined value.Power Zener diode 53 is arranged on the first surface 11 of plate 10 near switching device 21 and 23 in the mode of its surface direction perpendicular to first surface 11.
Switching device 21 to 24, shunt resistor 52 and power Zener diode 53 are collectively arranged within the first restricted area T1 of the first surface 11 of plate 10.First restricted area T1 is the region surrounded by the long dotted line chain-dotted line in Fig. 2.On the contrary, capacitor 31 to 33, relay 41 and 42 and coil 51 are collectively arranged within the second restricted area T2 of the second surface 12 of plate 10.Second restricted area T2 is the region surrounded by the long dotted line double dot dash line in Fig. 1.Second restricted area T2 is positioned in the position corresponding with the first restricted area T1.Especially, the second restricted area T2 is on the thickness direction of plate 10---namely in the direction that the first surface 11 with plate 10 is vertical with second surface 12---and overlapping with the first restricted area T1.According to the first execution mode, as depicted in figs. 1 and 2, to be oriented to cross over plate 10 directly relative with switching device 23 and 24 and power Zener diode 53 for capacitor 32 and 33.
Such as, controller 60 comprises microcomputer 61 and customer designed IC (IC) 62.Such as, microcomputer 61 and each customization in IC 62 are the semiconductor packages with CPU (CPU), read-only memory (ROM), random access memory (RAM) and input and output (I/O) part.Controller 60 control relay 41 and 42 and switching device 21 to 24.Controller 60 is by controlling to drive and control motor 101 to switching device 21 to 24 based on the signal from the transducer that vehicle is installed.According to the first execution mode, motor 101 has brush DC motor.
As shown in Figure 1, microcomputer 61 is arranged on the second surface 12 of plate 10.According to the first execution mode, microcomputer 61 is disposed in outside the second restricted area T2 of second surface 12.On the contrary, as shown in Figure 2, customize IC 62 to be arranged on the first surface 11 of plate 10.According to the first execution mode, customization IC 62 is disposed in outside the first restricted area T1 of first surface 11.
Next, with reference to Fig. 5, the electrical connection between switching device 21 to 24, capacitor 31 to 33, relay 41 and 42, coil 51, shunt resistor 52, power Zener diode 53 and controller 60 is described.
Positive terminal as the battery 102 of the power supply of vehicle is connected to relay 41.Relay 41 is switched to by controller 60 and switches on and off, and makes it possible to allow or stop to provide electric power from battery 102 to electronic control unit 1.Therefore, relay 41 is used as power supply relay.
Electric power from battery 102 is supplied to switching device 21 to 24 by coil 51.The noise of the electric power provided to motor 101 by electronic control unit 1 since battery 102 eliminated by coil 51.
The priming supply 106 of vehicle is connected to controller 60 and the node between relay 41 and coil 51.Controller 60---i.e. microcomputer 61 and customization IC 62---operates the electric power from priming supply 106.
As shown in Figure 5, switching device 21 and 23 is connected in series, and switching device 22 and 24 is connected in series.The series circuit of switching device 21 and 23 series circuit and switching device 22 and 24 is connected in parallel.
Relay 42 and motor 101 are connected between the node between node between switching device 21 and 23 and switching device 22 and 24.In this way, connecting valve device 21 to 24 is to form H-bridge circuit.Shunt resistor 52 is connected to the ground side terminal of switching device 23 and 24.Capacitor 30 (31 to 33) is connected in parallel between power line and earth connection.Capacitor 30 is reduced in the surge voltage occurred when switching device 21 to 24 is switched to conducting or turns off.
According to above-mentioned electrical connection, such as, when when switching device 21 and 24 is conducting, switching device 22 and 23 turns off, electric current flows through switching device 21, relay 42, motor 101 and switching device 24 successively.On the contrary, when switching device 21 and 24 shutoff when switching device 22 and 23 conducting, electric current sequentially passes through switching device 22, motor 101, relay 42 and switching device 23 with above-mentioned.Because motor 101 is for there being brush DC motor, so when the switching device 21 to 24 of H-bridge circuit is switched to turn-on and turn-off in the above described manner, drive motor 101 also makes motor 101 rotate.The holding wire carrying out the customization IC 62 of self-controller 60 is connected to switching device 21 to 24 individually, makes controller 60 can the switching of control switch device 21 to 24.Therefore, controller 60 is driven by the switching of control switch device 21 to 24 and controls motor 101.Because controller 60 carrys out control switch device 21 to 24 based on the electric current detected by shunt resistor 52, so controller 60 can accurately control switch device 21 to 24, and amplification is come and is controlled motor 101.
Relay 42 is switched to by controller 60 and switches on and off, and makes it possible to allow or stop to provide electric power from battery 102 to motor 101.Therefore, relay 42 is used as motor relay.
During the switching of switching device 20, relatively large electric current flows through switching device 20, capacitor 30, relay 41 and 42, coil 51 and shunt resistor 52.Therefore, when electronic control unit 1 works, switching device 20, capacitor 30, relay 41 and 42, coil 51 and shunt resistor 52 produce the heat being greater than predetermined value, and its temperature becomes relatively high.Each in switching device 20, capacitor 30, relay 41 and 42, coil 51 and shunt resistor 52 is all corresponding with the high heater members described in claim.
One end of power Zener diode 53 is connected to priming supply 106, controller 60 and the node between relay 41 and coil 51.The other end of power Zener diode 53 is connected to ground.
Be not more than predetermined threshold under normal circumstances from priming supply 106 to the electric power that electronic control unit 1 provides wherein, power Zener diode 53 prevents electric current from flowing to ground by it from priming supply 106.On the contrary, when being greater than threshold value from priming supply 106 to the electric power that electronic control unit 1 provides, power Zener diode 53 allows electric current to flow to ground by it from priming supply 106.Therefore, power Zener diode 53 prevents big current from flowing to electronic control unit 1 (particularly controller 60) from priming supply 106, thus protection electronic control unit 1.
As mentioned above, under normal circumstances, power Zener diode 53 does not make electric current pass through.That is, when the work of electronic control unit 1, power Zener diode 53 does not produce the heat being greater than predetermined value.Power Zener diode 53 is corresponding with the low heater members described in claim.
Power Zener diode 53 to be disposed near switching device 20 and to be used as thermal mass/capacity component.Therefore, during the switching of switching device 20, a part for the heat of switching device 20 is sent to power Zener diode 53, and the temperature of power Zener diode 53 correspondingly increases.
According to the first execution mode, switching device 20, capacitor 30, relay 41 and 42, coil 51, shunt resistor 52 and power Zener diode 53 are alleged surface mounted device (SMD).
Radiator 70 is made up of metal such as aluminium.Such as, as shown in figures 1 and 3, radiator 70 is similar to rectangular flat, and has each other relative first surface 71 and second surface 72.Radiator 70 is arranged on plate 10 in the mode of first surface 71 towards the first surface 11 of plate 10.
Electronic control unit 1 also has securing member 2.Such as, securing member 2 is made up of metal such as aluminium.According to the first execution mode, securing member 2 is screw.Plate 10 has the placement hole 13 in pre-position along the thickness direction take-through plate 10 of plate 10.Screw hole is formed in the first surface 71 of radiator 70.Securing member 2 is inserted by the placement hole 13 of plate 10 and is screwed into the screw hole of radiator 70, makes securing member 2 be engaged to radiator 70.Therefore, plate 10 and radiator 70 may be fixed to one another with the mode of the spaced apart preset distance of first surface 71 of radiator 70 with the first surface 11 of plate 10.
Such as, heat conduction member 80 comprises fin 81 and the Heat sink grease 82 of electric insulation.Such as, fin 81 is containing silicon and has the electrical insulation sheet of low thermal resistance.Such as, Heat sink grease 82 is the grease gel mainly containing silicon and have low thermal resistance.
Heat conduction member 80 is positioned between the first surface 11 of plate 10 and the first surface 71 of radiator 70, and contacts with switching device 20, shunt resistor 52, power Zener diode 53 and radiator 70.Therefore, heat conduction member 80 by the heat trnasfer of switching device 20, shunt resistor 52 and power Zener diode 53 to radiator 70.It is to be noted, heat conduction member 80 is positioned within the first restricted area T1.
In addition, as shown in Figure 3, heat conduction member 80 contacts with the first surface 11 of plate 10 and the first surface 71 of radiator 70.Therefore, heat conduction member 80 is sent to the heat trnasfer of plate 10 to radiator 70 by from switching device 20, shunt resistor 52, power Zener diode 53, capacitor 30, relay 41 and 42 and coil 51.
According to first execution mode, multiple heat conduction member 80 is arranged on the position corresponding with switching device 20, shunt resistor 52, power Zener diode 53, capacitor 30, relay 41 and 42 and coil 51, and described multiple heat conduction member 80 is integrated as a heat conduction member 80.For this reason, in the drawings, heat conduction member 80 obviously looks like a heat conduction member 80.
Switching device 20 is equal to or less than predetermined altitude value h1 apart from the height of the first surface 11 of plate 10.Similarly, shunt resistor 52 and power Zener diode 53 are equal to or less than predetermined altitude value h1 apart from the height of the first surface 11 of plate 10.Therefore, the first surface 11 of plate 10 can be oriented to as far as possible near the first surface 71 of radiator 70.
On the contrary, coil 51 is equal to or greater than predetermined altitude value h2 apart from the height of the second surface 12 of plate 10.Similarly, the height of the second surface 12 of capacitor 30 and relay 41,42 distance plate 10 is equal to or greater than predetermined altitude value h2.
In radiator 70, first surface 71 is partly recessed to second surface 72, makes it possible to form groove 73.Groove 73 is positioned in outside the first restricted area T1.Controller 60 is positioned in the position corresponding with groove 73.
As shown in Figures 2 and 3, electronic control unit 1 also comprises lid 4.Lid 4 is arranged on the side relative with radiator 70 of plate 10.Such as cover 4 made by metal such as aluminium and be similar to box.Cover second surface 12 side of 4 overlays 10, and the outward flange covering 4 is connected to the outward flange of radiator 70.Because second surface 12 side of plate 10 is coated with lid 4, so capacitor 30, relay 41 and 42, coil 51 and the microcomputer 61 be arranged on the second surface 12 of plate 10 can from impacts such as external force, water, dusts.In addition, because first surface 11 side of plate 10 is coated with radiator 70, so switching device 20, shunt resistor 52, power Zener diode 53 and the customization IC 62 be arranged on the first surface 11 of plate 10 can from impacts such as external force, water, dusts.
Electronic control unit 1 also comprises connector 3.As shown in Figure 1, connector 3 is arranged on the outward flange of plate 10 and is exposed to outside lid 4.Such as, connector 3 has the rectangular tubular housing be formed from a resin and the multiple terminals comprising PIG terminal (i.e. power supply terminal or side of the positive electrode terminal), earth terminal and Terminal of motor arranged in the housing.As shown in Figure 4, connector 3 is connected to wire harness 103.The positive terminal of battery 102 is connected to the PIG terminal of connector 3 by the line 104 of wire harness (harness) 103.Although not shown in the drawings, PIG connecting terminals is connected to the side of the positive electrode terminal of relay 41.The line 105 of wire harness 103 is by the Terminal of motor of the winding terminals of motor 101 electrical connection connector 3.
Next, the work of electronic control unit 1 is described.
When the driver of vehicle connects the ignition switch of vehicle, provide electric power and active electron control unit 1 from priming supply 106 to electronic control unit 1.When active electron control unit 1, controller 60 engage relay 41 and 42.Therefore, allow to provide electric power from battery 102 to motor 101.
In turn-on time of ignition switch during section, controller 60 is by based on turning to dtc signal and the switching of vehicle speed signal to switching device 20 to control to drive and control motor 101.Therefore, motor 101 produces the assist torque helping driver to make Vehicular turn.
When controller 60 is controlled motor 101 by the switching of control switch device 20, relatively large electric current flows through switching device 20, capacitor 30, relay 41 and 42, coil 51 and shunt resistor 52.Therefore, switching device 20, capacitor 30, relay 41 and 42, coil 51 and shunt resistor 52 produce heat, and its temperature becomes relatively high.
The heat of switching device 20, shunt resistor 52 and power Zener diode 53 is passed to radiator 70 by heat conduction member 80.
In addition, the heat of the capacitor 30 except switching device 20, shunt resistor 52 and power Zener diode 53, relay 41 and 42 and coil 51 is passed to radiator 70 by plate 10 and the heat conduction member 80 that contacts with plate 10 and radiator 70.
Therefore, when electronic control unit 1 works, the heat of switching device 20, shunt resistor 52, power Zener diode 53, capacitor 30, relay 41 and 42 and coil 51 is efficiently transferred to radiator 70.
In sum, the first execution mode can have following characteristics (1) to (11).
(1) be defined as on first surface 11 that the switching device 20 of high heater members, capacitor 30, relay 41 and 42, coil 51 and shunt resistor 52 be arranged on plate 10 or second surface 12, and produce the heat being greater than predetermined value when electronic control unit 1 works.Controller 60 controls motor 101 by control switch device 20.
Radiator 70 is arranged on plate 10 in the face of the mode of the first surface 11 of plate 10 with its first surface 71.Heat conduction member 80 to be positioned between plate 10 with radiator 70 and with at least switching device 20, shunt resistor 52 and radiator 70 contact.Therefore, the heat of switching device 20 and shunt resistor 52 is passed to radiator 70 by heat conduction member 80.
Switching device 20 and shunt resistor 52 are disposed within the first restricted area T1 of the first surface 11 of plate 10.On the contrary, capacitor 30, relay 41 and 42 and coil 51 are disposed within the second restricted area T2 of the second surface 12 of plate 10.Second restricted area T2 is positioned in the position corresponding with the first restricted area T1.Therefore, all high heater members be arranged on plate 10 is collectively arranged within the first restricted area T1 or the second restricted area T2.In other words, the number being arranged on all high heater members on plate 10 is equal to or greater than predetermined value with the ratio of the number of the high heater members be disposed within the first restricted area T1 or the second restricted area T2.In such method, switching device 20, shunt resistor 52, capacitor 30, relay 41 can be passed to radiator 70 by identical thermally conductive pathways (i.e. heat conduction member 80) efficiently with the heat of 42 and coil 51.
In addition, because all high heater members are collectively arranged within the first restricted area T1 or the second restricted area T2, so high heater members can with high-density installation on plate 10.Therefore, the size of plate 10 can be reduced, and the size of electronic control unit 1 can be reduced relatively.
In addition, because the switching device 20 in high heater members and shunt resistor 52 are arranged on the first surface 11 of plate 10, then switching device 20 and shunt resistor 52 are oriented to the first surface 71 near radiator 70, and the heat of switching device 20 and shunt resistor 52 can be dissipated efficiently to radiator 70.
In addition, capacitor 30 in high heater members, relay 41 and 42 and coil 51 are arranged on the second surface 12 of plate 10, and are disposed within following second restricted area T2: this second restricted area T2 is positioned in the position corresponding with the first restricted area T1 being furnished with switching device 20 and shunt resistor 52.Therefore, compare when being disposed in outside the second restricted area T2 with 42 and coil 51 with capacitor 30, relay 41, the heat that can reduce capacitor 30, relay 41 and 42 and coil 51 dissipates to the length of the heat dissipation path of radiator 70 via plate 10 and heat conduction member 80.Therefore, the heat of the capacitor 30, relay 41 and 42 and the coil 51 that are arranged on the second surface 12 of plate 10 can be made to dissipate efficiently.
(2) heat conduction member 80 contacts with plate 10 and radiator 70.Therefore, the heat of switching device 20, shunt resistor 52, capacitor 30, relay 41 and 42 and coil 51 can be delivered to radiator 70 efficiently by plate 10 and heat conduction member 80.
(3) multiple heat conduction member 80 is arranged on the position corresponding with switching device 20, shunt resistor 52, capacitor 30, relay 41 and 42 and coil 51.Therefore, the heat of switching device 20, shunt resistor 52, capacitor 30, relay 41 and 42 and coil 51 can be passed to radiator 70 by corresponding heat conduction member 80.
(4) heat conduction member 80 is integrated as a heat conduction member 80, and obviously looks like a heat conduction member 80.Therefore, heat conduction member 80 can easily adhere to or be applied between plate 10 and radiator 70.
Because all high heater members be arranged on plate 10 is collectively arranged within the first restricted area T1 or the second restricted area T2, so heat conduction member 80 can be integrated as mentioned above as a heat conduction member 80.That is, do not need to arrange separately heat conduction member 80 in the position corresponding with switching device 20, shunt resistor 52, capacitor 30, relay 41 and 42 and coil 51.
(5) controller 60 is disposed in outside the first restricted area T1 of the first surface 11 of plate 10 and the second restricted area T2 of second surface 12.Therefore, the transmission of heat to controller 60 of the high heater members be disposed within the first restricted area T1 or the second restricted area T2 can be reduced.Therefore, can prevent due to the heat of high heater members and cause controller 60 fault.
(6) switching device 20 in the high heater members within the first restricted area T1 being disposed in the first surface 11 of plate 10 and shunt resistor 52 are equal to or less than predetermined altitude value h1 apart from the height of first surface 11.Therefore, the first surface 11 of plate 10 can be oriented to as far as possible near the first surface 71 of radiator 70.Therefore, the heat of switching device 20, shunt resistor 52, capacitor 30, relay 41 and 42 and coil 51 can be passed to radiator 70 efficiently by plate 10.
(7) switching device 20 and shunt resistor 52 are similar to flat board, make switching device 20 can be parallel with the first surface 11 of plate 10 with the surface direction of shunt resistor 52.Therefore, switching device 20 and shunt resistor 52 apart from the height of the first surface 11 of plate 10 can be produced little as much as possible, and switching device 20 and shunt resistor 52 in the face of the area of radiator 70 can be produced large as much as possible.Therefore, the heat of switching device 20 and shunt resistor 52 can be passed to radiator 70 more effectively.
(8) switching device 20, capacitor 30, relay 41 and 42, coil 51 and shunt resistor 52 are produce the concrete example being greater than the high heater members of the heat of predetermined calorific value when electronic control unit 1 works.
(9) electronic control unit 1 also comprises the power Zener diode 53 with the volume being greater than predetermined value.Power Zener diode 53 is arranged near switching device 20 on plate 10, and produces the heat being not more than predetermined calorific value.Power Zener diode 53 is used as thermal mass/capacity component, and a part for the heat of switching device 20 is sent to power Zener diode 53.Therefore, the heat of switching device 20 is passed to radiator 70 by power Zener diode 53 and heat conduction member 80.
(10) power Zener diode 53 is as bent down the concrete example of heater members: this low heater members has the volume that is greater than predetermined value and produces the heat being not more than predetermined calorific value when electronic control unit 1 works.
(11) electric power-assisted steering apparatus 100 comprises electronic control unit 1 and motor 101.Motor 101 is controlled by electronic control unit 1, makes motor 101 can produce the assist torque helping driver to make Vehicular turn.
Make to produce a large amount of heat in electric power-assisted steering apparatus 100 because big current flows in electric power-assisted steering apparatus 100, and electric power-assisted steering apparatus 100 needs enough little of to be installed in the confined space of vehicle.Due to its small size and high cooling efficiency, electronic control unit 1 goes for electric power-assisted steering apparatus 100.
The electronic control unit 1 of the second execution mode according to present disclosure is described referring to Fig. 6 to Fig. 8.Second execution mode is different from the first execution mode to be in relay 41 and 42.
According to the second execution mode, relay 41 comprises switching device 411 and 412.As switching device 20, each in switching device 411 and 412 is semiconductor device, such as MOSFET and IGBT.Such as, as shown in Figure 7 and Figure 8, switching device 411 with 412 shape as rectangular flat, and within the first restricted area T1 being arranged on the first surface 11 of plate 10 in the mode that its surface direction can be parallel with first surface 11.
Relay 41 (that is, switching device 411 and 412) is switched to by controller 60 and switches on and off, and makes it possible to allow or stop to provide electric power from battery 102 to electronic control unit 1.
Relay 42 comprises switching device 421 and 422.The same with 412 as switching device 411, each in switching device 421 and 422 is semiconductor device, such as MOSFET and IGBT.Such as, as shown in Figure 7 and Figure 8, switching device 421 and 422 is similar to rectangular flat, and within the first restricted area T1 being arranged on the first surface 11 of plate 10 in the mode that its surface direction can be parallel with first surface 11.Relay 41 and 42 is oriented to close to each other.
Relay 42 (that is, switching device 421 and 422) is switched to by controller 60 and switches on and off, and makes it possible to allow or stop to provide electric power from battery 102 to electronic control unit 1.
As mentioned above, relay 41 and 42 is semiconductor switch, and unlike in the first embodiment, they are mechanical switch.
In addition, relay 41 and 42 is arranged within the first restricted area T1 of the first surface 11 of plate 10, unlike in the first embodiment, within the second restricted area T2 that they are arranged on the second surface 12 of plate 10.
As shown in Figure 8, switching device 411,412,421 and 422 is equal to or less than predetermined altitude value h1 apart from the height of the first surface 11 of plate 10.Coil 51 and capacitor 30 are equal to or greater than predetermined altitude value h2 apart from the height of the second surface 12 of plate 10.
As shown in Figure 7, according to the second execution mode, power Zener diode 53 is arranged within the first restricted area T1 of the first surface 11 of plate 10, and is positioned near relay 41 and 42.
As mentioned above, according to the second execution mode, relay 41 is constructed by tabular semiconductor switch device 411 and 412 and forms, and relay 42 is formed by tabular semiconductor switch device 421 and 422 structure.Relay 41 and 42 is arranged on the first surface 11 of plate 10.Therefore, compared with the electronic control unit 1 in the first execution mode, height and the size of electronic control unit 1 can be reduced.In addition, because relay 41 and 42 is arranged on the first surface 11 of plate 10, relay 41 and 42 is oriented to, near radiator 70, make the heat of relay 41 and 42 can effectively be delivered to radiator 70 by heat conduction member 80.
In addition, the power Zener diode 53 owing to being used as thermal mass/capacity component is installed near relay 41 and 42, so a part for the heat of relay 41 and 42 is passed to power Zener diode 53.Therefore, the heat of relay 41 and 42 can be passed to radiator 70 by power Zener diode 53 and heat conduction member 80.
(amendment)
Although describe present disclosure with reference to execution mode, it being understood that present disclosure is not limited to described execution mode.Present disclosure is intended to cover and is in various amendment in the spirit and scope of present disclosure and equivalent arrangements.Such as, described execution mode can be revised as follows.
In this embodiment, switching device 20 and shunt resistor 52 are arranged on the first surface 11 of plate 10, and capacitor 30, relay 41 and 42 and coil 51 are arranged on the second surface 12 of plate 10.But which in high heater members is arranged on the first surface 11 of plate 10 or second surface 12 and is not limited to described execution mode.Such as, switching device 20 can be arranged on first surface 11 instead of on second surface 12.
In embodiments, all high heater members be arranged on plate 10 is intensively arranged within the first restricted area T1 or the second restricted area T2.In other words, the number being arranged on all high heater members on plate 10 is 1 with the ratio of the number of the high heater members be arranged within the first restricted area T1 or the second restricted area T2.But some in high heater members can be disposed in outside the first restricted area T1 and the second restricted area T2, make this ratio be not less than predetermined value.
In this embodiment, motor 101 is brush motor and is driven by the H bridgt circuit be made up of four switching devices 21 to 24.Alternatively, motor 101 can be brushless motor and be driven by the inverter controlled by controller 60.Inverter is constructed by the Switch Controller of number identical with the number of phases of brushless motor and forms.Each Switch Controller has hot side switching device and low potential side switching device.Such as, when motor 101 is three-phase brushless motor, inverter can be formed by---i.e. six switching devices---structure by three Switch Controller.In this case, motor 101 can be configured to have two inverters (that is, altogether 12 switching devices) connected in redundant configuration mode.In such method, even if an inverter breaks down, motor 101 also can be driven by another inverter.That is, no matter the number of switching device (that is, high heater members) is how, no matter and also motor 101 be brush motor or brushless motor, can present disclosure be applied.
In this embodiment, heat conduction member 80 contacts with both plate 10 and radiator 70.But, always heat conduction member 80 not necessarily contacts with plate 10, as long as heat conduction member 80 contacts with high heater members and radiator 70.
In this embodiment, multiple heat conduction member 80 is integrated into a heat conduction member 80.Alternatively, each in heat conduction member 80 can be individually supplied to corresponding high heater members.Alternatively, heat conduction member 80 can divide in groups, and the heat conduction member 80 belonging to identical group can be integrated into a heat conduction member 80.All high heater members are not necessarily always provided with heat conduction member 80.
In this embodiment, heat conduction member 80 comprises both fin 81 and Heat sink grease 82.Alternatively, heat conduction member 80 can to comprise in fin 81 and Heat sink grease 82 only one.
In this embodiment, controller 60 is disposed in outside the first restricted area T1 of the first surface 11 of plate 10 and the second restricted area T2 of second surface 12.Alternatively, controller 60 can be disposed within the first restricted area T1 or the second restricted area T2.In such method, the heat of controller 60 can be passed to radiator 70 by the path that the path of the heat with high heater members is identical.
In this embodiment, the height being arranged on all high heater members on the first surface 11 of plate 10 is equal to or less than predetermined altitude value h1.Alternatively, the height of at least one be arranged in the high heater members on the first surface 11 of plate 10 can be greater than predetermined altitude value h1.
In this embodiment, the high heater members likeness in form rectangular flat on the first surface 11 of plate 10 is arranged on.But the high heater members be arranged on the first surface 11 of plate 10 can be any shape comprising polygon or circular flat board and polygon or circular columns.
In this embodiment, the height of at least one be arranged in the high heater members on the second surface 12 of plate 10 is equal to or greater than predetermined altitude value h2.Alternatively, the height of at least one be arranged in the high heater members on the second surface 12 of plate 10 can be less than predetermined altitude value h2.
In this embodiment, switching device 20, capacitor 30, relay 41 and 42, coil 51 and shunt resistor 52 are described to following high heater members: this high heater members produces the heat being greater than predetermined calorific value when electronic control unit 1 works.High heater members does not always need to comprise owning in switching device 20, capacitor 30, relay 41 and 42, coil 51 and shunt resistor 52.
In this embodiment, power Zener diode 53 is described to as bent down heater members: this low heater members is disposed near the high heater members that is arranged on plate 10, and produces the heat being not more than predetermined calorific value when electronic control unit 1 works.Alternatively, the volume having and be greater than predetermined value can be used and the device with the thermal conductivity being greater than predetermined conductance values as low heater members.Such as, likeness in form chip can be used and the device made is as low heater members by the material---such as copper, silver, aluminium, iron and carbon---of the thermal conductivity being greater than predetermined conductance values.
In this embodiment, priming supply 106 is electrically connected to the node between relay 41 and coil 51.Controller 60---i.e. microcomputer 61 and customization IC 62---operates the electric power from priming supply 106.Alternatively, priming supply 106 can be electrically connected to the side relative with coil 51 of relay 41, or can be electrically connected to the side relative with relay 41 of coil 51.
In this embodiment, high heater members and low heater members are surface mounted device (SMD).Alternatively, at least one in high heater members and low heater members can be via devices (THD).
In this embodiment, four switching devices 20 (that is, 21 to 24) and three capacitors 30 (that is, 31 to 33) are used to power to motor 101.The number of switching device 20 and the number of capacitor 30 can be any numbers.
In this embodiment, plate 10 is by being fixed to radiator 70 as the screw of securing member 2.Alternatively, plate 10 can be fixed to radiator 70 by Press fit joint, nuts and bolt connection, fastening connection etc.
In this embodiment, capacitor 30 is aluminium electrolytic capacitor.Such as, but capacitor 30 can be the capacitor of any type, conductive polymer capacitors or mixed capacitor.
In this embodiment, electronic control unit 1 is the discrete item of the motor 101 as control objectives.Alternatively, electronic control unit 1 can be integrated with motor 101.In this case, radiator 70 can be integrated with the frame end of motor 101.In such method, decrease the number of components in electric power-assisted steering apparatus 100, and correspondingly reduce the size of electric power-assisted steering apparatus 100.
In this embodiment, electronic control unit 1 is used in electric power-assisted steering apparatus 100.Alternatively, electronic control unit 1 may be used for motor or the analog of the device controlled except electric power-assisted steering apparatus 100.
Such change and amendment will be understood to be in the scope of the present disclosure limited by claims.
Claims (12)
1. the electronic control unit for controlling control objectives (101), described electronic control unit comprises:
Plate (10), described plate (10) has first surface (11) and the second surface (12) relative with described first surface (11);
Multiple high heater members (20,21,22,23,24,30,31,32,33,41,42,51,52,411,412,421,422), described multiple high heater members (20,21,22,23,24,30,31,32,33,41,42,51,52,411,412,421,422) to be installed on the described first surface of described plate or described second surface and to be configured to produce when described electronic control unit work the heat being greater than predetermined calorific value;
Controller (60,61,62), described controller (60,61,62) is configured to be controlled described control objectives by least one the high heater members controlled in described multiple high heater members;
Radiating component (70), described radiating component (70) is oriented to the described first surface in the face of described plate;
Heat conduction member (80,81,82), described heat conduction member (80,81,82) be positioned between described plate and described radiating component, and with described multiple high heater members, described heat conduction member (80,81,82) contacts that the heat of described multiple high heater members is passed to described radiating component, wherein
The sum installing described multiple high heater members is over the plates greater than estimated rate with the ratio of the number being arranged in the high heater members within first restricted area (T1) of described first surface or second restricted area (T2) of described second surface, and
Described second restricted area is positioned in the position corresponding with described first restricted area.
2. electronic control unit according to claim 1, wherein,
Described heat conduction member contacts with described plate and described radiating component.
3. electronic control unit according to claim 1, wherein,
Described heat conduction member is one of in multiple heat conduction member, and
Each heat conduction member in described multiple heat conduction member all contacts to the corresponding high heater members in described multiple high heater members.
4. electronic control unit according to claim 3, wherein,
At least two heat conduction members in described multiple heat conduction member are integrated into a heat conduction member.
5. electronic control unit according to claim 1, wherein,
Described controller to be installed on the described first surface of described plate or described second surface and to be disposed in outside described first restricted area and described second restricted area.
6. electronic control unit according to claim 1, wherein,
Described controller to be installed on the described first surface of described plate or described second surface and to be disposed within described first restricted area or described second restricted area.
7. electronic control unit according to claim 1, wherein,
At least one high heater members in described multiple high heater members is disposed within described first restricted area of the described first surface of described plate, and has when measuring from the described first surface of described plate the height being less than predetermined altitude value (h1).
8. electronic control unit according to claim 1, wherein,
On the described first surface that at least one high heater members in described multiple high heater members is installed in described plate and the likeness in form flat board parallel with described plate.
9. electronic control unit according to claim 1, wherein,
Described multiple high heater members comprises at least one in switching device, capacitor, relay, coil and shunt resistor.
10. electronic control unit according to claim 1, also comprises:
Be arranged on the low heater members (53) near at least one the high heater members in described multiple high heater members, wherein,
Described low heater members has the volume that is greater than predetermined value and produces the heat being not more than described predetermined calorific value.
11. electronic control units according to claim 10, wherein,
Described low heater members is power Zener diode or the device with the thermal conductivity being greater than predetermined thermal conductivity value.
12. 1 kinds, for the electric power-assisted steering apparatus of vehicle, comprising:
The electronic control unit (1) limited any one of claim 1 to 11, and
Control objectives (101), described control objectives (101) can be controlled by described electronic control unit and can produce the assist torque helping driver to make described Vehicular turn.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-269233 | 2013-12-26 | ||
| JP2013269233A JP6278695B2 (en) | 2013-12-26 | 2013-12-26 | Electronic control unit and electric power steering apparatus using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104754918A true CN104754918A (en) | 2015-07-01 |
| CN104754918B CN104754918B (en) | 2018-07-20 |
Family
ID=53483603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410820355.5A Active CN104754918B (en) | 2013-12-26 | 2014-12-25 | Electronic control unit and electric power-assisted steering apparatus with electronic control unit |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9555828B2 (en) |
| JP (1) | JP6278695B2 (en) |
| CN (1) | CN104754918B (en) |
| MY (1) | MY178655A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106891991A (en) * | 2015-12-17 | 2017-06-27 | 株式会社电装 | Motor control assembly |
| CN108476601A (en) * | 2016-01-08 | 2018-08-31 | 株式会社电装 | Electronic control unit and the electric power-assisted steering apparatus for using the electronic control unit |
| JP2019079903A (en) * | 2017-10-24 | 2019-05-23 | 株式会社オートネットワーク技術研究所 | Circuit structure and manufacturing method of the same |
| CN110654452A (en) * | 2018-06-29 | 2020-01-07 | 日本电产艾莱希斯株式会社 | Circuit board, electronic control unit for electric power steering, and electric power steering apparatus |
| CN111146908A (en) * | 2018-11-02 | 2020-05-12 | 株式会社电装 | Drive device and electric power steering apparatus using the same |
| CN113873749A (en) * | 2018-03-30 | 2021-12-31 | 日本电产艾莱希斯株式会社 | Electronic control unit for electric power steering |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5967071B2 (en) | 2013-12-26 | 2016-08-10 | 株式会社デンソー | Electronic control device and electric power steering device using the same |
| JP6693706B2 (en) * | 2015-04-06 | 2020-05-13 | 株式会社デンソー | Electronic control unit |
| JP6418041B2 (en) | 2015-04-06 | 2018-11-07 | 株式会社デンソー | Electronic control unit |
| JP6468036B2 (en) * | 2015-04-06 | 2019-02-13 | 株式会社デンソー | Electronic control unit |
| CN106298688B (en) * | 2015-05-28 | 2018-11-06 | 台达电子工业股份有限公司 | Encapsulation type power circuitry module |
| JP6528620B2 (en) * | 2015-09-15 | 2019-06-12 | 株式会社オートネットワーク技術研究所 | Circuit structure and electrical connection box |
| CN108137084B (en) | 2015-10-20 | 2020-12-22 | 三菱电机株式会社 | Integrated electric power steering apparatus and method of manufacturing the same |
| JP6555134B2 (en) * | 2016-01-08 | 2019-08-07 | 株式会社デンソー | Electronic control unit and electric power steering apparatus using the same |
| JP2017184490A (en) * | 2016-03-30 | 2017-10-05 | キヤノン株式会社 | Motor drive unit and image formation device |
| US9998055B2 (en) * | 2016-04-14 | 2018-06-12 | Caterpillar Inc. | Low inductance power electronics configuration for electric drive systems |
| JP6584652B2 (en) * | 2016-04-26 | 2019-10-02 | 三菱電機株式会社 | Power circuit equipment |
| JP6587213B2 (en) * | 2016-05-12 | 2019-10-09 | 株式会社オートネットワーク技術研究所 | Power distribution board |
| JP6683020B2 (en) * | 2016-06-01 | 2020-04-15 | 株式会社デンソー | Electric power conversion device and electric power steering device using the same |
| CN108369444A (en) * | 2016-06-07 | 2018-08-03 | 富士电机株式会社 | Power supply relay unit |
| JP6601328B2 (en) * | 2016-07-01 | 2019-11-06 | 株式会社デンソー | Motor equipment |
| DE102017212968B4 (en) * | 2016-08-05 | 2024-02-01 | Robert Bosch Gmbh | HOUSING STRUCTURE FOR AN ELECTRONIC CONTROL UNIT AND PRODUCTION METHOD |
| JP6729442B2 (en) * | 2017-02-20 | 2020-07-22 | トヨタ自動車株式会社 | Coil unit |
| KR102029332B1 (en) * | 2017-04-05 | 2019-10-07 | 엘에스산전 주식회사 | Board apparatus |
| JP6737221B2 (en) * | 2017-04-11 | 2020-08-05 | 株式会社デンソー | Electric power steering control device and electronic unit. |
| JP7054993B2 (en) * | 2017-05-11 | 2022-04-15 | 日本電産サンキョー株式会社 | Drive |
| JP6838501B2 (en) * | 2017-06-14 | 2021-03-03 | 株式会社デンソー | Electronic control device and electric power steering device using this |
| JP7033990B2 (en) | 2018-04-09 | 2022-03-11 | 株式会社デンソーテン | Electronic equipment and shunt resistance fixed structure |
| CN111885895B (en) * | 2020-08-07 | 2021-10-08 | 珠海格力电器股份有限公司 | Radiator, radiating method, demonstrator and radiating system |
| JP2022146048A (en) * | 2021-03-22 | 2022-10-05 | キオクシア株式会社 | Semiconductor memory device and heat radiator |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090103267A1 (en) * | 2007-10-17 | 2009-04-23 | Andrew Dean Wieland | Electronic assembly and method for making the electronic assembly |
| JP2009248864A (en) * | 2008-04-09 | 2009-10-29 | Mitsubishi Electric Corp | Electric power steering device and its manufacturing method |
| US20110013365A1 (en) * | 2009-07-16 | 2011-01-20 | Denso Corporation | Electronic control unit |
| JP2011023459A (en) * | 2009-07-14 | 2011-02-03 | Denso Corp | Electronic control unit |
| US20120057313A1 (en) * | 2010-09-03 | 2012-03-08 | National Semiconductor Corporation | Package for system level electronic products |
| JP2012199354A (en) * | 2011-03-22 | 2012-10-18 | Hitachi Automotive Systems Ltd | Electronic control device |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6549409B1 (en) * | 2000-08-21 | 2003-04-15 | Vlt Corporation | Power converter assembly |
| BRPI0100051B1 (en) * | 2001-01-11 | 2016-11-29 | Brasil Compressores Sa | electronic device enclosure |
| US6724631B2 (en) * | 2002-04-22 | 2004-04-20 | Delta Electronics Inc. | Power converter package with enhanced thermal management |
| JP4311243B2 (en) * | 2004-03-15 | 2009-08-12 | 株式会社デンソー | Electronics |
| US7310233B2 (en) * | 2005-01-28 | 2007-12-18 | Tyco Electronics Power Systems | Apparatus and method for transferring heat from an electrical module |
| JP2011023463A (en) * | 2009-07-14 | 2011-02-03 | Denso Corp | Semiconductor module |
| DE102009054517B4 (en) * | 2009-12-10 | 2011-12-29 | Robert Bosch Gmbh | Electronic control unit |
| JP5408502B2 (en) * | 2010-09-06 | 2014-02-05 | 株式会社デンソー | Electronic control unit |
| JP5967071B2 (en) * | 2013-12-26 | 2016-08-10 | 株式会社デンソー | Electronic control device and electric power steering device using the same |
| JP2015126100A (en) * | 2013-12-26 | 2015-07-06 | 株式会社デンソー | Electronic control device and electric power steering device using the same |
| JP6115465B2 (en) * | 2013-12-26 | 2017-04-19 | 株式会社デンソー | Electronic control unit and electric power steering apparatus using the same |
-
2013
- 2013-12-26 JP JP2013269233A patent/JP6278695B2/en active Active
-
2014
- 2014-12-23 MY MYPI2014703976A patent/MY178655A/en unknown
- 2014-12-24 US US14/582,877 patent/US9555828B2/en active Active
- 2014-12-25 CN CN201410820355.5A patent/CN104754918B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090103267A1 (en) * | 2007-10-17 | 2009-04-23 | Andrew Dean Wieland | Electronic assembly and method for making the electronic assembly |
| JP2009248864A (en) * | 2008-04-09 | 2009-10-29 | Mitsubishi Electric Corp | Electric power steering device and its manufacturing method |
| JP2011023459A (en) * | 2009-07-14 | 2011-02-03 | Denso Corp | Electronic control unit |
| US20110013365A1 (en) * | 2009-07-16 | 2011-01-20 | Denso Corporation | Electronic control unit |
| CN101958312B (en) * | 2009-07-16 | 2013-08-28 | 株式会社电装 | Electronic control unit |
| US20120057313A1 (en) * | 2010-09-03 | 2012-03-08 | National Semiconductor Corporation | Package for system level electronic products |
| JP2012199354A (en) * | 2011-03-22 | 2012-10-18 | Hitachi Automotive Systems Ltd | Electronic control device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106891991A (en) * | 2015-12-17 | 2017-06-27 | 株式会社电装 | Motor control assembly |
| CN108476601A (en) * | 2016-01-08 | 2018-08-31 | 株式会社电装 | Electronic control unit and the electric power-assisted steering apparatus for using the electronic control unit |
| CN108476601B (en) * | 2016-01-08 | 2020-04-07 | 株式会社电装 | Electronic control unit and electric power steering apparatus using the same |
| JP2019079903A (en) * | 2017-10-24 | 2019-05-23 | 株式会社オートネットワーク技術研究所 | Circuit structure and manufacturing method of the same |
| CN113873749A (en) * | 2018-03-30 | 2021-12-31 | 日本电产艾莱希斯株式会社 | Electronic control unit for electric power steering |
| CN110654452A (en) * | 2018-06-29 | 2020-01-07 | 日本电产艾莱希斯株式会社 | Circuit board, electronic control unit for electric power steering, and electric power steering apparatus |
| CN111146908A (en) * | 2018-11-02 | 2020-05-12 | 株式会社电装 | Drive device and electric power steering apparatus using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| US20150189794A1 (en) | 2015-07-02 |
| JP2015123846A (en) | 2015-07-06 |
| JP6278695B2 (en) | 2018-02-14 |
| US9555828B2 (en) | 2017-01-31 |
| CN104754918B (en) | 2018-07-20 |
| MY178655A (en) | 2020-10-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104754918A (en) | Electronic control unit and electric power steering apparatus having the same | |
| CN104742960A (en) | Electronic control unit and electric power steering apparatus having the same | |
| KR101086803B1 (en) | Power module | |
| US6704201B2 (en) | Power feed and heat dissipating device for power semiconductor devices | |
| CN104752390B (en) | Electronic control unit and electric power-assisted steering apparatus with electronic control unit | |
| CN108463883B (en) | Electronic control unit and electric power steering apparatus using the same | |
| US20160150662A1 (en) | Electrical Circuit and Method for Producing an Electrical Circuit for Activating a Load | |
| US20080277780A1 (en) | Electrical circuit device | |
| US9431318B2 (en) | Electronic device | |
| CN111697846B (en) | Motor controller and vehicle | |
| JP6020379B2 (en) | Semiconductor device | |
| CN108028238B (en) | Electronic control device | |
| CN108476601B (en) | Electronic control unit and electric power steering apparatus using the same | |
| CN110914979B (en) | Circuit arrangement | |
| WO2018211580A1 (en) | Power conversion apparatus | |
| WO2020080248A1 (en) | Circuit structure and electrical junction box | |
| CN104980083B (en) | Shell structure and assembly mode of electric automobile motor controller assembly | |
| KR101624492B1 (en) | Electronic control unit and electric power steering device using the same | |
| CN214848623U (en) | Electric control board | |
| CN113113398A (en) | Electric control board | |
| CN117981483A (en) | Power semiconductor module and drive train for a vehicle having such a power semiconductor module | |
| JP2018170462A (en) | Circuit device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |