CN101873766A - Method for manufacturing conductor track structure - Google Patents
Method for manufacturing conductor track structure Download PDFInfo
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- CN101873766A CN101873766A CN201010191359A CN201010191359A CN101873766A CN 101873766 A CN101873766 A CN 101873766A CN 201010191359 A CN201010191359 A CN 201010191359A CN 201010191359 A CN201010191359 A CN 201010191359A CN 101873766 A CN101873766 A CN 101873766A
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- conductor track
- track structure
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- abs plastic
- irradiation area
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Abstract
The invention relates to the technical field of non-conducting bearing materials, in particular to a method for manufacturing a conductor track structure. The method is characterized by comprising the following steps of: a. injection molding; b. laser processing; c. chemical activation: preparing palladium solution or silver solution according to surface structure of material and irradiating the surface of a region to adsorb a certain amount of noble metal atoms as the base of selective chemical plating; d. selective metallization: putting processed ABS plastic products in common chemical reduction cooper-plating solution; and e. formation of the conductor track. Compared with the prior art, the invention has wider range of application and unlimited application field of non-conducting bearing material. Because extra substances are not needed to add, such as non-conducting metal compounds, original characteristics of the non-conducting bearing material are better preserved, and the cost is greatly reduced without using common material which is especially treated.
Description
Technical field
The present invention relates to non-conductive loading material technical field, specifically a kind of manufacture method of conductor track structure.
Background technology
The domestic patent No.: 02812609.2 discloses a kind of manufacture method of conductor track structure, this conductor track structure by the metal nucleus and follow-up on metal core, apply metal layer constitute, wherein the metal nucleus forms by the meticulous fracture that is included in the non conducting metallized compound in the loading material of electromagnetic irradiation realization with distributing, non conducting metallized compound by highly heat-staple in moisture acidity or alkalinous metal electrolyte stable and undissolved inorganic oxide constitute, these oxides are the higher-order oxides with spinel structure, or simple d-metal oxide or its mixture or the mixed-metal compounds of the same clan with spinel structure, and described oxide remains unchanged in not irradiated zone.
Summary of the invention
Be to solve the restriction of original technology (patent No. ZL 02812609.2) to loading material order of the present invention; By the change and the process optimization of flow process, solved the metallization problem of all non-conductive loading materials, overcome the deficiency of original method.
For achieving the above object, design a kind of manufacture method of conductor track structure, it is characterized in that described manufacturing approach craft step is as follows: a. injection mo(u)lding, adopt common plastics ABS, squeeze out the ABS plastic goods with extruder, b. laser treatment, with laser radiation ABS plastic product surface, realize the different of irradiation area and non-irradiation area, form micro-rough at material surface, have the surface of microcellular structure, the c. chemical activation, according to the material surface structure, configuration palladium solution or silver-colored solution, a certain amount of precious metal atom of irradiation area surface adsorption is as the basis of selective chemical plating, d. selective metallization, the ABS plastic goods of above-mentioned processing are put into common electronation copper plating solution, realize the selective metallization film, the e. conductor rail forms, according to the needs of conductor rail, adopt chemical reduction method or electrolysis metallized film to be thickeied the thickness of needs.
Described chemical activation processing step is as follows: a. is degreasing 5-10min under 40 ℃ of-60 ℃ of temperature, b. washing 1-2 time, and c. preimpregnation 3-5min, d. activates 3-6min, e. washing 1-2 time.
Comprise in the described chemical activation technology and adopt fast metallization processes.
The present invention compared with prior art, non-conductive loading material applicable surface is wider, application is unrestricted; Owing to need not add extra material,, make that the original characteristic of non-conductive loading material is well kept such as non conducting metallized compound; Simultaneously, adopting does not have the special common material of handling, and makes cost have significantly and reduces.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is a process chart of the present invention.
Appointment Fig. 1 is a Figure of abstract
Embodiment
1, common plastics ABS is adopted in injection mo(u)lding, squeezes out the ABS plastic goods with extruder.
2, laser treatment with laser radiation ABS plastic product surface, realizes the different of irradiation area and non-irradiation area, forms micro-rough at material surface, has the surface of microcellular structure, for different surface textures is created in the subsequent chemistry activation
3, chemical activation, according to the material surface structure, configuration palladium solution or silver-colored solution are realized a certain amount of precious metal atom of irradiation area surface adsorption, as the basis of selective chemical plating.
4, selective metallization is put into common electronation copper plating solution with the ABS plastic goods of above-mentioned processing, realizes the selective metallization film.
5, conductor rail forms, and according to the needs of conductor rail, adopts chemical reduction method or electrolysis metallized film to be thickeied the thickness of needs.
Non-conductive loading material is taken from present existing technology and material, comprises existing plastics, pottery etc., and they do not need to add special material, use said method just can realize selective metallization; Adopt the mode of laser radiation, realize the different of irradiation area and non-irradiation area; By the mode of chemical activation,, make follow-up chemistry redox reaction to cause with the microcellular structure absorption of active component and plastics irradiation area.The structure of this micropore can guarantee more firm combination and lasting riveted.
Adhesion between conductor rail and the plastics improves, it is more firm in mechanical properties to utilize the goods of common ABS plastic forming materials relatively to add the goods of plastic shaping of non conducting metallized compound, toughness is better, the copper conductor interorbital heat-conductivity conducting performance difference of common ABS plastic and embedding is more remarkable, more possesses advantage at the anti-interference demanding electronics of some electromagnetism and field of wireless communication.
Claims (3)
1. the manufacture method of a conductor track structure, it is characterized in that described manufacturing approach craft step is as follows: a. injection mo(u)lding, adopt common plastics ABS, squeeze out the ABS plastic goods with extruder, b. laser treatment, with laser radiation ABS plastic product surface, realize the different of irradiation area and non-irradiation area, form micro-rough at material surface, surface with microcellular structure, c. chemical activation according to the material surface structure, disposes palladium solution or silver-colored solution, a certain amount of precious metal atom of irradiation area surface adsorption, as the basis of selective chemical plating, the d. selective metallization is put into common electronation copper plating solution with the ABS plastic goods of above-mentioned processing, realize the selective metallization film, e. conductor rail forms, and according to the needs of conductor rail, adopts chemical reduction method or electrolysis metallized film to be thickeied the thickness of needs.
2. the manufacture method of a kind of conductor track structure as claimed in claim 1, it is characterized in that described chemical activation processing step is as follows: a. is degreasing 5-10min under 40 ℃ of-60 ℃ of temperature, b. washing 1-2 time, c. preimpregnation 3-5min, d. activate 3-6min, e. washing 1-2 time.
3. the manufacture method of a kind of conductor track structure as claimed in claim 1 or 2 is characterized in that comprising in the described chemical activation technology the fast metallization processes of employing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101913593A CN101873766B (en) | 2010-06-02 | 2010-06-02 | Method for manufacturing conductor track structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101913593A CN101873766B (en) | 2010-06-02 | 2010-06-02 | Method for manufacturing conductor track structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101873766A true CN101873766A (en) | 2010-10-27 |
| CN101873766B CN101873766B (en) | 2011-07-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101913593A Expired - Fee Related CN101873766B (en) | 2010-06-02 | 2010-06-02 | Method for manufacturing conductor track structure |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102543855A (en) * | 2012-01-19 | 2012-07-04 | 讯创(天津)电子有限公司 | Manufacture method of three-dimensional integrated circuit structure and material |
| CN102806789A (en) * | 2011-06-03 | 2012-12-05 | 上海安费诺永亿通讯电子有限公司 | Method for forming metal pattern on surface of insulator |
| CN103219626A (en) * | 2013-03-28 | 2013-07-24 | 上海安费诺永亿通讯电子有限公司 | Method and device for covering upper and lower surfaces of part of conductive layer connected to plastic |
| CN103281871A (en) * | 2013-06-09 | 2013-09-04 | 上海安费诺永亿通讯电子有限公司 | Electronic circuit manufacturing method |
| CN103313521A (en) * | 2013-07-12 | 2013-09-18 | 王咏 | Manufacturing method of plastic parts and surface conductor structures thereof |
| CN103442518A (en) * | 2013-08-02 | 2013-12-11 | 上海安费诺永亿通讯电子有限公司 | Manufacturing method of electronic circuit |
| CN103747635A (en) * | 2013-12-30 | 2014-04-23 | 金发科技股份有限公司 | Method for selective deposition of metals through interfacial adsorption and application thereof |
| CN104244564A (en) * | 2014-04-30 | 2014-12-24 | 深圳光韵达光电科技股份有限公司 | Three-dimensional circuit and manufacturing method thereof |
| CN104661449A (en) * | 2015-02-16 | 2015-05-27 | 珠海元盛电子科技股份有限公司 | Hole metallization method based on laser activation technology |
| CN104975276A (en) * | 2014-04-11 | 2015-10-14 | 深圳市泛友科技有限公司 | Method of forming selective metal circuit on plastic surface and plastic part |
| CN105189815A (en) * | 2014-01-20 | 2015-12-23 | 富光Pl株式会社 | Synthetic resin product plating method |
| CN106211611A (en) * | 2011-02-25 | 2016-12-07 | 绿点高新科技股份有限公司 | Method and the conducting wire of continuous conduction circuit is set up on non-conductive substrate surface |
| CN116092929A (en) * | 2023-02-16 | 2023-05-09 | 浙江萃锦半导体有限公司 | Double-sided wafer chemical plating process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002536503A (en) * | 1999-02-03 | 2002-10-29 | バイエル アクチェンゲゼルシャフト | Molded parts capable of metal plating |
| CN1397967A (en) * | 2001-07-16 | 2003-02-19 | 保力马科技株式会社 | Key top for knob switch and its mfg. method |
| US7060421B2 (en) * | 2001-07-05 | 2006-06-13 | Lpkf Laser & Electronics Ag | Conductor track structures and method for production thereof |
| CN101634018A (en) * | 2008-07-27 | 2010-01-27 | 比亚迪股份有限公司 | Selective chemical plating method for plastic base material |
| CN101654564A (en) * | 2008-08-23 | 2010-02-24 | 比亚迪股份有限公司 | Plastic composition and surface selective metallization process thereof |
-
2010
- 2010-06-02 CN CN2010101913593A patent/CN101873766B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002536503A (en) * | 1999-02-03 | 2002-10-29 | バイエル アクチェンゲゼルシャフト | Molded parts capable of metal plating |
| US7060421B2 (en) * | 2001-07-05 | 2006-06-13 | Lpkf Laser & Electronics Ag | Conductor track structures and method for production thereof |
| CN1397967A (en) * | 2001-07-16 | 2003-02-19 | 保力马科技株式会社 | Key top for knob switch and its mfg. method |
| CN101634018A (en) * | 2008-07-27 | 2010-01-27 | 比亚迪股份有限公司 | Selective chemical plating method for plastic base material |
| CN101654564A (en) * | 2008-08-23 | 2010-02-24 | 比亚迪股份有限公司 | Plastic composition and surface selective metallization process thereof |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211611A (en) * | 2011-02-25 | 2016-12-07 | 绿点高新科技股份有限公司 | Method and the conducting wire of continuous conduction circuit is set up on non-conductive substrate surface |
| CN102806789A (en) * | 2011-06-03 | 2012-12-05 | 上海安费诺永亿通讯电子有限公司 | Method for forming metal pattern on surface of insulator |
| CN102543855A (en) * | 2012-01-19 | 2012-07-04 | 讯创(天津)电子有限公司 | Manufacture method of three-dimensional integrated circuit structure and material |
| CN102543855B (en) * | 2012-01-19 | 2014-07-09 | 讯创(天津)电子有限公司 | Manufacture method of three-dimensional integrated circuit structure and material |
| CN103219626A (en) * | 2013-03-28 | 2013-07-24 | 上海安费诺永亿通讯电子有限公司 | Method and device for covering upper and lower surfaces of part of conductive layer connected to plastic |
| CN103281871A (en) * | 2013-06-09 | 2013-09-04 | 上海安费诺永亿通讯电子有限公司 | Electronic circuit manufacturing method |
| CN103313521A (en) * | 2013-07-12 | 2013-09-18 | 王咏 | Manufacturing method of plastic parts and surface conductor structures thereof |
| CN103313521B (en) * | 2013-07-12 | 2016-11-02 | 王咏 | Plastic parts and the manufacture method of surface conductor structure thereof |
| CN103442518A (en) * | 2013-08-02 | 2013-12-11 | 上海安费诺永亿通讯电子有限公司 | Manufacturing method of electronic circuit |
| CN103747635A (en) * | 2013-12-30 | 2014-04-23 | 金发科技股份有限公司 | Method for selective deposition of metals through interfacial adsorption and application thereof |
| CN105189815A (en) * | 2014-01-20 | 2015-12-23 | 富光Pl株式会社 | Synthetic resin product plating method |
| WO2015154502A1 (en) * | 2014-04-11 | 2015-10-15 | 深圳市泛友科技有限公司 | Method of forming selective metal circuit on plastic surface, and plastic component |
| CN104975276A (en) * | 2014-04-11 | 2015-10-14 | 深圳市泛友科技有限公司 | Method of forming selective metal circuit on plastic surface and plastic part |
| CN104975276B (en) * | 2014-04-11 | 2019-07-12 | 深圳市泛友科技有限公司 | The method and plastic components of selective metal route are formed in frosting |
| CN104244564A (en) * | 2014-04-30 | 2014-12-24 | 深圳光韵达光电科技股份有限公司 | Three-dimensional circuit and manufacturing method thereof |
| CN104661449A (en) * | 2015-02-16 | 2015-05-27 | 珠海元盛电子科技股份有限公司 | Hole metallization method based on laser activation technology |
| CN104661449B (en) * | 2015-02-16 | 2019-01-01 | 珠海元盛电子科技股份有限公司 | A kind of hole metallization method based on laser activation technology |
| CN116092929A (en) * | 2023-02-16 | 2023-05-09 | 浙江萃锦半导体有限公司 | Double-sided wafer chemical plating process |
Also Published As
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|---|---|
| CN101873766B (en) | 2011-07-27 |
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| C14 | Grant of patent or utility model | ||
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Owner name: SHANGHAI LVYUN ELECTRONIC PRODUCT CO., LTD. Free format text: FORMER OWNER: SHANGHAI REETU SURFACE TREATMENT CO., LTD. Effective date: 20150721 |
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Effective date of registration: 20150721 Address after: 201512 Shanghai City, Jinshan District Jinshanwei town Qiushi Road No. 688 Building No. 4 room 222-223 Patentee after: Shanghai law electronic products Co., Ltd. Address before: Jinshan District Jinshan Wei Xin Road 201512 Shanghai City No. 789 Room 301 Patentee before: Shanghai REETU surface treatment Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110727 Termination date: 20160602 |