CN104602464B - A kind of wiring board cascaded surface covers preparation method and its application of the shoulder hole of copper - Google Patents
A kind of wiring board cascaded surface covers preparation method and its application of the shoulder hole of copper Download PDFInfo
- Publication number
- CN104602464B CN104602464B CN201510037191.3A CN201510037191A CN104602464B CN 104602464 B CN104602464 B CN 104602464B CN 201510037191 A CN201510037191 A CN 201510037191A CN 104602464 B CN104602464 B CN 104602464B
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- Prior art keywords
- copper
- hole
- core plate
- pieces
- shoulder hole
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Preparation method and its application of the shoulder hole of copper are covered the invention discloses a kind of cascaded surface, belongs to wiring board and manufactures field.The preparation method that the wiring board cascaded surface of the present invention covers the shoulder hole of copper, it is before outer-layer circuit is made, shoulder hole is closed inside assist side, after completion outer-layer circuit, gong opens core plate again, shoulder hole is spilt, etching solution during process outer-layer circuit production thereafter can be avoided to pour into shoulder hole, solve the problems, such as that etching solution causes corrosion to the copper of ladder position.
Description
Technical field
The invention belongs to wiring board to manufacture field, more particularly to a kind of wiring board cascaded surface covers the system of the shoulder hole of copper
Make the wiring board of method and its application.
Background technology
With the development of wiring board manufacturing technology, the wiring board containing shoulder hole is more and more.For containing shoulder hole
Wiring board, traditional preparation method are：First wiring board and prepreg are pressed, then direct gong goes out step, then in shoulder hole
Interior plating conducting metal.Although technique is simple, during gong step, the bad control of depth of step, moreover, plating when its
Upper conducting metal can all be adhered in shoulder hole, the outer graphics of rear process make and can cause corruption to conducting metal in shoulder hole
Erosion.
The content of the invention
To solve the above problems, the present invention provides a kind of preparation method for the shoulder hole that wiring board cascaded surface covers copper and its answered
Wiring board, concrete scheme are as follows：
The preparation method that a kind of wiring board cascaded surface covers the shoulder hole of copper, described preparation method include following step successively
Suddenly：
S1：First through hole is drilled out on the first core plate that one side covers copper；
S2：Circuit is completed in the one side of the second core plate of double-sided copper-clad to make, non-by the first core plate covers copper face and second
The circuit surface that core plate makes is pressed into pressing core plate by the first PP pieces；The first described PP pieces are provided with corresponding first through hole
First window；
S3：Pressing core plate is first sunk into copper coin plating, then copper plate and tin layers successively in first through hole；
S4：Make the first core plate on pressing core plate and cover copper face line pattern, then strip tin layers in first through hole；
S5：The non-copper face gong that covers that the 3rd core plate of copper is covered in one side goes out annular groove, and first is logical on annular groove and the first core plate
The position correspondence in hole；
S6：Copper face is covered into the non-of the 3rd core plate in the line pattern face of first core plate in pressing core plate and passes through the 2nd PP piece pressures
Synthetic line plate；The 2nd described PP pieces are provided with the second window of corresponding annular groove；After pressing, first through hole, annular groove position
In the inside of wiring board；
S7：Cover copper face in the 3rd core plate and correspond to the region gong of annular groove and go out the second through hole, expose first through hole, form ladder
Hole；
S8：To in shoulder hole layers of copper surface carry out blasting treatment, then to layers of copper surface carry out microetch, then successively sink nickel,
Gold.
Preferably, the aperture of the second described through hole is more than the aperture of first through hole.
Preferably, the fluidity of the first described PP pieces and the 2nd PP pieces is less than 0.06mm；On the first PP pieces
One window is bigger 0.2mm than the aperture of first through hole；The second window on the 2nd PP pieces is bigger than the aperture of the second through hole
0.2mm。
Further, in described step S3, the copper thickness of the heavy copper coin plating of pressing core plate is 2-4 μm；Copper facing in first through hole
The technological process of layer and tin layers includes patch dry film, exposure imaging, pattern plating copper, graphic plating tin, moves back dry film successively, described
Dry film be provided with the fenestra of corresponding first through hole, the small 0.150mm in aperture of the aperture ratio first through hole of fenestra；Described first is logical
In hole successively after copper plate and tin layers, copper layer thickness is 20-30 μm, and tin thickness is 5-8 μm.
Further, in described step S4, the technique stream that the first core plate on pressing core plate covers copper face line pattern is made
Cheng Yici includes patch dry film, exposure imaging, etches, moves back dry film, and described dry film is provided with the dry film cap bore of corresponding first through hole,
The small 0.2mm in aperture after the aperture ratio first through hole of dry film cap bore is tin plating.
Further, in described step S5, annular groove depth is 0.4 ± 0.05mm, and width is 1.0 ± 0.05mm.
Further, in described step S8, when layers of copper surface carries out blasting treatment in shoulder hole, in order to avoid shoulder hole
Interior hydrops and reduce cleaning effect, by shoulder hole blasting treatment down when putting plate.
Further, in described step S8, the thickness of the microetch is 1.5-2.0 μm；The thickness of heavy nickel is 5-8 μm；
The thickness of turmeric is 0.025-0.076 μm.
A kind of cascaded surface covers the shoulder hole wiring board of copper, and described wiring board carries the cascaded surface that above-mentioned preparation method makes
Cover the shoulder hole of copper.
The preparation method that the wiring board cascaded surface of the present invention covers the shoulder hole of copper, before the pressing of the 3rd core plate, not the
The second through hole gong on three core plates is opened, and etching solution during process production thereafter can be avoided to pour into shoulder hole, so as to solve erosion
Carve the problem of liquid causes corrosion to the copper of ladder position.
In first through hole before copper plate and tin layers, one layer of relatively thin copper, then graphic plating are only plated by first sinking copper coin plating
First through hole, by the making of multiple dry film, realize a plated hole and do not plate surface copper, reach the mesh of control surface copper thickness uniformity
, the thick uniformity thick with copper in first through hole of circuit copper is ensure that, it is different to solve the signal transmission caused by copper thickness is inconsistent
The problem of normal；In addition, using dry film and tin layers jointly as resist layer (being tin resist layer in shoulder hole), solving dry film can not
The cap bore problem of the macropore of realization.
3rd core plate, in the pre- gong annular groove of stitching surface, the circumference of a gong one, can ensure second to greatest extent before pressing
The rigidity of through hole position core plate, the problem of avoiding this position from occurring being recessed in rear processing procedure and cause dry film epiphragma not labor；Meanwhile ring
Shape groove can be used for accommodating the PP glue that the pressing of the 2nd PP pieces is overflowed during pressing, avoid the core of corresponding second through hole of PP glue bonds overflowed
Plate region, cause not taking out after the core plate region gong of corresponding second through hole is complete.
Brief description of the drawings
Fig. 1 is the structure chart for the shoulder hole wiring board that cascaded surface of the embodiment of the present invention covers copper；
Fig. 2 is the structure chart that the core plate of the embodiment of the present invention first drills out first through hole；
Fig. 3 is the pressing core plate structure figure after the core plate of the embodiment of the present invention first and the pressing of the second core plate；
Fig. 4 is that the embodiment of the present invention presses the first core plate line pattern making of core plate, first through hole moves back the structure after tin
Figure；
Fig. 5 is the structure chart after the core plate gong annular groove of the embodiment of the present invention the 3rd；
Fig. 6 is the core plate of the embodiment of the present invention the 3rd with pressing the structure chart after core plate presses.
Embodiment
In order to more fully understand the technology contents of the present invention, technical scheme is entered with reference to specific embodiment
One step introduction and explanation.
Embodiment
Cascaded surface as shown in Figure 1 covers the shoulder hole wiring board of copper, including the first core plate 1, the second core plate 2, the 3rd core plate
3rd, the first PP pieces 4, the 2nd PP pieces 5；Wiring board is provided with shoulder hole 6.The line layer of the wiring board is false 6 layers, between internal layer line width
Away from：Min 8/8miL, outer layer line width spacing：Min 8/8miL, plate Tg：150 DEG C, external copper layer thickness 1OZ.First core plate 1,
Second core plate 2, the thickness of the 3rd core plate 3 are 2.0mm；The fluidity of first PP pieces and the 2nd PP pieces is less than 0.06mm.
The preparation method that cascaded surface covers the shoulder hole wiring board of copper comprises the following steps successively：
Output the first core plate 1, the second core plate 2, the substrate of the 3rd core plate 3；Three core plates are drilled out using same borehole data
Peripheral positioning holes and by the first PP pieces 4 of laminated construction design, the peripheral positioning holes of the 2nd PP pieces 5.With the periphery drilled out
The first window that positioning hole gong goes out on the first PP pieces 4, the second window on the 2nd PP pieces 5；First on the first PP pieces 4 drilled out
Window is bigger 0.2mm than the aperture of design first through hole, and the second window on the 2nd PP pieces 5 is bigger than the aperture of the second through hole
0.2mm。
The one side layers of copper of first core plate 1 of double-sided copper-clad is etched away, first through hole 11 is drilled out on the first core plate, is such as schemed
Shown in 2.
Circuit is completed in the one side of the second core plate 2 of double-sided copper-clad to make, and turns into the second core plate circuit surface 21, by the first core
1 etching face and the second core plate circuit surface 21 are pressed into pressing core plate by the first PP pieces 4, as shown in figure 3, on the first PP pieces 4
First window it is corresponding with first through hole 11.
The heavy copper coin of pressing core plate is plating to copper thickness as 2-4 μm；Then through pasting dry film, exposure imaging, pattern plating copper, figure
Electrotinning, dry film process is moved back, it is 20-30 μm to make copper layer thickness in first through hole 11, and tin thickness is 5-8 μm.It should be noted
It is that dry film corresponds to the small 0.150mm in aperture of the aperture ratio first through hole 11 of the fenestra of first through hole 11.
Then by the first core plate cover copper face 12 by patch dry film, exposure imaging, etch, move back dry film process make line pattern,
It should be noted that need to ensure dry film correspond to the dry film cap bore of first through hole 11 aperture ratio first through hole 11 it is tin plating after aperture
Small 0.2mm.Then the tin layers of first through hole 11 are stripped, as shown in Figure 4.
The one side of 3rd core plate 3 is etched away into layers of copper, goes out annular groove 32 (gong one week) in the face gong for etching away layers of copper,
As shown in Figure 5.The external diameter of the external diameter of annular groove 32 and required second through hole is 0.4 ± 0.05mm just as, depth, width 1.0
± 0.05mm, the diameter of annular groove 32 are more than the aperture of first through hole 11.
The etching face that first core plate in pressing core plate is covered to the core plate 3 of copper face 12 and the 3rd is pressed into line by the 2nd PP pieces 5
Road plate, the 2nd PP pieces 5 are provided with the second window of corresponding annular groove 32, and after pressing, first, which leads to 11, annular groove 32, is located at wiring board
Inside, annular groove 32, the second window, the position correspondence of first through hole 11, as shown in Figure 6.
Other outer layer metal holes on wiring board are made, then the making core plate of outer layer second covers the core plate 3 of copper face 22 and the 3rd and covered
The line pattern of copper face 31, welding resistance makes after moving back film.
After completing welding resistance making, the region gong of the corresponding annular groove 32 of the 3rd core plate 3 of assist side goes out the second through hole, exposes
First through hole, form shoulder hole 6.
By the shoulder hole of wiring board down, layers of copper surface in blasting treatment shoulder hole, then microetch layers of copper surface 1.5-2.0
μm, then heavy 5-8 μm of nickel, 0.025-0.076 μm of turmeric, obtain the shoulder hole wiring board that cascaded surface covers copper.
The technology contents described above that the present invention is only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (1)
1. the preparation method that a kind of wiring board cascaded surface covers the shoulder hole of copper, it is characterised in that described preparation method is wrapped successively
Include following steps：
S1：First through hole is drilled out on the first core plate that one side covers copper；
S2：Circuit is completed in the one side of the second core plate of double-sided copper-clad to make, non-by the first core plate covers copper face and the second core plate
The circuit surface of making is pressed into pressing core plate by the first PP pieces；The first described PP pieces are provided with the first of corresponding first through hole
Window；The fluidity of the first described PP pieces is less than 0.06mm, and the first window on the first PP pieces is bigger than the aperture of first through hole
0.2mm；
S3：Pressing core plate is first sunk into copper coin plating, then copper plate and tin layers successively in first through hole；Press the heavy copper coin plating of core plate
Copper thickness be 2-4 μm；In described first through hole successively after copper plate and tin layers, copper layer thickness is 20-30 μm, and tin thickness is
5-8μm；
S4：Make the first core plate on pressing core plate and cover copper face line pattern, then strip tin layers in first through hole；
S5：The non-copper face gong that covers that the 3rd core plate of copper is covered in one side goes out annular groove, the external diameter shape of annular groove and required second through hole
Together；The annular groove depth is 0.4 ± 0.05mm, and width is 1.0 ± 0.05mm；
S6：The line pattern face of first core plate in pressing core plate is pressed into the non-copper face that covers of the 3rd core plate by the 2nd PP pieces
Wiring board；The 2nd described PP pieces are provided with the second window of corresponding annular groove；After pressing, first through hole, annular groove are located at line
The inside of road plate；The fluidity of the 2nd PP pieces is less than 0.06mm；The second window on the 2nd PP pieces is than the second through hole
The big 0.2mm in aperture；
S7：Cover copper face in the 3rd core plate and correspond to the region gong of annular groove and go out the second through hole, expose first through hole, form shoulder hole；
S8：By shoulder hole towards decentralization plate, blasting treatment is carried out to layers of copper surface in shoulder hole, then layers of copper surface carried out micro-
Erosion, the thickness of microetch is 1.5-2.0 μm；Sink nickel, turmeric successively again, the thickness of the turmeric is 0.025-0.076 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510037191.3A CN104602464B (en) | 2015-01-23 | 2015-01-23 | A kind of wiring board cascaded surface covers preparation method and its application of the shoulder hole of copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510037191.3A CN104602464B (en) | 2015-01-23 | 2015-01-23 | A kind of wiring board cascaded surface covers preparation method and its application of the shoulder hole of copper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104602464A CN104602464A (en) | 2015-05-06 |
| CN104602464B true CN104602464B (en) | 2018-03-13 |
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| CN201510037191.3A Active CN104602464B (en) | 2015-01-23 | 2015-01-23 | A kind of wiring board cascaded surface covers preparation method and its application of the shoulder hole of copper |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105657979A (en) * | 2016-04-01 | 2016-06-08 | 浪潮电子信息产业股份有限公司 | PCB (printed circuit board) and method for manufacturing same |
| CN108260302A (en) * | 2016-12-28 | 2018-07-06 | 中国科学院苏州纳米技术与纳米仿生研究所 | Multi-layer flexible circuit board and preparation method thereof |
| CN108323002B (en) * | 2017-01-16 | 2022-10-28 | 中兴通讯股份有限公司 | Printed circuit board and method |
| CN107222972A (en) * | 2017-06-14 | 2017-09-29 | 鹤山市中富兴业电路有限公司 | A kind of PCB construction and its manufacture craft for being embedded with passive device |
| CN108161253B (en) * | 2017-11-13 | 2019-10-15 | 上海申和热磁电子有限公司 | A kind of method of aperture on double-sided copper-clad ceramic substrate single side copper foil |
| CN109168249B (en) * | 2018-10-16 | 2020-01-03 | Oppo（重庆）智能科技有限公司 | Circuit board and manufacturing method thereof |
| CN112040674A (en) * | 2020-07-07 | 2020-12-04 | 广德三生科技有限公司 | Stepped blind slot mixed-compression high-frequency microwave printed circuit board and processing method thereof |
| CN114286507B (en) * | 2022-01-19 | 2024-03-29 | 瑞华高科技电子工业园(厦门)有限公司 | Double-sided FPC and manufacturing method thereof |
| CN116207050B (en) * | 2023-05-05 | 2023-07-07 | 成都恪赛科技有限公司 | Phased array TR chip packaging structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH08130376A (en) * | 1994-10-31 | 1996-05-21 | Matsushita Electric Works Ltd | Manufacture of multilayer printed wiring board |
| CN101697660B (en) * | 2009-10-28 | 2011-08-10 | 深南电路有限公司 | Method for processing stepped groove bottom patterned circuit board |
| CN102438413B (en) * | 2011-10-17 | 2014-04-02 | 广州杰赛科技股份有限公司 | Second-order ladder groove bottom graphical printed board and processing method thereof |
| CN103313515B (en) * | 2012-03-15 | 2016-07-06 | 北大方正集团有限公司 | The manufacture method of printed circuit board (PCB) step trough and comprise the printed circuit board (PCB) of step trough |
| CN103929884A (en) * | 2013-01-16 | 2014-07-16 | 深圳市牧泰莱电路技术有限公司 | Method for manufacturing printed circuit board with step slotted hole |
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