CN104600172A - 倒装芯片型led支架及其制造方法 - Google Patents
倒装芯片型led支架及其制造方法 Download PDFInfo
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- CN104600172A CN104600172A CN201410459700.7A CN201410459700A CN104600172A CN 104600172 A CN104600172 A CN 104600172A CN 201410459700 A CN201410459700 A CN 201410459700A CN 104600172 A CN104600172 A CN 104600172A
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- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000004080 punching Methods 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 14
- 238000005538 encapsulation Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 4
- 239000000084 colloidal system Substances 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 230000003292 diminished effect Effects 0.000 claims description 2
- 241000218202 Coptis Species 0.000 abstract description 7
- 235000002991 Coptis groenlandica Nutrition 0.000 abstract description 7
- 238000005520 cutting process Methods 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 238000010009 beating Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410459700.7A CN104600172A (zh) | 2014-09-10 | 2014-09-10 | 倒装芯片型led支架及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410459700.7A CN104600172A (zh) | 2014-09-10 | 2014-09-10 | 倒装芯片型led支架及其制造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104600172A true CN104600172A (zh) | 2015-05-06 |
Family
ID=53125811
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410459700.7A Pending CN104600172A (zh) | 2014-09-10 | 2014-09-10 | 倒装芯片型led支架及其制造方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104600172A (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106555964A (zh) * | 2015-12-29 | 2017-04-05 | 江西宝荣光电科技有限公司 | 一种用于车头灯的led光源装置及用其制备的led光源装置 |
CN106952990A (zh) * | 2016-01-07 | 2017-07-14 | 深圳市斯迈得半导体有限公司 | 一种芯片级led封装装置及其制作工艺 |
CN107046089A (zh) * | 2016-02-05 | 2017-08-15 | 深圳市斯迈得半导体有限公司 | 一种防硫化和卤化且具有抗氧化功能的倒装封led光源 |
CN107845718A (zh) * | 2016-09-18 | 2018-03-27 | 深圳市斯迈得半导体有限公司 | 一种基材选取灵活的新型结构的led光源的制作方法 |
CN107845705A (zh) * | 2016-09-18 | 2018-03-27 | 深圳市斯迈得半导体有限公司 | 基材通过真空溅射技术制造的新型led光源的制造方法 |
CN107949922A (zh) * | 2015-09-08 | 2018-04-20 | 首尔伟傲世有限公司 | 发光二极管封装件 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1265759A (zh) * | 1997-07-30 | 2000-09-06 | 因芬尼昂技术股份公司 | 芯片模块的制造方法 |
CN101350321A (zh) * | 2007-07-18 | 2009-01-21 | 晶科电子(广州)有限公司 | 直接倒装于支架内的发光二极管的制造方法 |
TW200926385A (en) * | 2007-12-12 | 2009-06-16 | Techwin Opto Electronics Co Ltd | LED leadframe manufacturing method |
CN102201525A (zh) * | 2010-03-25 | 2011-09-28 | Lg伊诺特有限公司 | 发光器件封装及具有该发光器件封装的照明*** |
CN102610733A (zh) * | 2012-02-14 | 2012-07-25 | 博罗承创精密工业有限公司 | Led灯、led支架及led支架料带结构 |
CN203466219U (zh) * | 2013-09-17 | 2014-03-05 | 博罗承创精密工业有限公司 | 分体式led支架 |
-
2014
- 2014-09-10 CN CN201410459700.7A patent/CN104600172A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1265759A (zh) * | 1997-07-30 | 2000-09-06 | 因芬尼昂技术股份公司 | 芯片模块的制造方法 |
CN101350321A (zh) * | 2007-07-18 | 2009-01-21 | 晶科电子(广州)有限公司 | 直接倒装于支架内的发光二极管的制造方法 |
TW200926385A (en) * | 2007-12-12 | 2009-06-16 | Techwin Opto Electronics Co Ltd | LED leadframe manufacturing method |
CN102201525A (zh) * | 2010-03-25 | 2011-09-28 | Lg伊诺特有限公司 | 发光器件封装及具有该发光器件封装的照明*** |
CN102610733A (zh) * | 2012-02-14 | 2012-07-25 | 博罗承创精密工业有限公司 | Led灯、led支架及led支架料带结构 |
CN203466219U (zh) * | 2013-09-17 | 2014-03-05 | 博罗承创精密工业有限公司 | 分体式led支架 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107949922A (zh) * | 2015-09-08 | 2018-04-20 | 首尔伟傲世有限公司 | 发光二极管封装件 |
CN107949922B (zh) * | 2015-09-08 | 2021-04-13 | 首尔伟傲世有限公司 | 发光二极管封装件 |
CN106555964A (zh) * | 2015-12-29 | 2017-04-05 | 江西宝荣光电科技有限公司 | 一种用于车头灯的led光源装置及用其制备的led光源装置 |
CN106952990A (zh) * | 2016-01-07 | 2017-07-14 | 深圳市斯迈得半导体有限公司 | 一种芯片级led封装装置及其制作工艺 |
CN107046089A (zh) * | 2016-02-05 | 2017-08-15 | 深圳市斯迈得半导体有限公司 | 一种防硫化和卤化且具有抗氧化功能的倒装封led光源 |
CN107845718A (zh) * | 2016-09-18 | 2018-03-27 | 深圳市斯迈得半导体有限公司 | 一种基材选取灵活的新型结构的led光源的制作方法 |
CN107845705A (zh) * | 2016-09-18 | 2018-03-27 | 深圳市斯迈得半导体有限公司 | 基材通过真空溅射技术制造的新型led光源的制造方法 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20170808 Address after: 523808, Guangdong, Dongguan province Songshan Lake hi tech Industrial Development Zone, No. 4 industrial North Road, building on the first floor Applicant after: Dongguan wisdom Photoelectric Technology Co., Ltd. Address before: 523808, No. 4, No. 1, industrial North Road, Songshan hi tech Industrial Development Zone, Guangdong, Dongguan Applicant before: Guangdong Changying Precision Technology Co., Ltd. |
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RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150506 |
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