CN104575684B - 一种含有金铜粉的复合导电银浆 - Google Patents
一种含有金铜粉的复合导电银浆 Download PDFInfo
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- 239000000843 powder Substances 0.000 title claims abstract description 38
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- 239000002002 slurry Substances 0.000 title claims abstract description 21
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 15
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- ANBBXQWFNXMHLD-UHFFFAOYSA-N aluminum;sodium;oxygen(2-) Chemical compound [O-2].[O-2].[Na+].[Al+3] ANBBXQWFNXMHLD-UHFFFAOYSA-N 0.000 claims description 6
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 claims description 6
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- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims 1
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- WBHQBSYUUJJSRZ-UHFFFAOYSA-M sodium bisulfate Chemical compound [Na+].OS([O-])(=O)=O WBHQBSYUUJJSRZ-UHFFFAOYSA-M 0.000 claims 1
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- 235000004443 Ricinus communis Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明公开了一种含有金铜粉的复合导电银浆,其是由下述重量份的原料制得:聚酰胺蜡1‑2、20‑25μm银粉40‑50、6‑10μm金粉5‑8、30‑60nm铜粉3‑5、改性玻璃粉14‑20、氢化蓖麻油0.8‑1.4、马来酸二辛酯 0.5‑1、聚氨酯树脂2‑4、松香4‑8、三氯乙烯18‑30、醋酸甲酯4‑7、硬酯酸丁酯0.2‑0.5、二羟乙基咪唑啉0.7‑1.2、二乙二醇***醋酸酯0.4‑0.6、硅烷偶联剂kh540 0.5‑0.8。本发明将金粉、铜粉以及改性处理后的玻璃粉添加到原料中,通过不同粒径的原料复配,使得附着力强,耐温湿性能好。
Description
技术领域
本发明属导电银浆领域,尤其涉及一种含有金铜粉的复合导电银浆。
背景技术
烧结型银导电浆料需要烧结成膜,烧结温度>500℃,玻璃粉或氧化物作为粘接相。银粉按照粒径分类,平均粒径<0.1μm(100nm)为纳米银粉; 0.1μm< Dav(平均粒径) <10.0μm为银微粉;Dav(平均粒径)> 10.0μm为粗银粉。粉末的制备方法有很多,就银而言,可一次采用物理法(等离子、雾化法),化学法(硝酸银热分解法、液相还原)。由于银是贵金属,易被还原而回到单质状态,因此液相还原法是目前制备银粉的最主要的方法。即将银盐(硝酸银等)溶于水中,加入化学还原剂(如水合肼等),沉积出银粉,经过洗涤、烘干而得到银还原粉,平均粒径在0.1-10.0μm之间,还原剂的选择、反应条件的控制、界面活性剂的使用,可以制备不同物理化学特性的银微粉(颗粒形态、分散程度、平均粒径以及粒径分布、比表面积、松装密度、振实密度、晶粒大小、结晶性等),对还原粉进行机械加工(球磨等)可得光亮银粉(polished silver powder),片状银粉(silver flake)。
发明内容
本发明的目的是提供一种含有金铜粉的复合导电银浆。
为了实现上述目的本发明采用如下技术方案:
一种含有金铜粉的复合导电银浆,其是由下述重量份的原料制得:
聚酰胺蜡1-2、20-25μm银粉40-50、6-10μm金粉5-8、30-60nm铜粉3-5、改性玻璃粉14-20、氢化蓖麻油0.8-1.4、马来酸二辛酯 0.5-1、聚氨酯树脂2-4、松香4-8、三氯乙烯18-30、醋酸甲酯4-7、硬酯酸丁酯0.2-0.5、二羟乙基咪唑啉0.7-1.2、二乙二醇***醋酸酯0.4-0.6、硅烷偶联剂kh540 0.5-0.8;
改性玻璃粉由下述重量份的原料制得:废玻璃粉10-20、Na2O2-4、Bi2O3 5-8,ZnO5-7,V2O5 4-6, SnO2 5-7、铝酸钠1-2、聚乙烯蜡2-4、氯化石蜡1-2、烷基苯磺酸钠2-4、偏硅酸钠3-5、土耳其红油 0.1-0.2,亚硫酸氢钠1-2、卵磷脂1-2、去离子水100-150;
所述的改性玻璃粉的制备方法为:
(1)将铝酸钠、聚乙烯蜡、氯化石蜡、以及去离子水加入反应釜中,300-400转/分搅拌均匀,再加入烷基苯磺酸钠、偏硅酸钠、土耳其红油 、亚硫酸氢钠、卵磷脂、升温至130-150℃,200-500rpm下搅拌均匀,得改性液;
(2)其余原料混匀烧结,烧结温度为1200-1400℃,时间为0.5-2小时,得玻璃熔融体淬火、球磨、干燥,过筛得30-50μm玻璃粉;
(3)将玻璃粉与改性液混匀,于30-50℃下搅拌1-2小时,静置5-8小时,抽滤干燥,即得。
所述的一种含有金铜粉的复合导电银浆,制备方法包括以下步骤:
(1)将氢化蓖麻油、马来酸二辛酯、聚氨酯树脂、松香、三氯乙烯、醋酸甲酯、硬酯酸丁酯、二羟乙基咪唑啉、二乙二醇***醋酸酯、硅烷偶联剂kh540于35-45℃下搅拌30-40分钟,得有机载体备用;
(2)将改性玻璃粉加入到有机载体中,搅拌混和,再加入6-10μm金粉混匀,再加入30-60nm铜粉混和均匀,再加入剩余原料,搅拌均匀得浆料;
(3)浆料球磨,研磨至浆料细度小于10μm,即得。
本发明的有益效果:
本发明将金粉、铜粉以及改性处理后的玻璃粉添加到原料中,通过不同粒径的原料复配,使得附着力强,耐温湿性能好。
具体实施方式
一种含有金铜粉的复合导电银浆,其是由下述重量(kg)的原料制得:
聚酰胺蜡1、20-25μm银粉40、6-10μm金粉8、30-60nm铜粉5、改性玻璃粉20、氢化蓖麻油0.8、马来酸二辛酯 1、聚氨酯树脂4、松香8、三氯乙烯30、醋酸甲酯4、硬酯酸丁酯0.2、二羟乙基咪唑啉0.7、二乙二醇***醋酸酯0.6、硅烷偶联剂kh540 0.5;
改性玻璃粉由下述重量(kg)的原料制得:废玻璃粉20、Na2O4、Bi2O3 5,ZnO 7,V2O55, SnO2 5、铝酸钠2、聚乙烯蜡4、氯化石蜡2、烷基苯磺酸钠2、偏硅酸钠3、土耳其红油 0.2,亚硫酸氢钠1、卵磷脂1、去离子水130;
所述的改性玻璃粉的制备方法为:
(1)将铝酸钠、聚乙烯蜡、氯化石蜡、以及去离子水加入反应釜中,400转/分搅拌均匀,再加入烷基苯磺酸钠、偏硅酸钠、土耳其红油 、亚硫酸氢钠、卵磷脂、升温至130℃,300rpm下搅拌均匀,得改性液;
(2)其余原料混匀烧结,烧结温度为1300℃,时间为0.8小时,得玻璃熔融体淬火、球磨、干燥,过筛得30-50μm玻璃粉;
(3)将玻璃粉与改性液混匀,于40℃下搅拌2小时,静置6小时,抽滤干燥,即得。
所述的一种含有金铜粉的复合导电银浆,制备方法包括以下步骤:
(1)将氢化蓖麻油、马来酸二辛酯、聚氨酯树脂、松香、三氯乙烯、醋酸甲酯、硬酯酸丁酯、二羟乙基咪唑啉、二乙二醇***醋酸酯、硅烷偶联剂kh540于45℃下搅拌40分钟,得有机载体备用;
(2)将改性玻璃粉加入到有机载体中,搅拌混和,再加入6-10μm金粉混匀,再加入30-60nm铜粉混和均匀,再加入剩余原料,搅拌均匀得浆料;
(3)浆料球磨,研磨至浆料细度小于10μm,即得。
采用丝网印刷机将银浆印刷于125mm×125mm Si基板上,然后在180℃干燥,再在880℃进行快速烧制电极引线,高温烧结后制成的电极引线表面银白,光滑无缺陷,剥离强度12.2N/cm,锡焊性能良好,方阻<10 Siements/sq,制备的太阳能电池光电转化效率为18.9%,拉力测试结果为附着力>13.5N/mm2。
Claims (2)
1.一种含有金铜粉的复合导电银浆,其特征在于,其是由下述重量份的原料制得: 聚酰胺蜡1-2、20-25μm银粉40-50、6-10μm金粉5-8、30-60nm铜粉3-5、改性玻璃粉14-20、氢化蓖麻油0.8-1.4、马来酸二辛酯 0.5-1、聚氨酯树脂2-4、松香4-8、三氯乙烯18-30、醋酸甲酯4-7、硬酯酸丁酯0.2-0.5、二羟乙基咪唑啉0.7-1.2、二乙二醇***醋酸酯0.4-0.6、硅烷偶联剂kh540 0.5-0.8; 改性玻璃粉由下述重量份的原料制得:废玻璃粉10-20、Na2O 2-4、Bi2O3 5-8,ZnO 5-7,V2O5 4-6, SnO2 5-7、铝酸钠1-2、聚乙烯蜡2-4、氯化石蜡1-2、烷基苯磺酸钠2-4、偏硅酸钠3-5、土耳其红油 0.1-0.2、亚硫酸氢钠1-2、卵磷脂1-2、去离子水100-150; 所述的改性玻璃粉的制备方法为: (1)将铝酸钠、聚乙烯蜡、氯化石蜡以及去离子水加入反应釜中,300-400转/分搅拌均匀,再加入烷基苯磺酸钠、偏硅酸钠、土耳其红油 、亚硫酸氢钠、卵磷脂,升温至130-150℃,200-500rpm下搅拌均匀,得改性液; (2)其余原料混匀烧结,烧结温度为1200-1400℃,时间为0.5-2小时,得玻璃熔融体,淬火、球磨、干燥,过筛得30-50μm玻璃粉; (3)将玻璃粉与改性液混匀,于30-50℃下搅拌1-2小时,静置5-8小时,抽滤干燥,即得。
2.根据权利要求1所述的一种含有金铜粉的复合导电银浆,其特征在于:制备方法包括以下步骤:
(1)将氢化蓖麻油、马来酸二辛酯、聚氨酯树脂、松香、三氯乙烯、醋酸甲酯、硬酯酸丁酯、二羟乙基咪唑啉、二乙二醇***醋酸酯、硅烷偶联剂kh540于35-45℃下搅拌30-40分钟,得有机载体备用;
(2)将改性玻璃粉加入到有机载体中,搅拌混合,再加入6-10μm金粉混匀,再加入30-60nm铜粉混合均匀,再加入剩余原料,搅拌均匀得浆料;
(3)浆料球磨,研磨至浆料细度小于10μm,即得。
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