CN104532183B - The preparation method of high-precision mask plate - Google Patents
The preparation method of high-precision mask plate Download PDFInfo
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- CN104532183B CN104532183B CN201510039433.2A CN201510039433A CN104532183B CN 104532183 B CN104532183 B CN 104532183B CN 201510039433 A CN201510039433 A CN 201510039433A CN 104532183 B CN104532183 B CN 104532183B
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- mask
- mask plate
- mask substrate
- substrate
- perforate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
Abstract
The present invention provides a kind of preparation method of high-precision mask plate, the opening area of mask substrate is first thinned to by the thickness that laser can be penetrated using half-etching processing procedure, then tension force is applied in the surrounding of mask substrate, make its surfacing, and mask substrate is welded on mask frame, afterwards with the perforate for the pattern for being cut by laser out mask plate demand, 1 micron of characteristic is can reach to mask substrate perforate using the lasing beam diameter of laser cutting, improve the perforate precision of mask plate and the positional precision of perforate, so as to more accurately produce the mask plate in accordance with design bore size；1 micron of characteristic is can reach using lasing beam diameter simultaneously, the perforate with minimum line width values can be produced on mask plate, so as to improve the resolution ratio of display；Further, since the cost of equipment reduction needed for production, so as to significantly reduce the production cost of mask plate；Because processing procedure process shortens, so that the production efficiency of mask plate greatly improved.
Description
Technical field
The present invention relates to the making field of organic light emitting diode display, more particularly to a kind of system of high-precision mask plate
Make method.
Background technology
Organic light emitting diode display (Organic Light Emitting Diode, OLED) is a kind of great development
The flat panel display of prospect, it has very excellent display performance, particularly self-luminous, simple in construction, ultra-thin, response
Speed is fast, wide viewing angle, low-power consumption and can realize the characteristics such as Flexible Displays, " dreamlike display " is described as, along with its production is set
Standby investment is much smaller than TFT-LCD, has obtained the favor of major display producers, it has also become the third generation is shown in display technology field
The main force of device.Current OLED has been in the eve of scale of mass production, with research further deeply, new technology it is continuous
Emerge in large numbers, OLED display device there will be a breakthrough development.
OLED has anode, organic luminous layer and the negative electrode being sequentially formed on substrate.Each function material layers of OLED and the moon
Pole metal layer thin film is prepared by vacuum thermal evaporation technique, and vacuum thermal evaporation technique needs to use mask plate (Mask).Mask
The effect of plate is OLED material evaporation is arrived the position designed, therefore position of opening, shape and the surface smoothness of mask plate
It is all quite important.Fig. 1 show in the schematic diagram of OLED material vacuum thermal evaporation process, crucible 100 add it is to be deposited
OLED material 200, less than 10-5Under Pa vacuum environment, crucible 100 slowly heats up, and reaches the gasification temperature of OLED material 200
After degree, OLED material 200 slowly becomes gaseous state distillation and come up, and through the perforate of mask plate 300, gaseous molecular is in substrate 400
Surface is deposited, and cooling condenses into solid-state molecular.The continuous accumulation of OLED material molecule slowly forms film on substrate 400.
Fig. 2 to Fig. 6 is referred to, is the schematic diagram of the mask plate manufacturing process of existing OLED material vacuum thermal evaporation.
The manufacturing process is generally comprised：Step 1, as shown in Fig. 2 making stainless steel mask frame (Frame) 10；Step 2, such as Fig. 3 institutes
Show there is provided mask substrate 20 ', the mask substrate 20 ' is usually 20 μm to 100 μm of stainless steel or the thin slice of dilval steel；
Step 3, as shown in figure 4, to mask substrate 20 ' carry out patterned process, i.e., some apertures 21 are opened in mask substrate 20 '；Step
Rapid 4, as shown in figure 5, applying certain tension force in the surrounding of mask substrate 20 ', its surfacing is made, and perforate 21 is without deformation,
Then mask substrate 20 ' and mask frame 10 are aligned；Step 5, as shown in fig. 6, laser spot welding, make mask substrate 20 ' with
Mask frame 10 welds together, and mask plate 20 is made.Complete after above-mentioned manufacturing process, the surface of obtained mask plate 20 is put down
Whole, perforate 21 is undeformed.
In order to improve the high-resolution of display, the size for generally designing light emitting pixel all very littles, so needing mask
The bore size of plate also very little.The preparation method of traditional mask plate is generally using painting photoresistance, exposure, for the first time development, chemistry
Etch, clean, applying the processing procedures such as photoresistance, exposure, development and second of chemical etching to carry out perforate to mask substrate again.
But the preparation method for carrying out perforate using chemical etching, due to the limitation of process conditions, in general perforate precision will
Less than 2 μm, aperture widths are less than 20 μm and have been difficult to realize, and thrown the net again after perforate and can make the shapes and sizes of opening with
Design size produces deviation, so that the perforate precision of mask plate is not high.
The mask plate made using traditional handicraft is generally had as a drawback that：Line width (the Critical of perforate on mask plate
Dimension, CD) precision be ± 2 μm~± 3 μm；The minimum feature of the perforate is about 20~30 μm；There are 2~3 μm simultaneously
Evaporation dead angle.
The content of the invention
It is an object of the invention to provide a kind of high-precision mask board manufacturing method, by using laser in mask substrate
Opening area after half-etching is cut, and can more accurately be produced the mask plate in accordance with design bore size, be carried
The perforate precision and the positional precision of perforate of high mask plate, reduce the production cost of mask plate, improve the production efficiency of mask plate.
To achieve the above object, the invention provides a kind of preparation method of high-precision mask plate, comprise the following steps：
Step 1, one mask substrate of offer, photoresistance is applied in the mask substrate, and the mask substrate for scribbling photoresistance is carried out
Exposure, developing manufacture process, so as to form opening area and non-open area in the mask substrate；
Step 2, the opening area to mask substrate carry out half-etching, then remove photoresistance, and clean mask substrate；
Step 3, the tension force certain to the application of mask substrate surrounding, make its surfacing, then provide a mask frame, will
Mask substrate is aligned with mask frame, and mask substrate is welded together with mask frame；
Step 4, according to design attitude and size, with the opening area in laser cutting mask substrate, cut out mask plate
The perforate of the pattern of demand, completes the making of mask plate.
The material of mask substrate is stainless steel or dilval in the step 1.
The thickness of the mask substrate is 20 μm to 100 μm.
Exposure is completed using film light shield in the step 1.
Half-etching, the mask substrate after half-etching are carried out to mask substrate using chemical etching process in the step 2
The upper thickness positioned at opening area is less than or equal to 5 μm.
Apply certain tension force in the step 3 to mask substrate surrounding using screen-tensioning machine, make its surfacing.
The material of mask frame described in the step 3 is stainless steel.
Mask substrate is welded together with mask frame using laser spot welding technique in the step 3.
A diameter of 1 μm of the laser beam being cut by laser in the step 4.
The Line-width precision of mask plate made from the step 4 is less than or equal to 1.5 μm.
Beneficial effects of the present invention：The preparation method for a kind of high-precision mask plate that the present invention is provided, first using half-etching
The opening area of mask substrate is thinned to the thickness that laser can be penetrated by processing procedure, then applies tension force in the four of mask substrate
In week, make its surfacing, and mask substrate is welded on mask frame, afterwards with the pattern for being cut by laser out mask plate demand
Perforate, the characteristic that can reach 1 micron using the lasing beam diameter of laser cutting improves mask plate to mask substrate perforate
Perforate precision and the positional precision of perforate, so as to more accurately produce the mask plate in accordance with design bore size；Simultaneously
1 micron of characteristic is can reach using lasing beam diameter, the perforate with minimum line width values can be produced on mask plate, so that
Improve the resolution ratio of display；Further, since the cost of equipment reduction needed for production, so as to significantly reduce the production of mask plate
Cost；Because processing procedure process shortens, so that the production efficiency of mask plate greatly improved.
In order to be able to be further understood that the feature and technology contents of the present invention, refer to below in connection with the detailed of the present invention
Illustrate and accompanying drawing, however accompanying drawing only provide with reference to and explanation use, not for being any limitation as to the present invention.
Brief description of the drawings
Below in conjunction with the accompanying drawings, it is described in detail by the embodiment to the present invention, technical scheme will be made
And other beneficial effects are apparent.
In accompanying drawing,
Fig. 1 is the schematic diagram of OLED material vacuum thermal evaporation process；
Fig. 2 is the schematic diagram of existing mask plate manufacturing process step 1；
Fig. 3 is the schematic diagram of existing mask plate manufacturing process step 2；
Fig. 4 is the schematic diagram of existing mask plate manufacturing process step 3；
Fig. 5 is the schematic diagram of existing mask plate manufacturing process step 4；
Fig. 6 is the schematic diagram of existing mask plate manufacturing process step 5；
Fig. 7 is the flow chart of the preparation method of the high-precision mask plate of the present invention.
Embodiment
Further to illustrate the technological means and its effect of the invention taken, below in conjunction with being preferable to carry out for the present invention
Example and its accompanying drawing are described in detail.
Referring to Fig. 7, the invention provides a kind of preparation method of high-precision mask plate, comprising the following steps：
Step 1, one mask substrate of offer, photoresistance is applied in the mask substrate, and the mask substrate for scribbling photoresistance is carried out
Exposure, developing manufacture process, so as to form opening area and non-open area in the mask substrate.
Specifically, the material of mask substrate is stainless steel or dilval in the step 1.The thickness of the mask substrate
For 20 μm to 100 μm.Exposure is completed using film light shield in the step 1.
The mask substrate preparation method of traditional use chemical etching perforate, due to directly forming perforate in the stage, be
Ensure perforate precision, it is therefore desirable to the high-precision quartz mask of use, and the mask board manufacturing method of the present invention, due in the rank
Section simultaneously not directly forms perforate, therefore need not precisely expose, and is exposed using film light shield, so as to significantly reduce life
Produce cost.
Step 2, the opening area to mask substrate carry out half-etching, then remove photoresistance, and clean mask substrate.
Specifically, carrying out half-etching to mask substrate using chemical etching process in the step 2, covered after half-etching
The thickness that ilm substrate is located at opening area is less than or equal to 5 μm.
The reason for carrying out half-etching be, existing mask substrate it is general it is most thin be merely able to reach 30 μm, but 30 μm of thickness
Degree laser can not be punched, first pass through half-etching, the thickness of the opening area of mask plate is reduced into 5 μm can effectively solve this and ask
Topic, is that the laser cutting perforate of subsequent step is ready.
Step 3, certain tension force applied to mask substrate surrounding using screen-tensioning machine, make its surfacing, then provide one
Mask frame, the mask substrate after throwing the net is aligned with mask frame, and mask substrate and mask frame are welded on into one
Rise；
Specifically, the material of mask frame described in the step 3 is stainless steel；Laser spot welding is used in the step 3
Technique welds together mask substrate with mask frame.
By throwing the net mask substrate, the tenesmus amount of mask substrate can be effectively controlled, further, by that will apply
Plus tension force and welding step are placed on before perforate, it is to avoid thrown the net to the deformation for being open and causing, carried again after perforate
The high perforate precision and the positional precision of perforate of mask plate；Simultaneously because the shadow that the processing procedure that is not required to consider to throw the net is caused to perforate
Ringing, the accurate screen-tensioning machine used during without making high-precision mask plate using prior art, need to only use and making low essence
The common screen-tensioning machine used during degree mask plate, so as to save 1/3 cost of equipment.
Step 4, according to design attitude and size, with the opening area in laser cutting mask substrate, cut out mask plate
The perforate of the pattern of demand, completes the making of mask plate.
Particularly, the diameter for the laser beam being cut by laser in the step 4 is minimum up to 1 μm, so that the step 4 is made
Mask plate on line width (Critical Dimension, CD) precision (error) of perforate≤1.5 μm can be reached, on the mask plate
Total spacing (TP, Total Pitch) precision (error) of perforate can effectively Bei control Zhi≤1.5 μm, and pass through in the prior art
The precision (error) of chemical etching perforate is generally higher than 2 μm, so that compared with prior art, perforate precision can be made more in the present invention
High mask plate.
Further, 1 micron of characteristic is can reach using lasing beam diameter, can be produced on mask plate with minimum
The perforate of line width values so that the resolution ratio of display panel can readily exceed 600PPI, and (Pixels PerInch, per inch is possessed
Number of pixels).
Specifically, the present invention completes perforate by using laser cutting parameter, used with existing chemical etch technique
Exposure machine is compared, and the radium-shine laser machine with precision is less expensive compared with exposure machine, only the 2/3 of exposure machine expense.
It is noted that compared with prior art, the preparation method of mask plate of the invention not only increases perforate essence
Degree, effectively reduces production cost, and because processing procedure process shortens many, so that production efficiency greatly improved.
In summary, the preparation method for a kind of high-precision mask plate that the present invention is provided, will first be covered using half-etching processing procedure
The opening area of ilm substrate is thinned to the thickness that laser can be penetrated, and then applies tension force in the surrounding of mask substrate, makes its table
Face is smooth, and mask substrate is welded on mask frame, afterwards with the perforate for the pattern for being cut by laser out mask plate demand, profit
The characteristic that 1 micron is can reach with the lasing beam diameter of laser cutting improves the perforate precision of mask plate to mask substrate perforate
With the positional precision of perforate, so as to more accurately produce in accordance with design bore size mask plate；Utilize laser simultaneously
Beam diameter can reach 1 micron of characteristic, and the perforate with minimum line width values can be produced on mask plate, so as to improve display
The resolution ratio of device；Further, since the cost of equipment reduction needed for production, so as to significantly reduce the production cost of mask plate；By
Shorten in processing procedure process, so that the production efficiency of mask plate greatly improved.
It is described above, for the person of ordinary skill of the art, can be with technique according to the invention scheme and technology
Other various corresponding changes and deformation are made in design, and all these changes and deformation should all belong to the claims in the present invention
Protection domain.
Claims (8)
1. a kind of preparation method of high-precision mask plate, it is characterised in that comprise the following steps：
Step 1, one mask substrate of offer, photoresistance is applied in the mask substrate, the mask substrate for scribbling photoresistance is exposed,
Developing manufacture process, so as to form opening area and non-open area in the mask substrate；
Step 2, the opening area to mask substrate carry out half-etching, then remove photoresistance, and clean mask substrate；
Step 3, the tension force certain to the application of mask substrate surrounding, make its surfacing, a mask frame are then provided, by mask
Substrate is aligned with mask frame, and mask substrate is welded together with mask frame；
Step 4, according to design attitude and size, with the opening area in laser cutting mask substrate, cut out mask plate demand
Pattern perforate, complete mask plate making；
Apply certain tension force in the step 3 to mask substrate surrounding using screen-tensioning machine, make its surfacing；
Half-etching is carried out to mask substrate using chemical etching process in the step 2, mask substrate is upper after half-etching
It is less than or equal to 5 μm in the thickness of opening area.
2. the preparation method of high accuracy mask plate as claimed in claim 1, it is characterised in that mask substrate in the step 1
Material be stainless steel or dilval.
3. the preparation method of the high-precision mask plate as described in power claim 1, it is characterised in that the thickness of the mask substrate
For 20 μm to 100 μm.
4. the preparation method of high accuracy mask plate as claimed in claim 1, it is characterised in that film is used in the step 1
Light shield completes exposure.
5. the preparation method of high accuracy mask plate as claimed in claim 1, it is characterised in that mask described in the step 3
The material of frame is stainless steel.
6. the preparation method of high accuracy mask plate as claimed in claim 1, it is characterised in that laser is used in the step 3
Spot-welding technology welds together mask substrate with mask frame.
7. the preparation method of high accuracy mask plate as claimed in claim 1, it is characterised in that laser is carried out in the step 4
A diameter of 1 μm of the laser beam of cutting.
8. the preparation method of high accuracy mask plate as claimed in claim 1, it is characterised in that mask made from the step 4
The Line-width precision of plate is less than or equal to 1.5 μm.
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| CN201510039433.2A CN104532183B (en) | 2015-01-26 | 2015-01-26 | The preparation method of high-precision mask plate |
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