CN104511988A - Special tooling for waste edge removal mold for plastic package of surface mount device diode - Google Patents
Special tooling for waste edge removal mold for plastic package of surface mount device diode Download PDFInfo
- Publication number
- CN104511988A CN104511988A CN201410650749.0A CN201410650749A CN104511988A CN 104511988 A CN104511988 A CN 104511988A CN 201410650749 A CN201410650749 A CN 201410650749A CN 104511988 A CN104511988 A CN 104511988A
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- pressure pin
- special tooling
- connecting plate
- rectangular frame
- axis direction
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- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention relates to a special tooling for a waste edge removal mold for plastic package of surface mount device diodes. The special tooling includes a rectangular frame; the inner wall of the rectangular frame clings to a periphery formed by four terrace die groups of a lower template; centers of the two short edges of the rectangular frame are provided with a vertically arranged inward connecting plate; the connecting plate is just between the two terrace die groups in the short axis direction of the lower template; two long axis edges of the rectangular frame are provided with a plurality of vertically arranged inward supporting rods A; both sides of the long axis direction of the connecting plate are provided with a plurality of vertically arranged outward supporting rods B; and the supporting rods A and B are corresponding to both ends of the long axis direction of terrace dies. The invention has the advantages that special tooling for a waste edge removal mold for plastic package of surface mount device diodes is a rectangular frame, the rectangular frame holds the 8 frames on the lower template, so as to save manpower and improve production efficiency.
Description
Technical field
The present invention relates to a kind of production auxiliary equipment of diode, particularly a kind of stamp-mounting-paper diode plastic packaging removes slitter edge mould special tooling.
Background technology
Diode be a kind of can the electronic device of unidirectional conductive electric current; production process comprises the steps such as welding, pickling, injection mo(u)lding, and wherein, injection-moulding step is carrying out shaping to material; encapsulated at the black glue in the outside of material, with protect inside chip material interference-free with pollute.
Stamp-mounting-paper diode is after carrying out injection molding processes, the cast runner to being connected with diode semi-finished product body after injection mo(u)lding is needed to remove, as shown in Figure 1, two pole frame set of cast runner to be removed, comprise the lead frame group of four group pattern distributions, the lead frame 1 that often group lead frame group is arranged by two adjacent spaces forms, and main running channel 2 is positioned at the center of four groups of lead frame groups.
Slitter edge is gone to carry out on particular manufacturing craft at present, two pole frame set of slitter edge above-mentioned to be gone are needed to be transferred on the lower bolster of mould before this, the structure of this lower bolster is as shown in Figure 2, the surrounding of the upper surface of lower bolster 3 has the die group of four array distribution on lower bolster 3, and by two, adjacent and spaced die 4 forms die group.
Take manual type at present, its shortcoming is due to for after the injection moulding simultaneously of many group diode frameworks, then carries out slitter edge simultaneously, manually transfers inconvenience, reduces production efficiency.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of convenient transfer diode framework and removes slitter edge mould special tooling to removing the stamp-mounting-paper diode plastic packaging in slitter edge mould.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of stamp-mounting-paper diode plastic packaging removes slitter edge mould special tooling, its innovative point is: comprise a rectangle frame, the inwall of this rectangle frame is just close to the outside of lower bolster four groups of punch set compositions, all have an inside vertically disposed connecting plate at the center on rectangle frame two minor axis limits, this connecting plate is just between lower bolster short-axis direction two groups of punch set; Two major axis limits of described rectangle frame are all provided with some both sides inwardly vertically arranging pressure pin A connecting plate long axis direction and all have some outside vertically disposed pressure pin B, this pressure pin A and pressure pin B all corresponding two ends at punch long axis direction.
Further, described pressure pin A and pressure pin B is T-shaped.
The invention has the advantages that: stamp-mounting-paper diode plastic packaging of the present invention goes slitter edge mould special tooling to be a rectangle frame, just this rectangle frame is put on the lower bolster of injection mold before injection moulding, after injection moulding completes, by holding up rectangle frame, thus hold up all frame set, and then the frame set entirety that rectangle frame holds up together with rectangle frame is put on the lower bolster of slitter edge mould, save manpower and materials, improve production efficiency; Pressure pin is T-shaped, enhances the structure of pressure pin.
Accompanying drawing explanation
Fig. 1 is the structural representation of the diode frame set of current cast runner to be removed.
Fig. 2 is the structural representation removing lower bolster in slitter edge mould at present.
Fig. 3 stamp-mounting-paper diode plastic packaging of the present invention removes the structural representation of slitter edge mould special tooling.
Detailed description of the invention
As shown in Figure 3, the invention discloses a kind of stamp-mounting-paper diode plastic packaging and remove slitter edge mould special tooling, comprise a rectangle frame 5, the inwall of this rectangle frame 5 is just close to the outside of lower bolster 3 four groups of punch set compositions, all have an inside vertically disposed connecting plate 6 at the center on rectangle frame 5 two minor axis limits, this connecting plate 6 is just between lower bolster short-axis direction two groups of punch set; Two major axis limits of rectangle frame 5 are all provided with some both sides inwardly vertically arranging pressure pin A7 connecting plate 6 long axis direction and all have some outside vertically disposed pressure pin B8, this pressure pin A7 and pressure pin B8 all corresponding two ends at punch 4 long axis direction, in order to strengthen the structure of pressure pin A7 and pressure pin B8 in the present embodiment, pressure pin A7 and pressure pin B8 is T-shaped.
During use, just by this rectangle circle is around injection mold lower bolster before injection moulding, after injection moulding completes, by holding up rectangle frame, thus hold up all frameworks, and then the framework entirety that rectangle frame holds up together with rectangle frame is put on the lower bolster of slitter edge mould, now rectangle frame is enclosed in the outside of punch set composition, after going slitter edge to complete, then picking-up rectangle frame is transferred to next station together with framework again.
More than show and describe general principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (2)
1. a stamp-mounting-paper diode plastic packaging removes slitter edge mould special tooling, it is characterized in that: comprise a rectangle frame, the inwall of this rectangle frame is just close to the outside of lower bolster four groups of punch set compositions, all have an inside vertically disposed connecting plate at the center on rectangle frame two minor axis limits, this connecting plate is just between lower bolster short-axis direction two groups of punch set; Two major axis limits of described rectangle frame are all provided with some both sides inwardly vertically arranging pressure pin A connecting plate long axis direction and all have some outside vertically disposed pressure pin B, this pressure pin A and pressure pin B all corresponding two ends at punch long axis direction.
2. stamp-mounting-paper diode plastic packaging according to claim 1 removes slitter edge mould special tooling, it is characterized in that: described pressure pin A and pressure pin B is T-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410650749.0A CN104511988B (en) | 2014-11-17 | 2014-11-17 | A kind of stamp-mounting-paper diode plastic packaging removes slitter edge mould special tooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410650749.0A CN104511988B (en) | 2014-11-17 | 2014-11-17 | A kind of stamp-mounting-paper diode plastic packaging removes slitter edge mould special tooling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104511988A true CN104511988A (en) | 2015-04-15 |
| CN104511988B CN104511988B (en) | 2017-08-11 |
Family
ID=52788145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410650749.0A Active CN104511988B (en) | 2014-11-17 | 2014-11-17 | A kind of stamp-mounting-paper diode plastic packaging removes slitter edge mould special tooling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104511988B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2052829A1 (en) * | 2007-10-26 | 2009-04-29 | Aplix | Insertion block for forming a field of hooks on an injection-moulded object and moulded object comprising a field of hooks of this type |
| CN202111068U (en) * | 2011-06-17 | 2012-01-11 | 如皋市易达电子有限责任公司 | Mould for removing waste edge of patch diode |
| CN203371709U (en) * | 2013-07-23 | 2014-01-01 | 宁波通宝精密机械有限公司 | Rubber-edge tearing mold |
| CN204450978U (en) * | 2014-11-17 | 2015-07-08 | 如皋市易达电子有限责任公司 | A kind of stamp-mounting-paper diode plastic packaging removes slitter edge mould special tooling |
-
2014
- 2014-11-17 CN CN201410650749.0A patent/CN104511988B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2052829A1 (en) * | 2007-10-26 | 2009-04-29 | Aplix | Insertion block for forming a field of hooks on an injection-moulded object and moulded object comprising a field of hooks of this type |
| CN202111068U (en) * | 2011-06-17 | 2012-01-11 | 如皋市易达电子有限责任公司 | Mould for removing waste edge of patch diode |
| CN203371709U (en) * | 2013-07-23 | 2014-01-01 | 宁波通宝精密机械有限公司 | Rubber-edge tearing mold |
| CN204450978U (en) * | 2014-11-17 | 2015-07-08 | 如皋市易达电子有限责任公司 | A kind of stamp-mounting-paper diode plastic packaging removes slitter edge mould special tooling |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104511988B (en) | 2017-08-11 |
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Effective date of registration: 20191129 Address after: 237300 Jinzhai Economic Development Zone, Anhui, Lu'an Patentee after: Jinzhai County triumphant return Electronic Science and Technology Co., Ltd. Address before: 226500, Jiangsu Province, Nantong City, Rugao moved by the town group shore village 7 groups Patentee before: Rugao Eada Electronics Co., Ltd. |
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