CN209851448U - Conveniently remove encapsulation mould structure of flash - Google Patents
Conveniently remove encapsulation mould structure of flash Download PDFInfo
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- CN209851448U CN209851448U CN201822207551.1U CN201822207551U CN209851448U CN 209851448 U CN209851448 U CN 209851448U CN 201822207551 U CN201822207551 U CN 201822207551U CN 209851448 U CN209851448 U CN 209851448U
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- tooth
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- encapsulating
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Abstract
The utility model relates to a conveniently remove mould structure of encapsulating of flash, the mould structure includes profile of tooth mold insert (5), every tooth (6) of profile of tooth mold insert (5) are convex structure, and one side of tooth (6) broad of convex structure is close to the region of encapsulating of product. The utility model relates to a conveniently remove encapsulating die structure of flash, it can pile up the flash at the profile of tooth mold insert, makes unnecessary plastic envelope material gather together, makes the flash that original thickness is thin big in area become to have the flash that certain thickness area is little, is convenient for get rid of through die-cut.
Description
Technical Field
The utility model relates to a conveniently remove encapsulation mould structure of flash belongs to semiconductor packaging technology field.
Background
As shown in fig. 1 and 2, in a conventional encapsulating mold design, a tooth-shaped insert is usually placed in the middle of each outer lead of a lead frame, and the molding compound flows into a non-encapsulating area through a cavity of the tooth-shaped insert. The width of the tooth-shaped insert needs to be the same as the distance between the outer pins, however, because the sizes of the frame pins and the tooth-shaped insert have tolerances, if the frame pins are too thin or the width of the tooth-shaped insert is too narrow, flash may be generated at the positions of the pins close to the plastic package during encapsulation, which brings much trouble to the subsequent production and the flash has great influence on the appearance, reliability, weldability and the like of the product. If the electrolytic deburring flash is used, the quality and the productivity of the product are influenced; if the frame pin is too thick or the width of the tooth-shaped insert is too wide, the pin is damaged by pressing a die during die assembly, so that the product is scrapped.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that an encapsulation mould structure and the technological method that conveniently remove flash are provided to above-mentioned prior art, it increases the groove design in the both sides of every tooth of profile of tooth mold insert, can make the flash gathering pin root outside, and then can be convenient get rid of the flash.
The utility model provides a technical scheme that above-mentioned problem adopted does: the encapsulating mold structure convenient for flash removal comprises an upper mold and a lower mold, wherein one or more cavity strips are correspondingly arranged on the upper mold and the lower mold respectively, when the upper mold and the lower mold are closed, a plurality of cavities are formed between the cavity strips of the upper mold and the corresponding cavity strips on the lower mold, a tooth-shaped insert is arranged on one side of each cavity corresponding to a frame pin, each tooth of the tooth-shaped insert is of a convex structure, and one side of the wider tooth of the convex structure is close to an encapsulating area of a product.
The encapsulation mold structure convenient for flash removal comprises a tooth-shaped insert, wherein each tooth of the tooth-shaped insert is of a trapezoid structure, and the wider side of each tooth of the trapezoid structure is close to an encapsulation area of a product.
A packaging mold structure convenient for flash removal comprises a tooth-shaped insert, wherein a groove is arranged on one side, close to a packaging area of a product, of a vertical edge of each tooth of the tooth-shaped insert.
Compared with the prior art, the utility model has the advantages of:
the utility model relates to a conveniently remove encapsulating die structure of flash, it can pile up the flash at the profile of tooth mold insert, makes unnecessary plastic envelope material gather together, makes the flash that original thickness is thin big in area become to have the flash that certain thickness area is little, is convenient for get rid of through die-cut.
Drawings
Fig. 1 is a schematic view of a structure of a conventional encapsulating mold.
Fig. 2 is a schematic diagram of a conventional encapsulating mold structure for generating flash.
Fig. 3 is a schematic structural view of the encapsulating mold for conveniently removing the flash of the present invention.
Fig. 4 is a schematic view of the cavity strip of the encapsulating mold for conveniently removing the flash of the present invention.
Fig. 5 is a schematic view of an embodiment 1 of the structure of the encapsulating mold for conveniently removing flash according to the present invention.
Fig. 6 is a schematic view of an embodiment 2 of the structure of the encapsulating mold for conveniently removing flash according to the present invention.
Fig. 7 is a schematic view of an embodiment 3 of the structure of the encapsulating mold for conveniently removing flash according to the present invention.
Wherein:
wherein:
upper die 1
Lower die 2
Pin 3
Flash 4
Tooth-shaped insert 5
Tooth 6
Plastic package material 7
Groove 8
Cavity bar 9
A mold cavity 10.
Detailed Description
The present invention will be described in further detail with reference to the following embodiments.
Example 1:
as shown in fig. 3, 4 and 5, the encapsulating mold structure convenient for flash removal in this embodiment includes an upper mold 1 and a lower mold 2, the upper mold 1 and the lower mold 2 are respectively and correspondingly provided with one or more cavity bars 9, when the upper mold 1 and the lower mold 2 are closed, a plurality of cavities 10 are formed between the cavity bars of the upper mold 1 and the corresponding cavity bars of the lower mold 2, one side of the cavity 10 corresponding to a frame pin is provided with a tooth-shaped insert 5, each tooth 6 of the tooth-shaped insert 5 is of a convex structure, a wider side of the tooth 6 of the convex structure is close to an encapsulating area of a product, flash can be accumulated at the root of the outer pin during encapsulating, flash with a certain thickness is formed, and meanwhile, a cross section of the flash contacting with a plastic encapsulating body is smaller, so that the flash can be removed by punching conveniently;
example 2:
as shown in fig. 6, in the embodiment, the encapsulating mold structure convenient for flash removal includes an upper mold 1 and a lower mold 2, the upper mold 1 and the lower mold 2 are respectively and correspondingly provided with one or more cavity bars 9, when the upper mold 1 and the lower mold 2 are closed, a plurality of cavities 10 are formed between the cavity bars of the upper mold 1 and the corresponding cavity bars of the lower mold 2, one side of the cavity 10 corresponding to a frame pin is provided with a tooth-shaped insert 5, each tooth 6 of the tooth-shaped insert 5 is in a trapezoid structure, one wider side of the tooth 6 of the trapezoid structure is close to an encapsulating region of a product, flash can be accumulated at the root of the outer pin during encapsulation to form flash with a certain thickness, and meanwhile, the flash has a smaller cross section in contact with a plastic encapsulation body, so that flash can be removed by punching.
Example 3:
as shown in fig. 7, in the embodiment, the encapsulating mold structure convenient for flash removal includes an upper mold 1 and a lower mold 2, the upper mold 1 and the lower mold 2 are respectively and correspondingly provided with one or more cavity bars 9, when the upper mold 1 and the lower mold 2 are closed, a plurality of cavities 10 are formed between the cavity bars of the upper mold 1 and the corresponding cavity bars of the lower mold 2, one side of the cavity 10 corresponding to a frame pin is provided with a tooth-shaped insert 5, one side of a vertical edge of each tooth 6 of the tooth-shaped insert 5, which is close to an encapsulating area of a product, is provided with a groove 8, when encapsulating, flash can be accumulated in the groove to form flash with a certain thickness, and simultaneously, the flash has a smaller cross section contacting with a plastic encapsulation body, so that flash can be removed by punching.
In addition to the above embodiments, the present invention also includes other embodiments, and all technical solutions formed by equivalent transformation or equivalent replacement should fall within the protection scope of the claims of the present invention.
Claims (3)
1. The utility model provides a conveniently remove encapsulation mould structure of flash which characterized in that: the die comprises an upper die (1) and a lower die (2), wherein one or more cavity strips (9) are correspondingly arranged on the upper die (1) and the lower die (2) respectively, when the upper die (1) and the lower die (2) are closed, a plurality of cavities (10) are formed between the cavity strips of the upper die (1) and the corresponding cavity strips on the lower die (2), one side of each cavity (10) corresponding to a frame pin is provided with a tooth-shaped insert (5), each tooth (6) of each tooth-shaped insert (5) is of a convex structure, and one wider side of each tooth (6) of the convex structure is close to an encapsulation area of a product.
2. The utility model provides a conveniently remove encapsulation mould structure of flash which characterized in that: the die comprises an upper die (1) and a lower die (2), wherein one or more cavity strips (9) are correspondingly arranged on the upper die (1) and the lower die (2) respectively, when the upper die (1) and the lower die (2) are closed, a plurality of cavities (10) are formed between the cavity strips of the upper die (1) and the corresponding cavity strips on the lower die (2), a tooth-shaped insert (5) is arranged on one side of each cavity (10) corresponding to a frame pin, each tooth (6) of the tooth-shaped insert (5) is of a trapezoidal structure, and one side of the wider tooth (6) of the trapezoidal structure is close to an encapsulation area of a product.
3. The utility model provides a conveniently remove encapsulation mould structure of flash which characterized in that: the die comprises an upper die (1) and a lower die (2), wherein one or more cavity strips (9) are correspondingly arranged on the upper die (1) and the lower die (2) respectively, when the upper die (1) and the lower die (2) are closed, a plurality of cavities (10) are formed between the cavity strips of the upper die (1) and the corresponding cavity strips on the lower die (2), a tooth-shaped insert (5) is arranged on one side of each cavity (10) corresponding to a frame pin, and a groove (8) is formed in one side of an encapsulating area, close to a product, on a vertical edge of each tooth (6) of the tooth-shaped insert (5).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201822207551.1U CN209851448U (en) | 2018-12-26 | 2018-12-26 | Conveniently remove encapsulation mould structure of flash |
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CN201822207551.1U CN209851448U (en) | 2018-12-26 | 2018-12-26 | Conveniently remove encapsulation mould structure of flash |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109676861A (en) * | 2018-12-26 | 2019-04-26 | 长电科技(宿迁)有限公司 | A kind of encapsulating mold structure and process for conveniently removing flash |
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2018
- 2018-12-26 CN CN201822207551.1U patent/CN209851448U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109676861A (en) * | 2018-12-26 | 2019-04-26 | 长电科技(宿迁)有限公司 | A kind of encapsulating mold structure and process for conveniently removing flash |
WO2020135002A1 (en) * | 2018-12-26 | 2020-07-02 | 长电科技(宿迁)有限公司 | Encapsulation mold structure convenient for removing molding-flash and process method |
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