CN104511988B - A kind of stamp-mounting-paper diode plastic packaging removes slitter edge mould special tooling - Google Patents
A kind of stamp-mounting-paper diode plastic packaging removes slitter edge mould special tooling Download PDFInfo
- Publication number
- CN104511988B CN104511988B CN201410650749.0A CN201410650749A CN104511988B CN 104511988 B CN104511988 B CN 104511988B CN 201410650749 A CN201410650749 A CN 201410650749A CN 104511988 B CN104511988 B CN 104511988B
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- China
- Prior art keywords
- rectangle frame
- pressure pin
- lower template
- slitter edge
- connecting plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Slitter edge mould special tooling is removed the present invention relates to a kind of stamp-mounting-paper diode plastic packaging, including a rectangle frame, the inwall of the rectangle frame is just close to the outside of four groups of punch set compositions of lower template, an inside vertically disposed connecting plate is respectively provided with the center on two short axle sides of rectangle frame, the connecting plate is located just between two groups of punch sets of lower template short-axis direction；Two major axis sides of the rectangle frame are mounted on some both sides for being inwardly vertically arranged pressure pin A connecting plate long axis directions and are respectively provided with some outwards vertically disposed pressure pin B, pressure pin A and the corresponding two ends in punch-pin long axis direction of pressure pin B.The advantage of the invention is that：The stamp-mounting-paper diode plastic packaging of the present invention goes slitter edge mould special tooling to be a rectangle frame, and 8 frameworks in lower template are integrally held up by rectangle frame, manpower and materials is saved, improves production efficiency.
Description
Technical field
The present invention relates to a kind of production auxiliary equipment of diode, more particularly to a kind of stamp-mounting-paper diode plastic packaging removes slitter edge mould
Has special tooling.
Background technology
Diode be it is a kind of can unidirectionally conduct the electronic device of electric current, production process includes welding, pickling, injection molding
Etc. step, wherein, injection-moulding step is molded to material, is encapsulated in the outside of material with black glue, to protect
Inside chip material without interruption with pollution.
Stamp-mounting-paper diode is after injection molding processes are carried out, it is necessary to be connected after to injection molding with diode semi-finished product body
A cast runner be removed, as shown in figure 1, two pole frame sets of a cast runner to be removed, including four group patterns distributions is drawn
Wire frame group, the lead frame 1 that every group of lead frame group is set by two adjacent spaces is constituted, and main running channel 2 is located at four groups of leads
The center of frame set.
Go slitter edge to be carried out on particular manufacturing craft at present, need two pole frame sets of above-mentioned slitter edge to be gone before this
It is transferred in the lower template of mould, the structure of the lower template is as shown in Fig. 2 the surrounding of the upper surface of lower template 3 has four
Cavity plate group of the array distribution in lower template 3, cavity plate group is made up of two adjacent and spaced cavity plates 4.
Take manual type at present, its shortcoming be due to for multigroup diode framework simultaneously be molded after, then simultaneously gone
Slitter edge, artificial transfer is inconvenient, reduces production efficiency.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of convenient transfer diode framework to the patch gone in slitter edge mould
Piece diode plastic packaging removes slitter edge mould special tooling.
In order to solve the above technical problems, the technical scheme is that：A kind of stamp-mounting-paper diode plastic packaging goes slitter edge mould special
With frock, its innovative point is：Including a rectangle frame, the inwall of the rectangle frame is just close to four groups of punch set compositions of lower template
Outside, be respectively provided with an inside vertically disposed connecting plate at the center on two short axle sides of rectangle frame, the connecting plate just position
Between two groups of punch sets of lower template short-axis direction；Two major axis sides of the rectangle frame are mounted on some being inwardly vertically arranged
The both sides of pressure pin A connecting plate long axis directions be respectively provided with it is some outwards vertically disposed pressure pin B, pressure pin A and pressure pin B it is corresponding
The two ends of punch-pin long axis direction.
Further, the pressure pin A and pressure pin B are T-shaped.
The advantage of the invention is that：The stamp-mounting-paper diode plastic packaging of the present invention goes slitter edge mould special tooling to be a rectangle frame,
Just the rectangle frame is put into the lower template of injection mold before injection, after the completion of injection, by holding up rectangle frame, so as to hold up
Rectangle frame, is then integrally put into the lower template of slitter edge mould by all frame sets together with the frame set that rectangle frame is held up again,
Manpower and materials are saved, production efficiency is improved；Pressure pin is T-shaped, enhances the structure of pressure pin.
Brief description of the drawings
Fig. 1 is the structural representation of the diode frame set of current a cast runner to be removed.
Fig. 2 is the structural representation for going lower template in slitter edge mould at present.
Fig. 3 stamp-mounting-paper diode plastic packagings of the present invention remove the structural representation of slitter edge mould special tooling.
Embodiment
As shown in figure 3, removing slitter edge mould special tooling, including a rectangle the invention discloses a kind of stamp-mounting-paper diode plastic packaging
Frame 5, the inwall of the rectangle frame 5 is just close to the outside of 3 four groups of punch set compositions of lower template, in 5 two short axles of rectangle frame
The center on side is respectively provided with an inside vertically disposed connecting plate 6, and the connecting plate 6 is located just at two groups of punch-pin of lower template short-axis direction
Between group；Two major axis sides of rectangle frame 5 are mounted on some both sides for being inwardly vertically arranged the long axis direction of pressure pin A7 connecting plates 6
Some outwards vertically disposed pressure pin B8, pressure pin A7 and the corresponding two ends in the long axis direction of punch-pin 4 of pressure pin B8 are respectively provided with, this
In order to strengthen pressure pin A7 and pressure pin B8 structure in embodiment, pressure pin A7 and pressure pin B8 are T-shaped.
In use, before injection just by the rectangle circle around the injection mold lower template on, after the completion of injection, pass through support
Rectangle frame is played, so as to hold up all frameworks, rectangle frame is integrally then put into slitter edge mould together with the framework that rectangle frame is held up again
In the lower template of tool, now rectangle frame is enclosed in the outside of punch set composition, after the completion of slitter edge is removed, then holds up rectangle again
Frame is transferred to next station together with framework.
The general principle and principal character and advantages of the present invention of the present invention has been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the simply explanation described in above-described embodiment and specification is originally
The principle of invention, without departing from the spirit and scope of the present invention, various changes and modifications of the present invention are possible, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (1)
1. a kind of stamp-mounting-paper diode plastic packaging goes the application method of slitter edge mould special tooling, it is characterised in that：The special tooling bag
A rectangle frame is included, the inwall of the rectangle frame is just close to the outside of four groups of punch sets compositions of lower template, in rectangle frame two
The center on short axle side is respectively provided with an inside vertically disposed connecting plate, and it is convex that the connecting plate is located just at two groups of lower template short-axis direction
Between module；Two major axis sides of the rectangle frame are mounted on some inwardly vertically disposed pressure pin A, connecting plate long axis direction
Both sides be respectively provided with some outwards vertically disposed pressure pin B, pressure pin A and the corresponding two ends in punch-pin long axis direction of pressure pin B；
The pressure pin A and pressure pin B are T-shaped；In use, before injection just by the rectangle circle around the injection mold lower template on, note
After the completion of modeling, by holding up rectangle frame, so as to hold up all frameworks, the framework for then again holding up rectangle frame together with rectangle frame is whole
Body is put into the lower template of slitter edge mould, and now rectangle frame is enclosed in the outside of punch set composition, after the completion of slitter edge is removed,
Hold up rectangle frame again again and be transferred to next station together with framework.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410650749.0A CN104511988B (en) | 2014-11-17 | 2014-11-17 | A kind of stamp-mounting-paper diode plastic packaging removes slitter edge mould special tooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410650749.0A CN104511988B (en) | 2014-11-17 | 2014-11-17 | A kind of stamp-mounting-paper diode plastic packaging removes slitter edge mould special tooling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104511988A CN104511988A (en) | 2015-04-15 |
| CN104511988B true CN104511988B (en) | 2017-08-11 |
Family
ID=52788145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410650749.0A Active CN104511988B (en) | 2014-11-17 | 2014-11-17 | A kind of stamp-mounting-paper diode plastic packaging removes slitter edge mould special tooling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104511988B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2922805B1 (en) * | 2007-10-26 | 2013-09-06 | Aplix Sa | INSERTION BLOCK FOR THE FORMATION OF A FIELD OF HOOKS ON AN INJECTION MOLDED OBJECT AND A MOLDED OBJECT HAVING A HOOK FIELD OF THIS TYPE |
| CN202111068U (en) * | 2011-06-17 | 2012-01-11 | 如皋市易达电子有限责任公司 | Mould for removing waste edge of patch diode |
| CN203371709U (en) * | 2013-07-23 | 2014-01-01 | 宁波通宝精密机械有限公司 | Rubber-edge tearing mold |
| CN204450978U (en) * | 2014-11-17 | 2015-07-08 | 如皋市易达电子有限责任公司 | A kind of stamp-mounting-paper diode plastic packaging removes slitter edge mould special tooling |
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2014
- 2014-11-17 CN CN201410650749.0A patent/CN104511988B/en active Active
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| Publication number | Publication date |
|---|---|
| CN104511988A (en) | 2015-04-15 |
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Effective date of registration: 20191129 Address after: 237300 Jinzhai Economic Development Zone, Anhui, Lu'an Patentee after: Jinzhai County triumphant return Electronic Science and Technology Co., Ltd. Address before: 226500, Jiangsu Province, Nantong City, Rugao moved by the town group shore village 7 groups Patentee before: Rugao Eada Electronics Co., Ltd. |
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| TR01 | Transfer of patent right |