CN104503043A - Multi-path parallel optical assembly - Google Patents
Multi-path parallel optical assembly Download PDFInfo
- Publication number
- CN104503043A CN104503043A CN201410845454.9A CN201410845454A CN104503043A CN 104503043 A CN104503043 A CN 104503043A CN 201410845454 A CN201410845454 A CN 201410845454A CN 104503043 A CN104503043 A CN 104503043A
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- guide pin
- hole
- lens mount
- metal reinforcement
- detector array
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention provides a multi-path parallel optical component, which comprises an optical connector, a plurality of parallel optical components and a plurality of optical modules, wherein the optical connector comprises a guide pin, a laser and/or a detector array and a driving chip; the lens base mounting plate is provided with a positioning groove, the lens base is clamped in the positioning groove, and the lens array is aligned and coupled with the laser and/or the detector array; correspond position department with guide pin mounting hole on the lens seat and be equipped with the guide pin pilot hole, the one end of guide pin passes guide pin mounting hole, dodges hole and guide pin pilot hole, with guide pin pilot hole transition fit to glue the bonding fixedly by the structure between with guide pin mounting hole. The passive coupling of the lens array and the laser and/or the detector array can be realized, the coupling efficiency and the precision are high, and the operation is simple; the flexible PCB is beneficial to reducing the packaging size, forming high-density distribution of components and enhancing the environmental adaptability.
Description
Technical field
The present invention relates to technical field of optical fiber communication, particularly relate to a kind of Multi-path parallel optical component.
Background technology
Along with more and more higher to the requirement of communication bandwidth in fiber optic communication field, the application of multidiameter delay Optical Fiber Transmission or parallel optical interconnecting is more and more extensive, in order to realize multidiameter delay light network, usually adopts multidiameter delay optical transceiver module to carry out multidiameter delay light network.
The parallel modules density of components that requirement is higher compared with single channel module, less package dimension and weight, lower energy consumption, have higher requirement to thermal design, electromagnetic interference shield design, packaging technology design, photoelectric coupling design and circuit design simultaneously.The direct decision module Performance And Reliability of structural design scheme that parallel optical module is perfect.Therefore, the optical assembly in parallel modules requires higher to the alignment precision of the parts such as each chip, lens, and error is little, thus ensures coupling efficiency high as far as possible.
In prior art, the coupling of parallel light assembly adopts active coupling usually, namely needs each chip live line work in optical assembly in coupling process, and coupling technique is complicated, and efficiency is low; In addition, existing parallel optical module multidiameter delay optical transceiver module of the prior art all adopts the packing forms meeting international standard, comprise QSFP MSA, SNAP12 MSA agreement etc., some packing forms is realize its some own specific function, the package dimension often made is larger, as SFF(49.56mm × 13.59mm × 9.8mm), SFP(56.5mm × 13.4mm × 8.5mm) etc., mostly due to its inner structure structure take size comparatively large and between all parts structural design be not quite reasonable causing.Being in particular in, is mostly often adopt rigid circuit board as system board structure conventional in encapsulation, for straight tabular can not occur corresponding bending, if bending, can damage components and parts corresponding on circuit board; In addition, the light parts assembly structure of optical assembly is compact not, and package dimension also can be caused to strengthen.Comparatively ambassador's environmental suitability is lower because of its package dimension for these encapsulation optical modules, if run in relatively rugged surroundings, because its resistance to shock is low, may be damaged or cannot normally work, and when running in highly-reliable system, its corresponding reliability also can not meet highly-reliable system requirement far away.
Summary of the invention
The present invention proposes a kind of novel Multi-path parallel optical component, and can solve existing standard parallel light assembly coupling technique complicated, efficiency is low, and package dimension is large, the problem that when running in highly-reliable system, reliability can not meet the demands.
For reaching above-mentioned technical purpose, technical scheme of the present invention is, a kind of Multi-path parallel optical component, comprise pcb board, be embedded with the lens mount of linearly evenly distributed lens arra, be arranged on optical connector on pcb board and electric connector, described optical connector comprises the driving chip of guide pin, linearly evenly distributed laser instrument and/or detector array and correspondence, described pcb board comprises rigidity pcb board portion and flexible PCB portion, and described electric connector is positioned in described rigidity pcb board portion, described flexible PCB portion is fixed with metal reinforcement plate and the lens mount installing plate of setting all in parallel, the similar thermal expansion coefficient of described metal reinforcement plate and described driving chip, and it has a bar shaped boss and be positioned at bar shaped boss end guide pin install through hole, described laser instrument and/or detector array are pasted onto on described bar shaped boss by high precision die bonder, described driving chip is pasted onto on described metal reinforcement plate by high precision die bonder, and be positioned at the side of described laser instrument and/or detector array, in described flexible PCB portion, correspondence is provided with described bar shaped boss, guide pin installs through hole, the pilot hole that laser instrument and/or detector array and driving chip expose, described lens mount installing plate is provided with the locating slot suitable with the contour shape of described lens mount, described lens mount is fastened in described locating slot, the groove bottom of described locating slot is the installation optical plane of described lens mount, and described groove bottom has for expose described bar shaped boss, guide pin install through hole, laser instrument and/or detector array dodge hole, described lens arra is aimed at described laser instrument and/or detector array and is coupled, described lens mount installs through hole corresponding position with described guide pin and is provided with guide pin pilot hole, one end of described guide pin is installed through hole through described guide pin, is dodged hole and guide pin pilot hole, and with described guide pin pilot hole transition fit, and and described guide pin install between through hole and be adhesively fixed by structure glue.
Compared with prior art, the present invention has the following advantages and good effect:
1, in the present invention, laser instrument and/or detector array are pasted onto on bar shaped boss by high precision die bonder, driving chip is also pasted onto on metal reinforcement plate by high precision die bonder simultaneously, micron-sized high precision die bonder pickup lens seat can be adopted, the lens light mouth center, each road of lens mount is aimed at the photosurface center of laser instrument and/or detector array respectively, realize lens to aim at the optical dimensions that laser instrument and/or detector array are listed in X-axis and Y-axis, simultaneously, lens mount is fastened in locating slot, by locating slot, the spacing of Z-direction is carried out to lens mount, realize lens to aim at the optical dimensions that laser instrument and/or detector array are listed in Z axis, thus realize the passive coupling of lens and laser instrument and/or detector array, passive coupling efficiency is high, precision is high, simple to operate,
2, pcb board comprises rigidity pcb board portion and flexible PCB portion, optical connector is arranged on the metal reinforcement plate that is connected with flexible PCB portion, then in encapsulation process, optical connector and metal reinforcement plate can be bending or folding with flexible PCB portion, be conducive to reducing package dimension, define the high density distribution of components and parts, strengthen adaptive capacity to environment;
3, metal reinforcement plate can make up the weak shortcoming of flexible PCB portion intensity, ensures the bulk strength of pcb board, and itself and driving chip similar thermal expansion coefficient, be convenient to the nude film installation of chip, avoid due to the effect defective chip that expands with heat and contract with cold.
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiment of the present invention parallel light transceiving module;
Fig. 2 is the decomposition chart of Fig. 1;
The structural representation of metal reinforcement plate in Fig. 3 embodiment of the present invention;
Fig. 4 is the structural representation (side towards light connection plate) at a lens mount installing plate visual angle in the embodiment of the present invention;
Fig. 5 is the structural representation (dorsad the side of light connection plate) at another visual angle of lens mount installing plate in the embodiment of the present invention;
Fig. 6 is the structural representation of pcb board in the embodiment of the present invention.
Embodiment
Below in conjunction with drawings and Examples, the present invention is described in detail.
See figures.1.and.2, Fig. 3 and Fig. 6, the present embodiment Multi-path parallel optical component, comprise pcb board 1, be embedded with the lens mount 3 of linearly evenly distributed lens arra 3-1, be arranged on optical connector on pcb board 1 and electric connector 8, optical connector comprises the driving chip 6 of guide pin 7, linearly evenly distributed laser instrument and/or detector array 5 and correspondence.Wherein, electric connector 8 adopts pluggable 10 × 10 MEG-Array electrical interfaces, meets SNAP12 MSA protocol requirement; Laser instrument and/or detector array 5 are VCSEL laser array and/or PD photodetector array, VCSEL laser array and/or PD photodetector array 5 are connected with driving chip 6 by beating gold thread, and driving chip 6 is connected with pad on pcb board 1 by beating gold thread; Lens mount 3 comprises 12 roads and to walk abreast bispheric lens array 3-1, wherein, the sphere at lens two ends is coupled with the MPO optical fiber connector outside VCSEL laser array and/or PD photodetector array 5 and module respectively, 12 Reuter's mirrors linearly equidistant arrangement, centre distance between each lens is 0.25mm, inner face each road light mouth of lens carries out optical coupled with each road photosurface of VCSEL laser array and/or PD photodetector array 5 respectively, the outer face light mouth of lens and the attachment unit interface compatibility of MPO standard.For ease of the encapsulation of optical connector part, reduce package dimension, pcb board 1 comprises rigidity pcb board portion 1-1 and flexible PCB portion 1-2, can be spliced by rigid circuit board and flexible PCB, or directly adopt overall flex-rigid wiring board, electric connector 8 is positioned on rigidity pcb board portion 1-1, and flexible PCB portion 1-2 is fixed with a metal reinforcement plate 4 and lens mount installing plate 2, all be arranged in parallel with flexible PCB portion 1-2, guide pin metal reinforcement plate 4 having a bar shaped boss 4-2 and be positioned at bar shaped boss 4-2 end installs through hole 4-5, laser instrument and/or detector array 5 are pasted onto on bar shaped boss 4-2 by high precision die bonder, driving chip 6 is also pasted onto on metal reinforcement plate 4 by high precision die bonder, be positioned at the side of laser instrument and/or detector array 5, due to metal reinforcement plate 4 and the similar thermal expansion coefficient of driving chip 6, namely the two thermal matching can be good, can be convenient to install with the laminating of driving chip 6, prevent from drawing bad or extruding driving chip owing to expanding with heat and contract with cold, it can select tungsten copper clad metal sheet etc., on flexible PCB portion 1-2, correspondence is provided with bar shaped boss 4-2, guide pin installs through hole 4-5, the pilot hole 1-4 that laser instrument and/or detector array 5 and driving chip 6 expose, be convenient to lens arra 3-1 aim at laser instrument and/or detector array 5 and be coupled, the shape of pilot hole 1-4 preferably with bar shaped boss 4-2, guide pin installs through hole 4-5 and driving chip 6 shared region shape on metal reinforcement plate 4 is suitable, so that to bar shaped boss 4-2, guide pin installs through hole 4-5 and driving chip 6 positions, guarantee flexible PCB portion 1-2 and metal reinforcement plate 4 rigging position accurate, improve efficiency of assembling.With reference to Fig. 4 and Fig. 5, lens mount installing plate 2 is provided with the locating slot 2-2 suitable with the contour shape of lens mount 3, lens mount 3 is fastened in locating slot 2-2, the groove bottom of locating slot 2-2 is the installation optical plane of lens mount 3, and be provided with first glue groove 2-1, the lower end optical plane of lens mount 3 is installed optical plane with the locating slot 2-2 of lens mount installing plate 2 and is coordinated, and carries out a glue in first glue groove 2-1 place and realize the reliable fixing of lens mount 3 and lens mount installing plate 2.Meanwhile, the groove bottom of locating slot 2-2 has for exposing bar shaped boss 4-2, guide pin installs through hole 4-5, laser instrument and/or detector array 5 dodges hole 2-5, lens arra 3-1 aims at laser instrument and/or detector array 5 and is coupled.Simultaneously, lens mount 3 is installed through hole 4-5 corresponding position with guide pin and be provided with guide pin pilot hole 3-2, one end of guide pin 7 is installed through hole 4-5 through guide pin, is dodged hole 2-5 and guide pin pilot hole 3-2, and with guide pin pilot hole 3-2 transition fit, and and guide pin install between through hole 4-5 and be adhesively fixed by structure glue.Simultaneously with reference to Fig. 5, in addition, lens mount 3 is installed with guide pin through hole 4-4 corresponding position and is provided with guide pin pilot hole 3-2, through hole 4-4, pilot hole 1-4 and guide pin pilot hole 3-2 are installed through guide pin in one end of guide pin 7, and with guide pin pilot hole 3-2 transition fit, and and guide pin install between through hole 4-4 and be adhesively fixed by structure glue, realize the fixing of guide pin 7.
Specifically, the present embodiment Multi-path parallel optical component is in manufacturing process, lens mount 3 is reliably fixed on lens mount installing plate 2, ensure that lens arra 3-1 aims in the optical dimensions of Z axis with laser instrument and/or detector array 5, then, use micron-sized high precision die bonder pickup lens seat 3, lens light mouth center, Shi Qige road is aimed at the photosurface center of the laser instrument be pasted onto by high precision die bonder on the relevant position of metal reinforcement plate 4 and/or detector array 5 and driving chip 6 respectively, micron-sized high precision die bonder can ensure that lens arra 3-1 aims in the optical dimensions of X-axis and Y-axis with laser instrument and/or detector array 5, thus realize lens arra 3-1 and aim at the passive coupling of laser instrument and/or detector array 5, passive coupling efficiency is high, and precision is high, simple to operate.In addition, the flexible PCB portion 1-2 of pcb board 1 can bend or fold, the metal reinforcement plate 4 being then provided with optical connector can be bending or folding with flexible PCB portion 1-2, the optical connector of light mouth encapsulation part is enable to reach angle of assembling and the position of most convenient, quick assembling, improves efficiency of assembling, and is conducive to reducing package dimension, define the high density distribution of components and parts, strengthen adaptive capacity to environment.
In addition, in the pcb board structure shown in Fig. 6, rigidity pcb board portion 1-1 is also provided with positioning holes on circuit board 1-5, front end screw fixed hole 1-3 and rear end screw fixed hole 1-6, accurate location when positioning holes on circuit board 1-5 can ensure to encapsulate between parallel light transceiver component and shell, facilitate the installation of pcb board 1 with fixing simultaneously, the effect of front end screw fixed hole 1-3 is the fore-end being fixed rigidity pcb board portion 1-1 by a word tack holding screw, the effect of rear end screw fixed hole 1-6 is the rear end part being fixed rigidity pcb board portion 1-1 by cross recess fillister head screw, the integral installation realizing pcb board 1 is fixed.
In the present embodiment, the quantity of guide pin 7 is two, be arranged in parallel, guide pin is installed through hole 4-5 and is corresponded to two, lay respectively at the two ends place of bar shaped boss 4-2, the linear array direction of laser instrument and/or detector array 5 is parallel with the circle center line connecting that two guide pins install through hole 4-5, then, when pasting laser instrument and/or detector array 5, can install the circle center line connecting of through hole 4-5 for benchmark with two guide pins, be convenient to the location of laser instrument and/or detector array 5, improve positioning precision and location efficiency.Simultaneously, two guide pins 7 are fixed by a guide pin frame 9, particularly, guide pin 7 is not installed through hole 4-5 through guide pin, is dodged hole 2-5, one end of guide pin pilot hole 3-2 is installed on this guide pin frame 9, guide pin frame 9 can improve the stability maintenance of guide pin 7 further, prevent guide pin 7 from coming off, when guide pin 7 fix in position, guide pin frame 9 is resisted against on metal reinforcement plate 4.
Further, as shown in Figure 3, metal reinforcement plate 4 also has the gear glue platform 4-3 of a projection, bar shaped boss 4-2 is positioned on gear glue platform 4-3, two guide pins install the two ends place that through hole 4-5 is positioned at gear glue platform 4-3, and gear glue platform 4-3 embeds in the pilot hole 1-4 on flexible PCB portion 1-2.By arrange gear glue platform 4-3 be convenient to metal reinforcement plate 4 assemble with flexible PCB portion 1-2 time, the pilot hole 1-4 of the surrounding outward flange and flexible PCB portion 1-2 that keep off glue boss 4-3 positions, guarantee flexible PCB portion 1-2 and metal reinforcement plate 4 accurate location.Now, the shape of pilot hole 1-4 preferably with gear glue platform 4-3, that two guide pins install region shape shared by through hole 4-5 and driving chip 6 is suitable.
As shown in Figure 4, lens cover plate 2 be provided with escape groove 2-4 for dodging driving chip 6 on the surface towards this of metal reinforcement plate 4, damage driving chip 6 by pressure after preventing lens cover plate 2 to be seated.
In the present embodiment, metal reinforcement plate 4 is integrated by heat pressing process pressing with the fixing assembling of flexible PCB portion 1-2, and metal reinforcement plate 4 and lens mount installing plate 2 can adopt screw fastening or gluing form to be fixedly connected with.
Further, metal reinforcement plate 4 is laid with the multiple projection 4-1 extended towards lens mount installing plate 2, on flexible PCB portion 1-2, correspondence is provided with the multiple through hole 1-7 passed for projection 4-1, the end face of each projection 4-1 is concordant and contact with lens mount installing plate 2 and fit, the surface that lens mount installing plate 2 and projection 4-1 fit is provided with second point glue groove 2-3, second point glue groove 2-3 is communicated with the sidepiece of lens mount installing plate 2, and metal reinforcement plate 4 and lens mount installing plate 2 are fixed with one by second point glue groove 2-3 interstitital texture glue.Being fixedly connected with of lens mount installing plate 2 and metal reinforcement plate 4 is realized by the form of interstitital texture glue, simple to operate, without the need to arranging fixed sturcture on corresponding component, and structure glue insulation;
For ensureing machining precision, meet Z axis optical dimensions tolerance, the end face of each projection 4-1 is concordant with the surface of bar shaped boss 4-2, simultaneously shaping by time processing, improves machining precision.
Paster for ease of driving chip 6 operates, improve paster efficiency, optical connector also includes chip paster mark 4-4, and driving chip 6 and chip paster identify 4-4 and be all pasted onto on metal reinforcement plate 4 by high precision die bonder, and driving chip 6 is positioned at the top of chip paster mark 4-4.By arranging chip paster mark 4-4, fixedly can carry out hi-Fix to driving chip 6, and then be convenient to fixedly carry out precision positioning to multi-path light electrical chip and optical fiber component, achieve the high-accuracy packaging passive alignment between the two and direct-coupling.
The above is only preferred embodiment of the present invention, and be not restriction the present invention being made to other form, any those skilled in the art may utilize the technology contents of above-mentioned announcement to be changed or be modified as the Equivalent embodiments of equivalent variations.But everyly do not depart from technical solution of the present invention content, any simple modification, equivalent variations and the remodeling done above embodiment according to technical spirit of the present invention, still belong to the protection domain of technical solution of the present invention.
Claims (9)
1. a Multi-path parallel optical component, comprise pcb board, be embedded with the lens mount of linearly evenly distributed lens arra, be arranged on optical connector on pcb board and electric connector, described optical connector comprises the driving chip of guide pin, linearly evenly distributed laser instrument and/or detector array and correspondence, it is characterized in that: described pcb board comprises rigidity pcb board portion and flexible PCB portion, described electric connector is positioned in described rigidity pcb board portion, described flexible PCB portion is fixed with metal reinforcement plate and the lens mount installing plate of setting all in parallel, the similar thermal expansion coefficient of described metal reinforcement plate and described driving chip, and it has a bar shaped boss and be positioned at bar shaped boss end guide pin install through hole, described laser instrument and/or detector array are pasted onto on described bar shaped boss by high precision die bonder, described driving chip is pasted onto on described metal reinforcement plate by high precision die bonder, and be positioned at the side of described laser instrument and/or detector array, in described flexible PCB portion, correspondence is provided with described bar shaped boss, guide pin installs through hole, the pilot hole that laser instrument and/or detector array and driving chip expose, described lens mount installing plate is provided with the locating slot suitable with the contour shape of described lens mount, described lens mount is fastened in described locating slot, the groove bottom of described locating slot is the installation optical plane of described lens mount, and described groove bottom has for expose described bar shaped boss, guide pin install through hole, laser instrument and/or detector array dodge hole, described lens arra is aimed at described laser instrument and/or detector array and is coupled, described lens mount installs through hole corresponding position with described guide pin and is provided with guide pin pilot hole, one end of described guide pin is installed through hole through described guide pin, is dodged hole and guide pin pilot hole, and with described guide pin pilot hole transition fit, and and described guide pin install between through hole and be adhesively fixed by structure glue.
2. Multi-path parallel optical component according to claim 1, is characterized in that: described guide pin is two that be arranged in parallel, and its one end of not installing through hole through described guide pin is installed on same guide pin frame, and described guide pin frame is resisted against on described metal reinforcement plate; Correspondingly, it is two that described guide pin installs through hole, and lay respectively at the two ends place of described bar shaped boss, the linear array direction of described laser instrument and/or detector array is parallel with the circle center line connecting that guide pin described in two installs through hole.
3. Multi-path parallel optical component according to claim 2, it is characterized in that: the gear glue platform described metal reinforcement plate also with a projection, described bar shaped boss is positioned on described gear glue platform, guide pin described in two installs the two ends place that through hole is positioned at described gear glue platform, and described gear glue platform embeds in the pilot hole in described flexible PCB portion.
4. Multi-path parallel optical component according to claim 3, is characterized in that: it is suitable that guide pin described in the shape of described pilot hole and described gear glue platform, two installs region shape shared by through hole and described driving chip.
5. Multi-path parallel optical component according to any one of claim 1 to 4, is characterized in that: the escape groove be provided with for dodging described driving chip of described lens cover plate.
6. Multi-path parallel optical component according to claim 5, is characterized in that: described metal reinforcement plate and the hot pressing pressing of described flexible PCB portion are integrated, and described metal reinforcement plate and described lens mount installing plate are fixed with one.
7. Multi-path parallel optical component according to claim 6, it is characterized in that: described metal reinforcement plate is laid with the multiple projections extended towards described lens mount installing plate, described flexible PCB portion correspondence is provided with the multiple through holes passed for described projection, the end face of each described projection is concordant and contact with described lens mount installing plate and fit, the surface that described lens mount installing plate and described projection fit is provided with a glue groove, described some glue groove is communicated with the sidepiece of described lens mount installing plate, described metal reinforcement plate and described lens mount installing plate are fixed with one by described glue groove interstitital texture glue.
8. Multi-path parallel optical component according to claim 7, is characterized in that: the end face of each described projection is concordant with the surface of described bar shaped boss.
9. Multi-path parallel optical component according to claim 1, it is characterized in that: described optical connector also includes chip paster mark, described driving chip and described chip paster identify and are pasted onto on described metal reinforcement plate by high precision die bonder, and described driving chip is positioned at the top of described chip paster mark.
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| CN201410845454.9A CN104503043B (en) | 2014-12-31 | 2014-12-31 | Multi-path parallel optical assembly |
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| CN201410845454.9A CN104503043B (en) | 2014-12-31 | 2014-12-31 | Multi-path parallel optical assembly |
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| CN106125215A (en) * | 2016-08-31 | 2016-11-16 | 中航海信光电技术有限公司 | A kind of parallel light assembly |
| CN106328664A (en) * | 2016-10-12 | 2017-01-11 | 格科微电子（上海）有限公司 | Camera module manufacturing method and terminal handling equipment |
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| US11927818B2 (en) | 2019-12-20 | 2024-03-12 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
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| CN107703589A (en) * | 2017-08-11 | 2018-02-16 | 中航海信光电技术有限公司 | A kind of Multi-path parallel optical component encapsulating structure and Multi-path parallel optical component |
| CN113009646A (en) * | 2019-12-20 | 2021-06-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| US11927818B2 (en) | 2019-12-20 | 2024-03-12 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
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Address after: 266100 Songling Road, Laoshan District, Qingdao, Shandong Province, No. 399 Patentee after: Qingdao Xinghang Photoelectric Technology Co.,Ltd. Address before: 266104 in the investment service center of Beizhai sub district office, beizhaike community, Laoshan District, Qingdao City, Shandong Province Patentee before: HISENSE & JONHON OPTICAL-ELECTRICAL TECHNOLOGIES Co.,Ltd. |